A54SX32A-1BGG329I - 48K Gate FPGA, 249 I/O, 329-BGA | Microchip
MPN: A54SX32A-1BGG329I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.2 | $722.00 |
| 100 | $66.9 | $6,690.00 |
| 500 | $61.4 | $30,700.00 |
| 1,000 | $57.8 | $57,800.00 |
Drop-in alternatives for A54SX32A-1BGG329I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX32A-1BGG329
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$47.6 / Unit
View Datasheet →A54SX32A-1BGG329M
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$82 / Unit
View Datasheet →A54SX32A-2BGG329
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Contact for price
View Datasheet →A54SX32A-2BGG329I
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$95 / Unit
View Datasheet →A54SX32A-BGG329M
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$97.6 / Unit
View Datasheet →A54SX32A-FBGG329
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$89.9 / Unit
View Datasheet →A54SX32A-1BGG329I Maximum Ratings & Electrical Characteristics
| Family | SX-A |
| System Gates | 48000 gates |
| Logic Cells / CLBs | 2880 |
| User I/O | 249 |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -1 |
| Maximum Toggle Frequency | 278 MHz |
| Process Technology | 0.25 um CMOS |
| Programming Type | Antifuse (one-time programmable) |
| Package | 329-ball PBGA (BGG329), 1.27 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Packaging | Tray |
A54SX32A-1BGG329I 329-ball pbga (bgg329), 1.27 mm pitch Pin Configuration Guide
Complete pinout information for A54SX32A-1BGG329I (329-ball pbga (bgg329), 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32A-1BGG329I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32A-1BGG329I is suitable for 6 applications: Industrial Control and Automation, Aerospace and Defense Electronics, Telecommunications Line Cards, Legacy System Sustenance and Obsolescence Management, Test and Measurement Instrumentation, Secure Embedded Control Systems.
Industrial Control and Automation
The A54SX32A-1BGG329I fits industrial controllers that consolidate PLC glue logic, motor control sequencing, and bus bridging into a single low-cost device. Its 48K system gates and 249 user I/O provide enough capacity to absorb dozens of discrete TTL/PLD devices, while the industrial I temperature grade and 2.5 V, 0.25 um CMOS core deliver stable operation in electrically noisy factory environments. In a typical line-card role the FPGA sits between a microprocessor and I/O modules, implementing chip-select decoding, handshaking, and parallel-to-serial conversion at deterministic speeds up to the 278 MHz toggle ceiling. Because the antifuse fabric is one-time programmable, configuration loads instantly at power-up with no external flash and cannot be corrupted by brownouts - a meaningful reliability advantage over SRAM FPGAs in unattended industrial equipment.
Recommended
Aerospace and Defense Electronics
Antifuse FPGAs are a mainstay of aerospace and defense signal and control electronics, and the A54SX32A-1BGG329I offers 48K gates with inherent SEU immunity in its one-time-programmable configuration. Unlike SRAM FPGAs that require mitigation (triple-mode redundancy on configuration bits), the antifuse interconnect cannot flip state under radiation, and there is no bitstream to intercept - a security advantage for mission electronics. The 329-ball BGA provides 249 I/O for sensor interface, telemetry formatting, and bus protocol glue logic, and M-grade screened siblings (A54SX32A-1BGG329M) exist on the same footprint for programs requiring military temperature ranges. Designers should budget radiation and power analysis per the SX-A datasheet thermal tables and reserve spare cells in the 2880-cell fabric for late requirement changes, since the device cannot be reprogrammed after deployment.
Recommended
Telecommunications Line Cards
In telecom backplane and line-card designs, the A54SX32A-1BGG329I serves as glueless interface logic between framers, network processors, and backplane connectors. The 249 user I/O support wide parallel data paths and multi-bank signaling, while the -1 speed grade's 278 MHz capability comfortably covers T1/E1 and legacy SONET support logic clock domains. The 2.5 V single-supply operation simplified power trees for the era's boards, and instant-on antifuse configuration ensures line cards are ready before host controllers complete reset enumeration. Designers typically pair the device with precision oscillators and voltage supervisors on the same card. When migrating designs to higher speeds, the pin-compatible A54SX32A-2BGG329I offers shorter clock-to-out delays on the identical footprint, making a speed-grade swap a zero-PCB-change upgrade path for margin-constrained timing closure.
Recommended
Legacy System Sustenance and Obsolescence Management
A primary ongoing use of the A54SX32A-1BGG329I is lifecycle sustainment of fielded systems originally designed around Actel/Microsemi SX-A parts. Because the fabric, pinout, and programming toolchain remain supported in Microchip Libero, engineers can recompile and reprogram identical die for boards that were designed decades ago. The 48K-gate, 249-I/O, 329-ball configuration drops directly onto existing land patterns, avoiding costly PCB respins. For buyers, the practical strategy is dual-sourcing the same footprint: keeping both the I-grade and the faster 2BGG329I qualified on the same assembly allows shortage-driven substitution without redesign. When exact MPNs become scarce, the commercial and M-grade BGG329 siblings provide functionally identical silicon with only temperature screening differences - verified before purchase against system environmental requirements.
