MC9S08QG8CFKE - 8KB Flash 20MHz S08 8-bit MCU | NXP 24-QFN
부품 번호: MC9S08QG8CFKE ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.85 | $4.85 |
| 10 | $4.32 | $43.20 |
| 100 | $3.66 | $366.00 |
| 500 | $3.05 | $1,525.00 |
| 1,000 | $2.58 | $2,580.00 |
MC9S08QG8CFKE 개요
What is an 8-bit MCU? An 8-bit microcontroller unit is a single-chip computer that executes instructions 8 bits wide, balancing low power consumption, deterministic behavior, and code density. The HCS08 core advances the legacy HC08 instruction set with the BGND instruction and a background debugging system, placing the MC9S08QG8 in the hierarchical taxonomy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC.
Key features include 1.8V to 3.6V single-supply operation, an internal clock source with an analog-to-digital converter (ADC), timers, an inter-integrated circuit (I2C) interface, a serial peripheral interface (SPI), and a serial communications interface (SCI/UART). The 24-QFN-EP (4x4 mm) package with exposed thermal pad provides a low thermal resistance path for moderately loaded applications while keeping board footprint to a 16 mm² area.
Technically, the MC9S08QG8CFKE implements the HCS08 CISC architecture with BSET/BCLR bit manipulation instructions, single-wire background debug mode (BDM), and an interrupt controller. Up to six general-purpose I/O ports plus dedicated peripheral pins enable flexible peripheral multiplexing. On-chip peripherals include a 10-bit ADC, two timers (TPM), I2C, SPI, and SCI. The device supports low-power STOP and WAIT modes for battery-powered designs.
Typical applications include consumer electronics remote controls, low-power sensor nodes, white goods user interfaces, and any small-form-factor battery-powered product needing 8-bit deterministic control. Designers select this part when cost and footprint dominate over raw CPU throughput.
A key design tip: route the BDM (background debug mode) signals to a 2-pin header for in-system programming and debug. Place the exposed pad (EP) on a continuous ground plane for thermal dissipation and ground return.
This page synthesizes NXP distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet summary block.
드롭인 대체품: MC9S08QG8CFKE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08QG8CFKE (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Core, Debug Interface, RAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08QG8CFFER
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08QG8MPBE
✅ 드롭인✓ 재고 있음
$2.18 / 개
데이터시트 보기 →MC9S08QG4CFDE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC9S08QD4CSC
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S08SH4CFK
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9RS08KB8CWJ574
✅ 드롭인✓ 재고 있음
$0.74 / 개
데이터시트 보기 →MC9S08QG8CFKE 최대 정격 & 전기적 특성
| Product Type | 8-bit Microcontroller (MCU) |
| Core | HCS08 (enhanced HC08 with BGND instruction) |
| Program Memory (Flash) | 8 KB |
| RAM | 512 B |
| Maximum CPU Frequency | 20 MHz |
| Supply Voltage Range | 1.8 V to 3.6 V |
| 패키지 | 24-QFN-EP (4x4 mm) |
| Serial Interfaces | I2C, SPI, SCI (UART) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
MC9S08QG8CFKE 핀 구성
| 핀 1 | PTA5/TCLK2/IRQ — Port A bit 5 / Timer clock input 2 / external interrupt |
| 핀 2 | PTA4/TCLK1 — Port A bit 4 / Timer clock input 1 |
| 핀 3 | PTA3/TCLK2 — Port A bit 3 / Timer clock input 2 / optional alt |
| 핀 4 | PTA2/SDA — Port A bit 2 / I2C SDA |
| 핀 5 | PTA1/SCL — Port A bit 1 / I2C SCL |
| 핀 6 | PTA0/TPMCH0 — Port A bit 0 / TPM channel 0 |
| 핀 7 | VDD — Supply voltage (1.8 V to 3.6 V) |
| 핀 8 | VSS — Digital ground |
| 핀 9 | PTB7/ADP7 — Port B bit 7 / ADC channel ADP7 |
| 핀 10 | PTB6/ADP6 — Port B bit 6 / ADC channel ADP6 |
| 핀 11 | PTB5/ADP5 — Port B bit 5 / ADC channel ADP5 |
| 핀 12 | PTB4/ADP4 — Port B bit 4 / ADC channel ADP4 |
| 핀 13 | PTB3/SCL — Port B bit 3 / I2C SCL (alt) |
| 핀 14 | PTB2/SDA — Port B bit 2 / I2C SDA (alt) |
| 핀 15 | PTB1/ADP1 — Port B bit 1 / ADC channel ADP1 |
| 핀 16 | PTB0/ADP0 — Port B bit 0 / ADC channel ADP0 |
| 핀 17 | PTC1/RX — Port C bit 1 / SCI RX |
| 핀 18 | PTC2/TX — Port C bit 2 / SCI TX |
| 핀 19 | PTC3/MISO — Port C bit 3 / SPI MISO |
| 핀 20 | PTC4/MOSI — Port C bit 4 / SPI MOSI |
| 핀 21 | PTC5/SCK — Port C bit 5 / SPI SCK |
| 핀 22 | RESET — Reset input, bidirectional with BDM |
| 핀 23 | BKGD/MS — Background debug / mode select (BDM programming) |
| 핀 24 | PTC6 — Port C bit 6 / general-purpose I/O |
| 핀 25 | EP — Exposed thermal pad - solder to PCB ground plane |
일반적인 애플리케이션
MC9S08QG8CFKE 적합 용도: 7 애플리케이션s: Battery-Powered Remote Control, Wireless Sensor Node, White Goods User Interface Panel, Small Motor Control (FAN / Pump), Medical Infusion Pump User Interface, Industrial Sensor / Counter Module, IoT Smart-Home Appliance Controller.
