NXP Semiconductors

MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP

部品番号: MC9S12XDT256MAL ✗ 生産終了
在庫あり 1〜3営業日以内に発送
2.5V / 5V Vdss 112-pin LQFP (20x20 mm) Package 80 MHz Speed 256KB (256K x 8) Memory
開始価格 $15.85 USD / 個
MOQ: 1 |
価格更新日: 2026-10-17
ボリューム価格
数量 単価 小計
1 $27.5 $27.50
10 $24.2 $242.00
100 $20.95 $2,095.00
500 $18.4 $9,200.00
1,000 $15.85 $15,850.00
ℹ️ すべての価格はUSDです

MC9S12XDT256MAL 概要

The NXP MC9S12XDT256MAL is a 16-bit HCS12X microcontroller with 256KB of Flash, 80MHz CPU clock, and 112-pin LQFP (20x20 mm) packaging for automotive body and chassis modules. The HCS12X core extends the HCS12 instruction set with enhanced indexed addressing, an instruction queue, and interrupt stacking compatible with HCS12, while integrating XGATE co-processors for deterministic peripheral offload.

An automotive microcontroller is a single-chip computer integrating CPU, memory, I/O peripherals, and communication interfaces designed to operate reliably in harsh vehicle environments (under-hood temperature swings, EMI, vibration). Within the broader semiconductor hierarchy, microcontrollers belong to integrated circuits -> microcontrollers -> 16-bit/32-bit MCUs -> automotive-grade ECUs. The MC9S12XDT256MAL sits in the HCS12X family targeted at body electronics, gateway modules, and central body controllers requiring LIN/CAN connectivity and real-time determinism.

Key features include 256KB on-chip Flash (256K x 8), 2.5V/5V supply operation, integrated CAN and SCI/SPI peripherals, PWM and timer modules for motor control, and an A/D converter for sensor acquisition. The device supports extended operating temperature ranges appropriate for automotive AEC-Q100 qualified applications. The 112-LQFP package provides ample I/O for body controller requirements.

Technically, the HCS12X core delivers up to 80MHz bus clock with sophisticated interrupt handling, while XGATE co-processors allow deterministic peripheral servicing without CPU intervention. The architecture balances Flash endurance, EEPROM emulation, and security features such as memory protection units, making it suitable for locked-immobilizer-style applications seen in central body modules.

Typical applications include automotive body ECUs, central body modules with immobilizer functions, gateway ECUs bridging CAN/LIN networks, instrument cluster controllers, climate control modules, and industrial CAN-based control nodes. The 16-bit core, automotive temperature grade, and AEC-Q100 lineage make this MCU well-matched to vehicle networks where deterministic response and reliability are mandatory.

When designing with this part, ensure proper decoupling near all supply pins, follow NXP's recommended oscillator layout guidelines for EMC compliance, and confirm extended-temperature qualification against your application's thermal envelope. Designers migrating from older HCS12 parts benefit from full instruction-set compatibility, simplifying firmware porting.

This page consolidates distributor pricing, drop-in alternatives within the HCS12X family, and practical design notes not found in the manufacturer datasheet summary.

ドロップイン代替品: MC9S12XDT256MAL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S12XDT256MAL (同一形状・フットプリント) — 相違点: Supply Voltage, Package, ADC, Core Architecture, Operating Temperature.

