EP1K100FC484-1N - 100K Gate ACEX-1K FPGA 333 I/O 484-FBGA | Intel
MPN: EP1K100FC484-1N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $65.5 | $6,550.00 |
| 250 | $61.25 | $15,312.50 |
| 500 | $58.4 | $29,200.00 |
Drop-in alternatives for EP1K100FC484-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K100FC484-1
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP1K100FC484-2N
✅ Drop-In✓ In Stock
$58.4 / Unit
View Datasheet →EP1K100FI484-2
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1K100FC484-3
✅ Drop-In✓ In Stock
$52.5 / Unit
View Datasheet →EP1K100EFI484-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$67.5 / Unit
View Datasheet →EP1K100FC484-2NGZ
✅ Drop-In✓ In Stock
$52 / Unit
View Datasheet →EP1K100FC484-1N Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 4,992 |
| Number of LABs/CLBs | 624 |
| Total RAM Bits | 49,152 |
| Number of I/O | 333 |
| Number of Gates | 100,000 |
| Voltage - Supply | 2.375 V to 2.625 V (core, 2.5 V nominal) |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Mounting Type | Surface Mount |
| Package / Case | 484-BBGA (FineLine BGA) |
| Technology | 0.22 µm CMOS |
| Speed Grade | -1N (medium) |
| Max Clock Frequency | 333.33 MHz |
| Configuration Method | SRAM-based, JTAG / serial EPROM |
| Embedded Memory Type | EAB (4 blocks, dual-port SRAM) |
| RoHS Status | Non-compliant (legacy product) |
| MSL Level | 3 |
EP1K100FC484-1N 484-bbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1K100FC484-1N (484-bbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K100FC484-1N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100FC484-1N is suitable for 6 applications: Telecom Line Card Interface Logic, Industrial Data Acquisition Front-End, Legacy ASIC Prototyping and Emulation, PCI / cPCI Bridge and Peripheral Controller, Video Processing Front-End (LCD / Camera Pipeline), Network Router / Switch Glue Logic.
Telecom Line Card Interface Logic
The EP1K100FC484-1N's 333 user I/Os and 49 Kbits of dual-port embedded SRAM make it well suited to telecom line-card interface logic, where parallel bus gluing and time-slot switching are required. The device's LVTTL/LVCMOS multi-voltage I/O banks interface directly to TDM framers and serializer/deserializer chips at 1.8 V, 2.5 V, or 3.3 V without external translators. The 624 LABs/CLBs provide enough logic capacity for HDLC controllers, framer back-pressure logic, and per-channel state machines across 32–64 E1/T1 ports. The 4 EABs hold per-channel elastic buffers and look-up tables for tone generation. Operating at 0–70 °C and supporting commercial telecom chassis thermal envelopes, the -1N speed grade handles 333 MHz system buses for backplane interconnect. Power sequencing must observe the 2.5 V core rail before any I/O bank ramps.
Recommended
Industrial Data Acquisition Front-End
In industrial data-acquisition front-ends the EP1K100FC484-1N serves as the central glue-logic and DSP pre-processing element, aggregating parallel ADC outputs, digital isolator channels, and fieldbus interfaces. The 4,992 logic elements implement FIR/IIR pre-filters, decimation stages, and protocol framing for Ethernet/IP, Profibus, or CANopen. The 333 I/Os comfortably absorb 16–24 channels of 16-bit parallel ADCs plus SPI/I2C control paths. Industrial designers typically pair this FPGA with external SRAM for sample buffering while leveraging the 49 Kbits of dual-port EAB memory for ping-pong DMA channels. Designers should note that for harsh industrial environments the EP1K100FI484-2 industrial-temperature variant is preferred over the -1N commercial grade.
Recommended
Legacy ASIC Prototyping and Emulation
Engineers use the EP1K100FC484-1N as a low-cost ASIC prototype vehicle because its 100,000-gate capacity maps cleanly onto many mid-complexity ASICs from the early 2000s. The 4 EABs emulate embedded SRAM macros, the 624 LABs implement random control logic, and the 333 I/Os let designers bring out full peripheral pin sets for bench characterization. Quartus II design-entry flows remain mature for ACEX-1K, including MegaWizard Plug-Ins for FIFOs, RAMs, and PLLs, enabling rapid iteration before committing to silicon. Compared to a fixed-function ASIC, the FPGA can be re-spun in hours and reused across multiple prototype builds. Engineers should budget configuration time and provision an EPCS configuration EPROM for standalone bench operation.
Recommended
PCI / cPCI Bridge and Peripheral Controller
The EP1K100FC484-1N is widely deployed as a PCI bridge in CompactPCI cards, motion-control boards, and instrumentation where it implements the 32-bit/33 MHz PCI target or master interface plus local bus control. Its 333 MHz internal logic and 4 EABs handle PCI transaction FIFOs, scatter-gather DMA descriptors, and mailbox registers. Multi-voltage I/O banks let the device directly interface legacy 5 V-tolerant peripherals on one bank and 3.3 V PCI on another. The 4,992 logic elements are sufficient for full PCI protocol plus custom register maps and interrupt controllers. Designers migrating legacy PCI designs should consider EP1C20F400C7 as a modern, low-power replacement but plan for pin-map rework.
