ラストタイムバイのお知らせ: MC9S08QG8CFKE は生産終了が近づいています。最終注文日: お問い合わせ. 利用可能な代替部品を見る →
NXP Semiconductors

MC9S08QG8CFKE - 8KB Flash 20MHz S08 8-bit MCU | NXP 24-QFN

部品番号: MC9S08QG8CFKE ⚠ ラストタイムバイ
在庫あり 1〜3営業日以内に発送
1.8 V to 3.6 V Vdss 24-QFN-EP (4x4 mm) Package 20 MHz Speed 8 KB Memory
開始価格 $2.58 USD / 個
MOQ: 1 |
価格更新日: 2026-10-19
ボリューム価格
数量 単価 小計
1 $4.85 $4.85
10 $4.32 $43.20
100 $3.66 $366.00
500 $3.05 $1,525.00
1,000 $2.58 $2,580.00
ℹ️ すべての価格はUSDです

MC9S08QG8CFKE 概要

The NXP MC9S08QG8CFKE is a member of the low-cost, high-performance HCS08 Family of 8-bit microcontroller units, featuring an enhanced HCS08 core, 8KB of Flash program memory, 512 bytes of RAM, and an integrated 20MHz bus clock in a 24-pin QFN-EP (4x4) exposed-pad package. Designed for battery-powered and space-constrained embedded designs, it integrates peripheral features typically found on larger devices into a small outline.

What is an 8-bit MCU? An 8-bit microcontroller unit is a single-chip computer that executes instructions 8 bits wide, balancing low power consumption, deterministic behavior, and code density. The HCS08 core advances the legacy HC08 instruction set with the BGND instruction and a background debugging system, placing the MC9S08QG8 in the hierarchical taxonomy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC.

Key features include 1.8V to 3.6V single-supply operation, an internal clock source with an analog-to-digital converter (ADC), timers, an inter-integrated circuit (I2C) interface, a serial peripheral interface (SPI), and a serial communications interface (SCI/UART). The 24-QFN-EP (4x4 mm) package with exposed thermal pad provides a low thermal resistance path for moderately loaded applications while keeping board footprint to a 16 mm² area.

Technically, the MC9S08QG8CFKE implements the HCS08 CISC architecture with BSET/BCLR bit manipulation instructions, single-wire background debug mode (BDM), and an interrupt controller. Up to six general-purpose I/O ports plus dedicated peripheral pins enable flexible peripheral multiplexing. On-chip peripherals include a 10-bit ADC, two timers (TPM), I2C, SPI, and SCI. The device supports low-power STOP and WAIT modes for battery-powered designs.

Typical applications include consumer electronics remote controls, low-power sensor nodes, white goods user interfaces, and any small-form-factor battery-powered product needing 8-bit deterministic control. Designers select this part when cost and footprint dominate over raw CPU throughput.

A key design tip: route the BDM (background debug mode) signals to a 2-pin header for in-system programming and debug. Place the exposed pad (EP) on a continuous ground plane for thermal dissipation and ground return.

This page synthesizes NXP distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet summary block.

ドロップイン代替品: MC9S08QG8CFKE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S08QG8CFKE (同一形状・フットプリント) — 相違点: Package, Mounting Type, Core, Debug Interface, RAM.

NXP Semiconductors
Package: QFN/QFP small package (FFE suffix)
Core: HCS08 8-bit CPU
Debug Interface: Background Debug Mode (BDM)
比較対象 MC9S08QG8CFKE →
NXP Semiconductors
Core: RS08 (8-bit)
比較対象 MC9S08QG8CFKE →
NXP Semiconductors
Package: 8-SOIC
Debug Interface: Background debugging system (single-wire BDM)
RAM: 256 B
比較対象 MC9S08QG8CFKE →
NXP Semiconductors
Debug Interface: Background Debug Mode (BDM), single breakpoint
比較対象 MC9S08QG8CFKE →
NXP Semiconductors
Mounting Type: Through-Hole
RAM: 512 bytes
比較対象 MC9S08QG8CFKE →
NXP Semiconductors
Package: 24-QFN-EP, 4 mm x 4 mm
Mounting Type: No-lead surface mount
比較対象 MC9S08QG8CFKE →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S08QG8CFFER

