A3PE600-1FG256I - ProASIC3E FPGA 600K Gates 256-FBGA | Microchip
部品番号: A3PE600-1FG256I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $58.9 | $58.90 |
| 10 | $53.1 | $531.00 |
| 100 | $46.8 | $4,680.00 |
| 500 | $42.3 | $21,150.00 |
| 1,000 | $38.2 | $38,200.00 |
A3PE600-1FG256I 概要
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory cells rather than the SRAM cells used by most Xilinx or Intel (Altera) devices. Within the programmable logic hierarchy, the A3PE600 sits as a low-density member of the ProASIC3E family, which itself belongs to the broader category of nonvolatile FPGAs and programmable system-on-chip devices.
Key features include single-chip operation with no external configuration PROM, instant-on power-up, live reprogrammability, and 130nm flash process technology. The 1.5V core supply and low total cost of ownership (TOC) make it attractive for cost-sensitive designs. The FG256 package provides fine-pitch ball interconnect for compact surface-mount assemblies.
Architecturally, the ProASIC3E fabric is built from VersaTiles - fine-grained logic tiles that implement both combinational and sequential functions - complemented by embedded memory and optional high-performance I/O banks. Flash switching technology eliminates configuration loading time and gives inherent resistance to configuration upset from radiation or power glitches, a key reason these parts are used in aerospace-adjacent and industrial applications.
Typical applications include industrial automation controllers, communications line cards, test and measurement instrumentation, medical equipment, and glue-logic consolidation where instant-on behavior and single-chip BOM simplicity matter.
For design, confirm the -1 speed grade timing against your timing closure targets in Libero SoC before committing, since the -2 grade offers faster performance at higher cost. Verify supported I/O standards for the FG256 package in the datasheet.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and sourcing context not found in the manufacturer datasheet alone.
ドロップイン代替品: A3PE600-1FG256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE600-1FG256I （同一形状・フットプリント） — 相違点: Package, Configuration Memory, Process Technology, Operating Temperature, Family.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE600-1FGG256I
✅ ドロップイン✓ 在庫あり
$33.5 / 個
データシートを見る →A3PE600-1FGG256
✅ ドロップイン✓ 在庫あり
$38.9 / 個
データシートを見る →A3PE600-2FG256I
✅ ドロップイン✓ 在庫あり
$26.4 / 個
データシートを見る →A3PE600-FG256I
✅ ドロップイン✓ 在庫あり
$44.6 / 個
データシートを見る →A3PE600-FGG256I
✅ ドロップイン✓ 在庫あり
$41.8 / 個
データシートを見る →A3PE600-1FG256I 最大定格＆電気的特性
| Family | ProASIC3E |
| Logic Gates | 600000 gates |
| User I/O | 165 |
| System Performance | 272 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| パッケージ | 256-FBGA (256-LBGA) |
| Configuration Memory | On-chip flash, single chip, no external PROM |
| Temperature Grade | Industrial (-40C to +85C) |
| 実装タイプ | Surface Mount |
| Terminal Form | Ball (BGA) |
| Package Shape | Square |
| Reprogrammability | Yes, live reprogrammable |
| Power-Up Behavior | Instant-on (flash based) |
A3PE600-1FG256I square ピン配置ガイド
A3PE600-1FG256I (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE600-1FG256I.
詳細は データシート をご参照ください。
主な用途
A3PE600-1FG256I の用途: 6 件s: Industrial Automation Controllers, Communications Line Cards, Test and Measurement Instrumentation, Medical Equipment Control Logic, Glue Logic and Bus Bridging, Aerospace-Adjacent and Security Systems.
Industrial Automation Controllers
The A3PE600-1FG256I fits industrial controller designs that need deterministic, instantly-available logic at power-up. Its 600K gates and 165 user I/Os provide room for I/O expansion, protocol bridging, and sequencing logic, while the industrial -40C to +85C rating matches factory floor environments. Because configuration is stored in on-chip flash, the FPGA is operational within milliseconds of power application with no external configuration PROM, simplifying the BOM and improving uptime for PLC and motor-control boards. The single-chip flash solution also reduces configuration-corruption risk in electrically noisy industrial settings. Designers should budget the 1.5V core rail and verify timing closure with the -1 speed grade for high-speed interfaces.
おすすめ
Communications Line Cards
Telecom and datacom line cards benefit from the A3PE600's 272 MHz system performance and 165 user I/Os for framing, multiplexing, and backplane glue logic. The 256-FBGA's fine-pitch balls support dense card layouts, and the flash fabric avoids configuration-download delays during hot-swap or rapid reboot cycles. The 1.5V core keeps power draw manageable for cards deployed in racks, while configurable I/O banks interface with 3.3V and 2.5V backplane standards. Engineers typically place the FPGA between PHY devices and the card CPU, using Libero SoC for timing closure at the -1 grade. Verify I/O standard support and per-bank voltage rails in the ProASIC3E datasheet for the specific backplane interface.