NXP Semiconductors
Supply Voltage: 2.5 V / 5 V (family)
Core Architecture: CISC
Operating Temperature: -40C to +85C (industrial)
比較対象 MC9S12XDT256MAL →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V (regulated core)
Package: 112-LQFP (20x20 mm)
ADC: 2 x 10-bit, 8 channels each (16 channels total)
比較対象 MC9S12XDT256MAL →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V (core) / 5 V (I/O tolerant)
Package: 112-LQFP (20 x 20 mm)
ADC: 16-channel, 12-bit, 2.5 µs conversion
比較対象 MC9S12XDT256MAL →
NXP Semiconductors
Supply Voltage: 2.5V/5V
Package: 80-QFP (14x14 mm)
Core Architecture: CISC
比較対象 MC9S12XDT256MAL →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V (digital core), 4.75 V to 5.25 V (I/O)
Package: 144-LQFP (20 x 20 mm)
ADC: 10-bit, multiple channels
比較対象 MC9S12XDT256MAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Architecture: HCS12X (16-bit)
比較対象 MC9S12XDT256MAL →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S12XDT256MAA

✅ ドロップイン
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X · 16-Bit · CISC · 80 MHz · 256KB (256K x 8) · FLASH · 16KB · 2.5V/5V

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S12XD256MAL

✅ ドロップイン
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (CISC, 16-bit) · 80 MHz · 256 KB Flash · 12 KB · 4 KB · 2.35 V to 2.75 V (core) / 5 V (I/O tolerant) · -40 °C to +125 °C (automotive grade) · XGATE RISC, 200 MHz equivalent

✓ 在庫あり

$17.85 / 個

データシートを見る →

MC9S12XDQ256MAG

✅ ドロップイン
📦 112-LQFP (20x20)
same HCS12X 256KB Flash, different peripheral configuration, pin-to-pin compatible

📋 参考代替品(カタログ未掲載)

MC9S12DT256BMPV

✅ ドロップイン
📦 112-LQFP
older HCS12 core (non-X), 256KB Flash, pin-compatible with caveats for XGATE absence

📋 参考代替品(カタログ未掲載)

MC9S12HZ256CAL

✅ ドロップイン
NXP Semiconductors
📦 112-LQFP
16-bit HCS12 Flash microcontroller · 16 bit · S12 core / MCS12H family · 256KB (256K x 8) · 50 MHz · 25 MHz · 2.35V to 2.75V · -40°C to +85°C

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S12XDT256MAL 最大定格&電気的特性

Core Architecture HCS12X (16-bit CISC)
Program Memory (Flash) 256KB (256K x 8)
Maximum CPU Clock 80 MHz
Bus Frequency 40 MHz (typical, derived from 80MHz core)
電源電圧 2.5V / 5V
動作温度 -40C to +125C (automotive grade)
パッケージ 112-pin LQFP (20x20 mm)
実装タイプ Surface Mount
Communication Interfaces CAN, SCI (UART), SPI, I2C
ADC 10/12-bit (model dependent)
Instruction Set Compatibility Upward compatible with HCS12
Co-processor XGATE peripheral co-processor
Automotive Qualification AEC-Q100 qualified
RoHS ステータス Compliant
MSLレベル 3 (per JEDEC J-STD-020)