✅ ドロップイン
📦 24-QFN-EP (4x4)
Same silicon; tape-and-reel orientation suffix variant; same Flash 8KB / RAM 512B / 20MHz

📋 参考代替品(カタログ未掲載)

MC9S08QG8MPBE

✅ ドロップイン
NXP Semiconductors
📦 24-QFN-EP (4x4)
HCS08 8-bit · 8 KB (8K x 8) · 512 bytes · 20 MHz · 1.8 V to 3.6 V · 16-PDIP (0.300 in, 7.62 mm) · Through-Hole · 16

✓ 在庫あり

$2.18 / 個

データシートを見る →

MC9S08QG4CFDE

✅ ドロップイン ⚠️ 仕様未検証
📦 24-QFN-EP (4x4)
Same QG family, smaller 4KB Flash (-50% memory), 512B RAM, same 20MHz HCS08 core, same 24-QFN-EP footprint

📋 参考代替品(カタログ未掲載)

MC9S08QD4CSC

✅ ドロップイン
NXP Semiconductors
📦 24-QFN-EP (4x4)
S08 (HCS08), 8-bit CISC · 8-bit · 16 MHz · 4 KB (4K x 8) · 256 B · 3.3 V / 5 V · 10-bit · 4

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S08SH4CFK

✅ ドロップイン
NXP Semiconductors
📦 24-QFN-EP (4x4)
8-bit S08SH microcontroller · HCS08 CPU · 40 MHz · 4 KB (4K x 8) · 8 bit · 256 B · 2.7 V to 5.5 V · 10 bit

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9RS08KB8CWJ574

✅ ドロップイン
NXP Semiconductors
📦 24-QFN-EP (4x4)
NXP Semiconductors (formerly Freescale) · RS08 (8-bit) · RS08KB · Flash · 8 KB (8K x 8) · 20 MHz · 20-SOIC (wide-body, 7.5 mm width) · Surface Mount

✓ 在庫あり

$0.74 / 個

データシートを見る →

MC9S08QG8CFKE 最大定格&電気的特性

Product Type 8-bit Microcontroller (MCU)
Core HCS08 (enhanced HC08 with BGND instruction)
Program Memory (Flash) 8 KB
RAM 512 B
Maximum CPU Frequency 20 MHz
Supply Voltage Range 1.8 V to 3.6 V
パッケージ 24-QFN-EP (4x4 mm)
Serial Interfaces I2C, SPI, SCI (UART)
実装タイプ Surface Mount
RoHS ステータス Compliant

MC9S08QG8CFKE ピン構成

QFN-24 Package Pinout Diagram QFN-24 4x4mm, P0.5mm, EP 2.6x2.6mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 QFN-24
ピン 1 PTA5/TCLK2/IRQ — Port A bit 5 / Timer clock input 2 / external interrupt
ピン 2 PTA4/TCLK1 — Port A bit 4 / Timer clock input 1
ピン 3 PTA3/TCLK2 — Port A bit 3 / Timer clock input 2 / optional alt
ピン 4 PTA2/SDA — Port A bit 2 / I2C SDA
ピン 5 PTA1/SCL — Port A bit 1 / I2C SCL
ピン 6 PTA0/TPMCH0 — Port A bit 0 / TPM channel 0
ピン 7 VDD — Supply voltage (1.8 V to 3.6 V)
ピン 8 VSS — Digital ground
ピン 9 PTB7/ADP7 — Port B bit 7 / ADC channel ADP7
ピン 10 PTB6/ADP6 — Port B bit 6 / ADC channel ADP6
ピン 11 PTB5/ADP5 — Port B bit 5 / ADC channel ADP5
ピン 12 PTB4/ADP4 — Port B bit 4 / ADC channel ADP4
ピン 13 PTB3/SCL — Port B bit 3 / I2C SCL (alt)
ピン 14 PTB2/SDA — Port B bit 2 / I2C SDA (alt)
ピン 15 PTB1/ADP1 — Port B bit 1 / ADC channel ADP1
ピン 16 PTB0/ADP0 — Port B bit 0 / ADC channel ADP0
ピン 17 PTC1/RX — Port C bit 1 / SCI RX
ピン 18 PTC2/TX — Port C bit 2 / SCI TX
ピン 19 PTC3/MISO — Port C bit 3 / SPI MISO
ピン 20 PTC4/MOSI — Port C bit 4 / SPI MOSI
ピン 21 PTC5/SCK — Port C bit 5 / SPI SCK
ピン 22 RESET — Reset input, bidirectional with BDM
ピン 23 BKGD/MS — Background debug / mode select (BDM programming)
ピン 24 PTC6 — Port C bit 6 / general-purpose I/O
ピン 25 EP — Exposed thermal pad - solder to PCB ground plane

