10M08DAF256A7G - MAX 10 FPGA 8K LE, 256-BGA | Intel / Altera
MPN: 10M08DAF256A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.75 | $287.50 |
| 100 | $24.9 | $2,490.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.95 | $18,950.00 |
Drop-in alternatives for 10M08DAF256A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M08DAF256C7G
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$7.95 / Unit
View Datasheet →10M08DAF256I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08DAF256A7P
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10M04DAF256A7G
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$3.53 / Unit
View Datasheet →10M08DAF256A7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 8,000 LE |
| Embedded Memory | 378 Kbit (387,072 bits) |
| Maximum User I/Os | 178 |
| Package | 256-LBGA (FineLine BGA, 17 mm x 17 mm) |
| Operating Temperature (Automotive 'A7G') | -40C to +125C (junction) |
| Core Supply Voltage | 1.2 V |
| Mounting Style | SMD/SMT |
| Configuration Memory | On-chip dual-configuration flash |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Yes |
| Development Tool | Intel Quartus Prime |
10M08DAF256A7G 256-lbga (fineline bga, 17 mm x 17 mm) Pin Configuration Guide
Complete pinout information for 10M08DAF256A7G (256-lbga (fineline bga, 17 mm x 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DAF256A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DAF256A7G is suitable for 6 applications: Industrial PLC and Motor Control, Automotive Body and Chassis Electronics, Factory Automation and Robotics I/O Hub, Low-Power Video Bridging and Display Controllers, Sensor Aggregation and IoT Edge Gateways, Replacement of Discrete Logic and Small CPLDs.
Industrial PLC and Motor Control
The 10M08DAF256A7G is well matched to industrial PLC and motor-control applications because its 178 GPIOs can interface directly with encoder feedback, PWM outputs, opto-isolated digital inputs, and stepper / servo driver lines without external logic. The on-chip dual-configuration flash enables fail-safe firmware updates in 24/7 factory environments, and the automotive -40C to +125C temperature grade (A7G) comfortably covers industrial control cabinet thermal envelopes. With 8K logic elements and 378 Kbit embedded SRAM, the FPGA can host a soft processor (such as Nios II) plus custom DSP logic for closed-loop current control. The 1.2 V core keeps total power dissipation low, eliminating the need for forced-air cooling in enclosed cabinets.
Recommended
Automotive Body and Chassis Electronics
The 'A7G' temperature grade (-40C to +125C junction) makes the 10M08DAF256A7G directly suitable for body and chassis ECUs such as body controllers, lighting controllers, and gateway modules. Its 8K LEs and 387 Kbit embedded memory allow consolidation of multiple discrete logic ICs, gate drivers, and small CPLDs into a single programmable device, reducing BOM cost and PCB area. The on-chip configuration flash provides instant-on behavior at cold crank, and dual images enable fail-safe OTA updates. Combined with 178 GPIOs supporting LVDS and 3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V I/O standards, the device bridges between automotive sensors, actuators, and CAN / LIN / Ethernet PHYs with minimal external glue logic.
Recommended
Factory Automation and Robotics I/O Hub
Robotics and factory-automation I/O hubs benefit from the 10M08DAF256A7G's 178 high-speed GPIOs, integrated ADC, and on-chip configuration flash that allows field reprogramming without an external boot device. The 8K-LE fabric can host EtherCAT / PROFINET slave controllers, encoder counters, and safety logic, while the 378 Kbit SRAM provides deterministic FIFO buffering between sensor streams and the host controller. The automotive temperature rating ensures reliable operation in unconditioned factory cabinets and near motor drives. Quartus Prime supports the device with proven reference designs for EtherCAT and IO-Link, accelerating development.
Recommended
Low-Power Video Bridging and Display Controllers
The 10M08DAF256A7G can act as a low-power video bridge or display controller in applications such as industrial HMIs and instrumentation front panels, where its 8K LEs are sufficient to drive LVDS displays and perform color-space conversion or chroma keying. The 378 Kbit embedded memory provides line-buffer storage, while the 1.2 V core keeps total device power below 1 W, enabling fanless operation. Its 256-ball BGA package supports the high pin count required for parallel RGB, LVDS, or MIPI D-PHY bridging when paired with external serializers. The instant-on flash architecture boots the controller within milliseconds of power-up.
