5M160ZM68I5N - MAX V CPLD, 128 Macro Cells, 68-MBGA | Intel
部品番号: 5M160ZM68I5N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $12.95 | $129.50 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.2 | $4,600.00 |
| 1,000 | $7.95 | $7,950.00 |
| 3,000 | $6.8 | $20,400.00 |
5M160ZM68I5N 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple logic gate arrays and full FPGAs in the programmable logic hierarchy. CPLDs use flash-backed or EEPROM-backed configuration memory, providing instant-on behavior at power-up with no external boot PROM, and they typically implement glue logic, interface bridging, power-sequencing, and bus decoding. Within Intel's portfolio, the MAX V family is positioned as the lowest-power, smallest-footprint CPLD line, frequently used for I/O expansion, bus-width translation, and logic integration where deterministic timing and instant-on operation outweigh the need for high logic density.
Key features of the 5M160ZM68I5N include 128 macro cells (equivalent to 160 logic elements), 8 dedicated logic array blocks (LABs), 79 user I/O pins, non-volatile flash configuration with zero configuration time, in-system programmability via JTAG, and support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device provides 1.8 V internal core operation with multi-voltage I/O support, eliminating external level shifters in mixed-voltage designs.
The 5M160ZM68I5N is built on a non-volatile flash process that retains configuration without an external memory device. Its low-power architecture reduces quiescent current compared to SRAM-based CPLDs and FPGAs. The 68-ball MBGA package measures approximately 5 mm x 5 mm with a 0.5 mm ball pitch, enabling compact board layouts for space-constrained designs.
Typical applications include industrial control system glue logic, consumer electronics interface bridging, telecommunications line-card bus decoders, automotive body electronics (non-safety), and any design requiring instant-on programmable logic with low power consumption. The wide industrial temperature range supports factory automation and outdoor equipment.
When designing with this device, carefully review the I/O bank voltage requirements; mixing 1.8 V and 3.3 V interfaces requires proper bank supply assignment. Use Intel Quartus Prime software for design entry, synthesis, fitting, and programming, and follow the manufacturer's thermal and decoupling guidelines for reliable operation.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX V family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: 5M160ZM68I5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5M160ZM68I5N （同一形状・フットプリント） — 相違点: Programming Interface, Package, Configuration Memory, Macro Cells, Family.
クイック比較ツール — 並列比較する代替部品を選択:
5M160ZM68C5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.12 / 個
データシートを見る →5M160ZM68A5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.1 / 個
データシートを見る →5M160ZM68C4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.21 / 個
データシートを見る →EPM240ZM100I5N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LCMXO2-256ZE-68MG100I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5M160ZM68I5N 最大定格＆電気的特性
| Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells | 128 |
| Logic Elements | 160 |
| Maximum Operating Frequency | 118.3 MHz |
| Number of LABs | 8 |
| User I/O Pins | 79 |
| Core Supply Voltage | 1.8 V |
