Cambridge GaN Devices

CGD65C055SP2 - 650V 27A GaN HEMT, BHDFN-9-1 | Cambridge GaN Devices

部品番号: CGD65C055SP2 ✓ 生産中
在庫あり 1〜3営業日以内に発送
650 V Vdss 27 A Id 55 mΩ Rds(on) BHDFN-9-1 (Bottom-side cooled, wettable flank) Package
開始価格 $2.49 USD / 個
MOQ: 1 |
価格更新日: 2026-10-15
ボリューム価格
数量 単価 小計
1 $3.85 $3.85
10 $3.47 $34.70
100 $3.08 $308.00
500 $2.78 $1,390.00
1,000 $2.49 $2,490.00
ℹ️ すべての価格はUSDです

CGD65C055SP2 概要

The Cambridge GaN Devices CGD65C055SP2 is a 650 V, 27 A enhancement-mode GaN-on-Si power HEMT housed in a 9-pin bottom-side-cooled wettable-flank BHDFN-9-1 package. It is built on CGD's proprietary ICeGaN gate technology, which delivers a 3 V threshold voltage, genuine 0 V turn-off, and a broad 9-20 V gate-drive voltage range. The device is designed for high-current, high-frequency switching where silicon MOSFETs run out of headroom, with a 55 mΩ on-resistance rating.

A GaN HEMT (Gallium Nitride High-Electron-Mobility Transistor) is a wide-bandgap semiconductor switch in the discrete-semiconductor hierarchy: GaN HEMT -> power transistor -> discrete semiconductor. Compared with silicon MOSFETs, GaN HEMTs offer much lower gate charge, zero reverse-recovery charge, and an order-of-magnitude lower switching loss, enabling higher switching frequencies (hundreds of kHz to MHz) without the efficiency penalty seen in Si. Cambridge GaN Devices (CGD) specialises in normally-off, enhancement-mode GaN with a robust gate interface that does not require a negative rail to keep the device off.

Key differentiating features include an integrated Miller clamp that suppresses false turn-on during fast transients, a wettable-flank BHDFN package for optical-inspection-friendly solder joints, and a thermal pad on the bottom side for direct PCB cooling. The 55 mΩ R_ds(on) at room temperature keeps conduction loss competitive with 600-650 V Si MOSFETs of similar die area, while the lower Qrr and Q_oss translate directly into reduced reverse-conduction loss in hard-switched half-bridges and totem-pole PFC stages.

Typical applications include telecom and server SMPS, on-board chargers for EVs, solar inverters, totem-pole PFC front stages, motor drives, and Class-D audio amplifiers. The 650 V rating provides ample margin over 400 V PFC rails (European rectified mains) and 380 V nominal solar-bus voltages.

When designing with this part, place a tight gate-drive loop (gate driver to gate-return) within 5 mm to minimise parasitic inductance that could otherwise cause Miller-induced dv/dt failures. Use a 0 V off-state gate bias for ICeGaN parts to leverage the genuine zero-volt turn-off specified in the datasheet, and consult the CGD application note on dead-time optimisation for half-bridges.

This page synthesises distributor pricing, drop-in alternative recommendations, and practical design notes not found in the manufacturer datasheet alone, providing a one-stop engineering reference for the CGD65C055SP2.

ドロップイン代替品: CGD65C055SP2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: CGD65C055SP2 (同一形状・フットプリント) — 相違点: Manufacturer, Package, RoHS Status, Technology.

Cambridge GaN Devices
Manufacturer: Cambridge GaN Devices
Package: 16-pin DFN 8x8 mm
RoHS Status: Compliant (lead-free)
比較対象 CGD65C055SP2 →

クイック比較ツール — 並列比較する代替部品を選択:

CGD65A055S2

✅ ドロップイン
Cambridge GaN Devices
📦 BHDFN-9-1
Cambridge GaN Devices · GaN-on-Si HEMT (enhancement mode) · 650 V · 55 mΩ · 27 A · ICeGaN™ (standard-driver compatible) · Yes (integrated CS output) · NL³ (non-linear low-loss)

✓ 在庫あり

$2.85 / 個

データシートを見る →

CGD65C055SP

✅ ドロップイン ⚠️ 仕様未検証
📦 BHDFN-9-1
same 650 V / 55 mΩ ICeGaN die and BHDFN-9-1 footprint; minor gate-drive tuning variant without current-sense pin

📋 参考代替品(カタログ未掲載)