おすすめ
Test and Measurement Instrumentation
Bench and automated test instruments use the A3PE600-1FG256I for channel sequencing, trigger logic, and interface translation. The instant-on flash configuration means measurement front-ends are live immediately after power-up - important for instruments with short warm-up windows - and the 600K-gate fabric comfortably implements counters, state machines, and bus interfaces. The industrial temperature grade supports instruments used on production floors, and live reprogrammability allows field firmware updates over JTAG without reflowing the board. Designers should confirm the -1 speed grade meets timing for the fastest measurement channels, or select the drop-in A3PE600-2FG256I variant where additional timing margin is required without a PCB change.
おすすめ
Medical Equipment Control Logic
Medical device control boards leverage the A3PE600's single-chip flash architecture to reduce component count - a benefit for reliability analyses and IEC design documentation. With 600K gates and 165 I/Os, the device implements sensor interfacing, actuator sequencing, and safety interlock logic. Instant-on operation ensures interlocks are active from the first milliseconds of power-up, and the nonvolatile fabric is immune to configuration loss from brownouts, an important failure-mode consideration in medical electronics. The 256-FBGA package suits compact patient-side electronics. Developers should validate the design per applicable medical standards and confirm memory content and I/O specifications directly from Microchip's ProASIC3E documentation.
おすすめ
Glue Logic and Bus Bridging
Consolidating PLD, decoder, and bus-bridge functions into one A3PE600 reduces total cost of ownership - a headline benefit Microchip cites for ProASIC3 devices. The 600K-gate fabric handles address decoding, level-compatible bus translation, reset trees, and processor companionship logic in a single 256-FBGA footprint, replacing multiple small CPLDs. Flash switching technology means no configuration files to load and no boot latency for CPU buses, so processors see their peripheral fabric instantly. The 165 user I/Os offer generous pinout flexibility for multi-bus boards. When migrating from older Actel ProASIC families, recompile in Libero SoC and re-verify pin assignments against the FG256 ball map.
おすすめ
Aerospace-Adjacent and Security Systems
While this industrial-grade part is not space-qualified, its flash-based fabric inherently resists configuration upset, making ProASIC3E devices common in ground-based avionics test sets, secure communications equipment, and defense ground infrastructure. The A3PE600-1FG256I provides 600K gates for protocol processing and encryption interface glue logic, with instant-on behavior valued in systems requiring rapid readiness. The absence of an external bitstream in system memory reduces configuration-tampering surface compared with SRAM FPGAs. Engineers must confirm the industrial -40C to +85C envelope and pursue Microchip's dedicated screening flows for any mission-critical deployment rather than relying on commercial distribution channels.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE600-1FG256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE600-1FGG256I | A3PE600-1FGG256 | A3PE600-2FG256I | A3PE600-FG256I | A3PE600-FGG256I |
|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | standard | standard |
| User I/O | 165 | 165 | 165 | 165 | 165 | 165 |
| Temperature Grade | Industrial (I suffix) | Industrial (I) | Commercial (no I) | Industrial (I) | Industrial (I) | Industrial (I) |
主な差別化要因
- Instant-on flash configuration, no external PROM （vs A3PE600-2FG256I)
- Lead-free ball finish availability in same footprint （vs A3PE600-1FGG256I)
- Industrial temperature rating （vs A3PE600-1FGG256)
- Trade-off: lower speed grade at lower cost （vs A3PE600-2FG256I)
設計ノート
Estimated: the 1.5V core rail dominates static power; size the core regulator for the ProASIC3E current table at your utilization level plus margin, and generate it from a buck converter with good load transient response. I/O bank supplies (typically 3.3V/2.5V/1.8V) should each have local bulk plus 0.1uF ceramic decoupling per bank. Verify exact current figures and power sequencing requirements in the Microchip ProASIC3E datasheet rather than estimating, since flash FPGAs have distinct programming-phase currents.
The 256-FBGA fine-pitch array requires controlled-impedance breakout; plan via-in-pad or dogbone escapes per your fabricator's BGA capability. Place 0.1uF decoupling capacitors on the back side of the board directly beneath the ball array to minimize loop inductance on the 1.5V core. Use SnapEDA's downloadable footprint for A3PE600-1FG256I to avoid land-pattern errors, and confirm ball map against the official Microchip pin tables before release.
Do not assume the -1 speed grade meets timing without running Libero SoC static timing analysis on your actual design; the -2 grade (A3PE600-2FG256I) is a same-footprint escape if closure fails. Also note the FG (standard) vs FGG (lead-free) suffixes differ in ball finish - procurement must match your assembly process. Finally, avoid cross-shopping A3P600 (ProASIC3) vs A3PE600 (ProASIC3E) parts casually; embedded memory and routing resources differ.
Reserve JTAG/programming access on test points or a header for FlashPro programming, since the flash fabric is field-updatable and this access pays for itself in manufacturing. Keep high-speed I/O routed as matched groups if used for source-synchronous interfaces, and reference I/O signals to their bank's supply plane. Consult Microchip application notes on ProASIC3E I/O standards for termination and slew-rate settings.
コンプライアンス情報
The FG suffix may indicate standard (non-lead-free) finishing; the FGG variants are the lead-free options. RoHS/REACH status not stated in provided data - verify on Microchip's product page before specifying.
