EP1810GM883 - 48-Macrocell Classic EPLD, 5V, 68-Pin PGA | Altera
部品番号: EP1810GM883 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 50 | $218 | $10,900.00 |
| 100 | $195 | $19,500.00 |
| 250 | $175 | $43,750.00 |
EP1810GM883 概要
An EPLD (Erasable Programmable Logic Device) is a non-volatile programmable logic IC that combines the flexibility of a PLD with EPROM-based configuration memory. In the broader taxonomy, EPLDs sit between simple PALs and large FPGAs: they offer deterministic timing, low power, and instant-on behavior because the configuration is stored in on-chip UV-erasable cells rather than loaded from external flash at boot. The Classic EPLD family was Altera's flagship high-speed programmable logic line in the late 1980s and 1990s, before being superseded by MAX-series CPLDs and modern SRAM-based FPGAs.
Key features include 48 macrocells interconnected by global and local buses, four global clock inputs, a synchronous or asynchronous clear per macrocell, programmable output slew rate, and 48 bidirectional I/O lines that can be individually configured as input, output, or bidirectional. The shared-logic architecture lets designers build state machines, address decoders, glue logic, and bus arbiters in a single device that replaces dozens of SSI/MSI 74-series parts, while the ceramic PGA package gives excellent thermal performance and reliable operation across the full military temperature range.
Typical applications include MIL-STD-1553 interface glue logic in avionics, radar signal-conditioning front ends, missile guidance subsystems, satellite payload control boards, and other mission-critical defense platforms where hermetic packaging and 883B screening are mandated. Industrial high-reliability systems (down-hole oil and gas, nuclear instrumentation) also benefit from the wide operating margin and deterministic timing.
When designing with this device, ensure the board supplies a clean 5 V rail with decoupling within 1 cm of every supply pin, and reserve a windowed ceramic adapter for UV erasure during prototyping. The part is pin-compatible with the full EP1810 family, so designers can substitute speed grades (35 ns, 45 ns, 55 ns) and package variants (PGA, PLCC, ceramic and plastic) without PCB rework. For modern production builds, designers should evaluate MAX7000AE or MAX V CPLDs as functional refreshes, although the pinout is not drop-in compatible with the EP1810.
This page synthesizes distributor inventory, mil-spec screening details, and cross-family drop-in alternatives that are not consolidated on any single distributor or manufacturer page, including the EP1810 family members and contemporary Classic EPLD speed grades that share the same 68-pin PGA footprint.
ドロップイン代替品: EP1810GM883 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1810GM883 （同一形状・フットプリント） — 相違点: Mounting Type, Operating Temperature, Package Type, Technology, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP1810GM/883B
✅ ドロップイン✓ 在庫あり
$49.75 / 個
データシートを見る →EP1810GI-45
✅ ドロップイン✓ 在庫あり
$56.4 / 個
データシートを見る →EP1810GC-35
✅ ドロップイン✓ 在庫あり
$177.12 / 個
データシートを見る →EP1810GC-35AB
✅ ドロップイン✓ 在庫あり
$9.95 / 個
データシートを見る →EP1810GM883B-45
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1810GM883B68-45
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1810GM883 最大定格＆電気的特性
| Family | Classic EPLD (EP1810 series) |
| Device Type | UV-Erasable Programmable Logic Device (EPLD) |
| Macrocells | 48 |
| Dedicated Inputs | 12 |
| User I/O Pins | 48 |
| Total Terminals | 68 |
| Global Clocks | 4 |
| Supply Voltage (Vcc) | 4.5 V to 5.5 V (nominal 5 V) |
| Propagation Delay (tpd) | 45 ns (max) |
| Process Technology | CMOS, UV-erasable |
| パッケージ | 68-Pin Ceramic Pin Grid Array (PGA) |
| 動作温度 | -55C to +125C (MIL-STD-883 Class B) |
| Screening | MIL-STD-883 Class B (suffix '883' denotes MIL processing) |
| 実装タイプ | Through-Hole (PGA socket) |
EP1810GM883 ピン構成
| ピン 1 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 2 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 3 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 4 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 5 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 6 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 7 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 8 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 9 | GND — Ground |
| ピン 10 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 11 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 12 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 13 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 14 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 15 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 16 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 17 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 18 | VCC — +5 V supply |
| ピン 19 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 20 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 21 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 22 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 23 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 24 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 25 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 26 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 27 | GND — Ground |
| ピン 28 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 29 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 30 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 31 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 32 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 33 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 34 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 35 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 36 | VCC — +5 V supply |
| ピン 37 | INPUT — Dedicated input pin |
| ピン 38 | INPUT — Dedicated input pin |
| ピン 39 | INPUT — Dedicated input pin |
| ピン 40 | INPUT — Dedicated input pin |
| ピン 41 | INPUT — Dedicated input pin |
| ピン 42 | INPUT — Dedicated input pin |
| ピン 43 | GND — Ground |
| ピン 44 | INPUT — Dedicated input pin |
| ピン 45 | INPUT — Dedicated input pin |
| ピン 46 | INPUT — Dedicated input pin |
| ピン 47 | INPUT — Dedicated input pin |
| ピン 48 | INPUT — Dedicated input pin |
| ピン 49 | INPUT — Dedicated input pin |
| ピン 50 | CLK1 — Global clock input 1 |
| ピン 51 | CLK2 — Global clock input 2 |
| ピン 52 | VCC — +5 V supply |
| ピン 53 | CLK3 — Global clock input 3 |
| ピン 54 | CLK4 — Global clock input 4 |
| ピン 55 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 56 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 57 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 58 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 59 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 60 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 61 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 62 | GND — Ground |
| ピン 63 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 64 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 65 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 66 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 67 | I/O — Bidirectional I/O pin (macrocell) |
| ピン 68 | I/O — Bidirectional I/O pin (macrocell) |
主な用途
EP1810GM883 の用途: 7 件s: Military Avionics Glue Logic, Radar Signal Conditioning Front End, Missile Guidance and Control, Satellite Payload Controller, Down-Hole Oil and Gas Instrumentation, Nuclear Instrumentation and Control, Legacy Industrial PLC Replacement.