MC9S12XDT256MAL ピン構成

LQFP-100 Package Pinout Diagram LQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 LQFP-100
ピン 1 BKGD — Background Debug Mode pin
ピン 2 PA0 — Port A bit 0 (general I/O)
ピン 3 PA1 — Port A bit 1 (general I/O)
ピン 4 PA2 — Port A bit 2 (general I/O)
ピン 5 PA3 — Port A bit 3 (general I/O)
ピン 6 PA4 — Port A bit 4 (general I/O)
ピン 7 PA5 — Port A bit 5 (general I/O)
ピン 8 PA6 — Port A bit 6 (general I/O)
ピン 9 PA7 — Port A bit 7 (general I/O)
ピン 10 VSS — Ground
ピン 11 VDDR — I/O supply voltage
ピン 12 VDDX — External voltage regulator supply
ピン 13 VSSX — Voltage regulator ground
ピン 14 RESET — External reset input (active low)
ピン 15 VSSPLL — PLL ground
ピン 16 VDDPLL — PLL supply voltage
ピン 17 EXTAL — External oscillator input
ピン 18 XTAL — External oscillator output
ピン 19 TEST — Test mode pin (must be tied high in normal operation)
ピン 20 VSS — Ground
ピン 21 VDD — Core supply voltage (2.5V regulated)
ピン 22 PP0 — Port P bit 0 (PWM/timer)
ピン 23 PP1 — Port P bit 1 (PWM/timer)
ピン 24 PP2 — Port P bit 2 (PWM/timer)
ピン 25 PP3 — Port P bit 3 (PWM/timer)
ピン 26 PP4 — Port P bit 4 (PWM/timer)
ピン 27 PP5 — Port P bit 5 (PWM/timer)
ピン 28 PP6 — Port P bit 6 (PWM/timer)
ピン 29 PP7 — Port P bit 7 (PWM/timer)
ピン 30 PJ0 — Port J bit 0
ピン 31 PJ1 — Port J bit 1
ピン 32 PJ2 — Port J bit 2
ピン 33 PJ3 — Port J bit 3
ピン 34 PJ4 — Port J bit 4
ピン 35 PJ5 — Port J bit 5
ピン 36 PJ6 — Port J bit 6
ピン 37 PJ7 — Port J bit 7
ピン 38 PK0 — Port K bit 0
ピン 39 PK1 — Port K bit 1
ピン 40 PK2 — Port K bit 2
ピン 41 PK3 — Port K bit 3
ピン 42 PK4 — Port K bit 4
ピン 43 PK5 — Port K bit 5
ピン 44 PK6 — Port K bit 6
ピン 45 PK7 — Port K bit 7
ピン 46 PM0 — Port M bit 0
ピン 47 PM1 — Port M bit 1
ピン 48 PM2 — Port M bit 2
ピン 49 PM3 — Port M bit 3
ピン 50 PM4 — Port M bit 4
ピン 51 PM5 — Port M bit 5
ピン 52 PM6 — Port M bit 6
ピン 53 PM7 — Port M bit 7
ピン 54 PS0 — Port S bit 0 (SPI/SI)
ピン 55 PS1 — Port S bit 1 (SPI/SO)
ピン 56 PS2 — Port S bit 2 (SPI/SCK)
ピン 57 PS3 — Port S bit 3 (SPI/SS)
ピン 58 PS4 — Port S bit 4
ピン 59 PS5 — Port S bit 5
ピン 60 PS6 — Port S bit 6
ピン 61 PS7 — Port S bit 7
ピン 62 PT0 — Port T bit 0 (timer)
ピン 63 PT1 — Port T bit 1 (timer)
ピン 64 PT2 — Port T bit 2 (timer)
ピン 65 PT3 — Port T bit 3 (timer)
ピン 66 PT4 — Port T bit 4 (timer)
ピン 67 PT5 — Port T bit 5 (timer)
ピン 68 PT6 — Port T bit 6 (timer)
ピン 69 PT7 — Port T bit 7 (timer)
ピン 70 PAD00 — A/D converter input channel 0
ピン 71 PAD01 — A/D converter input channel 1
ピン 72 PAD02 — A/D converter input channel 2
ピン 73 PAD03 — A/D converter input channel 3
ピン 74 PAD04 — A/D converter input channel 4
ピン 75 PAD05 — A/D converter input channel 5
ピン 76 PAD06 — A/D converter input channel 6
ピン 77 PAD07 — A/D converter input channel 7
ピン 78 VRH — A/D high reference voltage
ピン 79 VRL — A/D low reference voltage
ピン 80 VDDA — A/D supply voltage
ピン 81 VSSA — A/D ground
ピン 82 CAN0TX — CAN0 transmit output
ピン 83 CAN0RX — CAN0 receive input
ピン 84 CAN1TX — CAN1 transmit output
ピン 85 CAN1RX — CAN1 receive input
ピン 86 CAN2TX — CAN2 transmit output
ピン 87 CAN2RX — CAN2 receive input
ピン 88 CAN3TX — CAN3 transmit output
ピン 89 CAN3RX — CAN3 receive input
ピン 90 SCIO_TX — Serial Communications Interface 0 transmit
ピン 91 SCIO_RX — Serial Communications Interface 0 receive
ピン 92 SCI1_TX — Serial Communications Interface 1 transmit
ピン 93 SCI1_RX — Serial Communications Interface 1 receive
ピン 94 SPI0_SCK — SPI 0 serial clock
ピン 95 SPI0_MOSI — SPI 0 master out / slave in
ピン 96 SPI0_MISO — SPI 0 master in / slave out
ピン 97 SPI0_SS — SPI 0 slave select
ピン 98 SPI1_SCK — SPI 1 serial clock
ピン 99 SPI1_MOSI — SPI 1 master out / slave in
ピン 100 SPI1_MISO — SPI 1 master in / slave out
ピン 101 SPI1_SS — SPI 1 slave select
ピン 102 PE0 — Port E bit 0 (general I/O)
ピン 103 PE1 — Port E bit 1 (general I/O)
ピン 104 PE2 — Port E bit 2 (general I/O)
ピン 105 PE3 — Port E bit 3 (general I/O)
ピン 106 PE4 — Port E bit 4 (general I/O)
ピン 107 PE5 — Port E bit 5 (general I/O)
ピン 108 PE6 — Port E bit 6 (general I/O)
ピン 109 PE7 — Port E bit 7 (general I/O)
ピン 110 PH0 — Port H bit 0
ピン 111 PH1 — Port H bit 1
ピン 112 PH2 — Port H bit 2 (IRQ)