主な用途

MC9S08QG8CFKE の用途: 7 件s: Battery-Powered Remote Control, Wireless Sensor Node, White Goods User Interface Panel, Small Motor Control (FAN / Pump), Medical Infusion Pump User Interface, Industrial Sensor / Counter Module, IoT Smart-Home Appliance Controller.

📱

Battery-Powered Remote Control

The MC9S08QG8CFKE fits battery-powered remote controls because its 1.8V to 3.6V supply range aligns with two AAA cells, while the HCS08 core's STOP mode (sub-uA quiescent) extends battery life. The 8KB Flash accommodates proprietary infrared protocol stacks and button-debounce state machines; 512B RAM is sufficient for typical scan-matrix logic. Compared to a 32-bit MCU, the 8-bit core's deterministic interrupt latency prevents missed button-press glitches. The 24-QFN-EP 4x4 mm package fits inside a slim handheld remote housing, with a single ADC channel reading battery voltage for low-battery warning. The I2C peripheral drives an optional OLED status display, and the BDM pin enables factory-line firmware update. NXP part S9S08AW60E5MFGE is a sibling that can also serve low-power remote applications.

🧩

Wireless Sensor Node

The MC9S08QG8CFKE is well-suited for low-end wireless sensor nodes where its 20 MHz HCS08 core provides fast wake, sample, transmit, and sleep cycles. The integrated 10-bit ADC reads temperature or environmental sensors, and the SPI peripheral drives sub-GHz transceivers like the MC12311. With 8KB Flash for application firmware and 512B RAM for buffering one or two samples, the part fits typical sensor-node codebases. The 1.8V supply allows direct connection to a single Li-MnO2 coin cell. The exposed-pad QFN-EP package gives excellent thermal grounding for transmitter-induced heating. BDM enables field firmware update via a 2-pin header. Companion NXP S9S08DZ60F2MLHR can be used for higher-end sensor hubs requiring CAN connectivity.

🏭

White Goods User Interface Panel

The MC9S08QG8CFKE drives white-goods user interfaces where its 8-bit core runs deterministic keypad scanning, LED PWM dimming, and display control. The 24-QFN-EP package fits behind a glass keypad panel; six I/O ports drive 7-segment displays via SPI daisy-chained LED drivers. The 8KB Flash supports multilingual UI lookup tables, and 512B RAM holds a frame buffer for a small character LCD. The 20MHz bus clock keeps 50/60Hz mains-zero-cross detection accurate for TRIAC firing. The internal analog comparator (where present) provides hardware over-temperature trip. AEC-Q100 not applicable - this is a consumer-grade part. Companion NXP MC9S08AC8MFGE is a pin-compatible sibling in the AC family for richer UI builds.

