A54SX32-1BGG329I - SX FPGA 48K Gates 329-BGA | Microchip
MPN: A54SX32-1BGG329I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.4 | $624.00 |
| 100 | $56.9 | $5,690.00 |
| 500 | $52.1 | $26,050.00 |
| 1,000 | $47.8 | $47,800.00 |
Drop-in alternatives for A54SX32-1BGG329I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A54SX32-2BGG329I
✅ Drop-In✓ In Stock
$88.9 / Unit
View Datasheet →A54SX32-1BGG329
✅ Drop-In✓ In Stock
$544.99 / Unit
View Datasheet →A54SX32-BGG329
✅ Drop-In✓ In Stock
$515.58 / Unit
View Datasheet →A54SX32A-1BGG329I
✅ Drop-In📋 Reference alternative (not in catalog)
A54SX32-1BG329
✅ Drop-In📋 Reference alternative (not in catalog)
A54SX32-1BGG329I Maximum Ratings & Electrical Characteristics
| Family | Actel SX (54SX) |
| System Gates | 48000 |
| Equivalent Gates | 32000 |
| Logic Cells | 1800 |
| Configurable Logic Modules | 2880 |
| User I/O | 249 |
| Maximum System Frequency | 280 MHz |
| Speed Grade | -1 |
| Technology | 0.35 um CMOS |
| Supply Voltage | 3.3 V / 5 V |
| Package | 329-BBGA, 1.27 mm ball pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| Programming Type | One-Time Programmable (Antifuse) |
| RoHS Status | Compliant |
| Lead Free Status | Lead Free |
A54SX32-1BGG329I 329-bbga, 1.27 mm ball pitch Pin Configuration Guide
Complete pinout information for A54SX32-1BGG329I (329-bbga, 1.27 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32-1BGG329I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32-1BGG329I is suitable for 6 applications: Industrial Control and Automation, Networking and Communication Interface Logic, Aerospace and Defense Heritage Systems, Test and Measurement Equipment, Legacy System Sustainment and Obsolescence Management, Bus Bridging and Glueless Integration.
Industrial Control and Automation
The A54SX32-1BGG329I fits industrial control systems because its -40C to +85C industrial temperature grade, deterministic antifuse timing, and 249 user I/O cover the broad ambient swings and dense I/O typical of PLC backplanes, motor-control sequencers, and factory I/O modules. Its sea-of-modules architecture consolidates glue logic, bus arbitration, and state machines into one 48K-gate device, reducing board area and power versus discrete 74-series implementations. Because programming is one-time, the configured logic behaves like fixed ASIC logic with no configuration boot delay, so control outputs are valid within microseconds of power-up. Use the 3.3V/5V I/O support to interface directly with legacy 5V industrial sensors and drivers. Designers should budget one device per production unit since reprogramming after deployment is impossible.
Recommended
Networking and Communication Interface Logic
In networking hardware, the A54SX32-1BGG329I serves as protocol bridging, line-card glue logic, and backplane interface logic at up to 280 MHz system performance. Its 249 I/O in a high-density 329-ball BGA accommodates wide parallel buses, multi-port routing tables, and control/status fan-out that would otherwise require several CPLDs. Deterministic antifuse routing makes timing closure predictable for fixed-latency path designs, an advantage in telecom systems requiring bounded delay. The 3.3V/5V mixed I/O support eases integration of modern PHY chips with legacy 5V line-card logic. Because the device is one-time programmable and lacks configuration readback, it adds a hardware-security benefit in carrier infrastructure where configuration IP protection is a concern. Verify I/O standards and drive currents against the 54SX datasheet tables before layout.
Recommended
Aerospace and Defense Heritage Systems
The Actel SX family is widely deployed in defense and aerospace heritage platforms where configuration security, instant-on behavior, and radiation-tolerant design heritage matter. The A54SX32-1BGG329I's antifuse fabric cannot be read back or altered in the field, protecting design IP, and it requires no configuration PROM, eliminating a common single-point failure and reducing BOM count in sealed or space-constrained assemblies. Its fixed routing yields post-program timing that closely matches simulation, simplifying qualification of deterministic payload, telemetry, and avionics interface logic. Industrial temperature rating of -40C to +85C covers many ground-based and airborne environments. For new space programs, Microchip's RTAX radiation-tolerant families on XAIPART (e.g., RTAX2000S) extend this antifuse philosophy; for legacy sustainment, the A54SX32 family remains the form-fit-function reference.
Recommended
Test and Measurement Equipment
Bench instruments and automated test equipment (ATE) use the A54SX32-1BGG329I as timing generators, trigger logic, and bus controllers where deterministic, repeatable timing is essential. The 280 MHz -1 speed grade and fixed antifuse interconnect give every programmed unit identical delay characteristics - valuable when calibrating instruments or swapping field-replaceable logic boards. The 249 user I/O fan out to front-panel connectors, ADC/DAC control buses, and host interfaces, consolidating control logic that historically filled several devices. The 3.3V/5V I/O compatibility interfaces with both modern 3.3V instrument chipsets and legacy 5V TTL test fixtures common in production test racks. Industrial temperature operation supports uncooled rack environments. Because designs cannot be reprogrammed in the field, validate firmware fully before production programming.
