5CSEBA6U19C8SN - Cyclone V SE SoC FPGA 110K LE, ARM A9 | Intel
部品番号: 5CSEBA6U19C8SN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $263 | $2,630.00 |
| 100 | $241 | $24,100.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $205 | $205,000.00 |
5CSEBA6U19C8SN 概要
What is a SoC FPGA? A SoC FPGA combines a hard processor subsystem (HPS) with FPGA fabric on a single die, bridging the gap between microcontrollers and standalone FPGAs. Within the broader taxonomy, the 5CSEBA6U19C8SN sits as: SoC FPGA -> FPGA & SoC -> Programmable Logic -> Integrated Circuit -> Semiconductor. This integration reduces board area, simplifies power sequencing between processor and fabric, and enables higher-bandwidth processor-to-FPGA bridges than discrete multi-chip solutions.
Key features include the dual-issue ARM Cortex-A9 MPCore with NEON media engine and single-precision FPU, up to 600 MHz HPS clock, 110K logic elements, 224 DSP blocks (18x18 multipliers), and integrated transceivers up to 5 Gbps. The 28nm low-power process delivers static power below typical competing 40/65nm FPGAs, while the variable-precision DSP architecture allows designers to trade precision for dynamic power on a block-by-block basis.
Technical depth: the device implements a coherent Cortex-A9 core with 32 KB L1 instruction and data caches per core, 512 KB shared L2 cache, and a multi-port SDRAM controller supporting DDR2/DDR3/LPDDR2. The FPGA fabric uses 8-input adaptive logic modules (ALMs), M20K embedded memory blocks, and up to 224 variable-precision DSP blocks. Processor-to-FPGA interconnect uses the AXI bridge, enabling >125 Gbps aggregate throughput between HPS and fabric.
Typical applications include industrial motor control, factory automation, machine vision, automotive driver-assistance prototypes, video surveillance, and low-cost software-defined radio. The 5CSEBA6U19C8SN is also widely deployed in embedded Linux single-board computers where deterministic real-time response is required alongside user-space Linux.
A primary design consideration is PCB layout for the 484-ball UFBGA - all 484 balls must be routed on a high-density interconnect (HDI) board with micro-via stackups, and at least one full PCB layer must be dedicated to GND under the package thermal pad for thermal dissipation.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: 5CSEBA6U19C8SN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5CSEBA6U19C8SN （同一形状・フットプリント） — 相違点: Package, DSP Blocks, Operating Temperature, Logic Elements, Family.
クイック比較ツール — 並列比較する代替部品を選択:
5CSEBA6U19C8N
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →5CSEBA6U19C7SN
✅ ドロップイン✓ 在庫あり
$149.85 / 個
データシートを見る →5CSEBA6U19C7N
✅ ドロップイン✓ 在庫あり
$155.29 / 個
データシートを見る →5CSEBA6U19C6N
✅ ドロップイン✓ 在庫あり
$194.15 / 個
データシートを見る →5CSEBA6U19A7N
✅ ドロップイン✓ 在庫あり
$198.4 / 個
データシートを見る →5CSEBA5U19C8SN
✅ ドロップイン✓ 在庫あり
$162 / 個
データシートを見る →5CSEBA6U19C8SN 最大定格＆電気的特性
| Product Type | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Family | Cyclone V SE |
| Logic Elements | 110,000 |
| HPS Core | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | 28 nm low-power |
| DSP Blocks (18x18) | 224 |
| Transceivers | Up to 5 Gbps (per Cyclone V SE family) |
| パッケージ | 484-pin UFBGA (19x19 mm) |
| Core Voltage | 1.1 V |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Ball Count | 484 |
5CSEBA6U19C8SN 484-pin ufbga (19x19 mm) ピン配置ガイド
5CSEBA6U19C8SN (484-pin ufbga (19x19 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5CSEBA6U19C8SN.
詳細は データシート をご参照ください。
主な用途
5CSEBA6U19C8SN の用途: 6 件s: Industrial Motor Control, Machine Vision and Video Surveillance, Automotive Driver-Assistance Prototypes, Factory Automation and PLC Controllers, Software-Defined Radio and Baseband Processing, Embedded Linux Single-Board Computers.
