5CSEBA6U23C8SN - Cyclone V SE SoC FPGA, 110K LE, ARM Cortex-A9 | Intel
部品番号: 5CSEBA6U23C8SN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 250 | $1495 | $373,750.00 |
| 500 | $1420 | $710,000.00 |
5CSEBA6U23C8SN 概要
What is a SoC FPGA? A SoC FPGA combines a hard processor subsystem (typically ARM Cortex-A) with FPGA fabric on a single die. The HPS handles deterministic boot, OS run-time, and high-speed peripheral interfacing while the FPGA implements custom accelerators, glue logic, and parallel datapaths. SoC FPGAs sit at the top of the embedded computing hierarchy, above discrete MCU+FPGA dual-chip solutions and below pure ASICs.
The Cyclone V SE SoC uses TSMC's 28 nm low-power process, providing the fabric and HPS at a fraction of the static power of previous 40 nm Cyclone generations. The HPS integrates 10/100/1000 Ethernet MAC, USB 2.0 OTG, NAND flash controller, DDR2/DDR3 memory controller with ECC, and SD/MMC interfaces. The FPGA fabric supports up to 364 18x18 multipliers for variable-precision DSP, distributed and M10K block RAM, and up to 17 LVDS channels at 875 Mbps. Configuration is via fast passive parallel (FPP) or active serial (AS) flash with built-in decompression.
Typical applications include industrial machine vision, motor control drives, broadcast video processing, factory automation controllers, and portable medical instrumentation. The dual ARM cores support Linux or RTOS run-time while the FPGA fabric accelerates pixel pipelines, sensor aggregation, or signal processing tasks. Hardened peripherals offload deterministic I/O from the cores, reducing jitter in real-time control loops.
Design consideration: pin-muxing between HPS peripherals and FPGA I/O must be planned in early system design because HPS balls are dedicated while FPGA balls are user-assignable. Quartus Prime pin planner should be used to validate ball assignments before PCB fabrication to avoid costly respins.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for procurement and design decisions.
ドロップイン代替品: 5CSEBA6U23C8SN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5CSEBA6U23C8SN （同一形状・フットプリント） — 相違点: Package, Logic Elements, DSP Blocks, HPS Peripherals, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
5CSEBA6U23C8N
✅ ドロップイン✓ 在庫あり
$132 / 個
データシートを見る →5CSEBA6U23C7SN
✅ ドロップイン✓ 在庫あり
$410 / 個
データシートを見る →5CSEBA6U23C7N
✅ ドロップイン✓ 在庫あり
$185 / 個
データシートを見る →5CSEBA5U23C8SN
✅ ドロップイン✓ 在庫あり
$198.5 / 個
データシートを見る →5CSEBA4U23C8SN
✅ ドロップイン✓ 在庫あり
$15.95 / 個
データシートを見る →5CSEBA2U23C8SN
✅ ドロップイン✓ 在庫あり
$69.8 / 個
データシートを見る →5CSEBA6U19C8SN
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$205 / 個
データシートを見る →5CSEBA6U23C8SN 最大定格＆電気的特性
| Family | Cyclone V SE SoC FPGA |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) |
| Logic Elements | 110,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| DSP Blocks | 224 (18x18 multipliers) |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART |
| LVDS Channels | Up to 17 (875 Mbps) |
| Process Technology | TSMC 28 nm low-power |
| パッケージ | 672-ball UBGA (23x23 mm) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
5CSEBA6U23C8SN 672-ball ubga (23x23 mm) ピン配置ガイド
5CSEBA6U23C8SN (672-ball ubga (23x23 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5CSEBA6U23C8SN.
詳細は データシート をご参照ください。
主な用途
5CSEBA6U23C8SN の用途: 6 件s: Industrial Machine Vision Systems, Motor Control and Drive Systems, Broadcast Video Processing Equipment, Factory Automation Controllers, Portable Medical Instrumentation, Automotive Infotainment and ADAS Prototypes.
Industrial Machine Vision Systems
The 5CSEBA6U23C8SN fits industrial machine vision systems because its single ARM Cortex-A9 MPCore at 600 MHz runs Linux with image processing stacks (OpenCV) while the 110K LE FPGA fabric accelerates Bayer demosaicing, edge extraction, and HDR pixel pipelines. The HPS Gigabit Ethernet MAC supports GigE Vision camera interfaces at wire speed, and the USB 2.0 OTG enables flash or Wi-Fi dongle connectivity. With 224 DSP blocks, the FPGA can implement real-time convolution kernels at 1080p60 frame rates. Hardened DDR3 with ECC memory controller handles 4 GB of frame buffers without FPGA fabric overhead, and 4.45 Mbits embedded memory supports line buffers for multi-tap filters. Industrial camera OEMs benefit from BOM reduction by replacing MCU + FPGA dual-chip designs with a single SoC FPGA.
