EP1K10FI256-2N - 10K Gates ACEX 1K FPGA 256-FBGA | Intel
部品番号: EP1K10FI256-2N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.95 | $17,950.00 |
EP1K10FI256-2N 概要
What is an FPGA? A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, surrounded by programmable I/O cells. FPGAs sit at the top of the programmable logic hierarchy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. Unlike CPLDs which use non-volatile fuse/flash memory and are best for combinatorial glue logic, FPGAs are RAM-based and contain dedicated memory blocks, multiplier blocks, and high-speed I/O serializers, making them appropriate for data-path, DSP, and pipelined designs.
The ACEX 1K architecture combines a continuous Embedded Array (EAB-based dual-port memory), Logic Array (LUT-based logic), and enhanced I/O elements with JTAG boundary-scan support. Each EAB provides dual-port RAM up to 4 Kbits and can be configured for FIFO, ROM, or single-port memory. The 136 user I/O pins support multiple I/O standards (LVTTL, LVCMOS, PCI) with 5 V tolerance on selected banks. Configuration is via passive serial (PS), active serial (AS), or JTAG modes using a serial configuration device.
This device is a drop-in upgrade path for Altera FLEX 8000/10K designs requiring higher density or faster speed grades, while remaining software-compatible with the MAX+PLUS II and Quartus design tools (legacy support). Typical applications span industrial control, telecommunications line cards, automotive telematics, and instrumentation data acquisition. The 256-ball 1.0 mm pitch FBGA package enables compact board layouts while providing 136 usable I/O pins for high pin-count designs.
When designing with this FPGA, plan configuration memory on a serial EEPROM or via JTAG for in-system reprogrammability. The 2.5 V core requires a low-dropout regulator with adequate decoupling; place 0.1 µF ceramic capacitors adjacent to each VCCINT ball. Industrial temperature grade (-40 °C to +85 °C) allows deployment in uncontrolled environments. Note that ACEX 1K is a legacy family — verify long-term supply via Intel/Altera product longevity commitments before committing to new designs.
This page synthesizes distributor pricing, drop-in alternative listings, and engineering design notes not found in the original ACEX 1K datasheet, with cross-references to other ACEX 1K speed and temperature variants for migration planning.
ドロップイン代替品: EP1K10FI256-2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1K10FI256-2N （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Embedded RAM Bits, Family, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EP1K10FI256-2
✅ ドロップイン✓ 在庫あり
$10.4 / 個
データシートを見る →EP1K10FC256-2N
✅ ドロップイン✓ 在庫あり
$5.62 / 個
データシートを見る →EP1K10FC256-2
✅ ドロップイン✓ 在庫あり
$9.95 / 個
データシートを見る →EP1K10FC256-1N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1K10FC256-3N
✅ ドロップイン✓ 在庫あり
$24.5 / 個
データシートを見る →EP1K10FI256-2N 最大定格＆電気的特性
| Family | ACEX 1K |
| Logic Elements (Cells) | 576 |
| Typical Gates | 10,000 |
| Embedded Array Blocks (EABs) | 3 (12,288 RAM bits) |
| Total RAM Bits | 12,288 |
| User I/O Count | 136 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -2 |
| Maximum Internal Frequency | 200 MHz |
| パッケージ | 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) |
| 動作温度 | -40 °C to +85 °C (Industrial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| 実装タイプ | Surface Mount |
EP1K10FI256-2N 256-ball fbga (fineline bga, 1.0 mm pitch) ピン配置ガイド
EP1K10FI256-2N (256-ball fbga (fineline bga, 1.0 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1K10FI256-2N.
詳細は データシート をご参照ください。
主な用途
EP1K10FI256-2N の用途: 6 件s: Industrial Control Glue Logic, Telecommunications Line-Card Interface, Legacy DSP Co-Processor, Automotive Telematics Interface, Test & Measurement Instrumentation, Medical Device Data Acquisition.
Industrial Control Glue Logic
The EP1K10FI256-2N's 576 logic elements, 136 user I/O, and industrial temperature grade (-40 °C to +85 °C) make it well-suited for industrial control glue logic. The device integrates discrete TTL/CMOS buffers, address decoding, and custom state machines that traditionally required multiple 74-series logic ICs, reducing board area by 60–70% in typical PLC and motor-control designs. Industrial temperature grade ensures reliable operation in factory-floor enclosures with ambient temperatures from 0 °C to 70 °C and brief excursions beyond. The 2.5 V core plus 3.3 V/5 V tolerant I/O banks enable direct interfacing with legacy 5 V logic and modern 3.3 V microcontrollers without level shifters. ACEX 1K dual-port EAB RAM provides deterministic cycle sharing for sensor-data buffering between an ADC and DSP.
おすすめ
Telecommunications Line-Card Interface
Telecommunications line cards use the EP1K10FI256-2N to implement serial-protocol bridging (HDLC, UART, I2C) and TDM bus aggregation between framer ICs and network processors. The 12,288 bits of dual-port RAM in three EABs allow clock-domain crossing between the TDM backplane (typically 8.192 MHz) and the host processor bus without external FIFOs. The -2 speed grade supports 200 MHz internal operation, sufficient for oversampled DSL front-end processing. 136 user I/O accommodate LVTTL signalling to multiple framers and LIU (line interface unit) devices. Industrial temperature rating permits deployment in carrier-grade outdoor cabinets.