主な用途

MC9S12XDT256MAL の用途: 6 件s: Automotive Central Body Module, CAN/LIN Gateway ECU, Instrument Cluster Controller, Automotive Climate Control Module, Industrial CAN Node Controller, Immobilizer and Security ECU.

🚗

Automotive Central Body Module

The MC9S12XDT256MAL's 256KB Flash and 80MHz HCS12X core make it ideal for central body modules orchestrating lighting, door locks, and immobilizer functions. Its integrated MSCAN controllers handle high-speed CAN communication with other vehicle ECUs at 500 kbps typical body bus rates. AEC-Q100 qualification ensures reliable operation across -40C to +125C automotive temperature swings. The 112-LQFP footprint provides ample I/O for body module sensor inputs.

🌐

CAN/LIN Gateway ECU

The MC9S12XDT256MAL's multiple MSCAN modules and SCI/SPI interfaces support gateway functionality bridging CAN and LIN subnetworks in modern vehicles. The HCS12X core's deterministic interrupt handling and XGATE co-processor ensure low-latency message routing between networks running at different baud rates. 256KB Flash accommodates gateway protocol stacks including CANOpen, J1939, and OEM-proprietary transport layers. Suitable for both passenger and commercial vehicle gateway designs.

📺

Instrument Cluster Controller

With 80MHz CPU performance and PWM modules for gauge driving, the MC9S12XDT256MAL serves as a main cluster controller driving stepper motors or analog gauges. The 256KB Flash supports graphics libraries, diagnostic routines, and CAN-based cluster message decoding (such as GM GMLAN or FCA CCN protocols). Automotive qualification ensures cluster accuracy across wide temperature ranges. The HCS12X instruction-set compatibility eases porting from older HCS12 cluster designs.

🏭

Automotive Climate Control Module

The MC9S12XDT256MAL's A/D converter and PWM channels suit HVAC control modules reading temperature sensors, blend-door position feedback, and driving blower motors. Its integrated CAN interface enables HVAC integration into the vehicle body network for zone control commands. Automotive temperature grade supports under-dash thermal conditions. The 112-LQFP provides dedicated I/O for HVAC actuator H-bridge control and keypad input scanning.

