A54SX32-1BG329I - 32K Gate SX FPGA, 249 I/O, 329-BGA | Microchip
部品番号: A54SX32-1BG329I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $785.32 | $785.32 |
| 10 | $746.05 | $7,460.50 |
| 100 | $706.79 | $70,679.00 |
| 500 | $667.52 | $333,760.00 |
| 1,000 | $628.26 | $628,260.00 |
A54SX32-1BG329I 概要
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that designers configure in the field using a hardware description language such as VHDL or Verilog. Within the programmable-logic hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor), the SX family occupies the high-performance antifuse-based segment, offering non-volatile, one-time-programmable configuration with very low power.
Key features include the sea-of-modules architecture built from C-cells and R-cells that delivers gate efficiencies and performance levels beyond typical SRAM FPGAs of its generation, up to 280 MHz system performance, 249 available user I/O with multiple I/O standards, and antifuse interconnect that is inherently non-volatile, resistant to configuration disturbance, and requires no configuration PROM or boot time.
Technically, the SX architecture organizes logic into clusters connected through hierarchical routing, enabling predictable timing for performance-intensive designs such as bus bridging, protocol engines, and high-speed data path functions. The one-time-programmable antifuse process also removes the static current draw associated with SRAM configuration cells, reducing total power consumption in dense designs.
Typical applications include industrial automation controllers, communications and networking line cards, aerospace and defense data handling, and test-and-measurement instrumentation where a non-volatile, secure, high-performance FPGA fabric is required.
A key design consideration is that antifuse FPGAs cannot be reprogrammed: design changes require a new device, so thorough simulation and timing closure are essential before programming.
This page adds information gain beyond the manufacturer datasheet by synthesizing distributor pricing, same-package drop-in speed-grade and green-package alternatives, and practical design notes in one place.
ドロップイン代替品: A54SX32-1BG329I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A54SX32-1BG329I （同一形状・フットプリント） — 相違点: System Gates, Package, Family, RoHS Status, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
A54SX32-1BGG329I
✅ ドロップイン✓ 在庫あり
$47.8 / 個
データシートを見る →A54SX32-2BG329I
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →A54SX32-2BGG329I
✅ ドロップイン✓ 在庫あり
$88.9 / 個
データシートを見る →A54SX32-BG329I
✅ ドロップイン✓ 在庫あり
$560 / 個
データシートを見る →A54SX32-BGG329I
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →A54SX32A-1BGG329I
✅ ドロップイン✓ 在庫あり
$57.8 / 個
データシートを見る →A54SX32-1BG329I 最大定格＆電気的特性
| System Gates | 32,000 |
| Logic Modules (C-cells + R-cells) | 2880 |
| User I/O | 249 |
| Speed Grade | -1 |
| Maximum System Performance | Up to 280 MHz |
| Configuration Technology | Antifuse (one-time programmable, non-volatile) |
| パッケージ | 329-BBGA |
| Ball Pitch | 1.27 mm |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount |
| Architecture | Sea-of-modules (Actel SX family) |
| Configuration Storage | No external configuration PROM required |
| Manufacturer Family | Microchip (Actel/Microsemi) SX FPGA |
A54SX32-1BG329I 329-bbga ピン配置ガイド
A54SX32-1BG329I (329-bbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A54SX32-1BG329I.
詳細は データシート をご参照ください。
主な用途
A54SX32-1BG329I の用途: 6 件s: Industrial Automation Controllers, Communications and Networking Line Cards, Aerospace and Defense Data Handling, Test and Measurement Instrumentation, Secure Embedded Control Systems, Legacy BOM Continuity and System Sustainment.
Industrial Automation Controllers
The A54SX32-1BG329I fits industrial automation controllers where deterministic, instantly-available logic must operate from -40C to +85C without a configuration boot sequence. Its 32K antifuse gates and up to 249 user I/O handle motor-control state machines, fieldbus protocol bridging (e.g., between legacy parallel interfaces and serial fieldbuses), and safety-interlock logic. Because the antifuse configuration is non-volatile and immune to configuration upset, the FPGA is active within microseconds of power application - critical for PLC I/O modules that must present defined states immediately. Unlike SRAM FPGAs, no external configuration flash is exposed to industrial noise or corruption. Designers trade field-upgradeability for this instant-on security, so lock the design before production programming.
おすすめ
Communications and Networking Line Cards
In telecom and datacom line cards, the A54SX32-1BG329I serves as glueless bus bridging, backplane interface logic, and high-speed data-path aggregation. The SX sea-of-modules architecture supports system performance up to 280 MHz on the -1 grade, sufficient for legacy backplane protocols and parallel data handling, while 249 user I/O in a 1.27 mm-pitch 329-BGA provide the pin count line cards demand. The antifuse fabric adds no SRAM configuration static current, reducing overall card power versus SRAM FPGA equivalents, and its non-volatile startup lets the card enumerate on the backplane instantly. Place-and-route timing reports should confirm -1 grade closure for the target protocol clock before committing to one-time programming.
