5M1270ZF324I5N - MAX V 980-Macrocell CPLD, 324-FBGA | Intel
MPN: 5M1270ZF324I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $21.01 | $21.01 |
| 10 | $19.5 | $195.00 |
| 100 | $17.85 | $1,785.00 |
| 500 | $15.9 | $7,950.00 |
| 1,000 | $13.95 | $13,950.00 |
Drop-in alternatives for 5M1270ZF324I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5M1270ZF324C5N
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View Datasheet →5M1270ZF324C4N
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View Datasheet →5M1270ZF324A5N
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View Datasheet →5M1270ZF256I5N
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View Datasheet →5M1270ZF256C5N
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View Datasheet →5M1270ZF324I5N Maximum Ratings & Electrical Characteristics
| Series | MAX V |
| Device Family | 5M1270Z |
| Number of Macrocells | 980 |
| Number of Logic Array Blocks (LABs) | 16 |
| User I/Os | 271 |
| Maximum Internal Frequency | 212 MHz |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns |
| Number of I/O Banks | 8 |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Voltage Standards Supported | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVCMOS, LVTTL, SSTL) |
| Programmable Logic Type | In-System Programmable (ISP) flash-based CPLD |
| Configuration Interface | JTAG (IEEE 1149.1) |
| On-Chip User Flash Memory | 8 Kbits |
| Package | 324-pin FBGA (FineLine BGA), 19 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +100 °C (TJ) |
| Standby Current (typ, 25 °C) | 40 µA |
| RoHS Compliance | Compliant |
| Lead-Free | Yes |
5M1270ZF324I5N 324-pin fbga (fineline bga), 19 mm Pin Configuration Guide
Complete pinout information for 5M1270ZF324I5N (324-pin fbga (fineline bga), 19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M1270ZF324I5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M1270ZF324I5N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Power Meter and Smart-Energy Metering, SMPS and Power-Supply Control Logic, Battery-Operated Portable Devices, Cross-Matrix Switch and Signal Routing, Discrete-Logic Replacement and Board Consolidation.
Industrial I/O Expansion and Bus Bridging
The 5M1270ZF324I5N's 271 user I/Os across 8 voltage-configurable banks make it an ideal glue-logic companion to microcontrollers and microprocessors that lack sufficient native GPIO or require mixed-voltage interfacing. The device can bridge between a 3.3 V ARM Cortex-M host and 1.8 V DDR memory, or fan out 24-bit parallel LCD bus signals while adding address-latch and timing-control functions. Its 6.2 ns pin-to-pin delay supports industrial fieldbus latencies, and the 324-FBGA footprint absorbs dense routing on 4-layer FR-4 PCBs typical in PLC backplanes and motor-control inverters.
Recommended
Power Meter and Smart-Energy Metering
Smart electricity meters require reliable glue logic for metrology IC interfacing, anti-tamper switch monitoring, RTC supervision, and display multiplexing, all on a low standby current budget. The 5M1270ZF324I5N's typical 40 µA standby at 25 °C preserves battery life during power outages, while 980 macrocells comfortably fit the calibration state machine, LCD segment drivers, and M-Bus / DLMS / COSEM communication state machines. Its industrial -40 °C to +100 °C temperature grade meets outdoor meter enclosure requirements, and the flash-based non-volatile configuration eliminates the external boot EEPROM used in legacy designs.
Recommended
SMPS and Power-Supply Control Logic
Switch-mode power supplies require deterministic, low-latency digital control loops for PFC, synchronous rectification, and fault shutdown sequencing. The 5M1270ZF324I5N's 6.2 ns tPD and 212 MHz fMAX allow high-resolution digital PWM generation, while the 271 I/Os handle multi-phase current-sense inputs, gate-driver outputs, and PMBus/I2C housekeeping. The flash-based CPLD configuration avoids the inrush current spikes typical of SRAM FPGA boot sequences, simplifying EMI compliance and inrush-current design. Industrial temperature grade supports telecom rectifiers and industrial DIN-rail supplies.
Recommended
Battery-Operated Portable Devices
Portable medical, industrial handhelds, and e-reader products benefit from the 5M1270ZF324I5N's instant-on flash-based configuration and 40 µA typical standby, which collectively extend battery life compared with SRAM FPGA solutions that require boot PROMs and continuous configuration refresh. The 8 on-chip user-flash Kbits allow storage of calibration tables and serial numbers without an external EEPROM. With 271 I/Os the device can drive TFT panels, scan keypads, sequence power rails, and run the display refresh state machine from a single chip.
