DSPIC33CK128MP206-I/MR - 16-bit 100 MIPS DSC 128KB Flash | Microchip
MPN: DSPIC33CK128MP206-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.58 | $2.58 |
| 10 | $2.41 | $24.10 |
| 100 | $2.31 | $231.00 |
| 500 | $2.25 | $1,125.00 |
| 1,000 | $2.23 | $2,230.00 |
DSPIC33CK128MP206-I/MR Overview
A digital signal controller combines the deterministic control of a microcontroller with the mathematical throughput of a DSP. Within the power-management hierarchy of embedded systems, a DSC such as the dsPIC33CK family sits between a general-purpose MCU and a dedicated DSP, executing single-cycle MAC and DSP instructions that make closed-loop control algorithms such as field-oriented control (FOC) practical on a single chip.
Key features include the 100 MHz single-core dsPIC DSC engine with DSP instruction extensions, dual-panel Flash supporting live update firmware upgrades, integrated operational amplifiers, 12-bit ADCs, high-resolution PWM peripherals, and CAN Flexible Data (CAN FD) connectivity. The Flash ECC and memory built-in self-test (MBIST) target functional-safety (FuSa) designs.
Architecturally, the device uses a Modified Harvard architecture with separate program and data buses, allowing simultaneous instruction fetch and data access. The high-resolution PWM module provides fine edge placement resolution essential for switching power converters, while dual-partition Flash enables fault-tolerant in-field updates.
Typical applications include digital power supplies, brushless DC and PMSM motor control, advanced sensing, and industrial automation nodes requiring CAN FD networking.
Design consideration: the device operates from 3.0V to 3.6V, so regulate a 3.3V rail with adequate decoupling and exploit the exposed pad for ground return and thermal relief.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet. Pricing as of 2026-09-22.
Drop-in alternatives for DSPIC33CK128MP206-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK128MP206-I/MR (same form factor and footprint) — differing in Package, Operating Temperature, ADC, Data SRAM, Functional Safety Support.
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Request AlternativesDSPIC33CK128MP206-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33CK DSC, Modified Harvard |
| Maximum CPU Speed | 100 MIPS (100 MHz) |
| Program Flash | 128 KB (128K x 8) with ECC, dual partition |
| Data SRAM | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) |
| ADC | 12-bit |
| PWM | High-Resolution PWM |
| CAN | CAN FD (Flexible Data) |
| Integrated Op-Amps | Yes |
| DSP Instructions | Single-cycle MAC, DSP-enhanced |
| Functional Safety Support | FuSa (Flash ECC, MBIST) |
| Package | 64-QFN (9x9 mm), exposed pad |
| Mounting Type | Surface Mount |
| Pin Count | 64 |
DSPIC33CK128MP206-I/MR 64-qfn (9x9 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33CK128MP206-I/MR (64-qfn (9x9 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK128MP206-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK128MP206-I/MR is suitable for 6 applications: Digital Power Supplies, Brushless Motor Control (FOC), Automotive and Industrial CAN FD Networking Nodes, Advanced Sensing and Measurement, Industrial Automation and Control, Wireless and IoT Edge Control.
Digital Power Supplies
The DSPIC33CK128MP206-I/MR fits digital power conversion because its high-resolution PWM delivers fine duty-cycle and phase resolution for LLC, buck, boost, and totem-pole PFC topologies, while the 12-bit ADC is PWM-triggered for precisely synchronized current and voltage sampling. Operating at 100 MIPS with single-cycle MAC instructions, the dsPIC33CK core executes 3p3z compensators and cycle-by-cycle current limiting deterministically within each switching period. The integrated op-amps can amplify shunt signals internally, reducing external component count. Placed as the sole controller on the board, it runs from a clean 3.3V rail; the main trade-off versus a fixed-function controller is firmware development effort, repaid by field-updatable control laws via the dual-partition Flash with live update.
Recommended
Brushless Motor Control (FOC)
Field-oriented control of PMSM and BLDC motors demands deterministic loop timing, which the 100 MIPS dsPIC33CK core of the DSPIC33CK128MP206-I/MR provides with single-cycle multiply-accumulate for Park/Clarke transforms and PI current loops. The high-resolution PWM generates three complementary gate-drive pairs with dead-time insertion, and the 12-bit ADC samples phase currents synchronized to PWM centers to avoid switching noise. Integrated op-amps condition low-side shunt signals without external amplifiers, and the 64-pin QFN supplies enough I/O for encoder or Hall interfaces plus CAN FD for networked drives. Microchip's motor-control libraries target this exact family, shortening time to a functioning FOC stack.
Recommended
Automotive and Industrial CAN FD Networking Nodes
The CAN Flexible Data (CAN FD) controller integrated in the DSPIC33CK128MP206-I/MR supports payloads up to 64 bytes at higher bit rates than classical CAN, making the device suitable as a smart sensing or actuation node on industrial and vehicular networks. Combined with the 100 MIPS core, incoming frames can be parsed and responded to within tight timing windows, while the 128KB ECC-protected Flash and MBIST support functional-safety development workflows (FuSa). The 64-pin QFN offers ample I/O for local sensors and PWM actuators around the network interface. Designers should implement proper CAN transceiver isolation and follow Microchip's CAN FD application notes for bit-timing configuration.