🏭

Small Motor Control (FAN / Pump)

The MC9S08QG8CFKE controls small brushless-DC or brushed-DC fans and pumps where its TPM modules generate complementary PWM up to 20MHz and the ADC samples back-EMF for sensorless commutation. The 8KB Flash fits proprietary closed-loop RPM firmware, while 512B RAM supports a small state machine for soft-start. The 1.8V minimum supply supports direct 3.3V regulator or Li-ion operation, and the QFN-EP exposed pad dissipates ~500 mW comfortably. The 5V-tolerant I/O (via built-in ESD structures) drives external gate drivers. Software-based field-oriented control (FOC) fits inside 8KB on simpler 1-pulse motors. Companion NXP MC56F8037VLH delivers true DSP performance for higher-end BLDC; S912XEQ512J2MAA is a 16-bit HCS12 upgrade path.

💊

Medical Infusion Pump User Interface

The MC9S08QG8CFKE serves medical infusion pumps and bedside device user-interface panels where its HCS08 core executes keypad scanning, alarm generation, and OLED updates with deterministic timing. The 8KB Flash runs safety-rated keypad debounce and lock-out state machines; the 10-bit ADC reads the user-selected flow rate from a rotary encoder. Note this is a consumer-grade part not IEC 60601 qualified; refer to NXP medical-grade Freescale parts for life-support. The 1.8V to 3.6V supply facilitates battery-only operation during patient transport. The QFN-EP exposed pad gives solid ground return for the TFT display's EMI. Companion NXP MC9S12H256VFVE is a 16-bit upgrade for full safety-ICU-class infusion pumps.

🏭

Industrial Sensor / Counter Module

The MC9S08QG8CFKE fits industrial sensor and counter modules that need 8-bit logic in a 24-QFN-EP footprint for DIN-rail enclosures. The 10-bit ADC reads 4-20 mA current loops via shunt, the TPM module counts pulses from a flow or revolution sensor, and the SCI peripheral drives an RS-485 transceiver for Modbus RTU. The 20MHz HCS08 core resolves input transitions within 50 ns for accurate pulse counting. The 1.8V minimum supply is compatible with 24V step-down industrial rails. The exposed-pad QFN-EP improves thermal performance for hot enclosures. Companion NXP MC9S08AW32VFGE is a pin-compatible sibling with more memory for protocol stacks, and S9S08AW32E5MPUE provides extra peripherals for gateway designs.

🧩

IoT Smart-Home Appliance Controller

The MC9S08QG8CFKE controls IoT smart-home appliances such as connected thermostats, blinds controllers, and smart plugs. Its I2C peripheral drives a temperature/humidity sensor; its SPI peripheral connects to a sub-GHz radio module for low-power mesh networking. The 1.8V to 3.6V supply range supports direct coin-cell operation, and the 20MHz core executes protocol stacks (Zigbee/Thread/BLE) bridging logic. 8KB Flash accommodates commission firmware plus a couple of profile templates. The 24-QFN-EP 4x4 mm fits on the back of a US-style wall switch. Note: this is an 8-bit MCU not suited for native BLE radio handling but works well as a host MCU under a coprocessor. Companion NXP MK22FN1M0AVLK12 is the ARM Cortex-M4 upgrade path for native-radio designs.