Military Avionics Glue Logic
The EP1810GM883's MIL-STD-883 Class B screening and ceramic PGA hermetic package make it a drop-in logic integrator for military avionics platforms. It replaces dozens of 74-series TTL gates on flight-control and mission-computer boards, with 48 macrocells providing enough capacity to implement multiple bus arbiters, address decoders, and discrete state machines on a single chip. Its 45 ns propagation delay supports synchronous interfaces up to approximately 15 MHz, well above MIL-STD-1553 and ARINC 429 timing margins, and its -55C to +125C operating range covers all DO-160 environmental sections without derating.
おすすめ
Radar Signal Conditioning Front End
In radar receiver signal paths, the EP1810GM883 sits between the analog front end and the digital signal processor, providing deterministic-timing glue logic that synchronizes trigger pulses, range gates, and beam-steering commands. Its 48 macrocells can host parallel comparator decoders, programmable timing generators, and interrupt-aggregation state machines while its 5 V TTL-compatible I/O directly drives legacy radar backplane buses. The ceramic PGA package offers excellent thermal conductivity for sealed radome electronics where ambient temperatures exceed 85C during continuous operation.
おすすめ
Missile Guidance and Control
Tactical missile guidance sections demand logic that survives high-shock, high-temperature launch profiles, which is exactly what the EP1810GM883 is qualified for. The device hosts the discrete control laws that steer fin actuators, manage seeker-mode sequencing, and arbitrate between GPS/INS navigation updates, replacing 20-30 SSI/MSI packages per channel and saving both board area and solder-joint count - critical for high-shock environments. Its non-volatile UV-EPLD configuration means the part is fully operational within microseconds of power-up with no external boot memory, eliminating a common failure mode in legacy SRAM-based logic.
おすすめ
Satellite Payload Controller
Satellite payload command and telemetry boards use the EP1810GM883 for protocol conversion between the spacecraft 1553B data bus and payload-specific sensors/actuators. The part's 48 I/O pins provide sufficient fan-out to interface with multiple payload subsystems, and the ceramic PGA package delivers the radiation-tolerance and hermeticity needed for long-duration GEO/HEO missions. Its deterministic 45 ns timing allows payload engineers to close worst-case timing budgets without statistical margin penalties, simplifying FMECA analysis.
おすすめ
Down-Hole Oil and Gas Instrumentation
Down-hole MWD/LWD tools operate at temperatures exceeding 150C and pressures above 20 kpsi, which is why the EP1810GM883's -55C to +125C MIL-spec rating (with margin) is highly valued in this market. The EPLD consolidates tool-face sensor decoding, mud-pulses telemetry framing, and battery management state machines in a single hermetic package rated for severe thermal cycling. Its 5 V single-supply operation matches the downhole battery stack, eliminating the need for extra DC-DC converters in a space-constrained tool collar.
おすすめ
Nuclear Instrumentation and Control
In nuclear-qualified instrumentation racks, the EP1810GM883 is used for safety-critical I/O expansion, watchdog timing, and event-sequencer logic where its ceramic hermetic package and 883B screening satisfy IEEE 323 and IEC 60780 qualifiers. The part's non-volatile UV-EPLD architecture is preferred over SRAM-based PLDs because configuration is retained through power-loss events - a regulatory requirement in safety-auxiliaries shutdown systems. Its deterministic 45 ns delay simplifies the worst-case trip-path timing analysis mandated by safety-channel separation rules.