おすすめ
Aerospace and Defense Data Handling
Defense and aerospace data-handling subsystems value the A54SX32-1BG329I for its inherent configuration security and robustness: the one-time-programmable antifuse cannot be read back as a bitstream, resists configuration glitching under radiation-heavy or hostile electrical environments, and needs no configuration PROM that could be a single point of failure. The 32K-gate fabric implements MIL-STD-style bus interfaces, telemetry framing, and sensor-fusion glue logic, while the industrial -40C to +85C grade supports uncooled platforms. Board designers should budget for the 329-BGA reflow profile and lock programmed units against design change, since antifuse devices cannot be updated in the field.
おすすめ
Test and Measurement Instrumentation
Bench and automated test instruments use the A54SX32-1BG329I as timing generators, pattern generators, and instrument bus interface logic. The -1 speed grade delivers up to 280 MHz internal performance, enabling fine-grained stimulus timing, while 249 I/O drive dense channel counts in a compact 329-BGA footprint. Non-volatile antifuse configuration means the instrument is functional the moment power is applied - important for instruments whose calibration and self-test sequences begin at power-up. Because the device is one-time programmable, instrument firmware revisions require a hardware swap; teams typically qualify the design thoroughly and program at final assembly. Relative to SRAM FPGAs, the lower static power also simplifies thermal design in enclosed instrument chassis.
おすすめ
Secure Embedded Control Systems
Secure embedded control systems - access controllers, encryption key management glue logic, and tamper-responsive platforms - benefit from the A54SX32-1BG329I because antifuse configuration cannot be dumped as a bitstream, unlike SRAM FPGA images that are stored in external flash and readable at boot. The 32K gates implement state machines, whitening functions, and secure-boot handshake logic alongside 249 I/O for sensor and actuator control. Instant-on behavior guarantees security functions are active before other board logic initializes. The trade-off is permanence: security review must be completed before programming, and any post-deployment fix requires replacing the device, so hold spare programmed inventory for field service.
おすすめ
Legacy BOM Continuity and System Sustainment
Many deployed platforms still specify the A54SX32-1BG329I, and sustainment engineering teams source it to avoid redesigning validated boards. With roughly 5,808 pieces in stock at brokers as of 2026-09-03 and listings across 4 distributors per Octopart, availability exists today but should not be assumed indefinitely for a mature antifuse family. Drop-in options within the same 329-BGA footprint - the -2 speed grade A54SX32-2BG329I and the green BGG329 variants - extend sourcing flexibility without PCB change, since the identical die and pinout guarantee functional interchange after timing verification of the -2 grade. Budget single-unit pricing near $785 and pool demand across programs to improve allocation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A54SX32-1BG329I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A54SX32-1BGG329I | A54SX32-2BG329I | A54SX32-BGG329I | A54SX32A-1BGG329I |
|---|---|---|---|---|---|
| Package | 329-BBGA | 329-BBGA (green) - same | 329-BBGA - same | 329-BBGA (green) - same | PBGA329 - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 32,000 | 32,000 | 32,000 | 32,000 | 32,000 (SX-A enhanced die) |
| Speed Grade | -1 | -1 | -2 (faster) | Standard | -1 (SX-A) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Industrial |
| Configuration Technology | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
主な差別化要因
- Non-volatile instant-on antifuse configuration （vs SRAM FPGAs of equivalent gate count)
- Higher guaranteed timing on same footprint （vs A54SX32-2BG329I)
- Enhanced-generation upgrade path （vs A54SX32A-1BGG329I)
設計ノート
The A54SX32-1BG329I is one-time programmable: after antifuse programming the device cannot be erased or updated. Complete functional simulation, static timing analysis at the -1 speed grade corner, and design freeze review before submitting devices for programming. Hold a small pool of spare programmed units for field service, because a post-deployment fix requires physically replacing the FPGA. Do not rely on engineering-sample iteration cycles the way SRAM FPGA flows allow.
The 329-BBGA uses a 1.27 mm ball pitch, which is forgiving for assembly but still requires correct pad geometry per the datasheet package drawing. Follow Microchip's recommended land pattern and provide via-in-pad or dog-bone fanout for inner rows. Power and ground balls should connect to solid planes with decoupling capacitors placed at the package perimeter. Because the device has no external configuration memory, reserve no board space for a PROM, but keep JTAG programming access routed to a header for manufacturing programming.
Estimated: antifuse fabric draws no SRAM configuration static current, so static power is lower than an equivalent SRAM FPGA, but dynamic power still scales with clock frequency and switching activity (P ~ C*V^2*f). Verify core and I/O supply current requirements against the SX family datasheet power calculator for your design's toggle rates, and size the core regulator with margin. Never hot-socket I/O beyond datasheet ratings; review the datasheet hot-socketing specification for backplane insertion applications.
コンプライアンス情報
Compliance data was not present in the verified web data. The BGG329 green-package variants are positioned for RoHS-oriented requirements; verify current RoHS/REACH certificates with Microchip for the exact ordering code before purchase.
