10M25DAF256C7G - MAX 10 FPGA, 25K LE, 256-LBGA | Intel / Altera
MPN: 10M25DAF256C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.17 | $62.17 |
| 10 | $55.95 | $559.50 |
| 100 | $48.5 | $4,850.00 |
| 500 | $42.2 | $21,100.00 |
| 1,000 | $38.75 | $38,750.00 |
Drop-in alternatives for 10M25DAF256C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF256I7G
✅ Drop-In✓ In Stock
$60.3 / Unit
View Datasheet →10M25DAF256C8G
✅ Drop-In✓ In Stock
$45.3 / Unit
View Datasheet →10M25DAF256A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M25DAF256C7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 691,200 bits (M9K blocks) |
| User I/Os | 178 |
| Package | 256-LBGA (F256) |
| Speed Grade | -C7 |
| Temperature Grade | Commercial (0C to +85C) |
| Mounting Type | Surface Mount |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Integrated ADC | Yes, 12-bit (family feature) |
| DSP Blocks | Yes (family feature) |
| PLLs | Yes (family feature) |
| RoHS Status | Compliant |
| Operating Temperature | 0C to +85C |
10M25DAF256C7G 256-lbga (f256) Pin Configuration Guide
Complete pinout information for 10M25DAF256C7G (256-lbga (f256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DAF256C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DAF256C7G is suitable for 6 applications: Industrial Machine Vision, Factory Automation Controllers, Motor Control and Drive Interfaces, Video Format Conversion and Bridging, IoT Edge Sensor Nodes, Glue Logic Consolidation.
Industrial Machine Vision
The 10M25DAF256C7G's 25K logic elements and 691 Kbit embedded SRAM make it well suited for industrial machine vision preprocessing pipelines such as image binarization, blob detection, and line-scan buffering. The 178 user I/Os in the 256-LBGA package can directly interface with parallel CMOS image sensors (e.g., 8-bit or 16-bit data buses) and Camera Link base configuration. The integrated 12-bit ADC and DSP blocks further enable on-chip histogram equalization and edge-detection kernels. Unlike a microcontroller, the parallel hardware architecture sustains full frame rates at 60+ fps without software bottlenecks, making the 10M25 a strong fit for in-line factory inspection.
Recommended
Factory Automation Controllers
In factory automation, the 10M25DAF256C7G can replace multiple CPLDs or discrete logic glue by consolidating encoder interfacing, PWM generation, and fieldbus bridging in a single instant-on device. The on-chip flash configuration eliminates boot delays, enabling the controller to start within microseconds of power-up - critical for deterministic industrial Ethernet cycles. With 25K LE and 178 I/Os, the F256 LBGA can handle multi-axis stepper/servo control loops with quadrature decoder IP, while DSP blocks accelerate digital filtering on encoder feedback. The commercial 0C-85C temperature range covers most indoor control cabinets.
Recommended
Motor Control and Drive Interfaces
The 10M25DAF256C7G is a strong fit for motor control interface boards that need to generate multi-channel PWM, decode quadrature encoder feedback, and execute field-oriented control (FOC) loops. The device's DSP blocks accelerate Park/Clarke transforms and PI controllers at PWM switching frequencies up to 50 kHz, while 691 Kbit embedded memory buffers current/voltage sample arrays between ADC conversions. The 178 user I/Os in the F256 LBGA expose enough pins to drive six-channel three-phase inverters plus resolver/excited encoders. MAX 10's instant-on capability supports safety-critical start-up sequencing.
Recommended
Video Format Conversion and Bridging
The 10M25DAF256C7G handles video format conversion such as HDMI-to-LVDS, MIPI-CSI2 to parallel RGB, or interlaced-to-progressive conversion. Its 25K LE provide enough logic to instantiate color-space converters and scalers, while 691 Kbit embedded memory acts as line buffers for frame-rate conversion without external SDRAM. The 178 user I/Os in the F256 LBGA accommodate LVDS pairs (typically 1 LVDS pair per 2 pins) for high-speed video links up to several hundred MHz. The commercial temperature grade and integrated ADC simplify consumer video products and digital signage controllers.
