EP1K30FI256-2N - 30K Gate ACEX-1K FPGA, 256-BGA | Intel / Altera
部品番号: EP1K30FI256-2N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.4 | $18,400.00 |
EP1K30FI256-2N 概要
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells on a single silicon die. FPGAs occupy the top of the programmable logic taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. ACEX-1K specifically targets low-cost system-on-a-programmable-chip (SOPC) integration, allowing designers to implement embedded memory blocks, megafunctions, and DSP-style logic on one device, supplanting discrete logic ICs in many cost-sensitive designs.
Key features of the EP1K30FI256-2N include dual-port embedded array blocks (EABs) for efficient memory and specialized logic functions, an enhanced embedded array architecture, in-system programmability via IEEE 1149.1 JTAG, and a maximum internal operating frequency of 200 MHz. The 256-ball FineLine BGA package offers a compact footprint suitable for high-density boards while providing ample I/O for parallel buses, memory interfaces, and high-speed glue logic.
Typical applications span glue logic replacement, interface bridging, custom peripheral controllers, industrial control subsystems, and low-cost ASIC prototyping. The combination of dual-port EAB memory, 171 user I/Os, and a 2.5 V core makes it well suited to designs requiring moderate logic density and on-chip RAM without migrating to higher-cost Cyclone or Arria families.
When designing with this device, verify that the Quartus toolchain version supports the ACEX-1K family and that the board-level decoupling scheme supplies clean 2.5 V to the core. Since ACEX-1K is a legacy family, plan for long-term availability risk by validating second sources before committing to high-volume production.
ドロップイン代替品: EP1K30FI256-2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1K30FI256-2N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Total RAM Bits, Process Technology, Core Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
EP1K30FI256-2
✅ ドロップイン✓ 在庫あり
$18.2 / 個
データシートを見る →EP1K30FC256-2N
✅ ドロップイン✓ 在庫あり
$21.45 / 個
データシートを見る →EP1K30FC256-3N
✅ ドロップイン✓ 在庫あり
$17.5 / 個
データシートを見る →EP1K30FC256-3
✅ ドロップイン✓ 在庫あり
$11.1 / 個
データシートを見る →EP1K30FC256-2
✅ ドロップイン✓ 在庫あり
$22.95 / 個
データシートを見る →EP1K30F256-3
✅ ドロップイン✓ 在庫あり
$15.6 / 個
データシートを見る →EP1K10FI256-2N
✅ ドロップイン✓ 在庫あり
$17.95 / 個
データシートを見る →EP1K100FI256-2N
✅ ドロップイン✓ 在庫あり
$55.8 / 個
データシートを見る →EP1K30FI256-2N 最大定格＆電気的特性
| Family | ACEX-1K |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Embedded RAM Bits | 24,576 |
| Maximum User I/O | 171 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Frequency | 200 MHz |
| Number of LABs | 216 |
| パッケージ | 256-ball FineLine BGA (FBGA) |
| 実装タイプ | Surface Mount |
| Operating Temperature Grade | Industrial |
| Speed Grade | -2 |
| Programmable via | JTAG (IEEE 1149.1) |
| メモリタイプ | Dual-port Embedded Array Block (EAB) |
EP1K30FI256-2N 256-ball fineline bga (fbga) ピン配置ガイド
EP1K30FI256-2N (256-ball fineline bga (fbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1K30FI256-2N.
詳細は データシート をご参照ください。
主な用途
EP1K30FI256-2N の用途: 7 件s: Industrial Glue Logic Replacement, ASIC Prototyping and Emulation, Interface Bridging and Protocol Conversion, Legacy Telecommunications Equipment Maintenance, Test and Measurement Instrumentation, Custom Peripheral Controllers, Educational FPGA Development Boards.
Industrial Glue Logic Replacement
The EP1K30FI256-2N's 1,728 logic elements and 171 user I/Os make it ideal for replacing multiple discrete logic ICs in industrial control boards. Its 2.5 V core operates reliably across -40 °C to +85 °C, and dual-port EABs (24,576 RAM bits) can replace small SRAM/DRAM glue chips. The 256-ball FineLine BGA package consolidates wide bus interfaces (16/32-bit data, 24-bit address) into a compact footprint, while 200 MHz internal operation supports moderate-rate state machines, custom peripherals, and proprietary bus protocols (e.g., legacy fieldbus, custom parallel camera links) without driving BOM cost.
おすすめ
ASIC Prototyping and Emulation
Engineers use the EP1K30FI256-2N as an ASIC prototype for low-density custom silicon designs because its 30K gates and 24,576 RAM bits fit typical controller-class ASICs. Quartus II synthesis maps RTL to the ACEX-1K architecture, letting designers validate state machines and bus interfaces before committing to mask ROM. The 200 MHz internal frequency and JTAG-driven in-system programmability accelerate bring-up, while 171 user I/Os provide ample real-world signal access. This makes the EP1K30FI256-2N a stepping stone in design flows where Cyclone IV or Cyclone 10 LP would be the eventual migration target.
おすすめ
Interface Bridging and Protocol Conversion
The EP1K30FI256-2N excels at bridging legacy parallel buses (ISA, VME, custom 16/32-bit interfaces) to modern serial standards, with 171 user I/Os accepting multiple LVTTL/LVCMOS banks concurrently. Designers can implement custom state machines and FIFOs in the dual-port EABs, mapping protocol stacks (UART, SPI, I2C, parallel video) without external glue logic. The 200 MHz internal clock rate is sufficient for typical 50-100 MHz bus bridging. The industrial temperature grade and 256-ball BGA footprint suit embedded industrial PC and test instrumentation applications where pin density matters.