Industrial Motor Control
The 5CSEBA6U19C8SN is widely used in industrial servo drives, vector controllers, and stepper motor drivers where tight latency between sensor feedback and PWM output is required. Its single 600 MHz ARM Cortex-A9 HPS runs Linux or RTOS for supervisory control and fieldbus protocols (EtherCAT, PROFINET), while the 110K logic elements deliver deterministic PWM generation, encoder quadrature decoding, and current-loop control at microsecond resolution. The 224 variable-precision DSP blocks accelerate Park/Clarke transforms and PI loops at high PWM frequencies (up to 200 kHz), and the 28nm low-power process reduces heat dissipation in sealed cabinet designs. The integrated HPS also supports direct DDR3 access for trajectory buffers without fabric memory overhead.
おすすめ
Machine Vision and Video Surveillance
In machine vision and IP-camera designs, the 5CSEBA6U19C8SN pairs its Cortex-A9 HPS (running Linux with OpenCV) with FPGA fabric implementing high-throughput image processing pipelines such as Sobel edge detection, Gaussian filtering, and H.264/H.265 encode pre-processing. The 110K LE support multi-lane MIPI CSI-2 or LVDS camera ingest at 1080p60 with on-chip buffering, while the DDR3 controller in the HPS holds full frame buffers without external memory contention. The integrated transceivers enable GigE Vision or CoaXPress uplink for industrial cameras. Power efficiency from the 28nm process allows fanless IP66-rated enclosure designs, and the 484-ball UFBGA is sized for compact 4-layer HDI camera PCBs.
おすすめ
Automotive Driver-Assistance Prototypes
The 5CSEBA6U19C8SN's automotive-grade sibling (5CSEBA6U19A7N in the same U19 package) is deployed in ADAS development platforms, surround-view ECUs, and rear-view camera systems. The single Cortex-A9 HPS runs AUTOSAR or Linux for sensor fusion, while FPGA fabric accelerates multi-camera stitching and lane-departure algorithms. The 28nm low-power process helps meet ISO 26262 thermal budgets in sealed under-dash enclosures. While the 5CSEBA6U19C8SN itself is commercial grade, the same silicon is qualified for AEC-Q100 in the -A variant, enabling one design to be prototyped with the C8SN and then transferred to the automotive-qualified A7N for production without PCB redesign.
おすすめ
Factory Automation and PLC Controllers
Compact PLCs and edge gateways use the 5CSEBA6U19C8SN as a single-chip controller: the Cortex-A9 HPS runs IEC 61131-3 runtime, OPC UA server, and Modbus/TCP, while the FPGA fabric implements fast digital I/O (counter, PWM, frequency measurement) and inter-module communication. The 110K LE accommodate up to 32 high-speed counters with 100 kHz sampling, and the 484-ball UFBGA exposes 4 SERDES lanes for EtherCAT or PROFINET IRT slave connectivity via companion PHYs. The integrated DDR3 controller with ECC is valuable for SIL-rated industrial safety applications (IEC 61508). The 28nm process's low static current reduces thermal stress in DIN-rail enclosures with no forced cooling.
おすすめ
Software-Defined Radio and Baseband Processing
Low-cost SDR platforms use the 5CSEBA6U19C8SN's 224 18x18 DSP blocks to implement digital down/up-conversion, FIR/IIR filtering, and FFT cores for narrowband waveforms up to ~30 MHz of instantaneous bandwidth. The integrated transceivers interface directly to RF front-end ADCs/DACs without external bridge logic. The single Cortex-A9 HPS handles host-side protocol stack (GNU Radio, LTE stack, or custom waveforms) over Gigabit Ethernet. With 110K LE the device fits SDR designs targeting tactical radio, ISM-band modem, and small-cell prototype applications. Power-efficient 28nm operation enables battery-powered portable SDR kits.
