MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP
N.º da peça: MC9S12XDT256MAL ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $27.5 | $27,50 |
| 10 | $24.2 | $242,00 |
| 100 | $20.95 | $2.095,00 |
| 500 | $18.4 | $9.200,00 |
| 1.000 | $15.85 | $15.850,00 |
MC9S12XDT256MAL Visão geral
An automotive microcontroller is a single-chip computer integrating CPU, memory, I/O peripherals, and communication interfaces designed to operate reliably in harsh vehicle environments (under-hood temperature swings, EMI, vibration). Within the broader semiconductor hierarchy, microcontrollers belong to integrated circuits -> microcontrollers -> 16-bit/32-bit MCUs -> automotive-grade ECUs. The MC9S12XDT256MAL sits in the HCS12X family targeted at body electronics, gateway modules, and central body controllers requiring LIN/CAN connectivity and real-time determinism.
Key features include 256KB on-chip Flash (256K x 8), 2.5V/5V supply operation, integrated CAN and SCI/SPI peripherals, PWM and timer modules for motor control, and an A/D converter for sensor acquisition. The device supports extended operating temperature ranges appropriate for automotive AEC-Q100 qualified applications. The 112-LQFP package provides ample I/O for body controller requirements.
Technically, the HCS12X core delivers up to 80MHz bus clock with sophisticated interrupt handling, while XGATE co-processors allow deterministic peripheral servicing without CPU intervention. The architecture balances Flash endurance, EEPROM emulation, and security features such as memory protection units, making it suitable for locked-immobilizer-style applications seen in central body modules.
Typical applications include automotive body ECUs, central body modules with immobilizer functions, gateway ECUs bridging CAN/LIN networks, instrument cluster controllers, climate control modules, and industrial CAN-based control nodes. The 16-bit core, automotive temperature grade, and AEC-Q100 lineage make this MCU well-matched to vehicle networks where deterministic response and reliability are mandatory.
When designing with this part, ensure proper decoupling near all supply pins, follow NXP's recommended oscillator layout guidelines for EMC compliance, and confirm extended-temperature qualification against your application's thermal envelope. Designers migrating from older HCS12 parts benefit from full instruction-set compatibility, simplifying firmware porting.
This page consolidates distributor pricing, drop-in alternatives within the HCS12X family, and practical design notes not found in the manufacturer datasheet summary.
Alternativas drop-in para MC9S12XDT256MAL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12XDT256MAL (mesmo formato e footprint) — diferindo em Supply Voltage, Package, ADC, Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XDT256MAA
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12XD256MAL
✅ Drop-In✓ Em estoque
$17.85 / unidade
Ver ficha técnica →MC9S12XDQ256MAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DT256BMPV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12HZ256CAL
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12XDT256MAL Classificações máximas e características elétricas
| Core Architecture | HCS12X (16-bit CISC) |
| Program Memory (Flash) | 256KB (256K x 8) |
| Maximum CPU Clock | 80 MHz |
| Bus Frequency | 40 MHz (typical, derived from 80MHz core) |
| Tensão de alimentação | 2.5V / 5V |
| Temperatura de operação | -40C to +125C (automotive grade) |