Recommended
IoT Edge Sensor Nodes
The 10M25DAF256C7G's instant-on flash configuration makes it attractive for IoT edge nodes that wake from sleep and need to begin sampling sensors within microseconds, preserving battery life. The integrated 12-bit ADC directly digitizes analog sensor outputs (temperature, pressure, strain gauges) without an external ADC chip. With 25K LE, the device can run lightweight DSP pre-processing (FIR filters, FFT bins) on edge data before forwarding via SPI, I2C, or UART to a host MCU. The 256-LBGA F256 package exposes enough I/O to fan out to multiple sensor buses and wireless modules.
Recommended
Glue Logic Consolidation
Designers traditionally use multiple 5V or 3.3V CPLDs to perform address decoding, bus arbitration, watchdog timing, and reset sequencing between microcontrollers, ASICs, and memories. The 10M25DAF256C7G consolidates those functions into a single 25K LE device, reducing PCB area and BOM cost. The 178 user I/Os in the F256 LBGA accommodate wide address/data buses, while DSP and PLL resources generate multiple clock domains needed for memory and peripheral timing. Quartus Prime IP library provides standardized bridges, FIFOs, and memory controllers that shorten glue-logic design cycles from weeks to days.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DAF256C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF256I7G | 10M25DAF256C8G | 10M25DAF256A7G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256) | 256-LBGA (F256) | 256-LBGA (F256) | 256-LBGA (F256) |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 |
| Embedded Memory | 691,200 bits | 691,200 bits | 691,200 bits | 691,200 bits |
| User I/Os | 178 | 178 | 178 | 178 |
| Speed Grade | -C7 | -I7 (industrial temp) | -C8 (faster) | -A7 (slower, lower-cost) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| On-Chip Flash | Yes | Yes | Yes | Yes |
| Configuration Memory | Internal non-volatile flash (instant-on) | Internal non-volatile flash (instant-on) | Internal non-volatile flash (instant-on) | Internal non-volatile flash (instant-on) |
| RoHS Compliance | Yes | Yes | Yes | Yes |
Key Differentiators
- On-chip flash configuration enables instant-on operation without external boot memory (vs Cyclone V (5CEFA4F23I7N))
- Integrated 12-bit ADC eliminates external ADC for analog monitoring (vs Lattice ECP5 (LFE5U-25F))
- Mid-density 25K LE balances capacity and cost for industrial workloads (vs MAX 10 10M16 (16K LE))
Design Notes
The MAX 10 10M25 has separate VCCINT (core), VCCA (PLL analog), and VCCIO (I/O bank) rails. Decouple each rail with 100 nF X7R ceramic capacitors placed within 5 mm of each power pin, plus bulk 10-47 uF tantalum or polymer capacitors per rail. Power-on sequencing is not required (on-chip flash eliminates boot dependencies), but VCCIO banks must be at valid logic levels before any I/O toggles to avoid latch-up. Estimate: total quiescent current is approximately 100-300 mA at 1.2 V VCCINT, plus I/O leakage; always refer to the MAX 10 power management user guide for design-specific budgets.
Estimated: at typical utilization (~70% LE, ~50% memory) the 10M25DAF256C7G dissipates approximately 1-2 W. The 256-LBGA F256 package has a thermal resistance of approximately 15-25 C/W with a properly designed PCB thermal pad array on inner layers. Forced airflow (200 LFM) is recommended in sealed enclosures above 1.5 W. Use Quartus Prime PowerPlay power analyzer to generate accurate thermal estimates for the compiled design before finalizing the mechanical design.
The 256-LBGA F256 uses a 1.0 mm ball pitch. Follow Intel's MAX 10 PCB layout guidelines: microvia stack-ups (laser-drilled 0.1 mm vias) are strongly recommended for inner escape routing; 4-6 layer stack-up with continuous ground planes beneath the device is mandatory for signal integrity on high-speed LVDS and DDR interfaces. Keep all decoupling loop areas under 3 mm squared; route all differential pairs with 100 ohm differential impedance and length matching within 150 mils.
Do not confuse the F256 LBGA with the F484 FBGA - they are different packages and footprints. Always verify the full OPN suffix (256-LBGA = F256, 484-FBGA = F484). When migrating between MAX 10 densities in the same F256 package, confirm that the I/O count and bank voltages of the target device match your schematic; I/O banks can differ between densities. Do not assume the configuration mode (AS, PS, JTAG) is set correctly by Quartus default - explicitly set MSEL pins per your board's boot topology.
Compliance Information
RoHS compliant per Intel MAX 10 product page. Commercial temperature grade only (-C7); not AEC-Q100 qualified. Choose -I7 or -A7 suffix variants for industrial or automotive applications.