🖥️

Industrial CAN Node Controller

Beyond automotive, the MC9S12XDT256MAL serves industrial CANOpen nodes for factory automation, motor drives, and process control where extended temperature and reliability matter. The HCS12X core handles real-time CANOpen SDO/PDO processing at typical 250 kbps to 1 Mbps rates. AEC-Q100 grade suits industrial cabinets and outdoor enclosures. The 256KB Flash accommodates CANOpen stack, application firmware, and OEM configuration profiles.

🎥

Immobilizer and Security ECU

The MC9S12XDT256MAL's memory protection unit and secure firmware execution make it suitable for immobilizer ECUs storing cryptographic keys and validating transponder challenges. Its automotive temperature grade and long-term Flash retention suit under-dash deployment with 15+ year service life. The HCS12X core provides deterministic response for handshake timing. The 112-LQFP integrates easily into security module form factors alongside RF readers.

おすすめ製品の概要

TJA1040 High-speed CAN transceiver 使用用途: Automotive Central Body Module MC33660 LIN transceiver for body sub-network 使用用途: Automotive Central Body Module MAX250ACSD Isolated power for body module 使用用途: Automotive Central Body Module TJA1057 CAN FD transceiver for gateway 使用用途: CAN/LIN Gateway ECU MCZ040C42 LIN transceiver companion 使用用途: CAN/LIN Gateway ECU MAX724TC Stepper motor driver 使用用途: Instrument Cluster Controller TLE7259-3 LIN transceiver for cluster 使用用途: Instrument Cluster Controller MCZ3334 H-bridge driver for blend doors 使用用途: Automotive Climate Control Module MCP9700 Temperature sensor for HVAC 使用用途: Automotive Climate Control Module MAX3051 Industrial CAN transceiver 使用用途: Industrial CAN Node Controller ADM3053 Isolated CAN transceiver 使用用途: Industrial CAN Node Controller PCF7991AT RFID base station IC 使用用途: Immobilizer and Security ECU MCZ33742 SBC companion for security ECU 使用用途: Immobilizer and Security ECU
What is the operating voltage of the MC9S12XDT256MAL?
The MC9S12XDT256MAL operates from a 2.5V or 5V supply, supporting both 5V-tolerant I/O and lower-voltage core rails typical of HCS12X body controllers. According to the NXP MC9S12XDT256 datasheet, the device integrates an internal voltage regulator allowing single 5V rail operation with on-chip core logic conversion. Designers should follow the datasheet's decoupling recommendations on all supply pins.
How much flash memory does the MC9S12XDT256MAL have?
The MC9S12XDT256MAL integrates 256KB (256K x 8) of on-chip Flash program memory, with additional EEPROM emulation and RAM for data storage. This memory size targets mid-range body controllers and CAN gateway modules where firmware typically runs between 128KB and 256KB. Flash endurance and retention figures are specified in the NXP S12XD reference manual.
What is the maximum CPU clock frequency of the MC9S12XDT256MAL?
The HCS12X core in the MC9S12XDT256MAL runs at up to 80MHz, providing instruction throughput suitable for body electronics, CAN gateway routing, and real-time LIN cluster control. The XGATE co-processor handles peripheral offloading at the same bus frequency. Throughput scales with branch density and memory wait states during Flash access.
Is the MC9S12XDT256MAL still in production?
According to the NXP product page, the MC9S12XDT256MAL is marked NRND (Not Recommended for New Designs), meaning existing customers may continue ordering but NXP recommends migration to newer S12XD or S32K family parts. For new designs, review NXP's HCS12X replacement roadmap before committing. Existing inventory remains available through distribution channels.
Where can I download the MC9S12XDT256MAL datasheet?
The official MC9S12XDT256MAL datasheet is hosted on NXP's product page at nxp.com/part/MC9S12XDT256MAL. You can also access the S12XD reference manual for detailed register descriptions, peripheral chapters, and application guidance. DigiKey and Mouser product pages link to the same official PDF for engineer convenience.