Recommended
Test and Measurement Instrumentation
Bench and automated test equipment frequently uses the A54SX32A-1BGG329I as trigger-sequencing, counter, and bus-interface fabric. The deterministic timing of the antifuse fabric - fixed delays unaffected by configuration routing after programming - simplifies precision trigger path timing analysis compared to SRAM FPGAs whose delays vary with each recompile. With 2880 cells and 249 I/O, one device implements probe multiplexing, event counters, and host bus (PCI/ISA-era or custom) interfaces simultaneously. The industrial temperature grade supports thermally stressed rack environments near power supplies, and the 329-ball BGA's 1.27 mm pitch allows inspection-friendly assembly. Design-in tip: because the part is one-time programmable, build a self-test feature into the fabric and verify full simulation coverage in Libero before committing production fusemaps, avoiding field rework on OTP silicon.
Recommended
Secure Embedded Control Systems
Applications requiring configuration confidentiality and instant-on behavior - secure controllers, anti-tamper subsystems, and authentication hardware - benefit from the A54SX32A-1BGG329I's antifuse architecture. The fusemap physically resides beneath the metal layers and cannot be read out through a configuration interface, eliminating a class of IP-theft attack present in SRAM FPGA bitstreams. The 48K gates implement cryptographic helpers, challenge-response sequencers, or secure boot state machines, while 249 I/O interface with sensors, relays, and host processors. The 2.5 V core and 0.25 um CMOS process are mature and well-characterized for long-lifetime deployments. Designers should note the OTP trade-off: design revisions require a new programmed device, so version control of fusemap files in Libero and a programming-services contract are standard practice for secure programs based on this MPN.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32A-1BGG329I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32A-1BGG329 | A54SX32A-1BGG329M | A54SX32A-2BGG329I | A54SX32A-BGG329M |
|---|---|---|---|---|---|
| Package | 329-BBGA (BGG329), 1.27 mm pitch | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 gates | 48000 gates | 48000 gates | 48000 gates | 48000 gates |
| User I/O | 249 | 249 | 249 | 249 | 249 |
| Speed Grade / Max Toggle | -1 / 278 MHz | -1 / 278 MHz | -1 / 278 MHz | -2 / faster | standard / 238 MHz class |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Temperature Grade | Industrial (I) | Commercial (C) | Military (M) | Industrial (I) | Military (M) |
| Programming Type | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Key Differentiators
- Instant-on OTP configuration security (vs A54SX72A-FGG484I)
- Timing-margin headroom via pin-compatible -2 grade (vs A54SX32A-2BGG329I)
- Highest I/O count in the A54SX32A package lineup (vs A54SX32A-TQG144A)
Design Notes
The A54SX32A-1BGG329I runs on a single 2.5 V core supply with additional programming-related supply pins (VPP/VSI) tied per the SX-A datasheet power-supply connection tables. Estimate: dynamic power scales with toggle rate and I/O switching; at moderate utilization (a few thousand cells switching at 25-50 MHz) core current is typically in the tens-of-milliamps class, but compute your own figure with the Microchip web-based power calculator using your Libero fusemap. Decouple VCC with at least 10 uF bulk plus 0.1 uF ceramics at each corner of the BGA. Never power the device through long, unfiltered ribbon connections - antifuse devices are static-sensitive during programming supply conditions.
The BGG329 package uses a 1.27 mm ball pitch on a 27 x 27 grid. Route the inner ball rows first, fanning out with via-in-pad or dog-bone escapes on 0.3 mm drills; a 6-layer stack with dedicated ground plane keeps the 249 I/O impedance-controlled. Follow the SX-A datasheet pin tables exactly for VCC, GND, VPP, and VSI ball assignments - programming supplies must not be shared with noisy loads. Because the device is one-time programmable, the PCB cannot compensate for a mis-programmed part; verify land pattern against the manufacturer's IBIS/package drawing before fabrication.
The most common pitfall with antifuse SX-A devices is treating them like SRAM FPGAs: the A54SX32A-1BGG329I cannot be reprogrammed, so a single faulty fusemap scraps the physical device. Complete full timing simulation in Microchip Libero/Designer, verify I/O bank voltage compatibility, and confirm the fusemap checksum before submitting devices for programming. Also verify the speed-grade suffix on delivered parts - a -1 die cannot be upgraded to -2 timing after the fact, and ordering the wrong temperature grade (C vs I vs M) voids environmental qualification.
Compliance Information
FindIC lists the BGG329 package variant as ROHS COMPLIANT, PLASTIC, BGA-329. REACH, halogen-free, and conflict-minerals status not stated in provided data.
