A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
部品番号: A3PE600-1FGG256 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $56.25 | $562.50 |
| 100 | $48.75 | $4,875.00 |
| 500 | $43.1 | $21,550.00 |
| 1,000 | $38.9 | $38,900.00 |
A3PE600-1FGG256 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, the ProASIC3E family stores its configuration in on-chip flash, making it a single-chip, live-at-power-up solution that needs no external boot PROM and offers high resistance to configuration tampering.
Key features include flash-based, reprogrammable fabric on a 130-nm, 7-layer-metal (6 copper) CMOS process, true dual-port SRAM of up to 504 kbits across the family, single-chip operation with Live-At-Power-Up Level 0 support, and a low total cost of ownership as an ASIC replacement. The -1 speed grade balances performance with power, and FG256/FG484 packages are footprint-compatible, easing future migration.
The ProASIC3E architecture combines programmable logic tiles with embedded flash switching, delivering deterministic, instant-on behavior suited to glue logic consolidation, bus bridging, and secure control functions. Differential I/O support reduces single-ended I/O counts by two per pair when used.
Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics subsystems, where its instant-on flash fabric and single-chip footprint simplify power sequencing and board design.
A key design consideration: each differential pair consumes two single-ended I/Os, so budget I/O accordingly; voltage-referenced standards require one VREF pin per I/O minibank.
This page synthesizes distributor availability data, same-package drop-in variants, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE600-1FGG256 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE600-1FGG256 （同一形状・フットプリント） — 相違点: Package, Process Technology, Configuration Memory, Operating Temperature, Family.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE600-1FGG256I
✅ ドロップイン✓ 在庫あり
$33.5 / 個
データシートを見る →A3PE600-FGG256
✅ ドロップイン✓ 在庫あり
$19.6 / 個
データシートを見る →A3PE600-FGG256I
✅ ドロップイン✓ 在庫あり
$41.8 / 個
データシートを見る →A3PE600-2FGG256
✅ ドロップイン✓ 在庫あり
$33.15 / 個
データシートを見る →A3PE600-2FGG256I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M1AFS600-1FGG256
✅ ドロップイン✓ 在庫あり
$191.1 / 個
データシートを見る →M7AFS600-1FGG256
✅ ドロップイン✓ 在庫あり
$92 / 個
データシートを見る →A3PE600-1FGG256 最大定格＆電気的特性
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Elements | 7K LEs |
| User I/O | 165 |
| Registers | 110592 |
| Core Supply Voltage | 1.5 V |
| Maximum System Frequency | 272 MHz |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration Memory | On-chip flash (single-chip, live-at-power-up) |
| Speed Grade | -1 |
| 動作温度 | 0 C to +70 C |
| パッケージ | 256-LBGA (FBGA-256, 1 mm ball pitch) |
| 実装タイプ | Surface Mount |
| Logic Family | CMOS |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM |
| Power-Up Support | Live-At-Power-Up Level 0 |
| Reprogrammability | Yes (flash-based, in-system reprogrammable) |
A3PE600-1FGG256 256-lbga (fbga-256, 1 mm ball pitch) ピン配置ガイド
A3PE600-1FGG256 (256-lbga (fbga-256, 1 mm ball pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE600-1FGG256.
詳細は データシート をご参照ください。
主な用途
A3PE600-1FGG256 の用途: 6 件s: Networking and Communications Equipment, Avionics and Defense Subsystems, Industrial Control and Automation, Computing Platforms and Server Backplanes, Consumer Electronics, ASIC Prototyping and Emulation.
Networking and Communications Equipment
The A3PE600-1FGG256 fits switch, router, and backplane control-plane designs where 165 user I/Os bridge multiple bus domains and the flash fabric comes up instantly at power-on - no configuration PROM means line cards meet tight power-on-to-ready windows. Its 272 MHz (-1 grade) system performance handles packet framing, status aggregation, and LED/PHY supervision, while true dual-port SRAM buffers descriptor queues. Because it is single-chip, board BOM cost and sequencing risk drop versus SRAM FPGAs. Use the differential I/O capability for clock pairs, remembering each pair consumes two single-ended I/Os from the 165 available.
おすすめ
Avionics and Defense Subsystems
Flash-based configuration gives the A3PE600-1FGG256 inherent immunity to bitstream tampering and single-event configuration upsets that affect SRAM FPGAs, which is why Microchip targets the ProASIC3E family at avionics markets. In mission-computer I/O, sensor-interface, and ARINC-style bus glue logic, the live-at-power-up fabric removes boot sequencing from the safety case, and the single-chip solution reduces board-level parts counts. The 600K system gates absorb protocol bridges and discrete-discrete interfaces; select the A3PE600-1FGG256I industrial variant and consult Microchip for program-specific screening when temperature or quality flow-down applies.
