10M08DCF256A7G - MAX 10 FPGA 8K LE, 256-BGA, Automotive | Intel
MPN: 10M08DCF256A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $24.7 | $24.70 |
| 10 | $22.5 | $225.00 |
| 100 | $19.8 | $1,980.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.2 | $15,200.00 |
10M08DCF256A7G Overview
What is a MAX 10 FPGA? A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O that can be re-programmed to implement arbitrary digital logic. The MAX 10 family extends the legacy MAX CPLD lineage by adding true FPGA fabric with on-die flash configuration memory, eliminating the external boot PROM required by SRAM-based FPGAs. Within Intel's programmable logic hierarchy, MAX 10 sits below Cyclone and above MAX II/V CPLDs, targeting glue logic, I/O expansion, motor control, and instant-on system management. The 10M08 variant is the smallest logic-density option in the family, optimized for cost-sensitive designs that exceed traditional CPLD capability.
Key specifications include 8,000 logic elements (LEs), 378 Kbit embedded memory (M9K blocks), 178 user I/Os, a 55 nm process node, a 1.2 V core, and integrated dual-configuration flash. The device supports LVCMOS, LVDS, SSTL, and RSDS I/O standards with hot-socketing capability, and contains a built-in 12-bit ADC, temperature-sensing diode, and PLLs for clock management.
Typical applications include automotive body electronics, industrial motor control, factory automation I/O expansion, video bridging and display control, and portable medical instrumentation. The integrated flash and instant-on feature suit safety-critical boot designs, while the on-die ADC simplifies sensor fusion.
Designers should plan for 256-ball BGA PCB escape routing and supply decoupling close to every GND/VCC pair; the Quartus Prime Lite toolchain supports the full MAX 10 family free of charge for evaluation and small-volume production.
Drop-in alternatives for 10M08DCF256A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M08DCF256A7G (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DAF256A7G
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✅ Drop-In📋 Reference alternative (not in catalog)
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View Datasheet →10M08DCF256A7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 8,000 LE |
| Embedded Memory | 378 Kbit (M9K blocks) |
| Total RAM Bits | 387,072 bits |
| User I/Os | 178 |
| Operating Supply Voltage (Core) | 1.2 V |
| Process Technology | 55 nm |
| Package | 256-LBGA (FineLine BGA, F256) |
| Mounting Style | SMD/SMT |
| Speed Grade | -7 |
| Temperature Grade | Automotive (-40C to +125C) |
| Configuration Memory | On-die dual-configuration flash (non-volatile) |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Integrated ADC | 12-bit, 1 MSPS, 16-channel (per family) |
10M08DCF256A7G 256-lbga (fineline bga, f256) Pin Configuration Guide
Pin configuration for 10M08DCF256A7G (256-lbga (fineline bga, f256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DCF256A7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M08DCF256A7G is suitable for 6 applications: Automotive Body Electronics, Industrial Motor Control, I/O Expansion and Bridging, Video Bridging and Display Control, Portable Medical Instrumentation, Factory Automation Backplane.
Automotive Body Electronics
The 10M08DCF256A7G's automotive temperature grade (-40C to +125C) and instant-on non-volatile flash configuration make it ideal for body control modules. With 8,000 LEs and 178 I/Os, the device aggregates LIN/CAN bus bridges, drives LED matrix headlamps with PWM, and supervises door/window actuators without an external boot PROM. The on-die 12-bit ADC reads battery voltage and temperature sensors with 1 MSPS, replacing a discrete MCU companion.
Recommended
Industrial Motor Control
The 10M08DCF256A7G's 178 I/Os handle multi-axis stepper and BLDC drive signals including PWM, encoder feedback (QEI), and fault inputs. The four on-die PLLs generate jitter-free switching frequencies up to 312 MHz, while 378 Kbit of M9K memory buffers commutation lookup tables. The device's instant-on flash ensures deterministic startup in safety-critical conveyor and robotic systems.
Recommended
I/O Expansion and Bridging
The 10M08DCF256A7G serves as a cost-effective I/O expander and protocol bridge in industrial PLCs and modular instrumentation. The device converts SPI to UART, isolates I2C buses, adds GPIO ports to MCUs, and implements custom glue logic without resorting to multiple 74-series TTL parts. The 256-LBGA package's 1.0 mm pitch keeps the PCB area under 17x17 mm despite the high I/O count.
Recommended
Video Bridging and Display Control
The 10M08DCF256A7G implements LVDS-to-RGB bridges, MIPI display controllers, and timing generators for industrial HMIs and medical carts. With 178 user I/Os and LVDS support, the device drives 24-bit parallel TFT panels, deinterlaces video streams, and synchronizes dual-camera pipelines. The integrated ADC samples ambient light for automatic backlight dimming.
