A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip
MPN： A3PE1500-1FGG484 ✓ 啟用中A3PE1500-1FGG484 概覽
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than volatile SRAM. This places the ProASIC3E family in the broader hierarchy of programmable logic devices: FPGA -> programmable logic -> digital IC -> semiconductor. Unlike SRAM FPGAs, flash-based devices are live-at-power-up, single-chip solutions that require no external configuration PROM, reducing bill-of-materials cost and board area while improving configuration security and power-up immunity.
Key features include reprogrammable flash fabric, up to 504 kbits of true dual-port SRAM block memory, low total cost of ownership (TOC), and single-chip operation without boot devices. The fabric supports system-level performance suitable for glue logic consolidation, bus bridging, and control-plane functions.
Technically, the device uses Microchip's Versatile routing fabric with flash switches that retain configuration through power cycles. The Sea-of-Versatile-Element architecture provides fine-grained logic granularity, and embedded block SRAM supports FIFOs and dual-port buffering for data-path designs.
Typical applications include industrial automation control, communications and networking line-card support logic, medical instrumentation, and aerospace/defense systems where configuration volatility is undesirable. The 280 available I/Os in this package support wide parallel bus interfaces.
Design consideration: the commercial temperature grade (0C to +70C) of the non-I suffix means industrial designs should select the A3PE1500-1FGG484I variant instead; also plan I/O bank voltages carefully since ProASIC3E supports mixed-voltage I/O.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 A3PE1500-1FGG484 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE1500-1FGG484 （相同外形與佔位） — 差異在於 Package, System Gates, Family, Process Technology, Logic Elements.
A3PE1500-1FGG484I
✅ 直接替換聯絡詢價
查看資料表 →M1A3PE1500-1FGG484
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE1500-FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE3000-1FGG484I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-2FGG484
✅ 直接替換聯絡詢價
查看資料表 →A3PE1500-1FGG484 最大額定值與電氣特性
| Family | ProASIC3E |
| System Gates | 1,500,000 (1.5M) |
| Fabric Cells / Logic Capacity | 276,480 |
| Logic Cells | 38,400 |
| User I/Os (this package) | 280 |
| Max User I/Os (family) | 616 |
| Embedded SRAM | Up to 504 kbits true dual-port |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | On-chip flash (live-at-power-up, single-chip) |
| Speed Grade | -1 (standard) |
| 工作溫度 | 0C to +70C (commercial) |
| 封裝 | 484-ball FBGA (FGG484), 1.00 mm pitch |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
A3PE1500-1FGG484 484-ball fbga (fgg484), 1.00 mm pitch 腳位配置指南
A3PE1500-1FGG484（484-ball fbga (fgg484), 1.00 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE1500-1FGG484.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE1500-1FGG484 適用於 6 應用s: Industrial Automation Control, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Support Logic, Test and Measurement Equipment, Battery-Powered and Power-Sensitive Systems.
Industrial Automation Control
The A3PE1500-1FGG484 fits industrial automation controllers where instant-on behavior and single-chip integration reduce system complexity. Its flash-based fabric is live-at-power-up, so I/O states are valid within microseconds of power application - valuable for safety interlocks and motor-control sequencing that cannot wait for an SRAM FPGA to load configuration. The 280 user I/Os in the FGG484 package support wide parallel buses to PLC backplanes, encoder interfaces, and fieldbus PHYs, while up to 504 kbits of true dual-port SRAM buffer data between clock domains. Designers trade the commercial 0C to +70C rating against the lower cost of the non-I suffix; for uncontrolled factory-floor temperatures, the drop-in A3PE1500-1FGG484I variant should be specified instead.
推薦
Communications and Networking Line Cards
In networking equipment, the A3PE1500-1FGG484 serves as support logic bridging control processors, PHYs, and switch fabric. The 1.5M-gate fabric consolidates glue logic, bus arbitration, and status aggregation that would otherwise occupy multiple discrete devices, cutting BOM cost and board area. True dual-port SRAM (up to 504 kbits) implements FIFOs between asynchronous domains such as a management Ethernet MAC and a backplane interface. Because the configuration is flash-based, a line card reboots instantly without a configuration PROM, improving carrier-grade availability metrics. The 280 I/Os accommodate wide parallel PHY interfaces at moderate data rates; for line-rate packet processing, pair the FPGA with a dedicated switch IC and use the fabric for the control plane.
推薦
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE1500-1FGG484's deterministic, instant-on power-up and single-chip configuration, which simplify design documentation for regulatory review. The flash fabric retains its bitstream through power cycles and offers inherent resistance to configuration tampering compared to SRAM-based devices, supporting device-security requirements. With 280 user I/Os, the FGG484 part interfaces sensor front-ends, ADCs, and display controllers in patient monitors and laboratory analyzers. Designs must respect the commercial 0C to +70C temperature rating; clinical environments typically comply, but transport/storage conditions may justify the industrial A3PE1500-1FGG484I variant, which is footprint-identical and requires no PCB change to adopt.
