BSD214SNH6327XTSA1 - 20V N-Ch OptiMOS 1.5A | Infineon SOT-363
部品番号: BSD214SNH6327XTSA1 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0.46 | $0.46 |
| 10 | $0.41 | $4.10 |
| 100 | $0.36 | $36.00 |
| 500 | $0.31 | $155.00 |
| 1,000 | $0.27 | $270.00 |
BSD214SNH6327XTSA1 概要
A small-signal N-channel MOSFET is a voltage-controlled switching device in which a positive gate-to-source voltage creates an inversion layer that allows current to flow between drain and source. Small-signal MOSFETs sit at the lowest tier of the power MOSFET hierarchy (small-signal MOSFET -> MOSFET -> discrete semiconductor -> semiconductor) and are typically used for low-current switching, level shifting, load switching, and signal conditioning rather than high-power conversion. Within that hierarchy, OptiMOS devices target the lowest possible RDS(on) per unit area, which translates directly into lower conduction losses in compact surface-mount packages.
Key features of the BSD214SNH6327XTSA1 include low threshold voltage compatible with 2.5V logic drive, low on-state resistance in a small SOT-363 outline, ESD protection on the gate, and Pb-free lead plating with RoHS compliance. The H6327XTSA1 suffix indicates the part is qualified to AEC-Q101 and ships on 7-inch or larger reels per Infineon's standard packing code. Compared with larger DPAK/TO-220 MOSFETs, this device trades absolute current handling for a footprint that is several times smaller, enabling high-density switching in USB, HDMI, mobile, and automotive body-electronics designs.
Typical applications for this part include DC-DC conversion point-of-load switching, battery management load switching in mobile and wearable products, power-rail switching in automotive body modules, USB Type-C high-side load switches, and signal-level analog switching. It can also serve as a low-side switch for small relays, LEDs, or buzzers where space is constrained. The SOT-363 footprint places six pins (gate, source, drain, and three NC or duplicated pins depending on the variant's pinout) around a 2.1mm x 1.25mm body that is compatible with high-density PCB assembly.
When designing with this part, observe the 500mW (Ta) power dissipation limit and derate aggressively at elevated ambient temperatures; thermal resistance on a minimal copper pour is typically around 250-300 C/W. Keep the gate trace short and add a 100kohm pull-down on the gate if the part must default to off when the controller is in reset. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet.
ドロップイン代替品: BSD214SNH6327XTSA1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: BSD214SNH6327XTSA1 （同一形状・フットプリント） — 相違点: Package, Operating Temperature Range, Technology, FET Type, MSL Level.
クイック比較ツール — 並列比較する代替部品を選択:
BSD214SN L6327
✅ ドロップイン📋 参考代替品（カタログ未掲載）
BSS127H6327XTSA2
✅ ドロップイン✓ 在庫あり
$0.032 / 個
データシートを見る →BSP316PH6327XTSA1
✅ ドロップイン✓ 在庫あり
$0.21 / 個
データシートを見る →BSL308CH6327XTSA1
✅ ドロップイン✓ 在庫あり
$0.21 / 個
データシートを見る →BSS192PH6327FTSA1
✅ ドロップイン✓ 在庫あり
$0.34 / 個
データシートを見る →BSP742RIXUMA1
✅ ドロップイン✓ 在庫あり
$0.96 / 個
データシートを見る →BSD214SNH6327XTSA1 最大定格＆電気的特性
| FET Type | N-Channel |
| Technology | MOSFET (Metal Oxide), OptiMOS |
| Drain-to-Source Voltage (Vdss) | 20 V |
| Continuous Drain Current (Id) at 25C | 1.5 A |
| Power Dissipation (Pd) at Ta | 500 mW |
| Gate Drive Voltage (Rds On rated) | 2.5 V, 4.5 V |
| パッケージ | SOT-363 (PG-SOT363-PO), 6-pin |
| 実装タイプ | Surface Mount |
| 動作温度範囲 | -55C to +150C (junction) |
| Automotive Qualification | AEC-Q101 qualified |
| Lead Plating | Pb-free |
| RoHS ステータス | Compliant |
| MSLレベル | 1 |
| Standard Pack Quantity | 3000 (Tape & Reel) |
BSD214SNH6327XTSA1 ピン構成
| ピン 1 | Gate — Gate drive input (logic-level compatible) |
| ピン 2 | Source — Source connection (internally bonded to pin 5) |
| ピン 3 | Drain — Drain connection (internally bonded to pins 4 and 6) |
| ピン 4 | Drain — Drain duplicate for thermal spreading |
| ピン 5 | Source — Source duplicate for thermal spreading |
| ピン 6 | Drain — Drain duplicate for thermal spreading |
主な用途
BSD214SNH6327XTSA1 の用途: 7 件s: USB Type-C VBUS Load Switch, Automotive Body Electronics Load Switch, Mobile/Wearable Battery Load Switch, Point-of-Load DC-DC Switching, Signal-Level Analog Switching, LED Driver Low-Side Switch, Relay/Buzzer Low-Side Driver.
