DSPIC33EP256GM604T-I/ML - 70 MIPS 256KB DSC | Microchip
部品番号: DSPIC33EP256GM604T-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.54 | $55.40 |
| 100 | $4.95 | $495.00 |
| 500 | $4.42 | $2,210.00 |
| 1,000 | $3.98 | $3,980.00 |
DSPIC33EP256GM604T-I/ML 概要
A digital signal controller combines the compute architecture of a microcontroller with the mathematical acceleration of a digital signal processor. In the power-management hierarchy, the dsPIC33EP family sits between general-purpose MCUs and dedicated DSPs: it executes real-time control loops, digital filters, and transform algorithms while still offering the interrupts, timers, and communication peripherals engineers expect from a microcontroller.
Key features include the DSP-enhanced 16-bit core with barrel shifter and single-cycle MAC, a 4-channel DMA controller that offloads data movement between peripherals and RAM, and a rich peripheral set that includes motor-control PWM, input capture, quadrature encoder interface support, and multiple serial interfaces (UART, SPI, I2C) plus CAN for industrial networks. The device also supports IEEE 1149.2-compatible JTAG boundary scan, in-circuit programming, and three complex plus five simple hardware breakpoints for robust debugging.
Architecturally, the dsPIC33EP256GM604 uses a Harvard architecture with a 24-bit instruction word and pipelined execution, reaching 70 MIPS at its maximum clock rate. CMOS process technology keeps active power low, and multiple low-power modes (Idle, Sleep) allow battery-operated designs to stretch duty cycles. On-chip oscillator options with PLL reduce external BOM cost.
Typical applications include precision motor control (BLDC, PMSM, stepper), digital power conversion (PFC, LLC, solar inverters), and industrial sensing and automation nodes that require DSP-class filtering together with CAN bus connectivity.
Design consideration: place 100 nF ceramic decoupling capacitors at every VDD/VDDCORE pin pair as close to the package as possible, and use the exposed pad as a low-inductance ground connection; the exposed pad is electrically connected to VSS and also improves thermal dissipation.
This page synthesizes distributor availability data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-24.
ドロップイン代替品: DSPIC33EP256GM604T-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP256GM604T-I/ML （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Core, Program Memory Size, Quadrature Encoder Interfaces.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP256GM604-I/ML
✅ ドロップイン✓ 在庫あり
$4.9 / 個
データシートを見る →DSPIC33EP256GM604-E/ML
✅ ドロップイン✓ 在庫あり
$6.55 / 個
データシートを見る →DSPIC33EP512GM604-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP128GM604-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.95 / 個
データシートを見る →DSPIC33EP256GM304-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP256GM604T-I/ML 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC33EP DSC (Harvard) |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| 電源電圧 | 3.3 V |
| DMA Channels | 4 |
| パッケージ | 44-QFN (8x8 mm) with exposed pad |
| JESD-30 Package Code | S-PQCC-N44 |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (I grade) |
| Debug / Scan | IEEE 1149.2 compatible JTAG boundary scan |
| Programming | In-Circuit and In-Application Programming |
| Hardware Breakpoints | 3 complex and 5 simple |
| Packaging | Tape & Reel (T suffix) |
| RoHS ステータス | Compliant |
| Technology | CMOS |
DSPIC33EP256GM604T-I/ML ピン構成
| ピン 1 | MCLR — Master clear reset input / programming voltage |
| ピン 2 | AN0/VREF+/RB0 — Analog input 0 / positive voltage reference / port B bit 0 |
| ピン 3 | AN1/VREF-/RB1 — Analog input 1 / negative voltage reference / port B bit 1 |
| ピン 4 | AN2/RB2 — Analog input 2 / port B bit 2 |
| ピン 5 | AN3/RB3 — Analog input 3 / port B bit 3 |
| ピン 6 | AN4/RB4 — Analog input 4 / port B bit 4 |
| ピン 7 | AN5/RB5 — Analog input 5 / port B bit 5 |
| ピン 8 | VSS — Ground reference |
| ピン 9 | OSC1/CLKI/RC12 — Oscillator crystal input / external clock input |
| ピン 10 | OSC2/CLKO/RC15 — Oscillator crystal output / clock output |
| ピン 11 | VDD — Positive supply (3.3 V) |
| ピン 12 | PGD/EMUD1/RB6 — In-circuit debug data / port B bit 6 |
| ピン 13 | PGC/EMUC1/RB7 — In-circuit debug clock / port B bit 7 |
| ピン 14 | AN9/RB8 — Analog input 9 / port B bit 8 |