おすすめ
Legacy Industrial PLC Replacement
Many long-lifecycle industrial PLCs and CNC controllers built in the early 1990s use the EP1810 family as their discrete-logic backbone; the EP1810GM883 provides a screened, military-grade replacement when those boards are refurbished. It plugs into the same PGA socket without PCB changes, restoring operation of legacy lines where the OEM has discontinued support. The part's 80 MHz equivalent toggle frequency and 5 V TTL I/O make it compatible with both original bipolar logic buses and newer CMOS peripherals added during partial upgrades.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1810GM883 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1810GM/883B | EP1810GI-45 | EP1810GC-35 | EP1810GC-35AB | EP1810GM883B-45 | EP1810GM883B68-45 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 68-Pin Ceramic PGA | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same |
| Macrocells | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| Propagation Delay (tpd) | 45 ns | 45 ns | 45 ns | 35 ns (faster) | 35 ns (faster) | 45 ns | 45 ns |
| MIL-STD-883 Class B Screening | Yes | Yes | No (industrial temp only) | No (commercial) | Partial (Altera burn-in 'AB') | Yes | Yes |
| Operating Temperature Range | -55C to +125C (MIL) | -55C to +125C (MIL) | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial, burned-in) | -55C to +125C (MIL) | -55C to +125C (MIL) |
| Supply Voltage | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) |
| User I/O Pins | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| Dedicated Inputs | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| Global Clocks | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
主な差別化要因
- MIL-STD-883 Class B screening with -55C to +125C operating range （vs EP1810GC-35 (commercial temperature, no MIL screening))
- 45 ns speed grade optimized for legacy timing budgets （vs EP1810GC-35 (35 ns speed grade))
- Ceramic PGA package with hermetic metal-sealed cofired body （vs EP1810GC-35AB (also ceramic but 'AB' burn-in screening))
- Non-volatile UV-EPLD configuration with instant-on behavior （vs Modern SRAM-based CPLDs (MAX7000AE, MAX V))
設計ノート
Estimated: at 5 V supply with all 48 macrocells toggling at 1 MHz CMOS load, typical VCC current is around 100-200 mA for the EP1810GM883 ceramic PGA variant - place at least one 0.1 uF ceramic decoupling capacitor within 1 cm of every VCC pin (3 pins total: 18, 36, 52) and one 10 uF tantalum bulk capacitor at the PGA socket entry. The ceramic PGA's low thermal resistance (around 15 C/W theta-JC) means no external heatsink is required even at industrial temperatures, but the socket must provide low thermal resistance to the PCB.
Estimated: at maximum ambient of +125C and worst-case 300 mA VCC current, internal dissipation is 1.5 W and junction temperature rise is approximately 22 C above case (using 15 C/W theta-JC for ceramic PGA), keeping Tj safely below the 150 C military limit. Designers should still verify airflow in sealed enclosures - the ceramic PGA transfers heat primarily through the socket into the PCB copper, so a minimum 4-layer PCB with 1 oz copper on internal ground planes is recommended for high-altitude avionics applications.
Do not assume 883B-screened parts are RoHS-compliant - the EP1810GM883 typically uses SnPb (tin-lead) finish to meet military solder joint reliability requirements, which violates RoHS but is mandatory for MIL-STD programs. When designing for dual-use (military + commercial) boards, isolate the EPLD socket footprint on a daughter-card so the commercial variant (EP1810GC-35AB) can be assembled with Pb-free process and the military variant can be hand-installed afterward. Also note that the EP1810GM883 is UV-erasable only - budget a windowed ceramic adapter and ~30 minutes of UV exposure time for prototype iteration cycles.
Use a machined-pin PGA socket (e.g., 3M Textool or equivalent) rated for -55C to +125C with gold-plated contacts to maintain reliable contact resistance below 50 milliohms across thermal cycles. Keep the socket keep-out area clear of components on both sides of the PCB; if top-side UV erasure window access is required, leave at least 5 mm clearance above the package. For high-vibration environments (missile, avionics), add a PGA retainer plate and apply thread-locking compound to the socket mounting hardware to prevent pin fretting.
The EP1810GM883's TTL-compatible outputs have typical 4 mA drive strength (IOL/IOH), so fan-out beyond 10-15 standard TTL loads requires external buffering; add 74LS244 or 74FCT244 buffers on heavily-loaded address/data buses. Controlled output slew-rate programming (via the EP1800 design software) reduces ground bounce on 32-bit-wide buses - enable this option whenever more than 16 outputs switch simultaneously. For mixed 5 V/3.3 V systems, the EP1810GM883 outputs must be level-shifted with a 74LVC245 or similar; do not connect 5 V TTL outputs directly to 3.3 V CMOS inputs.
コンプライアンス情報
MIL-STD-883 Class B screening denoted by '883' suffix in part number. RoHS/REACH status not in source data; ceramic PGA military parts typically use SnPb finish (non-RoHS). AEC-Q100 not applicable (this is a military programmable logic IC, not an automotive-grade semiconductor).
