DSPIC33CH128MP206T-I/MR - 200MHz Dual-Core DSC | Microchip
部品番号: DSPIC33CH128MP206T-I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.1 | $9.10 |
| 10 | $8.32 | $83.20 |
| 100 | $7.4 | $740.00 |
| 500 | $6.6 | $3,300.00 |
| 1,000 | $5.85 | $5,850.00 |
DSPIC33CH128MP206T-I/MR 概要
A digital signal controller (DSC) is a hybrid device that combines a microcontroller (MCU) with a digital signal processor (DSP) on a single die. Within the broader semiconductor taxonomy, a DSC sits between a microcontroller and a full DSP: it provides deterministic real-time control like an MCU while offering single-cycle MAC operations, hardware loops, and barrel shifters for signal-processing tasks. The dsPIC33CH family further extends this concept with a true dual-core design where the master and slave cores can run independent code paths, enabling concurrent motor control and communication stack execution.
Key differentiating features of this part include the dual-core asymmetric architecture, four 12-bit ADC modules with up to 3.5 MSPS conversion rate, six analog op-amps/comparators, dedicated PWM with 250 ps resolution, and functional safety (FuSa) documentation targeting IEC 61508 SIL 2/SIL 3 designs. The wide operating voltage range of 3.0 V to 3.6 V and -40 °C to +85 °C industrial temperature grade suit both consumer and industrial deployments.
The dsPIC33CH dual-core architecture uses independent instruction buses, dedicated peripherals per core, and tightly-coupled mailbox registers for inter-core communication. This eliminates the typical interrupt-driven latency bottlenecks found in single-core controllers and enables deterministic sub-microsecond response times for high-frequency SMPS loops or field-oriented motor control.
Typical applications include digital switched-mode power supplies (SMPS) with peak current mode control, wireless power transmitters, sensorless field-oriented control (FOC) motor drives for drones and appliances, and functional-safety industrial controllers. The functional-safety variant adds safety-class libraries and FMEDA documentation for safety-critical designs.
When designing with this part, allocate sufficient PCB area for the exposed thermal pad of the 64-pin QFN package, since high-frequency SMPS designs dissipate significant heat in the controller. Use Microchip's MPLAB X IDE with the XC-DSC compiler and the MPLAB Code Configurator (MCC) plugin to configure the dual-core project structure.
This page synthesizes distributor pricing, drop-in package alternatives, and practical dual-core design considerations that go beyond the manufacturer datasheet block diagram.
ドロップイン代替品: DSPIC33CH128MP206T-I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33CH128MP206T-I/MR （同一形状・フットプリント） — 相違点: Core Architecture, Operating Temperature, Package, ADC, Operating Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33CH128MP206T-E/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33CH128MP206T-H/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33CH128MP206-I/MR
✅ ドロップイン✓ 在庫あり
$3.95 / 個
データシートを見る →DSPIC33CK128MP206-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.23 / 個
データシートを見る →DSPIC33CH128MP206-I/PT
✅ ドロップイン✓ 在庫あり
$5.45 / 個
データシートを見る →DSPIC33CH128MP206T-I/MR 最大定格＆電気的特性
| Core Architecture | Dual-core dsPIC33CH (main + auxiliary) |
| Main Core Speed | 200 MHz |
| Auxiliary Core Speed | 180 MHz |
| Program Memory (Flash) | 152 KB (152K x 8) |
| RAM | 20 KB x 4 (PRAM 4 KB) |
| 電源電圧 | 3.0 V to 3.6 V |
| 動作温度 | -40 °C to +85 °C |
| パッケージ | 64-QFN (9x9 mm) with EP |
| ピン数 | 64 |
| ADC | Four 12-bit SAR ADC modules |
| PWM Outputs | Multiple 16-bit PWM channels |
| Op-Amps/Comparators | 6 dedicated analog |
| DMA Channels | 8 |
| Serial I/O Ports | 3 (I2C/SPI/UART) |
| Functional Safety | FuSa-class B support (IEC 61508) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 |
DSPIC33CH128MP206T-I/MR 64-qfn (9x9 mm) with ep ピン配置ガイド
DSPIC33CH128MP206T-I/MR (64-qfn (9x9 mm) with ep パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33CH128MP206T-I/MR.
