A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
部品番号: A3PE600-FG256I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $58.1 | $581.00 |
| 100 | $52.9 | $5,290.00 |
| 500 | $48.2 | $24,100.00 |
| 1,000 | $44.6 | $44,600.00 |
A3PE600-FG256I 概要
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device or SRAM cells. Within the programmable logic hierarchy, the A3PE600 belongs to the ProASIC3E enhanced family, positioned above the base ProASIC3 (A3P) family with added embedded memory bandwidth and DSP-friendly features, making it a single-chip, live-at-power-up solution for system logic integration.
Key differentiating features include nonvolatile Flash configuration (no boot PROM, instant-on operation, inherently single-chip), 1.5V core operation for low dynamic power, enhanced embedded SRAM blocks suited to FIFO and dual-port buffering, and support for DDR interfaces on the E variant. The fabric is built on a 130nm CMOS process with Microsemi's flash switch technology, giving high immunity to configuration upset compared with SRAM FPGAs.
Architecturally, the device is organized as 13,824 VersaTiles (CLB-equivalent cells) with a sea-of-tiles mesh, plus dedicated blocks: embedded SRAM, and flexible I/O banks supporting multiple single-ended and differential standards. Timing closure is achieved through the Libero SoC design suite with Synplify synthesis.
Typical applications include industrial control and automation, aerospace and defense subsystems, secure bridge logic, communications line cards, medical instrumentation, and test equipment, where instant-on nonvolatile configuration and long-lifecycle supply are valued.
Design consideration: the FG (standard) package variant is RoHS non-compliant / contains lead per distributor data - the FGG variant is the green, lead-free option in the identical 256-ball footprint, so new lead-free designs should specify A3PE600-FGG256I.
This page synthesizes verified distributor data, same-family drop-in packaging variants, and practical design guidance not consolidated on the manufacturer datasheet.
ドロップイン代替品: A3PE600-FG256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE600-FG256I （同一形状・フットプリント） — 相違点: Package, RoHS Status, Configuration Memory, Process Technology, Family.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE600-FGG256I
✅ ドロップイン✓ 在庫あり
$41.8 / 個
データシートを見る →A3PE600-FGG256
✅ ドロップイン✓ 在庫あり
$19.6 / 個
データシートを見る →A3PE600-2FGG256
✅ ドロップイン✓ 在庫あり
$33.15 / 個
データシートを見る →A3PE600-FG256
✅ ドロップイン✓ 在庫あり
$33.5 / 個
データシートを見る →A3P600-FG256I
✅ ドロップイン✓ 在庫あり
$23.1 / 個
データシートを見る →M7AFS600-FGG256I
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →A3PE600-FG256I 最大定格＆電気的特性
| Logic Gates | 600000 |
| D Flip-Flops (DFFs) | 13824 |
| CLBs / VersaTiles | 13824 |
| Number of User I/O | 165 |
| Maximum System Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Technology | 130 nm CMOS flash-based |
| Configuration Memory | Nonvolatile Flash (single-chip, live at power-up) |
| 動作温度 | -40C to +100C (TJ), industrial |
| パッケージ | 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch |
| 実装タイプ | Surface Mount |
| Packaging | Tray |
| RoHS ステータス | RoHS Non-Compliant (contains lead; FGG variant is green) |
| Lead Free Status | Contains Lead |
| Family | ProASIC3E |
| Speed Grade | Standard (-1) |
A3PE600-FG256I 256-fbga (lbga), 17 x 17 mm, 1.0 mm pitch ピン配置ガイド
A3PE600-FG256I (256-fbga (lbga), 17 x 17 mm, 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE600-FG256I.
詳細は データシート をご参照ください。
主な用途
A3PE600-FG256I の用途: 6 件s: Industrial Control and Automation, Aerospace and Defense Subsystems, Secure Bridge and Interface Logic, Communications Line Cards and Backplane Bridging, Medical Instrumentation, Test and Measurement Equipment.
Industrial Control and Automation
Factory automation and motor-control supervisory logic benefit directly from the A3PE600-FG256I's instant-on flash configuration: the FPGA is live within microseconds of power application, eliminating boot-delay hazards in interlock and safety-adjacent logic. With 13,824 D flip-flops and 165 user I/O, a single device can consolidate PLC glue logic, encoder interfaces, and parallel bus bridging, while the -40C to +100C industrial temperature range covers unconditioned cabinet environments. The 1.425V-1.575V core keeps dynamic power low relative to SRAM FPGAs of similar density, easing thermal design in sealed enclosures. Place the device near the I/O connector field and provide solid bank decoupling; use the industrial -I grade, not the commercial variant, for field equipment.
おすすめ
Aerospace and Defense Subsystems
Flash-based ProASIC3E fabric offers inherently high immunity to configuration upset, a decisive advantage over SRAM FPGAs in avionics, satellite payload logic, and defense platforms where single-event configuration errors are unacceptable. The A3PE600-FG256I stores its bitstream in nonvolatile flash, requires no external configuration PROM (reducing parts count and failure points), and its 600K-gate / 165 I/O capacity handles telemetry framing, bus bridging (MIL-STD-1553 companion logic, ARINC glue), and sensor aggregation. The industrial -40C to +100C rating suits conduction-cooled enclosures. For new aerospace designs, specify the FGG lead-free variant unless legacy solder processes dictate the leaded FG metallization.