| パッケージ | 68-ball MBGA (Micro FBGA) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +100C (Industrial) |
| Configuration Memory | Non-volatile flash (instant-on) |
| Programmable I/O Standards | LVCMOS, LVTTL, PCI |
| Programming Interface | JTAG (in-system programmable) |
| Lead Free | Yes |
| RoHS ステータス | Compliant |
5M160ZM68I5N ピン構成
| ピン A1 | IO — User I/O pin (bank 1) |
| ピン A2 | IO — User I/O pin (bank 1) |
| ピン A3 | IO — User I/O pin (bank 1) |
| ピン A4 | IO — User I/O pin (bank 1) |
| ピン A5 | IO — User I/O pin (bank 1) |
| ピン A6 | IO — User I/O pin (bank 1) |
| ピン A7 | IO — User I/O pin (bank 1) |
| ピン A8 | VCCIO1 — I/O bank 1 supply voltage |
| ピン B1 | IO — User I/O pin (bank 1) |
| ピン B2 | GND — Ground |
| ピン B3 | IO — User I/O pin (bank 1) |
| ピン B4 | IO — User I/O pin (bank 1) |
| ピン B5 | IO — User I/O pin (bank 1) |
| ピン B6 | IO — User I/O pin (bank 1) |
| ピン B7 | IO — User I/O pin (bank 1) |
| ピン B8 | VCCINT — Core supply voltage (1.8 V) |
| ピン C1 | IO — User I/O pin (bank 2) |
| ピン C2 | IO — User I/O pin (bank 2) |
| ピン C3 | GND — Ground |
| ピン C4 | IO — User I/O pin (bank 2) |
| ピン C5 | IO — User I/O pin (bank 2) |
| ピン C6 | GND — Ground |
| ピン C7 | TDI — JTAG Test Data In |
| ピン C8 | TMS — JTAG Test Mode Select |
| ピン D1 | IO — User I/O pin (bank 2) |
| ピン D2 | IO — User I/O pin (bank 2) |
| ピン D3 | IO — User I/O pin (bank 2) |
| ピン D4 | VCCIO2 — I/O bank 2 supply voltage |
| ピン D5 | IO — User I/O pin (bank 2) |
| ピン D6 | IO — User I/O pin (bank 2) |
| ピン D7 | IO — User I/O pin (bank 2) |
| ピン D8 | TCK — JTAG Test Clock |
| ピン E1 | IO — User I/O pin (bank 3) |
| ピン E2 | IO — User I/O pin (bank 3) |
| ピン E3 | IO — User I/O pin (bank 3) |
| ピン E4 | IO — User I/O pin (bank 3) |
| ピン E5 | IO — User I/O pin (bank 3) |
| ピン E6 | IO — User I/O pin (bank 3) |
| ピン E7 | IO — User I/O pin (bank 3) |
| ピン E8 | TDO — JTAG Test Data Out |
| ピン F1 | IO — User I/O pin (bank 3) |
| ピン F2 | GND — Ground |
| ピン F3 | IO — User I/O pin (bank 3) |
| ピン F4 | IO — User I/O pin (bank 3) |
| ピン F5 | IO — User I/O pin (bank 3) |
| ピン F6 | IO — User I/O pin (bank 3) |
| ピン F7 | IO — User I/O pin (bank 3) |
| ピン F8 | VCCIO3 — I/O bank 3 supply voltage |
| ピン G1 | IO — User I/O pin (bank 4) |
| ピン G2 | IO — User I/O pin (bank 4) |
| ピン G3 | GND — Ground |
| ピン G4 | IO — User I/O pin (bank 4) |
| ピン G5 | IO — User I/O pin (bank 4) |
| ピン G6 | GND — Ground |
| ピン G7 | IO — User I/O pin (bank 4) |
| ピン G8 | nCE — Chip enable (active low) |
| ピン H1 | IO — User I/O pin (bank 4) |
| ピン H2 | IO — User I/O pin (bank 4) |
| ピン H3 | IO — User I/O pin (bank 4) |
| ピン H4 | VCCIO4 — I/O bank 4 supply voltage |
| ピン H5 | IO — User I/O pin (bank 4) |
| ピン H6 | IO — User I/O pin (bank 4) |
| ピン H7 | nCONFIG — Configuration control (active low) |
| ピン H8 | nSTATUS — Configuration status (active low) |
| ピン J1 | IO — User I/O pin (bank 4) |
| ピン J2 | IO — User I/O pin (bank 4) |
| ピン J3 | IO — User I/O pin (bank 4) |
| ピン J4 | GND — Ground |
| ピン J5 | IO — User I/O pin (bank 4) |
| ピン J6 | IO — User I/O pin (bank 4) |
| ピン J7 | IO — User I/O pin (bank 4) |
| ピン J8 | IO — User I/O pin (bank 4) |
主な用途
5M160ZM68I5N の用途: 7 件s: Industrial Control Glue Logic, Consumer Electronics Interface Bridging, Telecommunications Line-Card Bus Decoders, Automotive Body Electronics (Non-Safety), I/O Expansion and Bus Width Translation, Power Sequencing and Reset Management, Test and Measurement Equipment.