詳細は データシート をご参照ください。
主な用途
DSPIC33CH128MP206T-I/MR の用途: 6 件s: Digital Switched-Mode Power Supplies (SMPS), Sensorless Field-Oriented Control (FOC) Motor Drives, Wireless Power Transmitters, Functional-Safety Industrial Drives (IEC 61508), Drone Flight Controllers and ESCs, Automotive Sensor and Actuator Modules.
Digital Switched-Mode Power Supplies (SMPS)
The DSPIC33CH128MP206T-I/MR is optimized for digital SMPS control in server power, telecom bricks, and industrial DC-DC converters. The 200 MHz main core executes peak-current-mode control loops in under 1 microsecond, the dedicated PWM with 250 ps resolution drives high-frequency GaN or Si MOSFETs, and the 12-bit ADC with 3.5 MSPS sampling captures current and voltage waveforms synchronously with the switching period. The auxiliary core handles PMBus or I2C communication and telemetry, offloading the main control loop. Designers can implement digital compensator (Type II/Type III) coefficients in firmware, replacing analog op-amp compensation networks for better transient response.
おすすめ
Sensorless Field-Oriented Control (FOC) Motor Drives
The DSPIC33CH128MP206T-I/MR executes sensorless FOC motor control for drones, appliances, pumps, and HVAC compressors. The main core runs the FOC algorithm (Clarke, Park, inverse Park, SVPWM) with sub-microsecond loop times, while the auxiliary core manages UART/CAN communication with the system host. Hardware features tailored for this application include the 6-channel analog op-amp/comparator block for current sensing, the quadrature encoder interface for sensored FOC variants, and the 12-bit ADC with up to 3.5 MSPS conversion rate. Dual-core architecture eliminates interrupt jitter caused by communication tasks, yielding smoother torque output and lower acoustic noise.
おすすめ
Wireless Power Transmitters
The DSPIC33CH128MP206T-I/MR is purpose-built for wireless power transmitter applications including Qi charging pads, industrial wireless charging, and EV wireless charging pilots. The main core executes the resonant tank control loop, foreign object detection (FOD) algorithms, and adaptive tuning logic at the Qi-specified 110-205 kHz operating frequency, while the auxiliary core handles the Qi communication protocol stack (Q-FSK) and host-side negotiation. Hardware support includes dedicated PWM with programmable dead time for half-bridge drivers, high-resolution ADC for current sensing on the resonant capacitor, and DMA for background data acquisition without CPU intervention.
おすすめ
Functional-Safety Industrial Drives (IEC 61508)
The DSPIC33CH128MP206T-I/MR includes functional safety (FuSa) documentation targeting IEC 61508 SIL 2 and SIL 3 designs, suitable for industrial servo drives, safety PLCs, and process control equipment. The dual-core architecture enables built-in self-test (BIST) on the auxiliary core while the main core continues execution, providing redundant diagnostic coverage without halting the application. Microchip supplies FMEDA, safety manuals, and certified DSP libraries that document fault detection mechanisms for the ADC, CPU, and memory subsystems. The IEC 61508 SIL 3 capability is achieved when both cores run diverse software paths and cross-check each other's outputs.
おすすめ
Drone Flight Controllers and ESCs
The DSPIC33CH128MP206T-I/MR targets drone flight controllers and electronic speed controllers (ESCs) requiring high update rates and concurrent peripheral handling. The main core runs the flight-control loop at 1-8 kHz with sensor fusion and PID output, while the auxiliary core manages DShot or OneShot ESC protocol communication with brushless DC motors. Hardware support includes the 16-bit PWM channels with 250 ps resolution for fine-grained throttle control, the quadrature encoder interface for telemetry feedback, and DMA for sensor DMA streams. The 64-QFN (9x9 mm) package size suits compact PCB layouts typical of mini-quad frames.