おすすめ
Industrial Control and Automation
In PLC I/O modules, motor-control supervisory logic, and machine-vision trigger engines, the A3PE600-1FGG256 consolidates glue logic that previously needed several CPLDs and discrete parts. Its flash configuration survives brown-outs and powers up instantly, so machinery resumes deterministic behavior after faults - no reload from external memory. The 1.5V core keeps dynamic power low in always-on panels, and 165 I/Os interface 24V-buffered logic, encoders, and HMI buses. Designers should hold I/O-bank voltages within datasheet limits and reserve VREF pins per minibank when voltage-referenced standards are used on mixed-voltage boards.
おすすめ
Computing Platforms and Server Backplanes
Server and storage backplanes use the A3PE600-1FGG256 as a system-management fabric: it aggregates SMBus/PMBus status, drives FRU EEPROM access, sequences power-supply enables, and implements hot-swap handshake logic. The flash fabric is live before the main CPUs boot, letting the FPGA enforce correct power-up order - a task SRAM FPGAs cannot perform without external boot memory. The 272 MHz class performance covers management-bus Bridging comfortably, and true dual-port SRAM implements small FIFOs between asynchronous clock domains. Footprint compatibility with FG484 variants gives a migration path when channel counts grow.
おすすめ
Consumer Electronics
Microchip positions ProASIC3E as a cost-effective ASIC replacement for consumer products, and the A3PE600-1FGG256 fits display timing controllers, interface translation, and feature-bridging roles where ASIC NRE is unjustified. The single-chip flash solution eliminates the configuration flash that inflates BOM cost on consumer boards, and reprogrammability lets one PCB serve multiple SKUs through different programmed images. Low static power suits battery-adjacent and standby-path circuitry. For cost-down production runs, the standard-speed A3PE600-FGG256 variant in the same FBGA-256 footprint drops in without layout changes when timing margin allows.
おすすめ
ASIC Prototyping and Emulation
Design teams use the A3PE600-1FGG256 to prototype ASIC control blocks before committing to masks: the 600K-gate fabric absorbs RTL at moderate scale, the flash fabric loads at power-up for bench bring-up, and reprogrammability supports iterative verification. The 1 mm-pitch FBGA-256 keeps the prototype board compact, and footprint compatibility across FG256/FG484 lets a single carrier board host multiple member sizes when the design grows. True dual-port SRAM models embedded memories from the ASIC netlist. Remember that each differential pair consumes two of the 165 single-ended I/Os, so plan pin multiplexing for probe access early.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE600-1FGG256 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE600-1FGG256I | A3PE600-FGG256 | A3PE600-2FGG256 | M1AFS600-1FGG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600K-class (Fusion) |
| Speed Grade / Max Frequency | -1 / 272 MHz class | -1 / 272 MHz class | Standard (slower than -1) | -2 (faster than -1) | -1 (Fusion family) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V core (plus analog supplies) |
| Configuration Memory | On-chip flash (single-chip) | On-chip flash | On-chip flash | On-chip flash | On-chip flash (Fusion) |
| Extra Features | None (pure fabric) | None | None | None | Analog peripherals: ADC, eRAM, RTC |
主な差別化要因
- Instant-on flash configuration - no boot PROM （vs SRAM-based competitor FPGAs (Xilinx/Intel equivalents))
- Footprint migration path within same package （vs A3PE600-1FGG484 family members)
- Trade-off: lower fabric performance than SRAM FPGAs （vs A3PE600-2FGG256)
設計ノート
The A3PE600-1FGG256 core runs from 1.5V while I/O banks take separate rails (supporting multiple standards). Because the flash fabric is live-at-power-up, all rails must respect the datasheet power-up ramp and sequencing requirements - avoid uncontrolled rail contention during hot-socket or staged power events. Decouple each supply pin pair with at least 0.1 uF ceramic capacitors placed within 2 mm of the ball via, plus bulk 10 uF per rail. Verify actual core current with your design in Libero power analysis; 130-nm flash fabric has low static current but switching current scales with clock activity.
The 1 mm-pitch FBGA-256 requires a controlled-impedance stackup and via-in-pad or dog-bone escape patterns; plan at least one buried via layer for inner-row ball escapes. FG256 and FG484 are footprint-compatible per the datasheet, so a carrier layout that anticipates FG484 enables future density migration. Keep configuration and JTAG traces short and, in noisy environments, protect TCK with series termination. Reserve a VREF pin per I/O minibank whenever voltage-referenced standards (e.g., SSTL-class) are assigned in that bank.
Two frequently missed datasheet constraints: (1) each used differential I/O pair reduces the single-ended I/O count by two, so a design heavy on LVDS-style pairs can silently exceed the 165-I/O budget - perform I/O budgeting before pin placement; (2) the -1 speed grade tops out around the 272 MHz class, so high-throughput paths may fail timing and require the -2 grade - same footprint, but confirm timing in static analysis, not estimates. Also, the commercial-grade part is rated 0 C to +70 C only; use the "I" industrial variant for extended temperature environments rather than relying on derating.
コンプライアンス情報
Verified web data did not include compliance certificates. Microchip's current production ProASIC3E devices are generally offered in RoHS-compliant packaging - request the material declaration from Microchip or your distributor before ordering.