推薦
Aerospace and Defense Support Logic
ProASIC3E devices are widely used in defense and aerospace programs where configuration volatility is a system risk: the flash-based A3PE1500-1FGG484 powers up functional without any external bitstream, eliminating an attack and failure mode present in SRAM FPGAs. The 1.5M gates absorb bus interfaces (MIL-STD-1553 companion logic, ARINC companions), telemetry framing, and housekeeping functions, while dual-port SRAM implements ping-pong buffers between processing chains. Designers should note the commercial temperature grade and select the I-suffix variant for extended environments, and should verify radiation requirements against the dedicated RT ProASIC3 family for true spaceflight missions. The FGG484 footprint allows migration to A3PE3000 variants as logic grows without PCB rework.
推薦
Test and Measurement Equipment
Bench instruments and automated test equipment use the A3PE1500-1FGG484 for timing generation, trigger logic, and instrument bus interfacing. The 276,480-cell fabric with 38,400 logic cells implements precise digital delay lines, pattern generators, and protocol engines, while the flash configuration guarantees the instrument is operational the moment power is applied - important for instruments with fast-boot requirements. The 280 I/Os connect front-panel indicators, relay drivers, and multiple measurement channels simultaneously. Embedded true dual-port SRAM supports deep capture buffers for logic-analysis functions. Because the fabric is reprogrammable in-system via FlashPro, instrument firmware features can be updated in the field without recalling hardware, protecting both manufacturer and end-user investment.
推薦
Battery-Powered and Power-Sensitive Systems
The ProASIC3E family includes Low Static (Idle) mode support via the ULSICC macro documented in the ProASIC3E FPGA Fabric User's Guide, letting designs park the fabric in a low-leakage state between events. Combined with the absence of a configuration device - no PROM read on every power cycle - the A3PE1500-1FGG484 suits battery-backed data loggers, portable field equipment, and energy-harvesting nodes that wake intermittently. Flash storage means state and bitstream survive complete power removal, so the system resumes instantly on wake. Engineers should budget core current during active operation and use clock-gating and the ULSICC macro aggressively; the commercial 0C to +70C range should be verified against the product's environmental specification.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE1500-1FGG484 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE1500-1FGG484I | M1A3PE1500-1FGG484 | A3PE3000-1FGG484I | A3PE3000-2FGG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484), 1.00 mm pitch | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | Microchip Technology (Actel heritage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5M | 1.5M | 1.5M | 3M (2x) | 3M (2x) |
| Embedded ARM Core | None | None | ARM Cortex-M1 | None | None |
| Speed Grade | -1 (standard) | -1 | -1 | -1 | -2 (faster) |
| Configuration | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
主要差異化特點
- Instant-on single-chip operation (對比SRAM FPGAs (e.g., Xilinx/Intel equivalents))
- Extended-temperature drop-in within same footprint (對比A3PE1500-1FGG484I)
- Embedded processing upgrade without re-spin (對比M1A3PE1500-1FGG484)
- Trade-off: lower density ceiling vs A3PE3000 (對比A3PE3000-1FGG484I)
設計說明
The A3PE1500-1FGG484 uses a 1.5V core supply with separate I/O bank supplies. Decouple the core rail with at least 22 uF bulk capacitance plus 0.1 uF ceramics per power pin, placed within 3 mm of each VCC ball via. Because the flash fabric draws negligible configuration current at power-up (unlike SRAM FPGAs with inrush during bitstream loading), supply sequencing requirements are relaxed - but still follow the Microchip power-up ramp-rate guidance in the ProASIC3E user's guide to avoid I/O latch-up on mixed-voltage banks.
The FGG484 package uses a 1.00 mm ball pitch, which is routable on standard 0.8 mm-design-rule PCBs with via-in-pad or dog-bone fanout on the outer two rows. Plan at least 4 layers: signal-top, GND, power, signal-bottom. Connect all GND balls to a solid ground plane, and do not leave unused VCC/VCIO balls floating - tie each I/O bank's VCIO to its actual I/O voltage per the Libero voltage-mapping report. Estimated: a typical design uses the exposed thermal path minimally since the FBGA dissipates under 1 W in most glue-logic roles.
Do not confuse the FGG484 and FG484 package suffixes - they differ in ball pitch/finish details and are NOT interchangeable on the same PCB land pattern. Also verify the temperature grade: the non-I suffix (-1FGG484) is commercial 0C to +70C only. Finally, programming requires the Libero SoC toolchain and Microchip FlashPro hardware; SRAM-FPGA programming flows (JTAG bitstreams to external PROM) do not apply, and bitstream updates happen in-system via the on-chip flash.
合規資訊
Compliance status not stated in the retrieved distributor data; consult the Microchip product page or request a certificate of conformance. AEC-Q100 qualification is not claimed for ProASIC3E commercial/industrial parts.