CGD65C055P2

✅ ドロップイン ⚠️ 仕様未検証
📦 BHDFN-9-1
same 650 V / 55 mΩ ICeGaN die and BHDFN-9-1 footprint; alternate reel-packaging variant

📋 参考代替品(カタログ未掲載)

CGD65C055SP2 最大定格&電気的特性

Manufacturer Cambridge GaN Devices (CGD)
Part Number CGD65C055SP2
トランジスタタイプ N-Channel GaN HEMT (Enhancement Mode, Normally-Off)
Drain-Source Voltage (V_DS max) 650 V
Continuous Drain Current (I_D) 27 A
On-Resistance (R_DS(on)) 55 mΩ
Gate Threshold Voltage (V_TH) 3 V
Gate Drive Voltage Range 9 V to 20 V
Gate Turn-Off Voltage 0 V (genuine 0 V turn-off per ICeGaN)
Technology ICeGaN® GaN-on-Si, enhancement-mode
パッケージ BHDFN-9-1 (Bottom-side cooled, wettable flank)
実装タイプ Surface Mount
Channel Type N-Channel
RoHS ステータス Compliant
Lead-Free Yes

CGD65C055SP2 ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 Gate — Gate input, drive 9-20 V on, 0 V off (ICeGaN)
ピン 2 Kelvin Source — Kelvin source connection for gate-driver return
ピン 3 Source — Source (power)
ピン 4 Source — Source (power)
ピン 5 Source — Source (power)
ピン 6 Source — Source (power)
ピン 7 Source — Source (power)
ピン 8 Source — Source (power)
ピン 9 Drain — Drain (power, thermal pad electrically connected to drain)

安全動作領域 (estimated from datasheet)

DC連続動作

主な用途

CGD65C055SP2 の用途: 6 件s: Server & Telecom SMPS, Totem-Pole PFC Front Stage, Solar / PV Inverter DCDC Stage, EV On-Board Charger PFC Stage, Class-D Audio Amplifier Output Stage, Industrial Motor Drive Inverter.

🖥️

Server & Telecom SMPS

The CGD65C055SP2's 650 V rating and 55 mΩ R_DS(on) suit 400 V bus server and telecom SMPS designs. Compared with 600 V silicon MOSFETs of similar die area, the GaN HEMT cuts switching loss by 60-70% and eliminates reverse-recovery loss in the high-side device, allowing 100-200 kHz switching frequencies that shrink magnetics by 2-3x. The integrated Miller clamp suppresses dv/dt-induced false turn-on even with the higher dV/dt of GaN. Use the part in the primary-side hard-switched half-bridge, with 9-12 V gate drive and 0 V off-state bias to leverage ICeGaN's genuine zero-volt turn-off and meet 80 Plus Titanium efficiency targets.

⚡

Totem-Pole PFC Front Stage

The CGD65C055SP2 is an excellent choice for hard-switching totem-pole PFC at 65 kHz to 1 MHz. The zero Qrr of the GaN HEMT eliminates the reverse-recovery loss that otherwise forces silicon MOSFETs into slow-switched, bridgeless-PFC topologies. The 27 A continuous current rating supports 3-5 kW PFC stages for server and EV charger applications. Place the gate-driver within 5 mm of the gate pin to minimise parasitic inductance, and consult the Cambridge GaN Devices dead-time optimisation application note to minimise body-diode conduction intervals. Expected efficiency exceeds 99% at 50% load in a 3 kW totem-pole PFC.

☀️

Solar / PV Inverter DCDC Stage

In PV inverter DCDC boost stages the CGD65C055SP2 switches a 380 V nominal solar bus. The 650 V rating provides 70 V margin above the maximum power-point bus voltage. GaN's lower Qoss reduces switching loss in the hard-switched boost, and the BHDFN-9-1 bottom-cooled package simplifies heatsink attachment compared to top-cooled DFN parts. The integrated Miller clamp avoids shoot-through when paired with a high-performance SiC or GaN gate driver. Use 100 kHz to 500 kHz switching to shrink the boost inductor by 4x versus a 20 kHz silicon implementation.

🚗

EV On-Board Charger PFC Stage

The CGD65C055SP2 suits EV on-board charger (OBC) PFC and DCDC stages in the 6.6-22 kW range. Its 650 V rating directly supports 400 V rectified bus rails, and the 27 A current rating parallel-friendly for 11 kW OBCs. Cambridge GaN Devices operates automotive IATF 16949 processes; AEC-Q101 qualification status should be confirmed on the specific automotive-grade part variant. The 55 mΩ R_DS(on) keeps conduction loss manageable across a wide load range, and the 9-20 V gate-drive window simplifies interface with automotive 12 V gate drivers.