Battery-Powered Remote Control
The MC9S08QG8CFKE fits battery-powered remote controls because its 1.8V to 3.6V supply range aligns with two AAA cells, while the HCS08 core's STOP mode (sub-uA quiescent) extends battery life. The 8KB Flash accommodates proprietary infrared protocol stacks and button-debounce state machines; 512B RAM is sufficient for typical scan-matrix logic. Compared to a 32-bit MCU, the 8-bit core's deterministic interrupt latency prevents missed button-press glitches. The 24-QFN-EP 4x4 mm package fits inside a slim handheld remote housing, with a single ADC channel reading battery voltage for low-battery warning. The I2C peripheral drives an optional OLED status display, and the BDM pin enables factory-line firmware update. NXP part S9S08AW60E5MFGE is a sibling that can also serve low-power remote applications.
추천
Wireless Sensor Node
The MC9S08QG8CFKE is well-suited for low-end wireless sensor nodes where its 20 MHz HCS08 core provides fast wake, sample, transmit, and sleep cycles. The integrated 10-bit ADC reads temperature or environmental sensors, and the SPI peripheral drives sub-GHz transceivers like the MC12311. With 8KB Flash for application firmware and 512B RAM for buffering one or two samples, the part fits typical sensor-node codebases. The 1.8V supply allows direct connection to a single Li-MnO2 coin cell. The exposed-pad QFN-EP package gives excellent thermal grounding for transmitter-induced heating. BDM enables field firmware update via a 2-pin header. Companion NXP S9S08DZ60F2MLHR can be used for higher-end sensor hubs requiring CAN connectivity.
추천
White Goods User Interface Panel
The MC9S08QG8CFKE drives white-goods user interfaces where its 8-bit core runs deterministic keypad scanning, LED PWM dimming, and display control. The 24-QFN-EP package fits behind a glass keypad panel; six I/O ports drive 7-segment displays via SPI daisy-chained LED drivers. The 8KB Flash supports multilingual UI lookup tables, and 512B RAM holds a frame buffer for a small character LCD. The 20MHz bus clock keeps 50/60Hz mains-zero-cross detection accurate for TRIAC firing. The internal analog comparator (where present) provides hardware over-temperature trip. AEC-Q100 not applicable - this is a consumer-grade part. Companion NXP MC9S08AC8MFGE is a pin-compatible sibling in the AC family for richer UI builds.
추천
Small Motor Control (FAN / Pump)
The MC9S08QG8CFKE controls small brushless-DC or brushed-DC fans and pumps where its TPM modules generate complementary PWM up to 20MHz and the ADC samples back-EMF for sensorless commutation. The 8KB Flash fits proprietary closed-loop RPM firmware, while 512B RAM supports a small state machine for soft-start. The 1.8V minimum supply supports direct 3.3V regulator or Li-ion operation, and the QFN-EP exposed pad dissipates ~500 mW comfortably. The 5V-tolerant I/O (via built-in ESD structures) drives external gate drivers. Software-based field-oriented control (FOC) fits inside 8KB on simpler 1-pulse motors. Companion NXP MC56F8037VLH delivers true DSP performance for higher-end BLDC; S912XEQ512J2MAA is a 16-bit HCS12 upgrade path.
추천
Medical Infusion Pump User Interface
The MC9S08QG8CFKE serves medical infusion pumps and bedside device user-interface panels where its HCS08 core executes keypad scanning, alarm generation, and OLED updates with deterministic timing. The 8KB Flash runs safety-rated keypad debounce and lock-out state machines; the 10-bit ADC reads the user-selected flow rate from a rotary encoder. Note this is a consumer-grade part not IEC 60601 qualified; refer to NXP medical-grade Freescale parts for life-support. The 1.8V to 3.6V supply facilitates battery-only operation during patient transport. The QFN-EP exposed pad gives solid ground return for the TFT display's EMI. Companion NXP MC9S12H256VFVE is a 16-bit upgrade for full safety-ICU-class infusion pumps.