USB Type-C VBUS Load Switch
The BSD214SNH6327XTSA1's 20V Vdss rating comfortably exceeds the 5V/3A USB Type-C VBUS range, while its 2.5V gate-threshold drive is compatible with Type-C controller GPIO levels and the SOT-363 footprint fits the tight space near Type-C connectors. Used as a high-side load switch, it protects the system from VBUS hot-plug transients up to 20V and supports 1.5A continuous current at 25C ambient. Place a 100kohm gate pull-down resistor to ensure fail-safe off when the Type-C controller is in reset. Decoupling at the source pin is typically a 1uF ceramic cap, with TVS protection upstream for surge immunity.
おすすめ
Automotive Body Electronics Load Switch
AEC-Q101 qualification makes the BSD214SNH6327XTSA1 a strong fit for automotive body modules controlling interior lighting, seat heaters, or mirror adjusters. Its 20V Vdss and 1.5A Id handle 12V battery transients up to load-dump clamps, and the SOT-363 package is small enough for distributed electronic control units (ECUs). With 2.5V/4.5V gate drive ratings, the device can be driven directly by automotive-grade microcontrollers without a dedicated gate-driver IC. Pair with a TVS diode for ISO 7637-2 transient immunity and follow Infineon's automotive derating guidelines for junction temperature.
おすすめ
Mobile/Wearable Battery Load Switch
In mobile phones, smartwatches, and TWS earbuds, the BSD214SNH6327XTSA1 serves as a low-side switch for LEDs, haptic drivers, or small boost converters. Its 500mW power dissipation budget and tiny 2.1mm x 1.25mm SOT-363 footprint enable dense PCB layouts in wearables where every square millimeter counts. The 2.5V gate drive is directly compatible with 1.8V/3.3V GPIO from PMICs without level translation. For battery protection, add a series resistor on the gate to limit inrush, and keep source traces short to minimize voltage drop during pulsed loads.
おすすめ
Point-of-Load DC-DC Switching
As a synchronous-rectifier low-side switch in buck converters up to 1.5A, the BSD214SNH6327XTSA1's 2.5V gate drive and low RDS(on) deliver efficient rectification at 3.3V-12V rails. At 500kHz-1MHz switching frequencies typical of point-of-load converters, its small SOT-363 package keeps gate charge and switching losses manageable. Drive the gate directly from a PWM controller output to avoid gate-driver overhead. Use a Kelvin-source connection on PCB layout to avoid corrupting the gate-drive signal with source current ripple.
おすすめ
Signal-Level Analog Switching
The BSD214SNH6327XTSA1 can be used as an analog signal switch for low-current audio or sensor multiplexing when speed and on-resistance are not critical. Its low gate charge keeps switching transients short, and the SOT-363 footprint is smaller than most SSOP analog switches, making it attractive for space-constrained designs. Avoid using it for signals above 1MHz due to drain-source capacitance effects; below 100kHz it performs comparably to dedicated analog switches. Add a 100kohm gate pull-down to keep the channel off during power-up.
おすすめ
LED Driver Low-Side Switch
In LED driver circuits, the BSD214SNH6327XTSA1 acts as a low-side PWM switch to dim indicator LEDs, status LEDs, or small display backlights at up to 1.5A continuous. The 2.5V gate drive is logic-level compatible with microcontrollers, allowing direct PWM at frequencies up to 100kHz without a gate driver. The SOT-363 footprint fits tightly behind an LED array on small PCBs. Add a current-sense resistor in series with the LED to close a feedback loop, and place a flyback diode if switching inductive loads.