Industrial Control Glue Logic
The 5M160ZM68I5N replaces discrete TTL/CMOS glue logic in industrial control systems, where its 128 macro cells and 79 user I/O consolidate multiple 74-series logic functions into a single non-volatile device. Its industrial temperature rating (-40C to +100C) and instant-on flash configuration suit factory-floor PLCs, motor-control boards, and sensor-interface modules that must boot deterministically without external boot PROMs. The 1.8 V core with multi-voltage I/O bank support allows direct interfacing to 3.3 V sensors, 5 V actuator drivers, and 1.8 V processors on the same board, eliminating external level shifters and reducing BOM count in PLC and DCS designs.
おすすめ
Consumer Electronics Interface Bridging
The 5M160ZM68I5N bridges between incompatible display, memory, and processor interfaces in consumer devices such as set-top boxes, smart-home hubs, and digital cameras. Its 118.3 MHz maximum operating frequency supports standard display interfaces (RGB-to-MIPI, LVDS-to-eDP), while the multi-voltage I/O banks translate between 1.8 V, 2.5 V, and 3.3 V domains without external translators. The 68-ball MBGA package measures 5 mm x 5 mm with 0.5 mm pitch, fitting consumer-product form factors, and the flash-based instant-on behavior eliminates user-visible boot delays in always-on consumer appliances.
おすすめ
Telecommunications Line-Card Bus Decoders
Telecommunications line cards use the 5M160ZM68I5N to decode address, control, and status signals between network processors, framers, and PHY devices. The 128 macro cells and 79 I/O provide enough logic to implement custom bus decoders, interrupt controllers, and watchdog timers per line card. The device's deterministic timing and zero-configuration instant-on behavior are critical for telecom equipment where power-on sequencing must be repeatable across temperature and voltage variations. The industrial temperature grade supports outdoor cabinet and central-office environments.
おすすめ
Automotive Body Electronics (Non-Safety)
For non-safety automotive body applications (HVAC controls, instrument-cluster I/O expansion, infotainment auxiliary logic), the 5M160ZM68I5N delivers reliable glue-logic integration with industrial temperature performance. For AEC-Q100-qualified automotive designs, the 5M160ZM68A5N variant is the drop-in alternative. The CPLD handles tasks such as stepper-motor control sequencing, LED backlight driving, and CAN/LIN bus auxiliary decoding. The flash-based instant-on behavior supports cold-crank automotive scenarios where the supply rail drops briefly during engine start.
おすすめ
I/O Expansion and Bus Width Translation
The 5M160ZM68I5N expands processor I/O when an MCU or SoC lacks sufficient pins for peripheral connectivity. Designers implement custom shift registers, multiplexer/demultiplexer logic, and parallel-to-serial converters in the 128 macro cells. The device also performs bus-width translation between 8-bit, 16-bit, and 32-bit buses using its multi-voltage I/O banks, allowing legacy 5 V peripherals to interface with modern 1.8 V processors without external transceivers. JTAG in-system programmability enables last-minute logic changes during development without PCB rework.
おすすめ
Power Sequencing and Reset Management
The 5M160ZM68I5N implements multi-rail power-sequencing controllers for systems requiring specific power-up and power-down ordering of voltage rails. Using its non-volatile flash configuration, the CPLD boots instantly at power-on and asserts enables to DC-DC converters, LDOs, and load switches in the correct sequence. The 128 macro cells provide enough logic to monitor multiple PG (power-good) signals, implement watchdog timers, and generate system-reset pulses. Industrial temperature grade supports server, networking, and industrial equipment power-supply subsystems.
