10M04DAF256A7G - MAX 10 FPGA 4K LE, 256-LBGA | Intel
部品番号: 10M04DAF256A7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.88 | $5.88 |
| 10 | $5.29 | $52.90 |
| 100 | $4.7 | $470.00 |
| 500 | $4.12 | $2,060.00 |
| 1,000 | $3.53 | $3,530.00 |
10M04DAF256A7G 概要
A Field Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined by the user after manufacturing, composed of programmable logic blocks (LEs/LUTs), programmable interconnect, and dedicated hard-IP such as block memory, DSP/multiplier blocks, and I/O serdes. FPGAs sit at the top of the programmable-logic hierarchy: FPGA > CPLD > PLD > programmable logic > semiconductor. The MAX 10 family is Intel's smallest non-volatile FPGA line, optimized for I/O expansion, bridging, instant-on control, and low-power glue logic.
Key features include 4,000 logic elements, 250 Kbits of user flash memory, 178 Kbits of embedded SRAM (M9K blocks), up to 250 user I/O pins, integrated ADC blocks, and support for LVDS, LVCMOS, SSTL, and RSDS I/O standards. The 256-LBGA package exposes a high pin count in a 17x17 mm footprint, enabling dense PCB integration for industrial control and bridge applications.
The MAX 10 architecture uses a Logic Element (LE) built around a 4-input fracturable LUT, paired with dedicated 9 Kbit M9K memory blocks, 18x18 hardware multipliers, and on-chip flash for instant-on configuration. Configuration is stored in internal flash, allowing the device to operate in single-chip mode without external boot memory.
Typical applications include industrial I/O expansion and bridging, motor control and drive interfacing, video/display bridge logic, portable instrumentation, and low-volume ASIC prototyping. The integrated ADC and instant-on capability also suit sensor-fusion front-ends.
When designing with this device, ensure PCB power decoupling follows Intel's MAX 10 hardware reference design with bulk and 0.1 uF/0.01 uF capacitor networks at each supply pin. The configuration flash eliminates external PROMs but requires Quartus Prime programmer support for JTAG or in-system updates.
This page synthesizes distributor pricing, parametric comparison, and practical design notes that go beyond what the manufacturer datasheet alone provides.
ドロップイン代替品: 10M04DAF256A7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M04DAF256A7G （同一形状・フットプリント） — 相違点: Package, Process Technology, User Flash Memory, RoHS Status, Logic Elements (LE).
クイック比較ツール — 並列比較する代替部品を選択:
10M04DAF256C8G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10M04DCF256A7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$11.1 / 個
データシートを見る →10M04DCF256C8G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10M04DAF256A7G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Adaptive Logic Modules (ALM) | Not applicable (MAX 10 uses 4-input LUT LE architecture) |
| Embedded Memory (M9K bits) | 178 Kbit |
| User Flash Memory | 250 Kbit (typical for MAX 10 04 family) |
| Embedded 18x18 Multipliers | Yes (MAX 10 DSP blocks) |
| Maximum User I/O Pins | 250 (package-dependent) |
| Process Technology | 55 nm TSMC low-power CMOS |
| パッケージ | 256-LBGA (FineLine BGA, 17x17 mm) |
| 実装タイプ | Surface Mount (BGA) |
| Operating Temperature Grade | Automotive / Industrial (A7G = -40C to +125C TJ) |
| Configuration Method | On-chip flash (instant-on, single-chip mode) |
| Integrated ADC | Yes (MAX 10 ADC blocks) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Programming Interface | JTAG / Quartus Prime |
10M04DAF256A7G 256-lbga (fineline bga, 17x17 mm) ピン配置ガイド
10M04DAF256A7G (256-lbga (fineline bga, 17x17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M04DAF256A7G.
詳細は データシート をご参照ください。
主な用途
10M04DAF256A7G の用途: 6 件s: Industrial I/O Expansion and Bridging, Motor Control and Drive Interface, Video and Display Bridge Logic, Portable Test and Measurement Instrumentation, Low-Volume ASIC Prototyping, Sensor Fusion and IoT Edge Front-Ends.
Industrial I/O Expansion and Bridging
The 10M04DAF256A7G is well suited for industrial I/O expansion and bridging because its 4,000 logic elements and up to 250 user I/O pins provide ample glue-logic capacity to translate between LVCMOS, LVDS, and SSTL domains in motor drives and PLC backplanes. The MAX 10 instant-on flash configuration means the FPGA is live within milliseconds of power-up, eliminating the boot delay of SRAM-based FPGAs. The 256-LBGA footprint exposes a high pin count for parallel bus expansion and field-bridge glue logic.
おすすめ
Motor Control and Drive Interface
The 10M04DAF256A7G fits motor-control interface boards because the MAX 10 integrated ADC and 18x18 hardware multipliers can sample current/voltage feedback while the 4,000 LEs run space-vector PWM and field-oriented-control state machines. On-chip configuration flash lets the drive firmware boot in <100 ms for safety-critical machine startups. The 256-LBGA package supports the high pin count needed for parallel encoder and resolver interfaces.
