10M04DAF256A7G - MAX 10 FPGA 4K LE, 256-LBGA | Intel
MPN: 10M04DAF256A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.88 | $5.88 |
| 10 | $5.29 | $52.90 |
| 100 | $4.7 | $470.00 |
| 500 | $4.12 | $2,060.00 |
| 1,000 | $3.53 | $3,530.00 |
Drop-in alternatives for 10M04DAF256A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04DAF256C8G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M04DCF256A7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$11.1 / Unit
View Datasheet →10M04DCF256C8G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M04DAF256A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Adaptive Logic Modules (ALM) | Not applicable (MAX 10 uses 4-input LUT LE architecture) |
| Embedded Memory (M9K bits) | 178 Kbit |
| User Flash Memory | 250 Kbit (typical for MAX 10 04 family) |
| Embedded 18x18 Multipliers | Yes (MAX 10 DSP blocks) |
| Maximum User I/O Pins | 250 (package-dependent) |
| Process Technology | 55 nm TSMC low-power CMOS |
| Package | 256-LBGA (FineLine BGA, 17x17 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Grade | Automotive / Industrial (A7G = -40C to +125C TJ) |
| Configuration Method | On-chip flash (instant-on, single-chip mode) |
| Integrated ADC | Yes (MAX 10 ADC blocks) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Programming Interface | JTAG / Quartus Prime |
10M04DAF256A7G 256-lbga (fineline bga, 17x17 mm) Pin Configuration Guide
Complete pinout information for 10M04DAF256A7G (256-lbga (fineline bga, 17x17 mm) package) with 250 (package-dependent) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DAF256A7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 250 (package-dependent) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04DAF256A7G is suitable for 6 applications: Industrial I/O Expansion and Bridging, Motor Control and Drive Interface, Video and Display Bridge Logic, Portable Test and Measurement Instrumentation, Low-Volume ASIC Prototyping, Sensor Fusion and IoT Edge Front-Ends.
Industrial I/O Expansion and Bridging
The 10M04DAF256A7G is well suited for industrial I/O expansion and bridging because its 4,000 logic elements and up to 250 user I/O pins provide ample glue-logic capacity to translate between LVCMOS, LVDS, and SSTL domains in motor drives and PLC backplanes. The MAX 10 instant-on flash configuration means the FPGA is live within milliseconds of power-up, eliminating the boot delay of SRAM-based FPGAs. The 256-LBGA footprint exposes a high pin count for parallel bus expansion and field-bridge glue logic.
Recommended
Motor Control and Drive Interface
The 10M04DAF256A7G fits motor-control interface boards because the MAX 10 integrated ADC and 18x18 hardware multipliers can sample current/voltage feedback while the 4,000 LEs run space-vector PWM and field-oriented-control state machines. On-chip configuration flash lets the drive firmware boot in <100 ms for safety-critical machine startups. The 256-LBGA package supports the high pin count needed for parallel encoder and resolver interfaces.
Recommended
Video and Display Bridge Logic
The 10M04DAF256A7G works as a video/display bridge because its 250 user I/O pins can carry parallel RGB, LVDS, or MIPI DSI lanes between SoCs and TFT panels while the 178 Kbits of M9K memory buffers line-doubling operations. Per the MAX 10 handbook, LVDS rates up to 840 Mbps are supported, sufficient for 1080p bridging. The BGA package's short bond wires maintain signal integrity for sub-100 ps edge rates.
Recommended
Portable Test and Measurement Instrumentation
The 10M04DAF256A7G is ideal for portable instruments because the integrated ADC blocks sample analog signals without an external ADC, while the 4,000 LEs implement DSP filters, FFT engines, and trigger logic in a single device. The MAX 10 instant-on flash configuration lets handheld instruments power up to a known good state without external PROMs, saving PCB area and bill-of-materials cost. The 256-LBGA exposes enough I/O for parallel LCD and keypad interfaces.
Recommended
Low-Volume ASIC Prototyping
The 10M04DAF256A7G serves as a low-volume ASIC prototype because the 4,000 LEs and 178 Kbits M9K memory emulate small ASIC blocks, while the on-chip configuration flash allows rapid design iteration via JTAG. Quartus Prime supports pin-out migration from F256 to other MAX 10 packages, easing the path from prototype to mid-volume MAX 10 production. The 256-LBGA offers a realistic BGA footprint that matches production package thermal and routing constraints.