🎧

Class-D Audio Amplifier Output Stage

The CGD65C055SP2's low output charge and zero reverse-recovery charge translate directly into lower dead-time distortion in half-bridge Class-D audio amplifiers. The 27 A current rating supports 200-500 W per channel amplifier modules, and the high switching frequency (250 kHz to 1 MHz) shrinks the output LC filter to a small ferrite-and-film combination. Use the ICeGaN gate with a 12 V drive and 0 V off-state; the genuine zero-volt turn-off minimises idle-pop on power-up. Total Harmonic Distortion + Noise (THD+N) below 0.01% is achievable in a 250 W / 4 ohm amplifier at 1 kHz.

🏭

Industrial Motor Drive Inverter

In industrial motor-drive inverters the CGD65C055SP2 enables 100 kHz PWM switching for lower audible noise and higher control bandwidth. The 650 V rating supports 480 V rectified bus rails, and the 27 A current rating fits 5-10 HP inverter modules. The BHDFN-9-1 bottom-side-cooled package couples directly to a heatsink or cold-plate for sustained 27 A operation. Expect 50-70% switching-loss reduction compared with a 600 V silicon IGBT at the same switching frequency, or 2-3x switching frequency at the same loss budget for finer PWM resolution.

What is the drain-source breakdown voltage of CGD65C055SP2?
The CGD65C055SP2 is rated for 650 V drain-source breakdown voltage. According to the Cambridge GaN Devices datasheet for this part, the 650 V rating provides adequate margin above 400 V rectified-mains rails used in PFC front-stages and 380 V nominal solar-bus designs. Always derate per the safe-operating-area chart when designing for repetitive avalanche stress.
What is the on-resistance of CGD65C055SP2?
The CGD65C055SP2 has a typical on-resistance of 55 mΩ at room temperature. This R_DS(on) figure is competitive with 600-650 V silicon MOSFETs of similar die size, while the GaN HEMT structure eliminates reverse-recovery charge (Qrr) and dramatically reduces output charge (Qoss). Conduction loss at 27 A therefore equals approximately 41 W at full rated current.
Does CGD65C055SP2 require a negative gate voltage to turn off?
No. The CGD65C055SP2 uses Cambridge GaN Devices' ICeGaN gate technology which provides a genuine 0 V turn-off and a 3 V threshold voltage. Unlike depletion-mode GaN cascodes, ICeGaN is a true enhancement-mode, normally-off device. Designers can drive the gate between 9 V and 20 V in the on state and pull it to 0 V in the off state without a negative bias supply.
Where can I buy CGD65C055SP2 online and what is the price?
The CGD65C055SP2 is in stock at DigiKey (listing 27514096) with same-day shipping, priced at approximately $3.85 per unit at qty-1 as of 2026-10-15. Cambridge GaN Devices authorised distributors include DigiKey; check the Cambridge GaN Devices website for the latest authorised-channel list. Volume pricing drops to about $2.49 at 1000-piece quantities.
What is the lead time for CGD65C055SP2?
DigiKey lists CGD65C055SP2 with 'ships today' status (same-day shipping for orders placed before the cutoff), so the distributor lead time is effectively next-business-day. For factory-direct bulk orders above 10k units, contact Cambridge GaN Devices directly for a quote; typical factory lead time for this part is 10-14 weeks according to standard CGD order terms.
What is the difference between CGD65C055SP2 and CGD65A055S2?
Both are 650 V, 55 mΩ ICeGaN GaN HEMTs from Cambridge GaN Devices. The CGD65C055SP2 is the BHDFN-9-1 package with bottom-side cooling and wettable flanks, whereas the CGD65A055S2 is the standard top-cooled variant without the integrated current-sense pin. Choose CGD65C055SP2 when you need optical-inspection-friendly solder joints or bottom-side thermal coupling; choose the A-suffix for conventional top-cooled layouts.
What is the best drop-in replacement for CGD65C055SP2?
True pin-to-pin drop-in replacements for the BHDFN-9-1 footprint are limited, because Cambridge GaN Devices' BHDFN package with integrated current sense is a proprietary CGD package. Functionally equivalent GaN HEMTs in 650 V / 55 mΩ class exist from other vendors but use different pinouts (e.g. GaN Systems GS-065-055-1-L in a different package). Always verify pinout compatibility before substituting a discrete GaN HEMT into an existing CGD65C055SP2 PCB.
Where can I download the CGD65C055SP2 datasheet PDF?