What is the program memory size of MC9S08QG8CFKE?
The MC9S08QG8CFKE integrates 8 KB of on-chip Flash program memory alongside 512 bytes of RAM, according to the NXP MC9S08QG8 datasheet. The Flash is in-system programmable via the single-wire background debug mode (BDM) interface. The 8 KB figure places this device at the higher-density end of the S08QG family, which also includes 4 KB variants for cost-down designs.
What is the maximum operating frequency of MC9S08QG8CFKE?
The MC9S08QG8CFKE supports a maximum CPU bus frequency of 20 MHz, as listed in the NXP product family datasheet. This derives from a 2x internal frequency multiplier referenced to either the internal clock source or an external crystal. 20 MHz over the CISC HCS08 core yields approximately 1.0 MIPS per MHz behavior with single-cycle access to Flash, suitable for motor control loops and serial protocol handling.
Does MC9S08QG8CFKE include an ADC?
Yes - the MC9S08QG8CFKE integrates a 10-bit successive-approximation ADC with selectable reference and input channels mapped to specific port pins, per the NXP MC9S08QG8 datasheet. The ADC supports both software and hardware triggering, allowing synchronization to TPM channels for motor and metering applications. Confirm channel count from the device-specific pinout table.
What is the supply voltage range for MC9S08QG8CFKE?
The MC9S08QG8CFKE operates from a single 1.8 V to 3.6 V supply, matching a single Li-ion or two alkaline cell input rail, per the NXP MC9S08QG8 datasheet. The low minimum voltage of 1.8 V makes the part well-suited for battery-discharged margining near end-of-life. Brown-out detection and a low-voltage detect (LVD) circuit protect Flash integrity.
What package does MC9S08QG8CFKE use?
The MC9S08QG8CFKE is housed in a 24-pin QFN-EP (4x4 mm) package with an exposed thermal pad, per DigiKey listing. The exposed pad must be soldered to a continuous ground copper pour for both electrical grounding and thermal dissipation. The 4x4 mm outline fits inside the footprint of a 0402 passive array, ideal for compact wearable and sensor-node designs.
Where can I download the MC9S08QG8CFKE datasheet PDF?
The MC9S08QG8CFKE datasheet is published by NXP Semiconductors at https://www.nxp.com/docs/en/data-sheet/MC9S08QG8.pdf. This 352-page PDF covers the full S08QG family, with device-specific tables on features, pinout, electrical characteristics, and reference design schematics. Always cross-reference the 24-QFN-EP pinout portion for the CFKE suffix.
What is the pinout for MC9S08QG8CFKE in 24-QFN-EP?
The MC9S08QG8CFKE pinout in its 24-QFN-EP (4x4 mm) package is documented in the NXP MC9S08QG8 datasheet, with pins including VDD, VSS, RESET, BKGD/MS, PTA through PTC port pins, and dedicated peripheral functions for I2C, SPI, SCI, ADC, and TPM. The exposed thermal pad (pin 25) must be soldered to the ground plane. Refer to the package-specific pinout table for the CFKE variant.
What is the lifecycle status of MC9S08QG8CFKE?
According to the NXP product page, MC9S08QG8CFKE is approaching End of Life (last-time buy) status. NXP typically issues a Product Change Notice and Discontinuance notice approximately 6 to 12 months before final orders. Engineers designing new products should evaluate the MC9S08QG8 family siblings and cross-brand replacements early; for legacy maintenance, place last-time-buy orders well ahead of the notice deadline.
What is the best drop-in replacement for MC9S08QG8CFKE?
The closest drop-in same-package replacement within the same NXP family is the MC9S08QG8CFFER, which shares the same HCS08 core, 8 KB Flash, 512 B RAM, and 24-pin footprint in QFN-EP (different tape-and-reel orientation suffix). It is a confirmed compatible alternative in same-package form. For lower-cost replacements, look at NXP MC9S08QG4 (4 KB Flash, same 24-QFN-EP), which requires firmware footprint adjustment.
What is the price of MC9S08QG8CFKE?
As of 2026-10-20, MC9S08QG8CFKE is listed at approximately $4.85 in single-piece quantity from major distributors (DigiKey, Mouser), with volume pricing dropping to $2.58 at 1,000 pieces. Given the last-time-buy status, expect inventory thinning and price elasticity to increase. Octopart cross-checks six distributors in real time, which is the recommended sourcing tool for buyers.
Is MC9S08QG8CFKE in stock at distributors?
MC9S08QG8CFKE stock status varies with the last-time-buy progression, as of 2026-10-20. Mouser and DigiKey historically list the part as ships-today in small quantities, but lead times stretch as the discontinuance window closes. For ongoing production requirements, source via Octopart to compare six distributor inventories in real time and lock in a multi-year last-time-buy allocation.
What is the lead time for MC9S08QG8CFKE?
Lead time for MC9S08QG8CFKE is generally 6 to 12 weeks during normal periods but can stretch to 16+ weeks near end-of-life, as of 2026-10-20. Last-time-buy orders are typically non-cancellable and non-returnable. Engineers planning maintenance inventory for installed products should place orders well in advance of the final order date in the NXP Discontinuance notice.
MC9S08QG8CFKE vs MC9S08QG8CFFER - which is better for new designs?
MC9S08QG8CFKE (24-QFN-EP) and MC9S08QG8CFFER (reel-packaging variant) share identical silicon in the same 24-QFN-EP 4x4 mm package; the suffix only differs in carrier/packaging for production lines. For new designs, choose whichever suffix matches your assembly line preference (CFKE = tray/standard; CFFER = tape-and-reel). Both are functionally identical and pin-for-pin compatible, sourced from NXP datasheet family documentation.
When should I choose MC9S08QG8CFKE over a 32-bit MCU?
Choose the MC9S08QG8CFKE over a 32-bit ARM Cortex-M0/M0+ MCU when your application is deterministic, small, and cost-driven: remote controls, simple sensor nodes, appliance UI panels, or battery-powered devices with sleep-mode emphasis. The 8-bit HCS08 core delivers better code density for bit-banging tasks, simpler interrupt latency, and a typically lower BOM cost. Migrate to 32-bit when peripheral bandwidth (USB, CAN, Ethernet) or processing headroom dominates.
What development tools support MC9S08QG8CFKE?
NXP supports the MC9S08QG8CFKE through the CodeWarrior Development Studio for HCS08 (Eclipse-based) and the S08 Flash Tool for in-system programming via the BDM interface. P&E Micro produces the USB-ML-08 BDM multilink for hardware debug, and several low-cost open-source BDM probes from P&E and Pemicro are available. Freescale/NXP sample code covers ADC, I2C, SPI, and SCI peripherals.
Is there a cross-brand equivalent for MC9S08QG8CFKE?
Cross-brand drop-in equivalents for the MC9S08QG8CFKE are limited because HCS08 is a proprietary NXP core with no direct third-party clone. Microchip Technology PIC16F and Atmel/Microchip ATtiny devices occupy similar 8-bit 24-pin QFN positions but require code rewrite. For same-footprint reference, consult the Microchip competitor cross-reference tool with the device pinout table to identify PIC16F equivalent candidates.