Recommended
Cross-Matrix Switch and Signal Routing
Audio/video routing matrices, telecom cross-connects, and industrial test systems use high-density non-blocking switch fabrics that benefit from CPLD-based control planes. The 5M1270ZF324I5N's 8 I/O banks enable 8 independent voltage domains in a single chip, simplifying PCB routing when interfacing legacy 5 V, 3.3 V, and modern 1.8 V switch ASICs. With 980 macrocells the device can implement full HDCP-style handshake logic, I2C configuration shadowing, and per-port LED drivers. The non-volatile flash configuration ensures immediate fabric bring-up on power-on without CPU intervention.
Recommended
Discrete-Logic Replacement and Board Consolidation
Many designs still ship with dozens of 74-series TTL/CMOS glue packages - address latches, transceivers, muxes, and reset sequencers - consuming board area and BOM cost. The 5M1270ZF324I5N consolidates all of these into a single 19 mm FBGA, freeing PCB real-estate for higher-value analog or RF circuitry. Designers can re-target the same JTAG programming file across product variants by recompiling in Quartus, eliminating multiple SKUs of legacy logic. The MAX V 5M1270Z sub-series is purpose-built for this glue-logic replacement role with its low standby current and instant-on behavior.
Recommended
Recommended Products Summary
Engineering reference data for 5M1270ZF324I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M1270ZF324C5N | 5M1270ZF324C4N | 5M1270ZF324A5N | 5M1270ZF256I5N | 5M1270ZF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin FBGA (19 mm) | 324-pin FBGA - same | 324-pin FBGA - same | 324-pin FBGA - same | 256-pin FBGA - different | 256-pin FBGA - different |
| Macrocells | 980 | 980 | 980 | 980 | 980 | 980 |
| User I/Os | 271 | 271 | 271 | 271 | 212 | 212 |
| Pin-to-Pin Delay (tPD) | 6.2 ns | 6.2 ns | 7.5 ns | 6.2 ns | 6.2 ns | 6.2 ns |
| Max Internal Frequency (fMAX) | 212 MHz | 212 MHz | 152 MHz | 212 MHz | 212 MHz | 212 MHz |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +125 °C (Automotive flow) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
| Approx. 1-piece Price (USD, as of 2026-09-06) | 21.01 | 18.50 | 17.20 | 23.40 | 19.80 | 17.50 |
Key Differentiators
- Highest macrocell density in the MAX V 5M1270Z sub-series with industrial temperature grade (vs 5M1270ZF256I5N)
- Industrial -40 °C to +100 °C operating temperature range (vs 5M1270ZF324C5N)
- Flash-based non-volatile configuration with 8 Kbits user flash (vs SRAM-based small FPGAs (e.g., Cyclone V))
Design Notes
The MAX V 5M1270Z core requires a tightly regulated 1.8 V supply in the range 1.71 V to 1.89 V. Place a 100 µF bulk tantalum or polymer capacitor and a 1 µF X7R ceramic within 25 mm of the VCCINT balls. Estimated: a design using all 980 macrocells at 212 MHz toggling at typical 20% activity draws approximately 35 mA ICCINT plus I/O current; the on-chip voltage regulator tolerates a 3.3 V VCCIO supply but does not generate 1.8 V internally.
The 324-pin FBGA uses a 1.0 mm ball pitch and demands 4-layer PCB with microvia stackups (laser-drilled) for reliable assembly. Fanout should follow Intel's recommended dog-bone or via-in-pad pattern in the MAX V Device Handbook. Ground and VCCINT planes must remain solid under the BGA; split planes force return-current detours that degrade SSO performance. Keep high-speed outputs (DDR-style clocks, fast memory interfaces) on inner layers to reduce EMI.
Do not assume the 5V-tolerant inputs work without the PCI clamping diode enabled in the Quartus pin planner - by default the inputs clamp only at the I/O standard's VCCIO level. The JTAG chain must include 4.7 kΩ pull-ups on TMS, TDI, and TCK as recommended in AN 100. Designers migrating from MAX II to MAX V should review the new 8-bank I/O architecture - bank assignments and VREF pins differ between MAX II and MAX V layouts even in the same package.
Compliance Information
RoHS compliant per Intel product page. The standard 5M1270ZF324I5N is industrial temperature grade but NOT AEC-Q100 qualified - choose 5M1270ZF324A5N for automotive stress-tested flow. Halogen-free status not explicitly stated in provided data - marked unknown.