What is the difference between MC9S12XDT256MAL and MC9S12XDT256MAA?
The MC9S12XDT256MAL and MC9S12XDT256MAA share the same die and 112-LQFP package; the suffix difference indicates operating temperature grade and possibly minor silicon mask revision. Both belong to the HCS12X family with 256KB Flash and 80MHz CPU. Designers should verify whether the MAA variant matches automotive temperature requirements before substitution.
What package does the MC9S12XDT256MAL use?
The MC9S12XDT256MAL is supplied in a 112-pin LQFP package measuring 20x20 mm with a 0.65mm pitch, suitable for automotive PCB assembly with standard surface-mount reflow. The LQFP provides excellent thermal performance and ample I/O for body controller applications. Pin pitch and pad geometry follow JEDEC MS-026 standards for LQFP-112.
Can the MC9S12XDT256MAL be used in automotive body modules?
Yes, the MC9S12XDT256MAL is specifically designed for automotive body electronics applications including central body modules, immobilizer functions, CAN/LIN gateways, instrument clusters, and climate control units. Its AEC-Q100 qualification, extended temperature range, and integrated CAN controllers make it a proven choice for production vehicle networks used by major OEMs.
What is a drop-in replacement for the MC9S12XDT256MAL?
Drop-in alternatives within the HCS12X family include the MC9S12XDQ256MAG, which shares the same HCS12X core, 256KB Flash range, and 112-LQFP package but with adjusted peripheral mix. The MC9S12XD256MAL is a closely related variant. Both maintain pin-to-pin compatibility enabling direct PCB reuse with minimal firmware adjustments for peripheral routing.
Is the MC9S12XDT256MAL RoHS compliant?
Yes, the MC9S12XDT256MAL is RoHS compliant per NXP's product declaration, using lead-free termination suitable for Pb-free reflow profiles per JEDEC J-STD-020. The part also meets REACH requirements. NXP publishes material composition data sheets through its product environmental compliance portal for AEC-Q100 qualified automotive parts.
How much does the MC9S12XDT256MAL cost?
As of 2026-10-17, the MC9S12XDT256MAL prices range from approximately $27.50 at qty 1 down to $15.85 at qty 1000, based on DigiKey and Mouser distributor listings. LCSC Electronics lists the part from $25.24. Pricing varies with market conditions since the part is NRND; contact franchised distributors for current quotes and lead times.
What is the lead time for the MC9S12XDT256MAL?
As of 2026-10-17, lead time for the MC9S12XDT256MAL ranges from stock to several weeks depending on quantity and distributor, since the part is NRND. DigiKey lists ships-today availability on certain quantities; bulk orders may require factory allocation. For high-volume production, request a Last-Time-Buy quote from NXP through authorized distributors.
Does the MC9S12XDT256MAL have CAN controllers?
Yes, the MC9S12XDT256MAL integrates multiple MSCAN (Motorola Scalable CAN) controllers supporting CAN 2.0A/B protocols at speeds up to 1 Mbps, enabling gateway and body-network applications. The integrated CAN modules reduce external component count and BOM cost. Detailed register configuration is covered in the NXP S12XD reference manual.
What can replace the MC9S12XDT256MAL?
Within NXP's HCS12X family, the MC9S12XDQ256MAG and MC9S12XD256MAL serve as drop-in-compatible replacements sharing the same 112-LQFP footprint and HCS12X core. The MC9S12DT256BMPV is another related part across the family. Designers migrating to newer platforms should evaluate NXP's S32K1xx series for long-term automotive production roadmaps.
Is the MC9S12XDT256MAL suitable for industrial CAN applications?
Yes, beyond automotive, the MC9S12XDT256MAL suits industrial CAN node controllers, motor driver interfaces, and building automation gateways where extended temperature and AEC-Q100 reliability are valued. The 80MHz core handles CANOpen and DeviceNet stacks efficiently. Industrial users benefit from the same firmware toolchain as automotive deployments.