おすすめ
Video and Display Bridge Logic
The 10M04DAF256A7G works as a video/display bridge because its 250 user I/O pins can carry parallel RGB, LVDS, or MIPI DSI lanes between SoCs and TFT panels while the 178 Kbits of M9K memory buffers line-doubling operations. Per the MAX 10 handbook, LVDS rates up to 840 Mbps are supported, sufficient for 1080p bridging. The BGA package's short bond wires maintain signal integrity for sub-100 ps edge rates.
おすすめ
Portable Test and Measurement Instrumentation
The 10M04DAF256A7G is ideal for portable instruments because the integrated ADC blocks sample analog signals without an external ADC, while the 4,000 LEs implement DSP filters, FFT engines, and trigger logic in a single device. The MAX 10 instant-on flash configuration lets handheld instruments power up to a known good state without external PROMs, saving PCB area and bill-of-materials cost. The 256-LBGA exposes enough I/O for parallel LCD and keypad interfaces.
おすすめ
Low-Volume ASIC Prototyping
The 10M04DAF256A7G serves as a low-volume ASIC prototype because the 4,000 LEs and 178 Kbits M9K memory emulate small ASIC blocks, while the on-chip configuration flash allows rapid design iteration via JTAG. Quartus Prime supports pin-out migration from F256 to other MAX 10 packages, easing the path from prototype to mid-volume MAX 10 production. The 256-LBGA offers a realistic BGA footprint that matches production package thermal and routing constraints.
おすすめ
Sensor Fusion and IoT Edge Front-Ends
The 10M04DAF256A7G suits sensor-fusion edge nodes because the integrated ADC blocks digitize analog sensors while the 4,000 LEs run Kalman filters, threshold logic, and protocol stacks (I2C/SPI/UART). MAX 10 instant-on flash lets the edge node boot and stream valid data within milliseconds of power-up, critical for battery-powered event-driven sensing. The 256-LBGA exposes enough I/O for multi-sensor fan-out.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M04DAF256A7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M04DAF256C8G | 10M04DCF256A7G | 10M04DCF256C8G |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LBGA (17x17 mm) | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same |
| Logic Elements | 4,000 | 4,000 - same | 4,000 - same | 4,000 - same |
| Embedded Memory | 178 Kbit (M9K) | 178 Kbit - same | 178 Kbit - same | 178 Kbit - same |
| User Flash | 250 Kbit | 250 Kbit - same | 250 Kbit - same | 250 Kbit - same |
| Temperature Grade | Automotive (-40C to +125C TJ) | Commercial (0C to +85C TJ) | Automotive (-40C to +125C TJ) | Commercial (0C to +85C TJ) |
| Speed/Grade | DA grade (A7) | DA grade (C8) | DC grade (A7) | DC grade (C8) |
| Configuration | On-chip flash (instant-on) | On-chip flash - same | On-chip flash - same | On-chip flash - same |
| Integrated ADC | Yes (MAX 10 ADC) | Yes - same | Yes - same | Yes - same |
主な差別化要因
- On-chip configuration flash with instant-on boot （vs Cyclone 10 LP (10CL016YU256C8G))
- Integrated ADC blocks eliminate external ADC （vs Lattice MachXO2 (LCMXO2-256))
- Highest logic density in MAX 10 04 family with automotive grade （vs MAX 10 10M02DCU324A7G)
設計ノート
Estimated: at full I/O toggle and 50% logic utilization, the MAX 10 10M04 device draws ~300 mA from a 1.2 V core rail plus I/O current. Decouple each VCC/VCCIO pin pair with a 0.1 uF X7R ceramic in parallel with a 10 uF bulk capacitor, placed within 5 mm of the BGA via. Use a 4-layer PCB with a dedicated ground plane beneath the device to keep digital return paths short.
The 256-LBGA package has theta-JA around 15-20 C/W with standard 4-layer PCB design (per Intel MAX 10 thermal guide). At maximum 250 I/O toggle with capacitive loading, ensure junction temperature stays below 125 C for automotive A7G grade. Add thermal vias under the center BGA pads to the internal ground plane for additional heatsinking margin.
Use a 4-layer PCB with continuous ground and power planes. Escape the 1.0 mm pitch LBGA with microvias (0.1 mm laser via pad) plus 0.2 mm trace-and-space routing on outer layers. Per Intel layout guidelines, route all differential pairs (LVDS) with matched length within 150 mils and 100 ohm differential impedance. Place JTAG header within 2 inches of the JTAGEN and TCK pins for reliable in-system programming.
LVDS outputs on MAX 10 require a 100 ohm differential termination resistor at the receiver end. Series-PCB-trace impedance should match 50 ohm single-ended / 100 ohm differential. Avoid stubs on high-speed LVDS traces; route point-to-point with via-stitching ground returns beside the differential pair to suppress common-mode noise.
Do not assume the MAX 10 ADC inputs are 5 V tolerant - they are rated only to 3.3 V; add external resistive dividers or clamp diodes when interfacing 5 V sensors. Always assert CONF_DONE before releasing system reset to ensure the FPGA is fully configured. Per Intel errata, certain ADC channels share analog routing with specific GPIO banks - check the F256 pin-out file before final pin assignment.
コンプライアンス情報
RoHS and REACH compliance confirmed by distributor listings. AEC-Q100 qualification inferred from A7G temperature grade (-40C to +125C TJ) which corresponds to automotive-grade screening per Intel MAX 10 ordering guide.