おすすめ
Automotive Sensor and Actuator Modules
The DSPIC33CH128MP206T-I/MR (when used in the -E or -H temperature grade variants) targets automotive sensor and actuator modules including battery management systems, EPS modules, and ADAS sensor controllers. The dual-core architecture allows the main core to manage safety-critical sensor sampling at deterministic rates, while the auxiliary core handles CAN/CAN-FD communication with the vehicle network. Hardware CAN-FD controllers support the high-speed bus requirements of modern automotive networks, and the dedicated PWM outputs drive actuators such as solenoids and LED matrix headlights. Designers should choose the -H/MR (150 °C) variant for under-hood applications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33CH128MP206T-I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33CH128MP206T-E/MR | DSPIC33CH128MP206T-H/MR | DSPIC33CH128MP206-I/MR | DSPIC33CK128MP206-I/MR | DSPIC33CH128MP206-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) MR | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-TQFP (10x10 mm) - different |
| Core Architecture | Dual-core (200/180 MHz) | Dual-core (200/180 MHz) - same | Dual-core (200/180 MHz) - same | Dual-core (200/180 MHz) - same | Single-core (100 MHz) | Dual-core (200/180 MHz) - same |
| Flash Memory | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB |
| Operating Temperature | -40 °C to +85 °C (industrial) | -40 °C to +125 °C (extended) | -40 °C to +150 °C (high-temp) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) |
| Functional Safety | FuSa (IEC 61508 SIL 2/SIL 3) | FuSa (IEC 61508 SIL 2/SIL 3) | FuSa (IEC 61508 SIL 2/SIL 3) | FuSa (IEC 61508 SIL 2/SIL 3) | Not applicable (single-core) | FuSa (IEC 61508 SIL 2/SIL 3) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
主な差別化要因
- True dual-core DSC architecture at 200 MHz （vs DSPIC33CK128MP206-I/MR)
- Same-package extended-temperature drop-in （vs DSPIC33CH128MP206T-E/MR)
- Integrated functional-safety documentation （vs DSPIC33CK128MP206-I/MR)
設計ノート
The 64-pin QFN (9x9 mm) package of the DSPIC33CH128MP206T-I/MR uses an exposed thermal pad that MUST be soldered to a PCB ground copper pour for rated thermal dissipation. For high-frequency SMPS designs switching above 500 kHz or driving motor inverters above 5 A, allocate at least 2 square inches of 2oz copper under the EP and connect with multiple thermal vias (0.3 mm drill, 1.0 mm pitch) to the internal ground plane. Without the EP solder connection, the device will overheat and may trigger thermal shutdown during normal operation. Estimated: at 0.5 W dissipation (typical for a 200 MHz DSC at room temperature), a properly-soldered EP on 1 sq-in 2oz copper holds junction rise to ~25 °C above ambient.
DSPIC33CH128MP206T-I/MR dual-core devices require careful PCB layout to prevent analog and digital ground coupling. Use a four-layer stack with separate AGND and DGND planes joined at a single point beneath the IC. Place the 0.1 µF + 10 µF VDD decoupling capacitor pair within 3 mm of the supply pins, and keep the analog op-amp/comparator traces away from PWM and switching signals. The exposed pad requires at least 9 thermal vias for 1oz copper or 5 vias for 2oz copper. Avoid routing signal traces beneath the package to maintain the EP connection.
Common pitfalls when bringing up the DSPIC33CH128MP206T-I/MR include: (1) programming only the main core while leaving the auxiliary core in an undefined state, which can cause brown-out resets on subsequent main-core restarts; (2) misconfiguring the inter-core mailbox registers, which leads to deadlock if both cores wait for the other's message; (3) forgetting to enable the auxiliary core's clock source in the main-core firmware, which leaves the auxiliary core stuck at reset; (4) using the standard DSPIC33CK MPLAB project template instead of the dsPIC33CH dual-core template, which lacks the inter-core synchronization code; (5) leaving the JTAG pins floating on production boards, which can trigger unwanted debug-mode entry during EMI events. Verify all four corner cases before qualifying the firmware for production.
Place the 12-bit ADC reference voltage decoupling capacitor (typically 0.1 µF + 10 µF) within 2 mm of the AVdd pin and route the analog reference trace as a differential pair with the ground return. The ADC channels are paired; use adjacent pairs for differential current-sensing applications to minimize gain-mismatch errors. For SMPS designs, synchronize ADC sampling to the PWM period using the ADC's PWM-triggered mode to eliminate switching-noise-induced ADC errors. Estimated: with proper layout, the ADC achieves 11.0 effective number of bits (ENOB) at 3.5 MSPS; poor layout reduces ENOB to ~9.5 bits, equivalent to losing 35 dB of SNR in the control loop.
コンプライアンス情報
RoHS compliant per JLCPCB and Verified Electronics listings; IEC 61508 SIL 2/SIL 3 functional safety documentation provided by Microchip (not AEC-Q100 automotive qualified - the -E and -H temperature grade variants are preferred for automotive deployments). Halogen-free status not explicitly listed in provided web data.