おすすめ
Motor Control and Drive Systems
The 5CSEBA6U23C8SN is well suited for AC induction, BLDC, and servo motor control drives because the ARM Cortex-A9 HPS executes the velocity/torque control loops while the FPGA fabric implements deterministic PWM generation, encoder decoding (QEP, SSI, EnDat), and field-oriented control (FOC) math. The HPS floating-point NEON media engine accelerates Park/Clarke transforms, and 224 DSP blocks enable 50 kHz current loop rates with sub-microsecond latency. Hardened peripherals (CAN, SPI, I2C, UART) integrate directly with industrial networking stacks (CANopen, EtherCAT slave) and the dual-port Ethernet MAC supports EtherCAT with external PHY. The 28 nm low-power process keeps drive inverter enclosures below thermal limits, critical for IPM-mounted designs.
おすすめ
Broadcast Video Processing Equipment
The 5CSEBA6U23C8SN supports broadcast video processing applications including HDMI switching, video scaling, and broadcast format conversion. The FPGA fabric implements 3G-SDI/HD-SDI transceivers via LVDS channels (up to 17 LVDS pairs at 875 Mbps), color space conversion, and deinterlacing at full 1080p60. The HPS runs a Linux media stack handling HDMI-CEC, HDCP authentication, and audio mixing via I2S. The 4.45 Mbits embedded memory serves as line buffers for scaling, and 224 DSP blocks accelerate 2D FIR filters for chroma upsampling. Single-Cyclone-V BOM replaces discrete FPGA + host MCU + HDMI bridge chips, reducing board area and BOM cost in professional AV rack equipment.
おすすめ
Factory Automation Controllers
The 5CSEBA6U23C8SN drives factory automation controllers because the single ARM Cortex-A9 HPS runs a real-time Linux or RTOS (FreeRTOS, VxWorks) handling Modbus/TCP, OPC-UA, and PROFINET slave stacks, while the FPGA fabric implements deterministic glue logic, multi-axis PWM, and safety interlocks. The hardened peripherals (CAN, SPI, I2C, UART) interface directly to industrial sensors and actuators. 17 LVDS channels support high-speed industrial cameras, and 224 DSP blocks accelerate vibration analysis FFTs at 50 kHz sample rates for predictive maintenance. DDR3 with ECC provides radiation-tolerant memory for harsh factory environments with electrical noise, and 28 nm low-power process enables fanless DIN-rail mounted controller designs.
おすすめ
Portable Medical Instrumentation
The 5CSEBA6U23C8SN suits portable medical devices such as patient monitors, ultrasound beamformers, and point-of-care diagnostic analyzers because the ARM Cortex-A9 HPS runs the GUI and connectivity stack (Wi-Fi, BLE, USB) while the FPGA fabric performs signal acquisition, digital filtering, and DSP at deterministic latency. The 4.45 Mbits embedded memory buffers ADC samples before DMA to DDR, and 224 DSP blocks accelerate FIR decimation filters for ECG, EMG, or pulse oximetry front-ends. Low static power from the 28 nm process extends battery life in handheld designs, and the small 672-ball UBGA footprint fits compact portable enclosures. Hardened USB 2.0 OTG enables direct connection to hospital EMR systems for bedside data upload.