おすすめ
Legacy Telecommunications Equipment Maintenance
The EP1K30FI256-2N is used to maintain legacy telecom infrastructure where system lifetimes exceed 15 years. Its dual-port EAB RAM enables custom packet buffering and framing logic, while 171 user I/Os accommodate TDM bus interfaces and parallel control planes. The 2.5 V core and industrial temperature range meet NEBS-style reliability expectations. Service providers and telecom OEMs source the EP1K30FI256-2N through authorized remaining-stock and broker channels to support fielded systems, making lifecycle-aware design critical when planning long-term spares.
おすすめ
Test and Measurement Instrumentation
The EP1K30FI256-2N is well-suited to custom digital test instruments that require parallel bus capture, custom triggering logic, and on-chip memory for sample buffering. The 1,728 LEs and 24,576 EAB bits let designers implement up to 32-channel logic analyzers, pattern generators, and protocol exercisers in a single device. The 171 user I/Os provide generous probe points for parallel digital buses, while the 256-ball BGA package supports compact instrument form factors. Quartus II toolchain and JTAG programming simplify factory calibration and firmware updates.
おすすめ
Custom Peripheral Controllers
The EP1K30FI256-2N provides a flexible platform for building custom peripheral controllers (motor control, LED drivers, sensor aggregation) where off-the-shelf microcontrollers lack specific I/O combinations. Its 171 user I/Os support many simultaneous sensor channels, while dual-port EABs enable small buffer FIFOs for streaming data. The 200 MHz internal frequency accommodates DSP-style filter blocks at audio and low-rate control loop frequencies. Industrial temperature grading and the rugged BGA package suit factory-floor deployment, and JTAG-based in-system programming simplifies firmware updates.
おすすめ
Educational FPGA Development Boards
The EP1K30FI256-2N is occasionally used in legacy educational FPGA development platforms because its 1,728 LEs and dual-port EABs offer ample resources for student lab exercises (counter design, UART implementation, VGA drivers). Its 256-ball BGA package and 171 user I/Os support breadboard-friendly breakout boards with banks of LEDs, switches, and 7-segment displays. The 200 MHz internal frequency is sufficient for typical teaching designs, and Quartus II Web Edition toolchain (legacy version) supports ACEX-1K targets. Note: new courses should adopt Cyclone IV or Cyclone 10 LP dev kits instead.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1K30FI256-2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1K30FI256-2 | EP1K30FC256-2N | EP1K30FC256-3N | EP1K30FC256-3 | EP1K30F256-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Maximum User I/O | 171 | 171 | 171 | 171 | 171 | 171 |
| Speed Grade | -2 | -2 | -2 | -3 (faster) | -3 (faster) | -3 (faster) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Commercial/Industrial | Industrial |
主な差別化要因
- Same-family -2 speed grade with industrial temperature rating in lead-free packaging （vs EP1K30FI256-2)
- Faster -3 speed grade option exists in same 256-ball FBGA footprint （vs EP1K30FC256-3N)
- Higher-density 100K-gate ACEX-1K option exists in same package （vs EP1K100FI256-2N)
設計ノート
The EP1K30FI256-2N requires a clean 2.5 V core supply capable of sourcing up to 300-500 mA during configuration and high-activity operation. Place 0.1 µF and 10 µF decoupling capacitors as close as possible to each VCCINT and VCCIO power ball pair, distributed across the BGA footprint. Power sequencing is not strictly required for ACEX-1K, but bringing up the 2.5 V rail before driving JTAG signals prevents in-system programming errors. Estimate: a heavily loaded 30K-gate design can draw 200-400 mA steady-state at 100 MHz internal clock.
The 256-ball FineLine BGA package has a 1.0 mm ball pitch, demanding 4-6 layer PCB stack-up with microvia or via-in-pad technology for reliable assembly. Use 0.5 oz copper outer layers and 1 oz inner power planes; route differential pairs and clocks on inner stripline layers with controlled impedance (50 Ω single-ended, 100 Ω differential). Estimate: a properly designed BGA breakout adds 8-12 mm to board area versus a QFP-256 footprint, so allocate BGA escape channels before finalizing schematic symbol.
Avoid driving JTAG signals (TDI, TDO, TMS, TCK) before the 2.5 V core supply has stabilized, which can cause configuration failure or non-volatile memory corruption in the device's configuration SRAM. Do not exceed the 2.5 V core voltage tolerance (±5%); over-voltage damages the 0.22 µm CMOS core. Verify that the Quartus II version supports ACEX-1K (legacy support through Quartus II 13.0sp1; newer Quartus Prime does NOT support ACEX-1K, requiring older toolchain installation).
ACEX-1K I/O buffers are unterminated; for high-speed buses (>50 MHz) or long traces (>50 mm), add source-series termination (22-33 Ω) at the FPGA output to dampen reflections. The 171 user I/Os are organized into four I/O banks, each with its own VCCIO rail supporting mixed voltage standards (LVTTL, LVCMOS, PCI). Do not mix 5 V PCI and 3.3 V LVTTL in the same bank. Estimate: a 32-bit DDR-style bus at 100 MHz on 75 mm traces requires 22 Ω source termination to keep overshoot below 0.5 V.
コンプライアンス情報
EP1K30FI256-2N has the 'N' suffix indicating lead-free (Pb-free) packaging per Altera's legacy naming. AEC-Q100 is not applicable as this is an FPGA logic device, not an automotive-qualified analog/power part. REACH, halogen-free, and conflict minerals status not stated in available web data.
