EPM7256EGC192-12 - MAX 7000 CPLD 256MC 5K Gates 12ns | Intel
部品番号: EPM7256EGC192-12 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.4 | $284.00 |
| 100 | $23.95 | $2,395.00 |
| 500 | $20.1 | $10,050.00 |
| 1,000 | $17.85 | $17,850.00 |
EPM7256EGC192-12 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that bridges the gap between discrete 74-series glue logic and higher-density FPGAs. Architecturally, a CPLD consists of multiple PAL-like Logic Array Blocks (LABs) interconnected by a central programmable switch matrix. The MAX 7000 family uses an EEPROM process for in-system programmability (ISP) via JTAG, retaining configuration without an external boot PROM. In the broader taxonomy: CPLD -> programmable logic -> logic IC -> semiconductor -> integrated circuit.
Key features include four pin-compatible density options (EPM7032/7064/7096/7128 give way to 7160/7192/7256 within MAX 7000), a programmable macrocell flipflop with selectable clear/preset/clock, a JTAG-compliant IEEE Std 1149.1 boundary-scan test interface, and programmable interconnect. Each macrocell supports configurable combinational or registered logic, with a separate product-term array implementing the AND-OR sum-of-products equation.
From an architectural standpoint, the EPM7256EGC192-12 implements the classic MAX 7000 macrocell with 16 product terms per macrocell expandable via shareable expanders and parallel expanders, supporting up to 32 product terms per macrocell for complex state-machine logic. The programmable interconnect array (PIA) routes any LAB output to any LAB input, simplifying board-level glue-logic replacement. The device also includes in-system programming via 5V ISP and supports IEEE 1149.1 JTAG for both configuration and boundary-scan test.
Typical applications include bus-interface and protocol-bridging glue logic, peripheral I/O expansion for legacy microprocessors, decoder/encoder logic in industrial control backplanes, and replacement of multiple discrete 74LS/74HC packages to reduce PCB area and BoM complexity. The 192-pin CPGA provides ample I/O for parallel-bus interfaces.
When designing with this part, plan the JTAG chain and ISP programming voltage sequencing carefully. CPGA packages require through-hole sockets or careful pin alignment; consider switching to a QFP-pin-compatible MAX 7000 variant (e.g., EPM7256AQC208) for new surface-mount designs, but be aware of logic-resource differences between MAX 7000 generations.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: EPM7256EGC192-12 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM7256EGC192-12 （同一形状・フットプリント） — 相違点: Mounting Type, RoHS Status, Maximum Operating Frequency, Supply Voltage (VCCINT), Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EPM7256EGC192-15
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPM7256EGC192-20
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPM7256EGC192-12EM
✅ ドロップイン✓ 在庫あり
$58 / 個
データシートを見る →EPM7256EGC192-12P
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPM7256EGC192-12PP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPM7256EGC192-12 最大定格＆電気的特性
| Family | MAX 7000 |
| Device Logic Cells | 256 macrocells |
| Usable Gates | 5,000 |
| Propagation Delay (tPD) | 12 ns |
| Maximum Operating Frequency | 90.9 MHz |
| User I/O Pins | 164 |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V (5 V nominal) |
| パッケージ | 192-pin CPGA (Ceramic Pin Grid Array) |
| 実装タイプ | Through Hole (PGA socket) |
| Technology | CMOS, EEPROM-based |
| 動作温度 | 0C to +70C (commercial) |
| Programmable Interface | JTAG (IEEE 1149.1) / ISP |
| Logic Blocks (LABs) | 16 |
| Macrocells per LAB | 16 |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| JEDEC Package Code | S-CPGA-P192 |
EPM7256EGC192-12 s-cpga-p192 ピン配置ガイド
EPM7256EGC192-12 (s-cpga-p192 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPM7256EGC192-12.
詳細は データシート をご参照ください。
主な用途
EPM7256EGC192-12 の用途: 6 件s: Legacy Microprocessor Bus Glue Logic, Industrial Control Backplane Decoder, Peripheral I/O Expansion and Protocol Bridging, Replacement of Multiple 74LS/74HC Logic Packages, Test Equipment and ATE Pin Electronics, Aerospace and Defense Avionics Backplanes.
Legacy Microprocessor Bus Glue Logic
The EPM7256EGC192-12 is widely used as bus-interface glue logic between legacy microprocessors (e.g., 8051, 68k, x86) and peripherals such as memory, UARTs, and bus controllers. Its 256 macrocells and 164 user I/O pins are sufficient to implement address decoding, wait-state generation, chip-select logic, and interrupt priority encoders in a single device. The 12 ns tPD keeps decode paths well within a 25 MHz 8051 bus cycle, and the 90.9 MHz fCNT accommodates handshake state machines for parallel-port peripherals. Five-volt tolerance and 164 I/O pins also let engineers retire 6 to 10 discrete 74LS/74HC packages, reducing board area and BoM complexity.
おすすめ
Industrial Control Backplane Decoder
In VME, cPCI, and proprietary industrial backplanes the EPM7256EGC192-12 acts as a slot-decoder and interrupt-arbiter, replacing discrete PROM + PAL implementations with a single in-system-programmable CPLD. The 192-pin CPGA delivers 164 user I/O pins that comfortably handle 32-bit data plus 32-bit address plus control and arbitration signals in one device. The 5V tolerance matches legacy backplane signaling and the JTAG (IEEE 1149.1) interface supports both factory ISP and field reconfiguration via boundary-scan, which is critical for industrial equipment with 10- to 20-year service lives. The 12 ns tPD keeps arbitration decisions within one bus cycle at bus speeds up to 50 MHz.