The official CGD65C055SP2 datasheet PDF is hosted at https://d3pfqfz1dp5wqr.cloudfront.net/CGD_65_C055_SP_2_BHDFN_Datasheet_8f0030c9fe.pdf. The Cambridge GaN Devices product page at https://camgandevices.com/p/product-CGD65C055SP2 also provides the datasheet link, application notes, and ordering information. DigiKey's product detail page at https://www.digikey.com/en/products/detail/cambridge-gan-devices/CGD65C055SP2/27514096 links to the same PDF.
Where do I find the CGD65C055SP2 pinout?
The CGD65C055SP2 pinout is shown in the datasheet package diagram on page 1 of the BHDFN datasheet PDF. The BHDFN-9-1 is a 9-pin bottom-side-cooled package with wettable flanks; pin 1 is located via the package marker on the top side. Pin assignments and thermal pad connection are documented in the datasheet's 'Pin Configuration' section.
Is CGD65C055SP2 suitable for totem-pole PFC applications?
Yes. The CGD65C055SP2's zero reverse-recovery charge (Qrr) and low output charge (Qoss) make it ideal for hard-switching totem-pole PFC at 100 kHz-1 MHz switching frequencies. The 650 V rating provides comfortable margin above the 400 V rectified-mains bus, and the 27 A continuous current rating supports 3-5 kW PFC stages. Use the CGD half-bridge application note for dead-time optimisation.
What are the key specifications of CGD65C055SP2 that engineers should know?
The CGD65C055SP2 delivers 650 V V_DS, 27 A continuous I_D, 55 mΩ R_DS(on), 3 V gate threshold, 9-20 V gate drive range, and genuine 0 V turn-off, all in a 9-pin BHDFN bottom-cooled package with wettable flanks. The ICeGaN gate integrates a Miller clamp and provides an extended gate-drive window without negative bias. These specifications position the part as a 650 V GaN HEMT optimised for high-frequency hard-switched power conversion.
Can a 600 V silicon MOSFET be a drop-in replacement for CGD65C055SP2?
No, not as a true drop-in. A 600 V silicon MOSFET in the same BHDFN-9-1 package and pinout does not exist because the BHDFN-9-1 is a proprietary Cambridge GaN Devices package. Even if a silicon MOSFET were available in the same footprint, the gate-drive voltage, switching speed, and thermal performance would differ substantially, requiring PCB re-characterisation. GaN and Si are not drop-in equivalents in the same package.
What is the cross-brand equivalent for CGD65C055SP2 from another manufacturer?
Cambridge GaN Devices does not currently publish a formal cross-reference list for the BHDFN-9-1 package, and competitors such as GaN Systems, EPC, and Infineon use different pinouts and footprints. For parametric equivalents in the 650 V / 55 mΩ class, evaluate GaN Systems GS-065-055-1-L or Infineon IGLD60R055D1, but expect different package footprints and pin assignments that require PCB layout changes. There is no drop-in cross-brand equivalent today.
Is CGD65C055SP2 RoHS compliant?
Yes. The CGD65C055SP2 is RoHS compliant per the Cambridge GaN Devices product page and the datasheet. The BHDFN-9-1 package is lead-free and uses a wettable-flank plating finish that meets IPC solderability requirements. The part is also lead-free (Pb-free) and is rated for standard Pb-free reflow soldering processes up to peak 260 C per JEDEC J-STD-020.
Is CGD65C055SP2 suitable for EV onboard chargers?
Yes, the CGD65C055SP2 is well-suited for EV on-board charger (OBC) PFC and DCDC stages. Its 650 V rating supports 400 V rectified bus rails, the 55 mΩ R_DS(on) keeps conduction loss manageable, and the GaN HEMT's zero Qrr enables high-frequency operation that shrinks magnetics. Cambridge GaN Devices is automotive-targeted with IATF 16949 certification; check the automotive-grade part numbers separately for AEC-Q101 qualification.

エンジニアリング参考データ: CGD65C055SP2 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the CGD65C055SP2 when you need a 650 V, 27 A GaN HEMT in a bottom-cooled BHDFN-9-1 package with integrated Miller clamp and genuine 0 V turn-off. The package's wettable flanks make it ideal for high-volume automated assembly, and the bottom-side cooling simplifies heatsink integration. Choose the CGD65A055S2 if your design uses a conventional top-cooled heatsink layout. Choose the CGD65C055P2 if you do not need the integrated current-sense pin. For higher current applications, evaluate the 30-40 A's lower on-resistance class. For lower-voltage (<400 V) applications, a 200 V GaN part may provide better figure-of-merit. All three listed alternatives share the same BHDFN-9-1 footprint.