エンジニアリング参考データ: MC9S08QG8CFKE — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MC9S08QG8CFKE when you need an 8-bit HCS08 MCU with 8 KB Flash, 512 B RAM, and 20 MHz CPU in a 24-QFN-EP (4x4 mm) package for battery-powered devices, sensor nodes, white-goods UIs, or low-end industrial counters. Pick the MC9S08QG8CFFER for the same silicon in a tape-and-reel packaging variant, or the MC9S08QG8MPBE if your assembly prefers the alternative tape orientation. For tighter BOM, choose the MC9S08QG4CFDE (same package, 4 KB Flash, half the price) when the firmware footprint fits. For higher throughput with the same S08 ecosystem, see NXP S912 and S9S08DZ families (S9S08DZ60F2MLHR, S912XEG384J3CAGR). Migrate to ARM Cortex-M4 (MK22FX512AVLK12, MK22FN1M0AVLK12) for native USB or richer BLE/Zigbee handling.

代替品との比較

パラメータ この製品 MC9S08QG8CFFER MC9S08QG8MPBE MC9S08QG4CFDE MC9S08QD4CSC MC9S08SH4CFK
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 24-QFN-EP (4x4 mm) 24-QFN-EP (4x4 mm) - same 24-QFN-EP (4x4 mm) - same 24-QFN-EP (4x4 mm) - same 24-QFN-EP (4x4 mm) - same 24-QFN-EP (4x4 mm) - same
Core HCS08, 8-bit, 20MHz HCS08, 8-bit, 20MHz HCS08, 8-bit, 20MHz HCS08, 8-bit, 20MHz HCS08, 8-bit, 16MHz HCS08, 8-bit, 40MHz
Flash 8 KB 8 KB 8 KB 4 KB (-50%) 4 KB (-50%) 4 KB (-50%)
RAM 512 B 512 B 512 B 512 B 256 B (-50%) 128 B (-75%)
Supply Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 2.7 V to 5.5 V
Pin-out compatibility (drop-in) N/A (this part) 100% drop-in (same silicon, different suffix) 100% drop-in (same family packaging) Drop-in with firmware rescale (smaller Flash) Drop-in with firmware rescale Pin-compatible footprint, code rewrite required