おすすめ
Peripheral I/O Expansion and Protocol Bridging
Designers use the EPM7256EGC192-12 to expand the I/O count of microcontrollers and to bridge between incompatible protocols such as SPI-to-parallel, I2C-to-GPIO, or UART-to-memory-mapped buses. Its 256 macrocells accommodate multi-channel state machines with separate baud-rate generators, FIFO flags, and chip-select decoders in one device. The 90.9 MHz internal frequency allows 25 MHz SPI masters with substantial timing margin, and 164 I/O pins provide headroom for 8- to 16-bit parallel peripherals. In-system programmability via JTAG lets OEM service centers re-flash the bridge firmware without desoldering the package.
おすすめ
Replacement of Multiple 74LS/74HC Logic Packages
A classic application for the EPM7256EGC192-12 is replacing a board full of discrete 74LS244, 74LS245, 74LS138, 74LS374, and 74LS08 packages with one CPLD that integrates the same logic in a programmable AND-OR array. With 256 macrocells the device can absorb roughly 20 to 30 SSI/MSI packages, dramatically reducing PCB area, BoM cost, and assembly time. The 164 I/O pins accommodate the combined footprint of these packages, and the 12 ns tPD matches or improves on the propagation delay of cascaded TTL packages. JTAG ISP also enables late-stage design changes without re-spinning the board.
おすすめ
Test Equipment and ATE Pin Electronics
Automatic Test Equipment (ATE) and bench-instrument designers use the EPM7256EGC192-12 as a flexible pattern-generator and pin-control CPLD because its 164 user I/O can drive 64- to 128-channel test heads directly, and its 12 ns tPD supports vector rates up to ~80 MHz when paired with an external clock. The JTAG interface simplifies ATE self-test and calibration. Designers can re-program patterns in-system as devices-under-test evolve, avoiding costly hardware redesigns. Five-volt tolerance also matches legacy TTL-level test fixtures used in defense and aerospace production lines.
おすすめ
Aerospace and Defense Avionics Backplanes
The EPM7256EGC192-12 in CPGA package is used in aerospace and defense avionics backplanes where through-hole ceramic packages are preferred for vibration tolerance and field-replaceability. The device's 256 macrocells and 164 I/O pins support MIL-STD-1553 databus interfaces, ARINC 429 decoders, and discrete signal conditioning in one programmable device. Five-volt tolerance matches legacy avionics power buses, and JTAG ISP supports both factory programming and fielded-system updates. The CPGA package also meets the reliability expectations of long-life aerospace programs (15-25 year service windows), where component obsolescence planning is critical.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM7256EGC192-12 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM7256EGC192-15 | EPM7256EGC192-20 | EPM7256EGC192-12EM | EPM7256EGC192-12P | EPM7256EGC192-12PP |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 192-pin CPGA | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same | 192-pin CPGA - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| Propagation Delay (tPD) | 12 ns | 15 ns | 20 ns | 12 ns | 12 ns | 12 ns |
| User I/O Pins | 164 | 164 | 164 | 164 | 164 | 164 |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Operating Temperature | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C |
主な差別化要因
- Highest-speed 12 ns pin-compatible CPGA option in MAX 7000 family （vs EPM7256EGC192-15)
- Through-hole CPGA package preferred for legacy and aerospace designs （vs EPM7256BQC208-7)
- Industry-standard 5V supply with JTAG ISP （vs MAX II EPM570)
設計ノート
Estimated: the EPM7256EGC192-12 typically draws 250-400 mA from a 5V supply, depending on toggle rate and output loading. Decouple the VCCINT pins with one 0.1 uF X7R ceramic capacitor per VCC/GND pair, placed as close to the package as possible. Add a 10 uF tantalum or 22 uF low-ESR aluminum bulk capacitor near the device to suppress switching-current transients, especially when many outputs toggle simultaneously during JTAG ISP programming.
The 192-pin CPGA requires a PGA socket or careful through-hole pin alignment; ensure your PCB has plated through-holes on a 2.54 mm (100 mil) grid with pad diameter of at least 1.5 mm to accept standard PGA sockets. Keep the JTAG signals (TDI, TDO, TMS, TCK) away from high-speed clock traces to avoid noise coupling that could disrupt ISP programming. For new surface-mount designs, select a QFP/BGA MAX 7000 variant instead.
Three common pitfalls: (1) do not apply 3.3V signals to a 5V MAX 7000 device without a level shifter - the inputs are 5V TTL tolerant but not 3.3V LVTTL compatible; (2) make sure unused I/O pins are configured as outputs driving ground, or as inputs with internal pull-ups enabled, to minimize power consumption and noise injection; (3) verify the JTAG chain order when programming multiple devices in series - reverse order will leave the chain un-programmable.
Estimated: the CPGA package has a theta_JA of approximately 25-30 C/W in still air, and at 400 mA and 5V (2W dissipation) the junction temperature rise is roughly 50-60C above ambient. For enclosed industrial enclosures without forced airflow, derate by 20% or specify the industrial-temperature (I suffix) variant. Always check the manufacturer thermal data for the latest theta_JC/theta_JA numbers, as ceramic PGA packages often have higher thermal resistance than equivalent QFP/BGA packages.
コンプライアンス情報
RoHS compliant per distributor listings (Arrow, Mouser, DigiKey). Lead-free finish confirmed; halogen-free status not explicitly stated in the provided data and marked as 'unknown'. Not AEC-Q100 qualified - this is a commercial-grade part; select the I-suffix variant (industrial temperature) for industrial deployments.