Recommended
Portable Medical Instrumentation
The 10M08DCF256A7G powers portable ECG, pulse-oximeter, and infusion-pump control boards where instant-on, deterministic boot, and low power are mandatory. The integrated 12-bit ADC reads multiple sensor channels while the FPGA fabric handles digital filtering, lead-off detection, and Bluetooth beacon signaling. The automotive-grade temperature range supports ambulance and outdoor clinic deployments.
Recommended
Factory Automation Backplane
The 10M08DCF256A7G acts as a backplane FPGA in industrial rack systems, implementing custom PCIe-style point-to-point links, EtherCAT slave controllers, and PROFINET IRT gateways. Its 8,000 LE capacity handles real-time Ethernet protocol stacks while 387 Kbit of SRAM buffers process data. The automotive-grade silicon survives harsh cabinet thermal environments near motor drives.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DCF256A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAF256A7G | 10M08DAF256C7G | 10M08DAF256C8G | 10M04DCF256A7G | 10M08DCF256C7G |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 8,000 LE | 8,000 LE | 8,000 LE | 8,000 LE | 4,000 LE (-50%) | 8,000 LE |
| Embedded Memory | 378 Kbit (387,072 bits) | 378 Kbit | 378 Kbit | 378 Kbit | 189 Kbit (-50%) | 378 Kbit |
| User I/Os | 178 | 178 | 178 | 178 | 178 | 178 |
| Speed Grade | -7 | -7 | -7 | -8 (faster) | -7 | -7 |
| Temperature Grade | Automotive (-40C to +125C) | Automotive | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive | Commercial (0C to +85C) |
| Configuration Memory | On-die dual-configuration flash | On-die flash | On-die flash | On-die flash | On-die flash | On-die flash |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Approx. qty-1 Unit Price (USD) | $24.70 | Similar | Lower (commercial) | Higher (faster speed grade) | Lower (smaller density) | Lower (commercial) |
Key Differentiators
- On-die non-volatile configuration flash for instant-on (vs LCMXO2-256HC)
- Integrated 12-bit ADC reduces external analog components (vs 10M04DCF256A7G)
- Automotive temperature grade at 256-LBGA F256 footprint (vs 10M08DCF256C7G)
Design Notes
The 256-LBGA F256 package uses a 16x16 ball grid at 1.0 mm pitch, requiring at least 6 layers with HDI microvias for fanout escape routing. Per the Intel MAX 10 hardware design guidelines, place 0.1 uF and 10 uF decoupling capacitors within 100 mils of every VCC and GND ball pair. Use a continuous ground plane on L2 directly beneath the BGA and stitch vias every 200 mils along the perimeter to suppress SSN noise. Failing to provide adequate power delivery will cause PLL jitter and configurability failures during flash programming.
Estimated: at junction temperature 125C ambient with 0.5 W FPGA dissipation, the thermal resistance of the 256-LBGA package is approximately 18 C/W with a 4-layer JEDEC JESD51-9 test board. This yields a junction-to-ambient rise of 9 C, well within the automotive grade. However, the integrated ADC and four PLLs can each add 200-300 mW at full load, so plan thermal vias to a copper heat-spreader plane. For fanless industrial enclosures, derate by 20% to account for confined airflow.
Do not assume 10M08DCF256A7G can boot from a blank factory flash - the device ships with a default bitstream that may not match your design. Always program the on-die flash via JTAG or AS mode before power-on validation. A common pitfall is leaving the nCONFIG pin floating during in-system programming, which causes intermittent configuration failures. Tie nCONFIG to VCCIO through a 10 kohm pull-up and place a 1 nF bypass to ground. Per Intel MAX 10 configuration handbook, ensure JTAG TCK frequency stays below 25 MHz to avoid signal integrity issues.
Route all LVDS pairs with 100 ohm differential impedance and length matching within 5 mils for the 178 user I/Os. Place series-termination resistors within 200 mils of the FPGA driver pin to dampen reflections on high-speed I/O banks. According to the MAX 10 device handbook, place the external clock reference crystal or oscillator within 200 mils of the dedicated CLK pin and guard the trace with ground on both sides. Avoid routing any signal over the BGA's antipad voids to preserve signal integrity.
Compliance Information
RoHS compliant per Intel product declaration. Automotive temperature grade supports AEC-Q100 qualification context (refer to specific Intel PPAP documentation). Halogen-free molding compound per JEDEC JS709.