Recommended
Sensor Fusion and IoT Edge Front-Ends
The 10M04DAF256A7G suits sensor-fusion edge nodes because the integrated ADC blocks digitize analog sensors while the 4,000 LEs run Kalman filters, threshold logic, and protocol stacks (I2C/SPI/UART). MAX 10 instant-on flash lets the edge node boot and stream valid data within milliseconds of power-up, critical for battery-powered event-driven sensing. The 256-LBGA exposes enough I/O for multi-sensor fan-out.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DAF256A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DAF256C8G | 10M04DCF256A7G | 10M04DCF256C8G |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LBGA (17x17 mm) | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same |
| Logic Elements | 4,000 | 4,000 - same | 4,000 - same | 4,000 - same |
| Embedded Memory | 178 Kbit (M9K) | 178 Kbit - same | 178 Kbit - same | 178 Kbit - same |
| User Flash | 250 Kbit | 250 Kbit - same | 250 Kbit - same | 250 Kbit - same |
| Temperature Grade | Automotive (-40C to +125C TJ) | Commercial (0C to +85C TJ) | Automotive (-40C to +125C TJ) | Commercial (0C to +85C TJ) |
| Speed/Grade | DA grade (A7) | DA grade (C8) | DC grade (A7) | DC grade (C8) |
| Configuration | On-chip flash (instant-on) | On-chip flash - same | On-chip flash - same | On-chip flash - same |
| Integrated ADC | Yes (MAX 10 ADC) | Yes - same | Yes - same | Yes - same |
Key Differentiators
- On-chip configuration flash with instant-on boot (vs Cyclone 10 LP (10CL016YU256C8G))
- Integrated ADC blocks eliminate external ADC (vs Lattice MachXO2 (LCMXO2-256))
- Highest logic density in MAX 10 04 family with automotive grade (vs MAX 10 10M02DCU324A7G)
Design Notes
Estimated: at full I/O toggle and 50% logic utilization, the MAX 10 10M04 device draws ~300 mA from a 1.2 V core rail plus I/O current. Decouple each VCC/VCCIO pin pair with a 0.1 uF X7R ceramic in parallel with a 10 uF bulk capacitor, placed within 5 mm of the BGA via. Use a 4-layer PCB with a dedicated ground plane beneath the device to keep digital return paths short.
The 256-LBGA package has theta-JA around 15-20 C/W with standard 4-layer PCB design (per Intel MAX 10 thermal guide). At maximum 250 I/O toggle with capacitive loading, ensure junction temperature stays below 125 C for automotive A7G grade. Add thermal vias under the center BGA pads to the internal ground plane for additional heatsinking margin.
Use a 4-layer PCB with continuous ground and power planes. Escape the 1.0 mm pitch LBGA with microvias (0.1 mm laser via pad) plus 0.2 mm trace-and-space routing on outer layers. Per Intel layout guidelines, route all differential pairs (LVDS) with matched length within 150 mils and 100 ohm differential impedance. Place JTAG header within 2 inches of the JTAGEN and TCK pins for reliable in-system programming.
LVDS outputs on MAX 10 require a 100 ohm differential termination resistor at the receiver end. Series-PCB-trace impedance should match 50 ohm single-ended / 100 ohm differential. Avoid stubs on high-speed LVDS traces; route point-to-point with via-stitching ground returns beside the differential pair to suppress common-mode noise.
Do not assume the MAX 10 ADC inputs are 5 V tolerant - they are rated only to 3.3 V; add external resistive dividers or clamp diodes when interfacing 5 V sensors. Always assert CONF_DONE before releasing system reset to ensure the FPGA is fully configured. Per Intel errata, certain ADC channels share analog routing with specific GPIO banks - check the F256 pin-out file before final pin assignment.
Compliance Information
RoHS and REACH compliance confirmed by distributor listings. AEC-Q100 qualification inferred from A7G temperature grade (-40C to +125C TJ) which corresponds to automotive-grade screening per Intel MAX 10 ordering guide.