おすすめ
Embedded Linux Single-Board Computers
Hobbyist and commercial SBCs use the 5CSEBA6U19C8SN as the central SoC: the Cortex-A9 HPS boots mainline Linux with GPU-less framebuffer via simple-framebuffer, and the FPGA fabric provides user-defined expansion peripherals (custom UART/SPI/I2C bridges, retro-SoC accelerators, RISC-V soft-cores). The 110K LE fit several soft-core processors plus custom logic, and the integrated HPS Ethernet MACs (typically 2x Gigabit) plus USB 2.0 OTG give complete host connectivity. The 484-ball UFBGA package is supported by multiple open-source SoC-FPGA carrier board designs (e.g. DE10-Nano class boards), shortening time-to-prototype.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5CSEBA6U19C8SN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5CSEBA6U19C8N | 5CSEBA6U19C7SN | 5CSEBA6U19C6N | 5CSEBA6U19A7N | 5CSEBA5U19C8SN |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-pin UFBGA (19x19 mm) U19 | 484-pin UFBGA (19x19 mm) U19 - same | 484-pin UFBGA (19x19 mm) U19 - same | 484-pin UFBGA (19x19 mm) U19 - same | 484-pin UFBGA (19x19 mm) U19 - same | 484-pin UFBGA (19x19 mm) U19 - same |
| Logic Elements | 110,000 | 110,000 (identical) | 110,000 (identical) | 110,000 (identical) | 110,000 (identical) | 85,000 (-23%) |
| HPS Core | Single ARM Cortex-A9 MPCore, 600 MHz | Single ARM Cortex-A9, 600 MHz (same) | Single ARM Cortex-A9, 600 MHz (same) | Single ARM Cortex-A9, 600 MHz (same) | Single ARM Cortex-A9, 600 MHz (same) | Single ARM Cortex-A9, 600 MHz (same) |
| Speed Grade | -8 (fastest C8SN speed grade) | -8 (standard) | -7 (slower) | -6 (slowest) | -7 automotive | -8 fastest |
| DSP Blocks (18x18) | 224 | 224 (identical) | 224 (identical) | 224 (identical) | 224 (identical) | 156 (lower density) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Automotive (AEC-Q100) | Commercial |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
主な差別化要因
- Fastest speed grade in same-package family （vs 5CSEBA6U19C7SN)
- Maximum logic density within U19 footprint （vs 5CSEBA5U19C8SN)
- Commercial temperature grade at -8 speed grade （vs 5CSEBA6U19A7N)
設計ノート
The 484-ball UFBGA (19x19 mm) requires HDI PCB stackup with micro-vias; each ball pad has 0.5 mm pitch with staggered or laser-drilled vias in fan-out. Route at least 4 signal layers plus dedicated GND and power planes. Use the manufacturer's pin-out file with the U19 package code to identify HPS Ethernet, USB, and DDR3 ball assignments early in the stackup design - re-spins are expensive once HDI artwork is fabricated.
Estimated: at typical industrial utilization (40% LE, 50% DSP, 600 MHz HPS), junction temperature rise on the 484-ball UFBGA is roughly 15-25 C above ambient with 6-layer 1 oz copper thermal pad. Apply a continuous thermal pad via array on the bottom of the package connected to a GND pour extending at least 200 mils beyond the package edges. For >50% LE utilization with active transceivers, active cooling (small heatsink or airflow) is recommended.
Use Intel's Early Power Estimator (EPE) spreadsheet with the Cyclone V device selector to size regulator budgets. Required rails typically include 1.1 V core, 1.2 V/1.5 V/1.8 V DDR3, 2.5 V/3.3 V I/O, and a separate HPS rail. Decouple each rail with a 100 uF bulk + 10 uF + 1 uF + 0.1 uF ceramic stack placed within 5 mm of each supply pin pair to meet in-rush current and high-frequency switching noise requirements.
Do not confuse the 5CSEBA6 (110K LE) with 5CSEBA5 (85K LE) or 5CSEBA4 (75K LE) when designing for headroom - they share the U19 footprint but the smaller-density parts will fail timing if you assume 110K LE of fabric exists. Also verify the speed-grade letter position: 5CSEBA6U19C8SN is -8 with N suffix; ordering code with N suffix is -8 standard while without is -8S faster. Quartus Prime fitter settings differ between speed grades.
コンプライアンス情報
RoHS compliance confirmed by all authorized distributors and the Altera/Intel product page. For AEC-Q100 qualification, choose the 5CSEBA6U19A7N variant (same package).