| ピン 15 | AN10/RB9 — Analog input 10 / port B bit 9 |
| ピン 16 | AN11/RB10 — Analog input 11 / port B bit 10 |
| ピン 17 | AN12/RB11 — Analog input 12 / port B bit 11 |
| ピン 18 | AN13/RB12 — Analog input 13 / port B bit 12 |
| ピン 19 | AN14/RB13 — Analog input 14 / port B bit 13 |
| ピン 20 | AN15/RB14 — Analog input 15 / port B bit 14 |
| ピン 21 | AVDD — Analog positive supply |
| ピン 22 | AVSS — Analog ground |
| ピン 23 | AN7/RB15 — Analog input 7 / port B bit 15 |
| ピン 24 | TCK/RC0 — JTAG test clock / port C bit 0 |
| ピン 25 | TDO/SDO2/RF1 — JTAG test data out / SPI2 data out / port F bit 1 |
| ピン 26 | TDI/RF2 — JTAG test data in / port F bit 2 |
| ピン 27 | TMS/RF3 — JTAG test mode select / port F bit 3 |
| ピン 28 | RTCC/RC13 — RTCC secondary oscillator / port C bit 13 |
| ピン 29 | RF4 — General purpose I/O / peripheral function |
| ピン 30 | RF5 — General purpose I/O / peripheral function |
| ピン 31 | VSS — Ground reference |
| ピン 32 | VDD — Positive supply (3.3 V) |
| ピン 33 | RF6 — General purpose I/O / peripheral function |
| ピン 34 | RG0 — General purpose I/O / peripheral function |
| ピン 35 | RG1 — General purpose I/O / peripheral function |
| ピン 36 | RG2 — General purpose I/O / peripheral function |
| ピン 37 | RG3 — General purpose I/O / peripheral function |
| ピン 38 | RG6 — General purpose I/O / peripheral function |
| ピン 39 | RG7 — General purpose I/O / peripheral function |
| ピン 40 | RG8 — General purpose I/O / peripheral function |
| ピン 41 | VSS — Ground reference |
| ピン 42 | VDD — Positive supply (3.3 V) |
| ピン 43 | RG9 — General purpose I/O / peripheral function |
| ピン 44 | VSS/EP — Ground - exposed pad (connect to VSS plane) |
主な用途
DSPIC33EP256GM604T-I/ML の用途: 6 件s: Precision Motor Control (BLDC / PMSM), Digital Power Conversion, Industrial Automation and CAN Networking Nodes, Battery-Operated Portable Instruments, Audio and Signal Processing Systems, Embedded Sensing and IoT Edge Nodes.
Precision Motor Control (BLDC / PMSM)
The DSPIC33EP256GM604T-I/ML is purpose-built for precision motor control: its 70 MIPS DSP core with single-cycle MAC executes field-oriented control (FOC) loops at tens of kHz with margin to spare, while motor-control PWM peripherals generate complementary dead-band-gated outputs for three-phase inverters. The quadrature encoder interface inputs handle position feedback directly, and the 4-channel DMA streams ADC current-sense samples to RAM without CPU intervention, minimizing loop jitter. Placed as the sole controller in a servo or traction drive, it replaces separate MCU-plus-DSP combinations, cutting BOM cost. Designers should budget cycle time for the current loop and use hardware breakpoints to verify ISR latency during commissioning.
おすすめ
Digital Power Conversion
In digital power supplies - PFC stages, LLC resonant converters, and solar micro-inverters - the DSPIC33EP256GM604T-I/ML closes fast voltage and current loops with its 70 MIPS core and DSP multiply-accumulate instructions, achieving control bandwidths that analog-heavy designs previously required. High-resolution PWM outputs drive half-bridges with fine duty resolution, while the ADC-plus-DMA pipeline samples input and output rails synchronously with the switching period, suppressing beat-frequency artifacts. The 3.3 V single-supply operation simplifies isolated bias design. Engineers should synchronize PWM and ADC triggers in hardware and validate transient response with the on-chip run-time watch; the extended-temperature -E/ML variant suits power stages in sealed enclosures.
おすすめ
Industrial Automation and CAN Networking Nodes
The DSPIC33EP256GM604T-I/ML serves well as an intelligent industrial node: CAN connectivity links it to factory fieldbuses, while UART, SPI, and I2C interface sensors, actuators, and HMI front-ends. Its DSP engine performs FIR/IIR filtering and FFT analysis on vibration or current signatures for predictive maintenance, and the 256 KB Flash accommodates protocol stacks plus application logic with room to spare. JTAG boundary scan per IEEE 1149.2 supports production-line board testing without bed-of-nails access to fine-pitch nets. The industrial -40C to +85C rating covers typical cabinet environments; for outdoor or drive-mounted electronics, select the -E/ML extended-grade variant instead.