代替品との比較

パラメータ この製品 CGD65A055S2 CGD65C055SP CGD65C055P2
Package BHDFN-9-1 (bottom-cooled, wettable flank) BHDFN-9-1 - same BHDFN-9-1 - same BHDFN-9-1 - same
Brand Cambridge GaN Devices Cambridge GaN Devices - same Cambridge GaN Devices - same Cambridge GaN Devices - same
Drain-Source Voltage (V_DS) 650 V 650 V 650 V 650 V
Continuous Drain Current (I_D) 27 A 27 A 27 A 27 A
On-Resistance (R_DS(on)) 55 mΩ 55 mΩ 55 mΩ 55 mΩ
Gate Threshold Voltage 3 V 3 V 3 V 3 V
Integrated Miller Clamp Yes Yes Yes Yes
Integrated Current Sense Yes (current-sense pin) No No Yes

主な差別化要因

  • Genuine 0 V turn-off (ICeGaN technology) (vs Generic depletion-mode GaN cascodes)
  • Bottom-side cooled BHDFN-9-1 package with wettable flanks (vs Standard top-cooled DFN GaN packages)
  • Integrated Miller clamp suppresses false turn-on (vs Discrete 650 V silicon MOSFETs)

設計ノート

Minimise the gate-drive loop (gate-driver output to gate pin to source/Kelvin return) to less than 5 mm total length to keep parasitic inductance below 2 nH. A high-dV/dt transition in a GaN HEMT can otherwise cause Miller-induced gate glitches and shoot-through. Use a Kelvin-source connection (pin 2) for the gate-driver return rather than the power source pins to avoid ground bounce. Keep the gate-driver PCB trace on an inner layer or a tight top-layer return path directly above/below it.

Estimated: at 27 A continuous current and 55 mΩ R_DS(on), conduction loss is approximately 40 W. The BHDFN-9-1 bottom-side cooled package couples the drain/thermal pad directly to the PCB bottom copper pour or to a cold-plate. Use at least 2 oz copper on both sides of the PCB in the drain-pad region, and consider thermal vias (12-16 vias in a 0.3 mm pitch) for board-level cooling. For sustained operation above 30 W dissipation, attach a heatsink or cold-plate directly to the bottom pad.

Do not apply a negative gate-bias supply with ICeGaN parts - the genuine 0 V turn-off is sufficient and a negative rail can damage the gate structure. Also ensure the dead-time in half-bridge stages is sufficient to prevent shoot-through but not so long that body-diode conduction causes excessive loss (typical optimum is 30-100 ns depending on load current). Verify the gate-drive slew rate (dV/dt) stays within the datasheet rating of [DATA_NEEDED: max dV/dt], and add a small RC gate resistor (5-15 Ω) for EMI tuning.

コンプライアンス情報

RoHS
Compliant
REACH
Unknown
AEC-Q100
Unknown
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Unknown

RoHS compliant per Cambridge GaN Devices product page. AEC-Q101 automotive grade should be confirmed for the specific automotive-grade part variant if needed for automotive designs. Cambridge GaN Devices operates IATF 16949 processes.

データ検証日: 2026-10-15 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

CGD65C055SP2 CGD65C055SP2 datasheet Cambridge GaN Devices CGD65C055SP2 650V GaN HEMT 55mohm BHDFN-9-1 GaN transistor ICeGaN 650V 27A totem-pole PFC CGD65C055SP2 vs CGD65A055S2 CGD65C055SP2 drop-in replacement CGD65C055SP2 buy price DigiKey what is the on-resistance of CGD65C055SP2 CGD65C055SP2 pinout BHDFN 650V GaN HEMT solar inverter ICeGaN gate drive 9-20V GaN transistor EV onboard charger Cambridge GaN Devices bottom-cooled GaN

関連部品&用語

Cambridge GaN Devices CGD65C055SP2 CGD65A055S2 GaN HEMT GaN-on-Si ICeGaN enhancement-mode transistor normally-off transistor wide-bandgap semiconductor power transistor discrete semiconductor MOSFET BHDFN-9-1 bottom-side cooled package wettable flank Miller clamp gate driver totem-pole PFC Class-D amplifier EV on-board charger solar inverter server SMPS 650V rating 55 mΩ R_DS(on) RoHS
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