主な差別化要因

  • Last production run is the QG8 density tier within S08QG family (vs MC9S08QG4CFDE)
  • 1.8V minimum supply supports single Li-ion or 2x alkaline cell operation (vs MC9S08SH4CFK)
  • Same-family compatibility with NXP S08/S12/S16 upgrade paths (vs ARM Cortex-M0 third-party MCUs)

設計ノート

The 24-QFN-EP (4x4 mm) package exposes the paddle at pin 25 to a top-side thermal pad. Solder it to a continuous ground copper pour spanning at least 1 square inch across the top and inner PCB layers. For 8-bit MCU loads (<= 50 mW total power), the exposed pad is more important for ground integrity than thermal dissipation, but it does lower junction-to-ambient thermal resistance significantly.

Place a 0.1 uF ceramic capacitor as close as possible to the VDD pin (pin 7) with the loop area minimized. Add a 4.7 uF to 10 uF bulk capacitor at the regulator output feeding VDD. The MC9S08QG8CFKE's internal brown-out reset and low-voltage detect reset the part cleanly at voltage transients. Apply decoupling separately to the analog AVDD reference if used, with a ferrite bead or resistor between digital VDD and analog AVDD.

Route the BDM (BKGD/MS, pin 23) signal with a 10 kohm pull-up to VDD and a footprint for a 2-pin 0.1 inch header or pogo-pad test land. This enables in-system programming without needing to remove the microcontroller. Trace the BDM line away from high-current switching signals and motor PWM lines to avoid programming glitches during production test.

Estimate: Pin 22 (RESET) is bidirectional and shares the BDM line. Do not pull RESET low externally without a 4.7 kohm or larger series resistor to avoid interfering with BDM operation. Initializing peripherals in the wrong order after STOP mode recovery can leave I2C or SPI peripherals stuck; clear the IICSC and SPISC registers explicitly after wake-up. Check the BDIV/bus-frequency ratio on switch to FEI mode.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS compliant per DigiKey listing. Not AEC-Q100 qualified - this is a commercial/industrial grade part. NXP Discontinuance and Replacement notice pending - check NXP product page for last-time-buy deadline.

データ検証日: 2026-10-20 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MC9S08QG8CFKE MC9S08QG8CFKE datasheet NXP MC9S08QG8CFKE pinout MC9S08QG8CFKE price MC9S08QG8CFKE lead time MC9S08QG8CFKE in stock MC9S08QG8 8KB flash 20MHz 24-QFN-EP HCS08 8-bit MCU 24-QFN 1.8V MC9S08QG8CFKE vs MC9S08QG8CFFER MC9S08QG8CFKE drop in replacement MC9S08QG8CFKE for sensor node NXP 8-bit MCU 20MHz battery powered S08QG family migration MC9S08 last time buy replacement

関連部品&用語

NXP Semiconductors MC9S08QG8CFKE MC9S08QG8CFFER MC9S08QG4 MC9S08QD4 MC9S08SH4 MC9S08 family HCS08 core 8-bit microcontroller MCU S08QG Flash memory 24-QFN-EP QFN package RoHS REACH I2C SPI SCI UART ADC TPM timer BDM background debug mode embedded processor battery-powered design AEC-Q100
クイック見積RFQ
詳細をすべてご記入ください — 営業チームが24時間以内にご返信いたします
部品番号 メーカー パッケージ QTY 目標価格 小計
合計: $0.00 USD
✓
見積を送信しました!

24時間以内にメールでご返信いたします

1
RFQ送信済み
2
見積受領
3
注文済み
4
お支払い
5
発送済み
6
配達済み
RFQの詳細を表示