おすすめ
Secure Bridge and Interface Logic
The nonvolatile flash fabric of the A3PE600-FG256I makes it well suited to secure bridge logic, anti-tamper glue logic, and proprietary interface conversion where the bitstream must not be externally readable at power-up - unlike SRAM FPGAs whose configuration streams over the bus and can be intercepted. The single-chip design removes the configuration read path entirely. With 165 user I/O and 350 MHz-class system performance, it converts between legacy parallel buses, memory-style interfaces, and custom serial links. Microchip's flash FPGA security features (flash lock) should be enabled in the bitstream generation step of Libero. The industrial temperature grade supports extended field deployment in network and defense infrastructure.
おすすめ
Communications Line Cards and Backplane Bridging
Telecom and datacom line cards use the A3PE600-FG256I as backplane glue: PCI-style parallel bridges, framing logic, and FIFO buffering between PHYs and processors. The ProASIC3E variant's enhanced embedded SRAM blocks implement deep FIFOs and dual-port buffers natively, and the 350 MHz system ceiling comfortably covers line-rate byte-parallel processing at OC-3/STM-1 class rates. The 1.5V core limits switching power on densely populated cards, and instant-on flash startup lets the card enumerate before host bring-up completes. Budget I/O banks by voltage domain early, since 165 user I/O across FBGA banks constrains mixed-voltage floorplanning on a 17 x 17 mm package.
おすすめ
Medical Instrumentation
Diagnostic and laboratory instruments employ the A3PE600-FG256I for sensor timing, ADC framing, and display/control interface logic. Flash configuration means measurement subsystems are operational the instant power is applied - important for instruments that perform power-on self-calibration sequences. The 130nm flash fabric produces no configuration-read radiation and low core noise at 1.5V, helping sensitive analog front ends sharing the board. The 600K-gate fabric consolidates touch-panel interfaces, motor-stage control, and acquisition timing in one device, reducing validation surface. Medical OEMs also value the pin-compatible FGG lead-free variant for RoHS-driven supply-chain resilience; qualify both suffixes on the same footprint during design.
おすすめ
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automatic test equipment use the A3PE600-FG256I for pattern generation, capture logic, and DUT interface adaptation. The 350 MHz system performance and 13,824 DFFs support high-frequency pattern engines, while 165 user I/O maps well to probe heads and multi-channel pod interfaces. Instant-on flash startup means the instrument's digital subsystem is ready during the host OS boot, cutting measurement-cycle latency. The FBGA footprint's 1.0 mm pitch simplifies signal-access probing compared with finer-pitch BGA families. For instruments requiring higher-speed capture, the -2 speed grade in the same 256-FBGA footprint (A3PE600-2FGG256) provides faster I/O timing without PCB redesign.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE600-FG256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE600-FGG256I | A3PE600-FGG256 | A3PE600-2FGG256 | A3P600-FG256I |
|---|---|---|---|---|---|
| Package | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-LBGA - same footprint |
| Brand / Family | Microchip Technology - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3 (base) |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/O | 165 | 165 | 165 | 165 | 177 |
| Operating Temperature | -40C to +100C (TJ), industrial | -40C to +100C (TJ), industrial | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (TJ), industrial |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
主な差別化要因
- Nonvolatile flash configuration, single-chip instant-on （vs A3P600-FG256I)
- Industrial temperature rating with lead-free option in the same footprint （vs A3PE600-FGG256)
- Faster timing headroom without PCB change （vs A3PE600-2FGG256)
設計ノート
Supply the 1.5V core rail from a regulator holding 1.425V-1.575V across load transients; core dynamic current scales with clock activity, so budget per Libero power-analysis reports rather than worst-case sheet values. I/O banks each need their own VCCI rails matched to the selected I/O standards - mixed 3.3V/2.5V/1.8V banks are common in bridge applications. Add bulk (47-100 uF) plus per-ball-pair 0.1 uF decoupling; the FBGA ball field makes inner-ball decoupling placement critical in early layout passes.
The 256-FBGA has 1.0 mm pitch with escape routing feasible on 4 layers minimum (signal via-in-pad or dog-bone escapes under the array). Reserve the two outermost ball rows for user I/O where possible and keep power/ground balls near the center for short via throws to internal planes. Because 91 of 256 balls are non-user-I/O (power, ground, programming), confirm bank assignments in the datasheet package chapter before committing the stack-up; fanout errors here are the most common cause of respins.
The FG suffix is RoHS non-compliant (contains lead) - for new global-market builds, migrate the identical design to A3PE600-FGG256I; the footprint and bitstream are unchanged, but green molding compound may shift the reflow profile, so re-qualify the assembly process. Also verify speed-grade timing margins with the actual -1 grade models in Libero before locking the design; if STA margins are under ~10%, move to the -2 grade rather than attempting over-constraint workarounds.
コンプライアンス情報
Per distributor datasheet data (digchip), the A3PE600-FG256I has Lead Free Status 'Contains Lead' and RoHS Status 'RoHS Non-Compliant'. The FGG suffix variants are the green/lead-free equivalents in the same 256-FBGA footprint.