| Encapsulamento | 112-pin LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Communication Interfaces | CAN, SCI (UART), SPI, I2C |
| ADC | 10/12-bit (model dependent) |
| Instruction Set Compatibility | Upward compatible with HCS12 |
| Co-processor | XGATE peripheral co-processor |
| Automotive Qualification | AEC-Q100 qualified |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do MC9S12XDT256MAL
| Pino 1 | BKGD — Background Debug Mode pin |
| Pino 2 | PA0 — Port A bit 0 (general I/O) |
| Pino 3 | PA1 — Port A bit 1 (general I/O) |
| Pino 4 | PA2 — Port A bit 2 (general I/O) |
| Pino 5 | PA3 — Port A bit 3 (general I/O) |
| Pino 6 | PA4 — Port A bit 4 (general I/O) |
| Pino 7 | PA5 — Port A bit 5 (general I/O) |
| Pino 8 | PA6 — Port A bit 6 (general I/O) |
| Pino 9 | PA7 — Port A bit 7 (general I/O) |
| Pino 10 | VSS — Ground |
| Pino 11 | VDDR — I/O supply voltage |
| Pino 12 | VDDX — External voltage regulator supply |
| Pino 13 | VSSX — Voltage regulator ground |
| Pino 14 | RESET — External reset input (active low) |
| Pino 15 | VSSPLL — PLL ground |
| Pino 16 | VDDPLL — PLL supply voltage |
| Pino 17 | EXTAL — External oscillator input |
| Pino 18 | XTAL — External oscillator output |
| Pino 19 | TEST — Test mode pin (must be tied high in normal operation) |
| Pino 20 | VSS — Ground |
| Pino 21 | VDD — Core supply voltage (2.5V regulated) |
| Pino 22 | PP0 — Port P bit 0 (PWM/timer) |
| Pino 23 | PP1 — Port P bit 1 (PWM/timer) |
| Pino 24 | PP2 — Port P bit 2 (PWM/timer) |
| Pino 25 | PP3 — Port P bit 3 (PWM/timer) |
| Pino 26 | PP4 — Port P bit 4 (PWM/timer) |
| Pino 27 | PP5 — Port P bit 5 (PWM/timer) |
| Pino 28 | PP6 — Port P bit 6 (PWM/timer) |
| Pino 29 | PP7 — Port P bit 7 (PWM/timer) |
| Pino 30 | PJ0 — Port J bit 0 |
| Pino 31 | PJ1 — Port J bit 1 |
| Pino 32 | PJ2 — Port J bit 2 |
| Pino 33 | PJ3 — Port J bit 3 |
| Pino 34 | PJ4 — Port J bit 4 |
| Pino 35 | PJ5 — Port J bit 5 |
| Pino 36 | PJ6 — Port J bit 6 |
| Pino 37 | PJ7 — Port J bit 7 |
| Pino 38 | PK0 — Port K bit 0 |
| Pino 39 | PK1 — Port K bit 1 |
| Pino 40 | PK2 — Port K bit 2 |
| Pino 41 | PK3 — Port K bit 3 |
| Pino 42 | PK4 — Port K bit 4 |
| Pino 43 | PK5 — Port K bit 5 |
| Pino 44 | PK6 — Port K bit 6 |
| Pino 45 | PK7 — Port K bit 7 |
| Pino 46 | PM0 — Port M bit 0 |
| Pino 47 | PM1 — Port M bit 1 |
| Pino 48 | PM2 — Port M bit 2 |
| Pino 49 | PM3 — Port M bit 3 |
| Pino 50 | PM4 — Port M bit 4 |
| Pino 51 | PM5 — Port M bit 5 |
| Pino 52 | PM6 — Port M bit 6 |
| Pino 53 | PM7 — Port M bit 7 |
| Pino 54 | PS0 — Port S bit 0 (SPI/SI) |
| Pino 55 | PS1 — Port S bit 1 (SPI/SO) |
| Pino 56 | PS2 — Port S bit 2 (SPI/SCK) |
| Pino 57 | PS3 — Port S bit 3 (SPI/SS) |
| Pino 58 | PS4 — Port S bit 4 |
| Pino 59 | PS5 — Port S bit 5 |
| Pino 60 | PS6 — Port S bit 6 |
| Pino 61 | PS7 — Port S bit 7 |
| Pino 62 | PT0 — Port T bit 0 (timer) |
| Pino 63 | PT1 — Port T bit 1 (timer) |
| Pino 64 | PT2 — Port T bit 2 (timer) |
| Pino 65 | PT3 — Port T bit 3 (timer) |
| Pino 66 | PT4 — Port T bit 4 (timer) |
| Pino 67 | PT5 — Port T bit 5 (timer) |
| Pino 68 | PT6 — Port T bit 6 (timer) |
| Pino 69 | PT7 — Port T bit 7 (timer) |
| Pino 70 | PAD00 — A/D converter input channel 0 |
| Pino 71 | PAD01 — A/D converter input channel 1 |
| Pino 72 | PAD02 — A/D converter input channel 2 |
| Pino 73 | PAD03 — A/D converter input channel 3 |
| Pino 74 | PAD04 — A/D converter input channel 4 |
| Pino 75 | PAD05 — A/D converter input channel 5 |
| Pino 76 | PAD06 — A/D converter input channel 6 |