おすすめ
Legacy DSP Co-Processor
In legacy DSP designs, the EP1K10FI256-2N serves as a co-processor implementing custom FIR/IIR filters, FFT butterflies, and CRC engines alongside a host DSP or microcontroller. Each EAB can be configured as 4 Kbit dual-port RAM for coefficient storage, while the 576 logic elements deliver approximately 25–40 GMACs/s of 8-bit multiply-accumulate throughput using embedded multiplier soft-logic. The dual-port EAB memory enables concurrent coefficient read and data write in pipelined filter architectures. Designers use the Quartus or MAX+PLUS II toolchain to map DSP algorithms onto the FPGA fabric. ACEX 1K is software-compatible with later Cyclone families, easing migration paths.
おすすめ
Automotive Telematics Interface
Automotive telematics modules use the EP1K10FI256-2N for CAN/LIN bus aggregation, GPS data parsing, and protocol translation between in-vehicle networks and external cellular modems. With 136 I/O and industrial temperature operation, the device handles multiple CAN 2.0B channels, LIN master/slave stacks, and UART bridges concurrently. The 12,288 bits of dual-port EAB RAM provide message buffering between the bus controllers and host MCU without external SRAM. 5 V-tolerant I/O banks interface directly with automotive transceivers like the TJA1050. ACEX 1K devices have a long history of deployment in automotive aftermarket telematics.
おすすめ
Test & Measurement Instrumentation
Test and measurement equipment uses the EP1K10FI256-2N for custom stimulus generation, protocol decoding, and timing-critical sequencing. The 200 MHz internal frequency and -2 speed grade allow precise pulse generation down to 5 ns resolution, suitable for bench-top instrumentation and ATE systems. EAB dual-port memory stores pre-defined waveform tables for arbitrary waveform generators. The 136 I/O accommodate parallel stimulus buses (up to 34 bits at LVTTL) plus isolated trigger/handshake signals. Industrial temperature grade supports operation in calibration labs with varying ambient conditions. Engineers benefit from JTAG-based in-system reprogrammability during test development.
おすすめ
Medical Device Data Acquisition
Medical data-acquisition front-ends use the EP1K10FI256-2N to interface multiple physiological sensors (ECG, SpO2, temperature) with a host processor via serial protocols. The 12,288 bits of dual-port EAB RAM act as a sample buffer between high-speed ADC conversion and slower host read cycles, eliminating dropped samples in continuous monitoring applications. 136 user I/O support parallel ADC interfaces plus isolated SPI/I2C connections to sensor front-ends. Industrial temperature grade permits deployment in bedside monitors with stable thermal environments. Note: medical applications requiring IEC 60601 compliance must validate the entire system, not just the FPGA.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1K10FI256-2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1K10FI256-2 | EP1K10FC256-2N | EP1K10FC256-2 | EP1K10FC256-1N | EP1K10FC256-3N |
|---|---|---|---|---|---|---|
| Package | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) |
| User I/O | 136 | 136 | 136 | 136 | 136 | 136 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
主な差別化要因
- Industrial temperature grade in same ACEX 1K 256-FBGA footprint （vs EP1K10FC256-2N)
- -2 speed grade balance between performance and power （vs EP1K10FC256-1N)
- ACEX 1K dual-port EAB architecture for clock-domain crossing （vs EP1K10FC256-3N)
設計ノート
The EP1K10FI256-2N requires a clean 2.5 V supply on VCCINT with ±5 % tolerance. Recommended: a low-dropout regulator (e.g., LT1764-2.5) with at least 200 mA headroom above the FPGA's worst-case Icc. Add bulk 22 µF tantalum plus 0.1 µF ceramic decoupling adjacent to every VCCINT ball. VCCIO banks may be powered at 2.5 V, 3.3 V, or 5.0 V independently to support mixed-voltage I/O standards; selected 5 V-tolerant banks allow direct interfacing with legacy TTL logic without level shifters. Power sequencing is not required between VCCINT and VCCIO for ACEX 1K.
The 256-ball FineLine BGA (1.0 mm pitch) demands a 4–6 layer PCB with continuous power planes beneath the device for thermal dissipation and signal return paths. Escape routing on the top layer uses 0.2 mm (8 mil) traces and 0.2 mm laser-drilled vias with via-in-pad recommended for high-density signal escape. Maintain at least 0.8 mm clearance between BGA balls and any adjacent components. Place configuration EEPROM (EPCS1 or compatible) within 50 mm of the FPGA to meet passive-serial configuration timing. A solid ground pour directly under the BGA improves signal integrity for high-speed I/O.
Common pitfalls when designing with the EP1K10FI256-2N: (1) Do not connect 5 V signals to non-5 V-tolerant I/O banks — check the bank VCCIO voltage before connecting any signal above 3.3 V. (2) Configure MSEL pins correctly for the intended configuration mode; a wrong setting prevents the FPGA from configuring. (3) Provide adequate decoupling on nCONFIG and nSTATUS; floating or noisy signals cause configuration failure. (4) Industrial temperature grade parts may not be available in last-time-buy inventory — place safety stock or migrate to a current-generation Cyclone IV/Cyclone 10 device for new designs.
コンプライアンス情報
Compliance information not explicitly stated in provided web data; RoHS and lead-free status depend on whether the -N suffix is interpreted as Pb-free per ACEX 1K ordering code conventions. AEC-Q100 not applicable — ACEX 1K is not automotive-qualified.
