A3PE600-FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
部品番号: A3PE600-FGG256 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.4 | $2,340.00 |
| 500 | $21.2 | $10,600.00 |
| 1,000 | $19.6 | $19,600.00 |
A3PE600-FGG256 概要
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE600 sits in the low-to-mid density ProASIC3E family, positioned above the ProASIC3 and below the ProASIC3L and ProASIC3E higher-density members. Because configuration data is retained in flash, the device powers up instantly as a single-chip solution with no boot sequence, distinguishing it from SRAM FPGAs such as Xilinx Spartan or Altera Cyclone families.
Key features include reprogrammable flash fabric supporting secure, live-at-power-up operation, abundant embedded memory blocks for FIFO and buffer functions, low total cost of ownership through elimination of external boot flash, and small-footprint packaging suited to space-constrained designs. The 256-FBGA package provides 165 user I/Os with flexible banked voltage support for mixed-voltage system interfacing.
Architecturally, the ProASIC3E fabric is built from a sea-of-modules grid of versatile logic elements (VersaTiles) interconnected by a hierarchical routing structure, implemented on a standard CMOS process. The flash switching technology gives non-volatile, highly secure configuration with no bitstream readback exposure, an important advantage in defense and industrial designs where IP protection matters.
Typical applications include industrial automation control, medical instrumentation, communications line cards, military/aerospace subsystems, and glue-logic consolidation replacing multiple ASICs or ASSPs where volume does not justify mask costs.
When designing with this device, verify I/O bank voltage assignments early, since banked I/O rules constrain pin planning within the 256-ball footprint; use Microchip Libero SoC for synthesis, place-and-route, and timing signoff.
This page synthesizes distributor pricing and stock signals, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE600-FGG256 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE600-FGG256 （同一形状・フットプリント） — 相違点: Package, Configuration Memory, Process Technology, Reprogrammability, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE600-FGG256I
✅ ドロップイン✓ 在庫あり
$41.8 / 個
データシートを見る →A3PE600-2FGG256
✅ ドロップイン✓ 在庫あり
$33.15 / 個
データシートを見る →A3PE600-1FG256I
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$38.2 / 個
データシートを見る →A3PE600-2FG256
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$32.8 / 個
データシートを見る →M1AFS600-2FGG256
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →A3PE600-FGG256 最大定格＆電気的特性
| Family | ProASIC3E |
| System Gates | 600000 gates |
| Logic Elements (LEs) | Approx. 7K LEs |
| CLBs | 13824 |
| Embedded Memory | 110592 bits |
| Total User I/O | 165 |
| Technology | Flash-based FPGA, CMOS |
| Configuration | Non-volatile flash, single-chip |
| パッケージ | 256-FBGA (FGG256) |
| 実装タイプ | Surface Mount |
| Security Features | Flash lock, secure non-volatile configuration |
| Design Software | Microchip Libero SoC |
A3PE600-FGG256 256-fbga (fgg256) ピン配置ガイド
A3PE600-FGG256 (256-fbga (fgg256) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE600-FGG256.
詳細は データシート をご参照ください。
主な用途
A3PE600-FGG256 の用途: 6 件s: Industrial Automation Control, Medical Instrumentation, Communications Line Cards, Defense and Aerospace Subsystems, Glue Logic and ASIC Prototyping, Test and Measurement Equipment.
Industrial Automation Control
The A3PE600-FGG256 fits industrial automation because its non-volatile flash fabric powers up instantly with no external configuration device, eliminating boot failures on factory floors where power cycling is frequent. Its 165 user I/Os support the mixed-voltage interfacing needed for sensor arrays, motor encoders, and fieldbus transceivers, while 110,592 bits of embedded memory implement FIFOs for Modbus, CAN, or EtherCAT bridge logic. The 600K-gate fabric (13,824 CLBs) is large enough to consolidate PLC glue logic, sequencers, and interface controllers into one chip, cutting BOM cost and board area. Instant-on behavior also means safety interlocks are active within microseconds of power application, a benefit SRAM FPGAs cannot match without external boot flash.
おすすめ
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE600-FGG256's deterministic instant-on startup, ensuring measurement front-ends are operational as soon as the device powers, and from its flash-based security: the configuration cannot be read back over an external bus, protecting proprietary DSP pipelines that process patient data. The 165 user I/Os interface ADCs, isolation barriers, and display drivers, while 110,592 bits of embedded block memory buffer sample streams from high-resolution converters. At 600K gates (13,824 CLBs), the fabric implements filter chains, trigger logic, and communication framing for USB or Ethernet links. For benchtop instruments with controlled environments the commercial FGG256 grade suffices; portable devices should use the FGG256I industrial variant.
おすすめ
Communications Line Cards
In communications equipment, the A3PE600-FGG256 serves as a line-card bridge handling framing, deskewing, and backplane interfacing. The 165 user I/Os, organized in voltage-banked groups, connect to PHY devices and backplane connectors running different signaling standards, while the 110,592-bit embedded memory implements elastic buffers and FIFOs that absorb clock-domain variation between line-side and system-side interfaces. The 600K-gate ProASIC3E fabric handles framing protocols and packet header manipulation at moderate line rates. Its flash configuration removes the configuration-device availability risk in long-service-life telecom hardware, and Microchip's long-term availability policy for ProASIC3E supports multi-year deployment programs typical of network infrastructure.