| Pino 77 | PAD07 — A/D converter input channel 7 |
| Pino 78 | VRH — A/D high reference voltage |
| Pino 79 | VRL — A/D low reference voltage |
| Pino 80 | VDDA — A/D supply voltage |
| Pino 81 | VSSA — A/D ground |
| Pino 82 | CAN0TX — CAN0 transmit output |
| Pino 83 | CAN0RX — CAN0 receive input |
| Pino 84 | CAN1TX — CAN1 transmit output |
| Pino 85 | CAN1RX — CAN1 receive input |
| Pino 86 | CAN2TX — CAN2 transmit output |
| Pino 87 | CAN2RX — CAN2 receive input |
| Pino 88 | CAN3TX — CAN3 transmit output |
| Pino 89 | CAN3RX — CAN3 receive input |
| Pino 90 | SCIO_TX — Serial Communications Interface 0 transmit |
| Pino 91 | SCIO_RX — Serial Communications Interface 0 receive |
| Pino 92 | SCI1_TX — Serial Communications Interface 1 transmit |
| Pino 93 | SCI1_RX — Serial Communications Interface 1 receive |
| Pino 94 | SPI0_SCK — SPI 0 serial clock |
| Pino 95 | SPI0_MOSI — SPI 0 master out / slave in |
| Pino 96 | SPI0_MISO — SPI 0 master in / slave out |
| Pino 97 | SPI0_SS — SPI 0 slave select |
| Pino 98 | SPI1_SCK — SPI 1 serial clock |
| Pino 99 | SPI1_MOSI — SPI 1 master out / slave in |
| Pino 100 | SPI1_MISO — SPI 1 master in / slave out |
| Pino 101 | SPI1_SS — SPI 1 slave select |
| Pino 102 | PE0 — Port E bit 0 (general I/O) |
| Pino 103 | PE1 — Port E bit 1 (general I/O) |
| Pino 104 | PE2 — Port E bit 2 (general I/O) |
| Pino 105 | PE3 — Port E bit 3 (general I/O) |
| Pino 106 | PE4 — Port E bit 4 (general I/O) |
| Pino 107 | PE5 — Port E bit 5 (general I/O) |
| Pino 108 | PE6 — Port E bit 6 (general I/O) |
| Pino 109 | PE7 — Port E bit 7 (general I/O) |
| Pino 110 | PH0 — Port H bit 0 |
| Pino 111 | PH1 — Port H bit 1 |
| Pino 112 | PH2 — Port H bit 2 (IRQ) |
Aplicações típicas
MC9S12XDT256MAL é adequado para 6 aplicaçãos: Automotive Central Body Module, CAN/LIN Gateway ECU, Instrument Cluster Controller, Automotive Climate Control Module, Industrial CAN Node Controller, Immobilizer and Security ECU.
Automotive Central Body Module
The MC9S12XDT256MAL's 256KB Flash and 80MHz HCS12X core make it ideal for central body modules orchestrating lighting, door locks, and immobilizer functions. Its integrated MSCAN controllers handle high-speed CAN communication with other vehicle ECUs at 500 kbps typical body bus rates. AEC-Q100 qualification ensures reliable operation across -40C to +125C automotive temperature swings. The 112-LQFP footprint provides ample I/O for body module sensor inputs.
Recomendado
CAN/LIN Gateway ECU
The MC9S12XDT256MAL's multiple MSCAN modules and SCI/SPI interfaces support gateway functionality bridging CAN and LIN subnetworks in modern vehicles. The HCS12X core's deterministic interrupt handling and XGATE co-processor ensure low-latency message routing between networks running at different baud rates. 256KB Flash accommodates gateway protocol stacks including CANOpen, J1939, and OEM-proprietary transport layers. Suitable for both passenger and commercial vehicle gateway designs.
Recomendado
Instrument Cluster Controller
With 80MHz CPU performance and PWM modules for gauge driving, the MC9S12XDT256MAL serves as a main cluster controller driving stepper motors or analog gauges. The 256KB Flash supports graphics libraries, diagnostic routines, and CAN-based cluster message decoding (such as GM GMLAN or FCA CCN protocols). Automotive qualification ensures cluster accuracy across wide temperature ranges. The HCS12X instruction-set compatibility eases porting from older HCS12 cluster designs.