エンジニアリング参考データ: MC9S12XDT256MAL — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MC9S12XDT256MAL for new automotive body and gateway designs where AEC-Q100 qualification, 256KB Flash, 80MHz HCS12X core with XGATE, and 112-LQFP footprint are required. The MC9S12XDT256MAA is the direct alternate suffix in the same family. For designs without XGATE requirements, the MC9S12DT256BMPV offers a lower-cost path though with 25% lower CPU clock. The MC9S12HZ256CAL is preferred when active lifecycle status matters more than temperature range, since the XDT variants are NRND. For new automotive designs, evaluate NXP's S32K1xx family for long-term production support.

代替品との比較

パラメータ この製品 MC9S12XDT256MAA MC9S12XD256MAL MC9S12XDQ256MAG MC9S12DT256BMPV MC9S12HZ256CAL
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP - same 112-LQFP - same
Core Architecture HCS12X (16-bit) HCS12X - same HCS12X - same HCS12X - same HCS12 (non-X) HCS12X
Flash Memory 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
CPU Clock 80 MHz 80 MHz 80 MHz 80 MHz 50 MHz 50 MHz
XGATE Co-processor Yes Yes Yes Yes No Yes
Operating Temperature -40C to +125C Per suffix variant -40C to +125C -40C to +125C -40C to +125C -40C to +85C
Lifecycle Status NRND NRND NRND NRND NRND Active
Automotive Grade AEC-Q100 qualified AEC-Q100 qualified AEC-Q100 qualified AEC-Q100 qualified AEC-Q100 qualified AEC-Q100 qualified

主な差別化要因

  • HCS12X core with XGATE co-processor (vs MC9S12DT256BMPV)
  • Multi-channel MSCAN integration (vs MC9S12HZ256CAL)
  • Wider temperature range (vs MC9S12HZ256CAL)

設計ノート

Decouple every VDD/VDDR/VDDA/VDDX supply pin with a 100nF ceramic capacitor placed within 5mm of the pin per NXP's HCS12X hardware design guidelines. Use a 10uF bulk capacitor near the MCU plus 4.7uF near the internal voltage regulator output. A clean ground plane directly beneath the LQFP reduces digital switching noise coupling into ADC references.

The TEST pin must be tied to VDDR through a 1k-10k resistor or directly high; floating TEST pin may place the MCU in factory test mode and prevent normal startup. The BKGD pin requires a dedicated pull-up to VDDR when not actively in use for background debug. Both pins are commonly overlooked by designers migrating from other MCU families and cause debug-time headaches.

CAN bus termination: place 120 ohm termination resistors at each end of the CAN bus, not at the MCU. Use shielded twisted pair for CAN_H/CAN_L traces with characteristic impedance of 120 ohms. Keep CAN traces away from switching power supply nodes and PWM outputs to minimize EMI-induced CAN error frames. Follow NXP AN2464 CAN application note guidance for EMC compliance.

Estimated: at full 80MHz CPU load with all peripherals active, the LQFP-112 junction-to-ambient thermal resistance is approximately 45-55 C/W on a standard 4-layer JEDEC PCB. For under-hood or high-ambient automotive deployments, ensure ambient temperature plus internal power dissipation does not exceed the 125C junction limit. Add thermal vias beneath the exposed pad if available in your PCB stack-up.

The MC9S12XDT256MAL integrates an internal voltage regulator producing 2.5V core from 5V VDDR supply, eliminating external core LDO requirements. However, power sequencing requires VDDR stable before RESET deassertion per NXP S12XD reference manual. Adding a 100nF + 10uF capacitor pair at the VDDX pin ensures stable internal regulator operation across load transients.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

RoHS compliant and AEC-Q100 qualified per NXP product declarations. Halogen-free per NXP environmental compliance documentation. Conflict minerals compliant per NXP's CMRT filings.

データ検証日: 2026-10-17 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

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