おすすめ
Relay/Buzzer Low-Side Driver
For driving small relays, buzzers, or solenoids, the BSD214SNH6327XTSA1's 1.5A Id and 20V Vdss are well-matched to 5V/12V coil voltages. The N-channel low-side configuration simplifies gate drive (just tie the gate to a logic-level GPIO through a resistor). A flyback diode across the relay coil is mandatory to clamp inductive kickback. The SOT-363 package handles the thermal load of pulsed coil currents provided average current stays below 500mW dissipation. Verify coil inrush current stays within 1.5A peak.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: BSD214SNH6327XTSA1 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | BSD214SN L6327 | BSS127H6327XTSA2 | BSL308CH6327XTSA1 | BSP316PH6327XTSA1 | BSS192PH6327FTSA1 | BSP742RIXUMA1 |
|---|---|---|---|---|---|---|---|
| Package | SOT-363 (PG-SOT363-PO) | SOT-363 (PG-SOT363-PO) - same | SOT-363 - same | SOT-363 - same | SOT-363 - same | SOT-363 - same | SOT-363 - same |
| Brand | Infineon Technologies | Infineon Technologies - same | Infineon Technologies - same | Infineon Technologies - same | Infineon Technologies - same | Infineon Technologies - same | Infineon Technologies - same |
| FET Type | N-Channel | N-Channel - same | N-Channel (depletion) | N-Channel - same | P-Channel - opposite | P-Channel - opposite | N-Channel - same |
| Drain-to-Source Voltage (Vdss) | 20 V | 20 V - same | 600 V | 30 V - slightly higher | -20 V (P-channel) | -250 V (P-channel) | 42 V - higher |
| Continuous Drain Current (Id) | 1.5 A | 1.5 A - same | 0.02 A - much lower | 2.0 A - higher | -0.9 A (P-channel) | -0.15 A (P-channel) | 1.3 A - similar |
| Automotive Qualification | AEC-Q101 | AEC-Q101 - same | AEC-Q101 - same | AEC-Q101 - same | AEC-Q101 - same | AEC-Q101 - same | AEC-Q101 - same |
主な差別化要因
- AEC-Q101 qualified in SOT-363 （vs BSP316PH6327XTSA1)
- Higher drain current rating than BSS127H6327XTSA2 （vs BSS127H6327XTSA2)
- Logic-level 2.5V gate drive （vs BSP742RIXUMA1)
- Compact SOT-363 footprint （vs BSL308CH6327XTSA1)
設計ノート
The BSD214SNH6327XTSA1 has a 500mW power dissipation rating at Ta=25C and minimal copper-pour thermal resistance around 250-300 C/W. Estimated: at 1.5A with 1V drop, dissipation is 1.5W, which would raise junction temperature by 375-450C - well beyond safe limits. Derate current to under 0.8A continuous on a standard 1-oz copper pour, or use thermal via arrays and additional copper to spread heat. Always validate against the manufacturer's SOA curves in the Infineon datasheet.
SOT-363 pads should use a 0.3mm x 0.4mm copper land pattern with thermal vias under the drain pins (pins 3, 4, 6) to spread heat into inner copper planes. Keep the gate trace short (under 5mm) and route it away from drain-source switching nodes to avoid capacitive coupling that could cause false turn-on. A 100kohm gate pull-down resistor is recommended to default the channel to off when the controller GPIO is in high-impedance during reset.
Do not exceed the 20V Vdss rating even during inductive load turn-off transients - add a flyback diode across inductive loads. Verify the gate drive voltage is at least 4.5V for lowest Rds(on); at 2.5V Vgs the device still switches but on-resistance is several times higher. Avoid using this part as a low-side switch for high-frequency switching converters above 1MHz without proper Kelvin-source layout, as source inductance will degrade switching performance.
For low-side switching applications, place the BSD214SNH6327XTSA1 as close as possible to the load with a short, wide trace on the source pin to minimize ground bounce. For high-side switching, place a P-channel equivalent or use a gate-driver IC to level-shift the gate drive. Keep the drain and source traces on opposite sides of the package to minimize parasitic loop inductance. Estimated: a poor layout can add 20-50 nH of loop inductance, causing 2-5V ringing at 1A turn-off.
コンプライアンス情報
AEC-Q101 (automotive) qualified per Infineon datasheet and DigiKey product page. Pb-free lead plating, RoHS compliant. REACH compliance assumed per EU regulation.