Recommended
Video Processing Front-End (LCD / Camera Pipeline)
For video front-ends in security cameras, LCD controllers, and machine-vision pre-processors the EP1K100FC484-1N delivers the I/O count and dual-port SRAM needed for pixel-rate pipelines. The 4 EABs hold line buffers, color-space conversion matrices, and gamma-correction LUTs in dual-port mode for simultaneous read/write. The 333 I/Os accept 24-bit parallel RGB/YCbCr camera data plus control signals and drive LVDS or LVTTL panels with no external logic. Operating up to 333 MHz the device comfortably pipelines 640×480 @ 60 Hz or 800×600 @ 50 Hz with room for on-the-fly histogram and thresholding. Multi-voltage I/O simplifies direct interface to 1.8 V image sensors.
Recommended
Network Router / Switch Glue Logic
In network routers and managed switches the EP1K100FC484-1N serves as a custom glue-logic device between PHY/MAC chips, lookup TCAMs, and CPU management buses. Its 333 I/Os handle GMII/RGMII side-band signals, JTAG chains across the chassis, and front-panel LED drivers without external bus expanders. The 49 Kbits of embedded SRAM provides per-port counters and rate-limit buckets in dual-port mode, accessible simultaneously by the management CPU and forwarding engine. The device's JTAG-based in-system programmability enables remote firmware updates via the management CPU, ideal for deployed networking gear. For new designs migrating beyond ACEX-1K, the EP1C12Q240C8 offers similar I/O count with active toolchain support.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FC484-1N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC484-1 | EP1K100FC484-2N | EP1K100FI484-2 | EP1K100FC484-3 | EP1K100EFI484-2 | EP1K100FC484-2NGZ |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| User I/O | 333 | 333 | 333 | 333 | 333 | 333 | 333 |
| Speed Grade | -1N | -1 | -2N | -2 | -3 | -2 | -2N |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +100 °C (industrial) | 0 °C to +70 °C | -40 °C to +100 °C (industrial) | 0 °C to +70 °C |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest I/O density in the ACEX-1K family (vs EP1K100FC256-3N)
- Available lead-free / RoHS-compliant assembly (vs EP1K100FC484-1 (without N suffix))
- Faster speed grade available as direct drop-in (vs EP1K100FC484-2N)
Design Notes
The EP1K100FC484-1N requires a 2.5 V core supply (2.375 V–2.625 V) plus independent I/O bank supplies. Decouple each VCCINT pin with 0.1 µF ceramic in parallel with 10 µF tantalum or polymer placed within 5 mm of the BGA balls. I/O banks (VCCIO) may be powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V — design constraint: an unused bank must still receive a valid VCCIO rail within the device's absolute maximum ratings. Estimated ICC (core) at 100% toggle rate and 333 MHz: 600 mA; at idle: ~150 mA. Budget at least 1.5 A total supply current with 20% derating.
The 484-FBGA package (1.0 mm ball pitch, FineLine BGA) requires a multi-layer PCB with at least 4 routing layers and microvia technology. Fan-out routing between BGA rows demands controlled-impedance traces (50 Ω single-ended) for LVDS/LVTTL outputs. Place the configuration EPROM (EPCS1/EPCS4) within 50 mm of the FPGA DATA0/DCLK/nCONFIG/nSTATUS pins and route them with matched lengths (delta < 2 mm). Provide a low-impedance ground plane directly under the BGA and stitch ground vias around the perimeter every 5 mm to reduce SSO noise. JTAG chain TCK must be length-matched to within ±1 inch across all devices in the chain.
Do not use Quartus Prime (version 9.1 and later) — ACEX-1K device support was removed in Quartus II 9.1. Use Quartus II 9.0 or earlier, or Max+Plus II, for compilation. Do not exceed the 2.625 V absolute maximum on VCCINT or damage is permanent. Configuration bitstreams are SRAM-based: the FPGA loses its design on power-down and must be re-configured from an EPCS EPROM or JTAG on every power-up. The -1N speed grade is commercial temperature only; for industrial environments substitute EP1K100FI484-2 or EP1K100EFI484-2, which are pin-compatible but characterized over -40 °C to +100 °C.
Estimated: the EP1K100FC484-1N dissipates approximately 1.5 W at 100% utilization and 333 MHz (P ≈ C·V²·f·α). Junction temperature rise with the 484-FBGA package is typically θJA = 11 °C/W on a 4-layer JEDEC test board, giving a 16 °C rise at 1.5 W. The commercial 0 °C to +70 °C operating range can be met with this thermal envelope provided the PCB has a continuous ground/power plane stack-up. For designs operating near the upper temperature limit, consider forced airflow or a heat-spreader copper pour over the BGA. Industrial variants (-2, -3 grades with 'I' suffix) have higher θJA due to extended temperature characterization.
Compliance Information
The EP1K100FC484-1N is the lead-free (RoHS-compliant) assembly variant of the ACEX-1K 100K family. Per Intel CMRT filings, conflict-minerals status is compliant. REACH compliance is declared by franchised distributors; halogen-free status is not specified in available data. AEC-Q100 is not applicable (FPGA is not an automotive-qualified IC under ACEX-1K family documentation).