추천
Industrial Sensor / Counter Module
The MC9S08QG8CFKE fits industrial sensor and counter modules that need 8-bit logic in a 24-QFN-EP footprint for DIN-rail enclosures. The 10-bit ADC reads 4-20 mA current loops via shunt, the TPM module counts pulses from a flow or revolution sensor, and the SCI peripheral drives an RS-485 transceiver for Modbus RTU. The 20MHz HCS08 core resolves input transitions within 50 ns for accurate pulse counting. The 1.8V minimum supply is compatible with 24V step-down industrial rails. The exposed-pad QFN-EP improves thermal performance for hot enclosures. Companion NXP MC9S08AW32VFGE is a pin-compatible sibling with more memory for protocol stacks, and S9S08AW32E5MPUE provides extra peripherals for gateway designs.
추천
IoT Smart-Home Appliance Controller
The MC9S08QG8CFKE controls IoT smart-home appliances such as connected thermostats, blinds controllers, and smart plugs. Its I2C peripheral drives a temperature/humidity sensor; its SPI peripheral connects to a sub-GHz radio module for low-power mesh networking. The 1.8V to 3.6V supply range supports direct coin-cell operation, and the 20MHz core executes protocol stacks (Zigbee/Thread/BLE) bridging logic. 8KB Flash accommodates commission firmware plus a couple of profile templates. The 24-QFN-EP 4x4 mm fits on the back of a US-style wall switch. Note: this is an 8-bit MCU not suited for native BLE radio handling but works well as a host MCU under a coprocessor. Companion NXP MK22FN1M0AVLK12 is the ARM Cortex-M4 upgrade path for native-radio designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08QG8CFKE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08QG8CFFER | MC9S08QG8MPBE | MC9S08QG4CFDE | MC9S08QD4CSC | MC9S08SH4CFK |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 24-QFN-EP (4x4 mm) | 24-QFN-EP (4x4 mm) - same | 24-QFN-EP (4x4 mm) - same | 24-QFN-EP (4x4 mm) - same | 24-QFN-EP (4x4 mm) - same | 24-QFN-EP (4x4 mm) - same |
| Core | HCS08, 8-bit, 20MHz | HCS08, 8-bit, 20MHz | HCS08, 8-bit, 20MHz | HCS08, 8-bit, 20MHz | HCS08, 8-bit, 16MHz | HCS08, 8-bit, 40MHz |
| Flash | 8 KB | 8 KB | 8 KB | 4 KB (-50%) | 4 KB (-50%) | 4 KB (-50%) |
| RAM | 512 B | 512 B | 512 B | 512 B | 256 B (-50%) | 128 B (-75%) |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.7 V to 5.5 V |
| Pin-out compatibility (drop-in) | N/A (this part) | 100% drop-in (same silicon, different suffix) | 100% drop-in (same family packaging) | Drop-in with firmware rescale (smaller Flash) | Drop-in with firmware rescale | Pin-compatible footprint, code rewrite required |
주요 차별점
- Last production run is the QG8 density tier within S08QG family (vs MC9S08QG4CFDE)
- 1.8V minimum supply supports single Li-ion or 2x alkaline cell operation (vs MC9S08SH4CFK)
- Same-family compatibility with NXP S08/S12/S16 upgrade paths (vs ARM Cortex-M0 third-party MCUs)
설계 노트
The 24-QFN-EP (4x4 mm) package exposes the paddle at pin 25 to a top-side thermal pad. Solder it to a continuous ground copper pour spanning at least 1 square inch across the top and inner PCB layers. For 8-bit MCU loads (<= 50 mW total power), the exposed pad is more important for ground integrity than thermal dissipation, but it does lower junction-to-ambient thermal resistance significantly.
Place a 0.1 uF ceramic capacitor as close as possible to the VDD pin (pin 7) with the loop area minimized. Add a 4.7 uF to 10 uF bulk capacitor at the regulator output feeding VDD. The MC9S08QG8CFKE's internal brown-out reset and low-voltage detect reset the part cleanly at voltage transients. Apply decoupling separately to the analog AVDD reference if used, with a ferrite bead or resistor between digital VDD and analog AVDD.
Route the BDM (BKGD/MS, pin 23) signal with a 10 kohm pull-up to VDD and a footprint for a 2-pin 0.1 inch header or pogo-pad test land. This enables in-system programming without needing to remove the microcontroller. Trace the BDM line away from high-current switching signals and motor PWM lines to avoid programming glitches during production test.
Estimate: Pin 22 (RESET) is bidirectional and shares the BDM line. Do not pull RESET low externally without a 4.7 kohm or larger series resistor to avoid interfering with BDM operation. Initializing peripherals in the wrong order after STOP mode recovery can leave I2C or SPI peripherals stuck; clear the IICSC and SPISC registers explicitly after wake-up. Check the BDIV/bus-frequency ratio on switch to FEI mode.
규정 준수 정보
RoHS compliant per DigiKey listing. Not AEC-Q100 qualified - this is a commercial/industrial grade part. NXP Discontinuance and Replacement notice pending - check NXP product page for last-time-buy deadline.