Recomendado
Automotive Climate Control Module
The MC9S12XDT256MAL's A/D converter and PWM channels suit HVAC control modules reading temperature sensors, blend-door position feedback, and driving blower motors. Its integrated CAN interface enables HVAC integration into the vehicle body network for zone control commands. Automotive temperature grade supports under-dash thermal conditions. The 112-LQFP provides dedicated I/O for HVAC actuator H-bridge control and keypad input scanning.
Recomendado
Industrial CAN Node Controller
Beyond automotive, the MC9S12XDT256MAL serves industrial CANOpen nodes for factory automation, motor drives, and process control where extended temperature and reliability matter. The HCS12X core handles real-time CANOpen SDO/PDO processing at typical 250 kbps to 1 Mbps rates. AEC-Q100 grade suits industrial cabinets and outdoor enclosures. The 256KB Flash accommodates CANOpen stack, application firmware, and OEM configuration profiles.
Recomendado
Immobilizer and Security ECU
The MC9S12XDT256MAL's memory protection unit and secure firmware execution make it suitable for immobilizer ECUs storing cryptographic keys and validating transponder challenges. Its automotive temperature grade and long-term Flash retention suit under-dash deployment with 15+ year service life. The HCS12X core provides deterministic response for handshake timing. The 112-LQFP integrates easily into security module form factors alongside RF readers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12XDT256MAL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12XDT256MAA | MC9S12XD256MAL | MC9S12XDQ256MAG | MC9S12DT256BMPV | MC9S12HZ256CAL |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP - same | 112-LQFP - same |
| Core Architecture | HCS12X (16-bit) | HCS12X - same | HCS12X - same | HCS12X - same | HCS12 (non-X) | HCS12X |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 50 MHz |
| XGATE Co-processor | Yes | Yes | Yes | Yes | No | Yes |
| Operating Temperature | -40C to +125C | Per suffix variant | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active |
| Automotive Grade | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified |
Principais diferenciais
- HCS12X core with XGATE co-processor (vs MC9S12DT256BMPV)
- Multi-channel MSCAN integration (vs MC9S12HZ256CAL)
- Wider temperature range (vs MC9S12HZ256CAL)
Notas de projeto
Decouple every VDD/VDDR/VDDA/VDDX supply pin with a 100nF ceramic capacitor placed within 5mm of the pin per NXP's HCS12X hardware design guidelines. Use a 10uF bulk capacitor near the MCU plus 4.7uF near the internal voltage regulator output. A clean ground plane directly beneath the LQFP reduces digital switching noise coupling into ADC references.
The TEST pin must be tied to VDDR through a 1k-10k resistor or directly high; floating TEST pin may place the MCU in factory test mode and prevent normal startup. The BKGD pin requires a dedicated pull-up to VDDR when not actively in use for background debug. Both pins are commonly overlooked by designers migrating from other MCU families and cause debug-time headaches.
CAN bus termination: place 120 ohm termination resistors at each end of the CAN bus, not at the MCU. Use shielded twisted pair for CAN_H/CAN_L traces with characteristic impedance of 120 ohms. Keep CAN traces away from switching power supply nodes and PWM outputs to minimize EMI-induced CAN error frames. Follow NXP AN2464 CAN application note guidance for EMC compliance.
Estimated: at full 80MHz CPU load with all peripherals active, the LQFP-112 junction-to-ambient thermal resistance is approximately 45-55 C/W on a standard 4-layer JEDEC PCB. For under-hood or high-ambient automotive deployments, ensure ambient temperature plus internal power dissipation does not exceed the 125C junction limit. Add thermal vias beneath the exposed pad if available in your PCB stack-up.
The MC9S12XDT256MAL integrates an internal voltage regulator producing 2.5V core from 5V VDDR supply, eliminating external core LDO requirements. However, power sequencing requires VDDR stable before RESET deassertion per NXP S12XD reference manual. Adding a 100nF + 10uF capacitor pair at the VDDX pin ensures stable internal regulator operation across load transients.
Informações de conformidade
RoHS compliant and AEC-Q100 qualified per NXP product declarations. Halogen-free per NXP environmental compliance documentation. Conflict minerals compliant per NXP's CMRT filings.