おすすめ
Battery-Operated Portable Instruments
Portable and battery-powered instruments benefit from the DSPIC33EP256GM604T-I/ML combination of DSP throughput and low-power modes. Idle and Sleep modes cut average current so a battery can last through a full shift, while wake-on-interrupt lets the 70 MIPS core burst-process sensor data - performing FFTs, calibration math, or digital filtering - then return to sleep within microseconds. The 3.3 V operation matches single-cell Li-ion rails through a small LDO, and the compact 8x8 mm QFN saves board area in handheld form factors. The 4-channel DMA keeps ADC sampling running during sleep-adjacent idle states, further reducing CPU-on time and extending battery life in datalogging applications.
おすすめ
Audio and Signal Processing Systems
The DSP-enhanced architecture of the DSPIC33EP256GM604T-I/ML makes it effective for embedded audio and general signal processing: 24-bit fixed-point arithmetic with single-cycle MAC executes equalization, echo cancellation, and active-noise-control filters efficiently at 70 MIPS. UART and SPI link to audio codecs and ADC front-ends, while DMA transfers sample blocks to RAM without CPU stalls, preserving deterministic latency. The 256 KB Flash stores long filter coefficient tables and multi-band processing chains. For applications needing higher audio-specific throughput, Microchip's dsPIC33CK family offers an upgrade path; however, for cost-sensitive industrial audio (intercoms, PA controllers, acoustic sensors) this part delivers DSP-class performance at MCU-class pricing.
おすすめ
Embedded Sensing and IoT Edge Nodes
As an IoT edge controller, the DSPIC33EP256GM604T-I/ML preprocesses sensor streams locally before transmission: the DSP core applies windowing, averaging, and anomaly-detection filters to ADC data, reducing radio airtime and cloud compute cost. The 4-channel DMA pipelines multi-sensor acquisition, and 32 KB RAM buffers burst data between sampling events. Communication spans UART, SPI, I2C, and CAN, allowing integration with both legacy industrial buses and external radio modules. Multiple low-power modes suit duty-cycled battery deployments. Designers should sequence peripherals through the DMA controller and use In-Application Programming to support field firmware updates over the network without a dedicated programmer visit.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP256GM604T-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP256GM604-I/ML | DSPIC33EP256GM604-E/ML | DSPIC33EP512GM604-I/ML | DSPIC33EP128GM604-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) EP | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB | 128 KB |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Packaging | Tape & Reel | Tray | Tray / Tape & Reel variants | Tray | Tray |
| DMA Channels | 4 | 4 | 4 | 4 | 4 |
| Relative Cost | Baseline | Similar (tray, often lower unit cost) | Premium (extended temp) | Higher (2x Flash) | Lower (half Flash) |
主な差別化要因
- Tape & Reel supply for automated assembly （vs DSPIC33EP256GM604-I/ML)
- Extended-temperature upgrade on same footprint （vs DSPIC33EP256GM604-E/ML)
- Flash headroom option without redesign （vs DSPIC33EP512GM604-I/ML)
- Cost optimization path （vs DSPIC33EP128GM604-I/ML)
設計ノート
The 44-QFN exposed pad is electrically connected to VSS and serves as both the main ground return and thermal path. Connect it to the ground plane with a grid of at least 4-5 vias directly under the pad. Decouple every VDD pin with 100 nF ceramic capacitors placed within 2 mm of the pin, and add a 10 uF bulk capacitor near the supply entry. Isolate AVDD with an RC filter (e.g., ferrite bead plus 10 uF plus 100 nF) from the digital rail to preserve ADC accuracy.
At 70 MIPS, keep the crystal or external clock traces short and guarded by ground. When using JTAG for boundary scan or debugging, route TCK away from analog inputs to prevent clock coupling into the ADC. The 4-channel DMA can produce burst bus activity - separate motor-control PWM outputs and analog sensing traces from DMA-heavy digital lines to minimize ground bounce on mixed-signal sections of the board.
Do not assume all dsPIC33EP 44-pin variants share identical peripheral pin maps: the GM304 sub-family swaps some peripheral allocations versus GM604, so verify pin-to-peripheral mapping in the family pinout tables before substituting. Also, PGC/PGD programming pins are shared with port pins - avoid loading them during reset, or in-circuit serial programming will fail. Finally, remember the -I grade stops at +85C; use the -E/ML variant for enclosures exceeding that ambient.
コンプライアンス情報
RoHS compliant per distributor parametric data (datasheets.com, updated 13-OCT-2024). REACH, halogen-free, and conflict-minerals declarations not found in provided data - confirm on Microchip's official product page.