Recommended
Advanced Sensing and Measurement
The DSPIC33CK128MP206-I/MR serves advanced sensing applications by pairing its 12-bit ADC with the integrated operational amplifiers, allowing direct connection of low-level sensor signals such as shunts, thermistors, and bridge outputs with minimal external circuitry. The 100 MIPS DSP engine applies digital filtering - IIR/FIR, oversampling, and averaging - in real time, exploiting single-cycle MAC throughput. SRAM of 16KB buffers waveform captures for diagnostics, and results can be streamed over CAN FD or UART. Because the ADC can be triggered from the PWM timer, cyclic sampling of switched sensor front ends stays jitter-free. The main design consideration is keeping the 3.0V-3.6V supply clean to preserve ADC accuracy.
Recommended
Industrial Automation and Control
In factory automation, the DSPIC33CK128MP206-I/MR acts as a deterministic control element driving actuators, interpreting encoder feedback, and exchanging commands over CAN FD with PLCs and drives. Its 100 MIPS core closes control loops in the tens-of-microseconds class, while the high-resolution PWM handles heater, valve, or small-motor power stages. The ECC-protected dual-partition Flash enables firmware updates on installed equipment without a service visit - critical for long-lifecycle industrial assets. The industrial temperature grade (-40C to +85C) matches cabinet and floor environments. Trade-off: as a DSC it lacks high-level connectivity like Ethernet, so it is best positioned as a satellite controller beneath a network master.
Recommended
Wireless and IoT Edge Control
For IoT edge nodes that must perform local real-time control, the DSPIC33CK128MP206-I/MR provides the 100 MIPS processing muscle while a companion radio module handles connectivity. The DSC preprocesses sensor data - filtering, FFT feature extraction using DSP instructions - and offloads only compact results to the network, reducing radio duty cycle and system power. CAN FD and multiple UART/SPI/I2C ports integrate diverse peripherals, and the 64-pin QFN offers enough I/O for displays, keys, and power management around the node. Pairing with a low-power MCU for sleep-state housekeeping is a common architecture when battery life dominates; the trade-off is two-firmware coordination.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK128MP206-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK256MP206-I/MR | DSPIC33CK64MP206-I/MR | DSPIC33CK32MP206-I/MR | DSPIC33CK128MP206-E/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| Program Flash | 128 KB (ECC, dual partition) | 256 KB (ECC, dual partition) | 64 KB | 32 KB | 128 KB |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +150C (E grade) |
| Key Peripherals | 12-bit ADC, Hi-Res PWM, CAN FD, Op-Amps | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
Key Differentiators
- Largest Flash in the same 64-QFN footprint (vs DSPIC33CK64MP206-I/MR)
- Live-update capable dual-partition Flash (vs DSPIC33CK32MP206-I/MR)
- Extended-temperature upgrade without redesign (vs DSPIC33CK128MP206-E/MR)
Design Notes
Supply the DSPIC33CK128MP206-I/MR from a regulated 3.3V rail within the 3.0V-3.6V datasheet window. Decouple every VDD/VDDCORE pin with 100 nF ceramic capacitors placed within 2 mm of the pin, plus bulk 10 uF near the package. The dsPIC33CK core draws transient current bursts during 100 MHz execution, so low-impedance, short ground returns are essential to avoid brown-out resets during Flash write operations.
The 64-QFN (9x9) exposed pad (EP) must be soldered to a grounded via-stitched copper pour - it is the primary ground and thermal path, not an option. For rework-friendly assembly, use an approximately 60-70% solder paste coverage grid on the EP pattern. Route high-resolution PWM outputs away from the 12-bit ADC traces to minimize coupling; keep ADC reference traces on a quiet island with dedicated decoupling.
Do not confuse temperature-grade suffixes: -I is -40C to +85C, -E extends to +150C per family documentation; using an I-grade part in a sealed motor-drive enclosure that exceeds 85C ambient risks field failures. Also, dual-partition live update requires correct boot partition configuration bits - misconfiguration can brick programming. Verify both settings against the Microchip programming specification during firmware sign-off.
When driving external MOSFET gate drivers from the high-resolution PWM outputs, keep each PWM trace short and paired with its complement to preserve dead-time integrity; long stubs add skew that erodes the fine edge resolution the HR-PWM module provides. For ADC front ends, place the anti-aliasing RC filter (e.g., 1 kOhm / 1 nF class, per your sampling rate) close to the input pin and reference the filter ground to the EP ground plane.
Compliance Information
Compliance status not stated in the provided verified web data. Microchip standard product is typically RoHS-compliant, but per data authenticity rules this must be confirmed from the manufacturer product page before claim.