Recommended
Legacy System Sustainment and Obsolescence Management
The primary modern use of the A54SX32-1BGG329I is sustaining deployed systems originally designed around the Actel SX family. Because the 329-ball footprint is shared across A54SX32 speed/temperature grades and the pin-compatible SX-A variant (A54SX32A-1BGG329I), procurement teams can re-source boards without PCB respin when the exact speed grade or temperature grade becomes allocation-constrained. The one-time-programmable fabric also means fielded units cannot drift from their certified configuration - a common requirement in certified medical, transportation, and utility control equipment. Keep programming files, programmer access, and a strategic device buffer, since the 0.35 um process is mature and Microchip product lifecycles should be monitored. Document the drop-in substitution matrix (speed grade, temperature grade, green package) in the configuration management plan.
Recommended
Bus Bridging and Glueless Integration
Embedded systems frequently need to bridge mismatched buses - PCI-style local buses to proprietary backplanes, or 5V peripheral buses to 3.3V processors. The A54SX32-1BGG329I performs this role gluelessly: its 249 I/O with 3.3V/5V operation eliminates external level-shifters on 5V segments, and 2880 configurable logic modules implement wait-state generators, byte-swap logic, interrupt controllers, and address decoding within one device. Deterministic antifuse routing guarantees fixed decode and handshaking latencies, which simplifies driver timing assumptions in real-time operating systems. Instant-on configuration means the bridge is active before the host processor completes reset, avoiding boot-order dependencies. Designers should confirm per-bank I/O loading and slew requirements against the 54SX datasheet, and reserve spare I/O for debug taps before programming, since the device cannot be altered afterward.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32-1BGG329I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32-2BGG329I | A54SX32A-1BGG329I | A54SX32-BGG329 |
|---|---|---|---|---|
| Package | 329-BBGA (1.27 mm pitch) | 329-BBGA - same | PBGA329 (1.27 mm) - same | 329-BBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 | 48000 | 48000 | 48000 |
| User I/O | 249 | 249 | 249 | 249 |
| Max System Frequency | 280 MHz (-1 speed grade) | faster (-2 speed grade) | ~278 MHz | 240 MHz (standard) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | [DATA_NEEDED: temp range] |
| RoHS / Lead Free | Compliant / Lead Free | Compliant / Lead Free (GG) | Compliant / Lead Free (GG) | Non-green (leaded ball) variant |
| Architecture / Fabric | SX antifuse, 0.35 um CMOS, OTP | SX antifuse, 0.35 um CMOS, OTP | SX-A enhanced antifuse, OTP | SX antifuse, 0.35 um CMOS, OTP |
| Price (qty 1, as of 2026-09-03) | $68.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- One-time-programmable configuration security (vs A54SX32A-1BGG329I (SX-A))
- Highest speed option in same footprint via -2 grade (vs A54SX32-2BGG329I)
- Industrial temperature at lower cost than full redesign (vs A54SX32-1BGG329)
Design Notes
The A54SX32-1BGG329I is one-time programmable (antifuse). There is no field rework: a design change requires a physically new device. Complete all functional verification in simulation, run static timing analysis against the -1 speed grade tables in the Microchip 54SX datasheet, and freeze the netlist before submitting devices to programming. Reserve a margin of unused I/O and logic (at least 10-15%) in the design for late ECOs, and archive the programming bitstream plus programmer setup with your configuration-management records.
The SX family is prized for low static power because antifuse interconnect draws no configuration current, unlike SRAM FPGAs. Supply the core and I/O per the datasheet 3.3V/5V requirements with 0.1 uF ceramic decoupling at each supply pin pair and bulk 10 uF capacitance near the BGA. Power dissipation is design-dependent (frequency, I/O toggling, loading); use Microchip's SX power calculator/spreadsheet referenced in the family documentation, then verify junction temperature against the industrial -40C to +85C ambient rating with the 329-BBGA thermal resistance from the datasheet package section.
Design the 329-ball land pattern to the 1.27 mm pitch BGA outline in the 54SX datasheet package drawing. Use an via-in-pad or dogbone escape strategy on outer rows and route inner-row balls out on internal layers; a 4-6 layer board is typically sufficient for this pin count. Because the GG package is lead-free, match your reflow profile to SAC solder paste limits and confirm MSL handling per the shipping label. Keep trace impedance and stub lengths controlled for the 280 MHz-capable clock paths, and place series termination on high-fanout outputs per datasheet I/O drive characteristics.
Compliance Information
RoHS Compliant and Lead Free status confirmed by DigiKey/digchip distributor data; GG suffix denotes green lead-free BGA ball metallization. REACH, halogen-free, and conflict-minerals status not stated in provided data.