Recommended
Sensor Aggregation and IoT Edge Gateways
In sensor aggregation hubs and industrial IoT edge gateways, the 10M08DAF256A7G combines multiple low-speed serial buses (UART, SPI, I2C) and discrete GPIO lines into a single Ethernet-connected edge node. The MAX 10's on-chip flash eliminates the external boot PROM typical of SRAM-based FPGAs, reducing BOM and improving reliability. With 8K LEs the device can host a soft RISC-V or Nios II core plus protocol stacks (Modbus, MQTT-SN) while leaving logic headroom for custom filtering. The A7G temperature grade supports outdoor enclosures and remote cabinets.
Recommended
Replacement of Discrete Logic and Small CPLDs
The 10M08DAF256A7G is a cost-efficient replacement for designs that today combine several discrete 74-series logic ICs, small CPLDs, and glue logic on a single board. With 8K LEs and 178 GPIOs the device absorbs the entire discrete-logic footprint while adding reconfigurability and inventory simplification. The on-chip flash means the board ships pre-programmed and does not require in-system programming infrastructure at end-of-line. Compared with CPLDs the 10M08 also offers more memory, embedded ADC, and richer I/O standards at a similar price point.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DAF256A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAF256C7G | 10M08DAF256I7G | 10M08DAF256A7P | 10M04DAF256A7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 8,000 LE | 8,000 LE | 8,000 LE | 8,000 LE | 4,000 LE (-50%) |
| Embedded Memory | 378 Kbit (387,072 bits) | 378 Kbit | 378 Kbit | 378 Kbit | 189 Kbit (-50%) |
| Maximum User I/Os | 178 | 178 | 178 | 178 | 178 |
| Temperature Grade (suffix) | Automotive -40C to +125C (A7G) | Commercial 0C to +85C (C7G) | Industrial -40C to +100C (I7G) | Automotive -40C to +125C (A7P, Pb-free) | Automotive -40C to +125C (A7G) |
| On-Chip Configuration Flash | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) | Yes (dual-image) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Higher temperature grade (-40C to +125C automotive) versus commercial-grade 10M08DAF256C7G (vs 10M08DAF256C7G)
- Larger 8K-LE silicon versus 4K-LE 10M04DAF256A7G in the same 256-LBGA footprint (vs 10M04DAF256A7G)
- Dual-image on-chip configuration flash versus single-image 10M08DAF256A7P variant (vs 10M08DAF256A7P)
Design Notes
The 256-ball BGA requires PCB micro-via or via-in-pad technology. Use a 17 mm x 17 mm BGA land pattern with 1.0 mm ball pitch per the MAX 10 pin connection guidelines. Provide at least four signal layers plus dedicated power / ground planes, with continuous ground stitching vias around the BGA perimeter for return-path integrity. Match the length of JTAG and clock differential pairs within 150 mils to avoid timing skew.
The 10M08DAF256A7G requires a 1.2 V core supply plus separate VCCIO supplies for each I/O bank (typically 3.3 V, 2.5 V, 1.8 V, 1.5 V, or 1.2 V). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10 uF / 47 uF capacitors on each supply rail. Estimated: at 25% toggle rate and 178 active GPIOs, total core current is roughly 200-400 mA; verify against Quartus Prime PowerPlay estimates for your exact design.
Respect the LVDS I/O bank assignments: LVDS transmitters require a 2.5 V VCCIO, while LVDS receivers use an internal 100 ohm differential termination that must be enabled in the device pin assignment file. Keep at least 2x the trace-width spacing between LVDS pairs and single-ended signals to maintain 60 dB isolation. Route high-speed memory interfaces on inner stripline layers with reference ground planes on both sides.
Do not leave MSEL pins floating; they determine the configuration mode (AS, PS, JTAG) at power-up and must be tied to VCCIO or GND through 1 kohm resistors. Always specify the dual-image boot option in the Quartus Prime programming file generator to enable fail-safe fallback. Ensure CONF_DONE and nSTATUS have external 10 kohm pull-ups to VCCIO if used in serial configuration mode.
Compliance Information
RoHS and lead-free status inferred from the 'A7G' suffix in the ordering part number (G = halogen-free, 7 = lead-free finish). AEC-Q100 qualification applies because the part carries the 'A' temperature-grade suffix designating the automotive -40C to +125C window. Compliance fields default to 'compliant' for Intel MAX 10 family members; confirm against the latest manufacturer declaration of conformity before automotive certification.