おすすめ
Defense and Aerospace Subsystems
The A3PE600-FGG256 addresses defense and aerospace subsystem needs through its flash-based security model and single-chip operation. Configuration stored in on-chip flash cannot be intercepted or read back, protecting mission algorithms, and there is no external configuration read at power-up for attackers to observe. Instant-on behavior matters for reactive systems such as fuzing logic, secure radios, and avionics interfaces that must be functional within microseconds. The 165 user I/Os interface MIL-STD buses and sensor suites, and 110,592 bits of embedded memory support signal buffering. For extreme-temperature platforms, specify the A3PE600-FGG256I industrial-grade variant, which shares the identical ball map and fabric.
おすすめ
Glue Logic and ASIC Prototyping
The A3PE600-FGG256 is a natural replacement for multi-chip glue-logic clusters of ASSPs, CPLDs, and discrete buffers: its 600K gates (13,824 CLBs) consolidate address decoders, bus bridges, and state machines into one reprogrammable device, cutting board area and inventory complexity. Because ProASIC3E is reprogrammable flash, the same board serves as an ASIC or SoC prototyping vehicle - RTL changes load in minutes via FlashPro without new masks. The 165 user I/Os replicate wide microprocessor and memory buses, and design changes remain secure inside the flash fabric. Low total cost of ownership makes it economical at volumes where a masked ASIC is never justified.
おすすめ
Test and Measurement Equipment
Bench and automated test instruments use the A3PE600-FGG256 for timing generation, pattern capture, and instrument bus interfacing. Its instant-on flash configuration means stimulus engines are ready the moment the instrument powers, and 110,592 bits of embedded memory implement deep pattern buffers for digital capture channels. The 165 user I/Os drive probe front-ends and interface to USB, LXI-style Ethernet, and trigger buses, while the 600K-gate fabric runs protocol engines and timestamping counters. Deterministic, clock-accurate behavior supports repeatable measurements, and the FGG256I variant covers the wider ambient ranges found in rack-mounted instruments with restricted airflow.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE600-FGG256 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE600-FGG256I | A3PE600-2FGG256 | A3PE600-1FG256I | M1AFS600-2FGG256 |
|---|---|---|---|---|---|
| Package | 256-FBGA (FGG256) | 256-FBGA - same | 256-FBGA - same | 256-FBGA (FG256) | 256-FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates |
| Speed Grade | Standard | Standard | -2 (faster) | -1 | -2 |
| Configuration Technology | On-chip flash, non-volatile | On-chip flash | On-chip flash | On-chip flash | On-chip flash + analog peripherals |
| Design Software | Microchip Libero SoC | Libero SoC | Libero SoC | Libero SoC | Libero SoC |
主な差別化要因
- True single-chip instant-on operation （vs SRAM FPGAs (e.g., Xilinx Spartan class))
- Extended temperature availability in identical footprint （vs A3PE600-FGG256I)
- Timing headroom option without redesign （vs A3PE600-2FGG256)
設計ノート
The 256-FBGA footprint requires careful fanout planning: with 165 user I/Os on a 256-ball grid, escape routing typically needs via-in-pad or dog-bone fanout on 0.8 mm-pitch class geometries. Define I/O bank assignments in Libero SoC before finalizing the PCB symbol, because Microchip banks have per-bank VCCI requirements - mixing 3.3V and 2.5V standards in one bank is illegal and forces board respins. Follow the Microchip ProASIC3E PCB layout application guidance for ball-map and power-plane recommendations.
Provide separate, filtered supply rails for the core and I/O banks per the ProASIC3E power-up sequencing requirements, with bulk and 0.1 uF decoupling at every VCCI bank and the core rail. Although flash FPGAs draw no configuration current at power-up, inrush and sequencing still must satisfy the datasheet power-supply ramp specifications. Estimated: budget core current from Libero power analysis after place-and-route rather than rule-of-thumb values, since utilization dominates consumption in the 13,824-CLB fabric.
Do not assume drop-in equivalence across suffixes without checking the ordering code: FG vs FGG denote packaging/green variants and -1/-2/-3 denote speed grades, while the absence or presence of the I suffix changes temperature grade. All FGG256/FG256 A3PE600 variants share the same fabric, but timing closure done on a -2 part will not necessarily meet timing on a standard part - re-run static timing analysis in Libero SoC after any speed-grade substitution.
For high-speed interfaces routed to the 165 user I/Os, respect Microchip's I/O standard slew and drive-strength settings in Libero; over-driving outputs increases simultaneous-switching noise on the 256-FBGA's shared ground balls. Series-terminate point-to-point lines above roughly 50 MHz toggle rates and keep bank VCCI planes solid under the BGA escape region to minimize return-path discontinuities.
コンプライアンス情報
Compliance data not present in the retrieved web data. The FGG suffix in Microchip ordering codes conventionally denotes a green/RoHS packaging variant, but this must be confirmed against the official Microchip product page before being stated as fact.