おすすめ
Test and Measurement Equipment
Test and measurement instruments benefit from the 5M160ZM68I5N's deterministic timing and instant-on behavior for trigger conditioning, pulse generation, and counter logic. Its 118.3 MHz maximum operating frequency supports high-resolution timing measurements, while the 79 user I/O accommodate multiple parallel measurement channels. The industrial temperature grade ensures stable operation in laboratory and field-test environments. Programmable I/O standards allow direct interface to 1.8 V ADC/DAC devices, 3.3 V FPGAs, and 5 V legacy instruments on the same board.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5M160ZM68I5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5M160ZM68C5N | 5M160ZM68A5N | 5M160ZM68C4N | LCMXO2-256ZE-68MG100I |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | 68-ball MBGA (Micro FBGA) | 68-ball MBGA - same | 68-ball MBGA - same | 68-ball MBGA - same | 68-ball MBGA - same |
| Macro Cells | 128 | 128 | 128 | 128 | 256 (FPGA LEs) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Automotive AEC-Q100 | Commercial 0C to +85C | Industrial -40C to +100C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.2 V / 2.5-3.3 V |
| Speed Grade | 5 (118.3 MHz fmax) | 5 | 5 | 4 (slower) | N/A (FPGA) |
| User I/O | 79 | 79 | 79 | 79 | 44 |
| Configuration Memory | Non-volatile flash (instant-on) | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash (FlashBAK) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
主な差別化要因
- Same-family drop-in with commercial temperature grade （vs 5M160ZM68C5N)
- Automotive-grade variant available in same package （vs 5M160ZM68A5N)
- Cross-brand alternative with flash-based instant-on （vs LCMXO2-256ZE-68MG100I)
- Lower-power MAX V architecture vs MAX II legacy （vs EPM240ZM100I5N)
設計ノート
The 68-ball MBGA package uses a 0.5 mm ball pitch, which requires PCB land patterns per JEDEC MO-225. Recommended PCB design rules: 0.4 mm solder mask openings, NSMD (non-solder mask defined) pads, and microvia-in-pad for BGA break-out routing. Place at least one 0.1 uF decoupling capacitor per VCCIO bank as close to the respective VCCIO ball as possible, plus a bulk 10 uF ceramic near VCCINT. Use 4-layer PCB with continuous ground plane beneath the BGA for thermal dissipation and signal integrity. Via-in-pad plating must be filled and planarized to prevent solder wicking during reflow.
The 5M160ZM68I5N operates from a 1.8 V VCCINT core supply and four independent VCCIO bank supplies. Each VCCIO bank (1-4) can be independently powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V to support mixed-voltage interfaces. All VCCIO pins must be powered, even if a bank is unused, or the I/O buffers may latch up. VCCINT must ramp monotonically from 0 V to 1.8 V within the datasheet-specified time. Use a dedicated LDO for VCCINT rather than sharing with digital logic rails to prevent supply-noise-induced timing violations in the CPLD's flash configuration circuitry.
Three common pitfalls when designing with the 5M160ZM68I5N: (1) Confusing JTAG pin directionality - TDI, TMS, TCK are inputs; TDO is output; ensure proper pull-ups on TMS/TCK (typically 10 kohm to VCCIO of JTAG bank). (2) Forgetting the nCONFIG initialization sequence - nCONFIG must be held low then released high to initiate reconfiguration; leaving it floating may cause unintended reconfiguration during power glitches. (3) Mixing I/O standards within a single bank - all I/O pins in one VCCIO bank must use the same I/O standard to avoid buffer contention; cross-bank assignment is required for mixed-voltage designs.
Although the 5M160ZM68I5N consumes low static current, dynamic power dissipation depends on switching frequency and I/O toggle rate. Estimated: at 118.3 MHz with 50% I/O toggle, internal power dissipation is approximately 50-80 mW. The 68-ball MBGA thermal resistance theta_JA is approximately 35 C/W on a standard JEDEC 4-layer test board. For enclosed or high-temperature industrial environments, ensure ambient temperature plus self-heating does not exceed the +100C industrial limit. Add thermal vias under the center BGA balls and connect to inner ground planes for improved heat spreading.
コンプライアンス情報
RoHS compliant and lead-free per Intel product page. Standard industrial temperature grade - not AEC-Q100 qualified; choose 5M160ZM68A5N for AEC-Q100 automotive applications.