おすすめ
Automotive Infotainment and ADAS Prototypes
The 5CSEBA6U23C8SN powers automotive infotainment prototypes and pre-production ADAS sensor-fusion platforms because the single ARM Cortex-A9 MPCore runs QNX or Linux with full instrument-cluster graphics stacks, while the FPGA fabric implements MIPI-CSI2 camera aggregation (up to 17 LVDS channels), surround-view stitching, and lane-detection algorithms in DSP blocks. The HPS CAN interfaces integrate with vehicle bus networks, and 224 DSP blocks accelerate 360-degree video stitching at 30 fps. For pre-production prototypes, this SoC FPGA delivers the deterministic real-time processing required for ADAS before committing to an ASIC. Designers should note the SE class is not AEC-Q100 qualified - production vehicles require ASIL-rated automotive processors.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5CSEBA6U23C8SN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5CSEBA6U23C8N | 5CSEBA6U23C7SN | 5CSEBA5U23C8SN | 5CSEBA4U23C8SN |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball UBGA (23x23, U23) | 672-ball UBGA (23x23, U23) - same | 672-ball UBGA (23x23, U23) - same | 672-ball UBGA (23x23, U23) - same | 672-ball UBGA (23x23, U23) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 85,000 | 49,000 |
| DSP Blocks | 224 | 224 | 224 | 156 | 116 |
| Embedded Memory (Mbits) | 4.45 | 4.45 | 4.45 | 3.97 | 3.16 |
| HPS Processor | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz |
| Speed Grade | 8 (commercial) | 8 (commercial) | 7 (commercial) | 8 (commercial) | 8 (commercial) |
| RoHS Compliance | Yes (leaded, SN suffix) | Yes (lead-free, N suffix) | Yes (leaded, SN suffix) | Yes (leaded, SN suffix) | Yes (leaded, SN suffix) |
主な差別化要因
- Highest logic element count in Cyclone V SE SoC family （vs 5CSEBA5U23C8SN)
- Highest DSP block count among 5CSEBAx variants （vs 5CSEBA4U23C8SN)
- Speed grade 8 provides the highest performance in the family （vs 5CSEBA6U23C7SN)
設計ノート
The Cyclone V SE SoC FPGA requires a multi-rail power supply: VCCINT (1.1V core for FPGA fabric and HPS), VCCPD (2.5V/3.3V I/O pre-drivers), VCCIO (1.2V-3.3V I/O banks), and HPS-specific VCC_HPS (1.1V core) plus HPS_VCCIO. Use a dedicated sequencing controller such as the TPS3808 or LTC3026 to enforce power-up sequencing. Estimated: typical total board power is 5-10W depending on fabric utilization and HPS workload; HPS-only idle draws approximately 1.5W, while full utilization (HPS + 110K LE @ 60% toggle rate) draws 8-12W. Decoupling: place 0402 ceramic capacitors every 20 balls with 1 uF near each supply pin and 100 nF bulk caps at supply entry points.
The 672-ball UBGA package has theta_JA of approximately 14 C/W with standard JEDEC 2s2p PCB. At 8W dissipation, the junction-to-ambient temperature rise is approximately 112C, which will exceed the 100C commercial limit. For designs exceeding 5W, use a 4-layer PCB with continuous inner ground planes, multiple thermal vias under the package center, and consider a heatsink or active airflow. Cyclone V SE supports thermal diode output for in-system monitoring via the HPS temperature sensor. Estimated: junction temperature at 8W with standard 4-layer PCB is approximately TJ = TA + 8W * 14 C/W = TA + 112C; ensure TA < 88C for commercial grade operation.
BGA fanout strategy: use microvia (laser-drilled, 0.1 mm pitch) stackup with 1-2 signal layers per BGA row. Avoid via-in-pad unless assembly supports it (ENIG + gold plating). Differential pair routing (LVDS, USB, Ethernet) must maintain 100 ohm differential impedance with length matching within 150 mil. DDR3 routing requires fly-by topology for address/command signals with series termination at the controller; data byte lanes must be length-matched within 50 mil. Quartus Prime DDR3 IP provides PCB guidelines; otherwise follow JEDEC JESD79-3.
Common pitfalls: (1) HPS ball functions are fixed - attempting to repurpose them as FPGA I/O causes configuration failure; consult the pin tables before layout. (2) JTAG chain - always include a 10-pin Cortex Debug + Altera JTAG header for development; production boards should populate a JTAG header only on validation units. (3) Configuration scheme - selecting AS (active serial) mode requires a valid EPCQ flash; do not boot from JTAG only in production. (4) SE class SoC FPGA does NOT include transceivers - for serial protocols above 1 Gbps, choose SX or ST variants.
Use Quartus Prime pin planner early in the design to assign FPGA ball functions and validate against HPS fixed pinout. Bank voltage selection (VCCIO 1.2V, 1.5V, 1.8V, 2.5V, 3.3V) must match your external logic; mixing voltages within a bank is not supported. Clock routing: place dedicated clock input pins near the FPGA corner to minimize jitter from CLK skew. The HPS has dedicated clock pins (HPS_CLK1, HPS_CLK2) that should be driven from low-jitter crystal oscillators rather than the FPGA fabric. Reference Intel Cyclone V Device Handbook pin tables for recommended pin assignments.
コンプライアンス情報
RoHS compliant per Intel product page. The 'SN' suffix denotes leaded finish; the 'N' suffix variant is lead-free. The Cyclone V SE SoC family is not AEC-Q100 qualified - production automotive designs must use qualified processors such as TDA2x or ASIL-rated components.
