MPC870CZT133 - MPC8xx 133MHz 32-Bit MPU | NXP | 256-PBGA
料号： MPC870CZT133 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $82 | $8,200.00 |
| 250 | $76.5 | $19,125.00 |
| 500 | $71 | $35,500.00 |
MPC870CZT133 概述
An MPU (Microprocessor Unit) is a CPU-centric integrated circuit that contains the central processing unit, control logic, and on-chip peripheral interfaces but typically relies on external memory for program and data storage. MPUs sit higher in the computing hierarchy than MCUs (which integrate flash/RAM), and are commonly used when large external memory footprints, DMA engines, or specialized peripheral modules are required. The MPC8xx family extends the PowerPC core with dedicated communications hardware for telecom and industrial applications, occupying a distinct niche between general-purpose microprocessors and dedicated communication ASICs.
Key features of the MPC870CZT133 include a 32-bit PowerPC core at 133 MHz, integrated CPM for HDLC/USB/UART support, 256-ball PBGA package, and extended operating temperature range suitable for industrial environments. The device supports up to 32-bit external memory bus and offers multiple serial interface controllers, reducing external component count in networking equipment.
The architecture combines a PowerPC integer unit with a RISC-based CPM, allowing simultaneous execution of communications protocol handling and general-purpose processing. The 133 MHz clock speed delivers approximately 133 MIPS of integer performance, adequate for legacy router, bridge, and serial concentrator designs. Memory management is handled by a hardware MMU supporting virtual memory and protection.
Typical applications include industrial serial concentrators, low-end routers and bridges, telecom control boards, factory automation controllers, and legacy embedded systems requiring PowerPC instruction-set compatibility. The integrated CPM eliminates the need for an external protocol controller in most designs.
Designers should verify long-term supply before committing to new designs, as the MPC8xx family is approaching end-of-life. Existing designs should plan for migration to the MPC85xx or QorIQ families for new production. The 256-ball PBGA requires careful PCB layout with controlled-impedance traces and adequate thermal relief for reliable operation.
This page synthesizes distributor availability, drop-in MPC8xx alternatives, lifecycle status, and practical design notes that go beyond the manufacturer hardware specifications document, helping engineers assess sourcing options and modernization paths.
直接替换替代料： MPC870CZT133 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC870CZT133 （相同外形与封装尺寸） ——差异在于 Core Architecture, Package, Operating Temperature, Package Code, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
MPC870ZT133
✅ 直接替换✓ 有现货
$28.75 / 个
查看数据手册 →MPC875ZT133
✅ 直接替换✓ 有现货
$19.85 / 个
查看数据手册 →MPC870CVR133
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$18.4 / 个
查看数据手册 →MPC860DTZQ133D4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MPC870CZT133 最大额定值与电气特性
| Part Number | MPC870CZT133 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | MPC8xx (PowerQUICC) |
| Core Architecture | PowerPC 32-bit RISC |
| Number of Cores | 1 |
| Core Speed | 133 MHz |
| 数据总线宽度 | 32-bit |
| 封装 | 256-PBGA (23x23 mm) |
| Package Code | HBGA, BGA-256 |
| Terminal Form | Ball |
| Number of Terminals | 256 |
| On-chip Peripherals | Communications Processor Module (CPM), UART, HDLC, USB |
| 安装类型 | Surface Mount |
| RoHS 状态 | unknown |
| Lead-Free | unknown |
| 无卤 | unknown |
| AEC-Q100 Qualified | not_applicable |
MPC870CZT133 hbga, bga-256 引脚配置指南
MPC870CZT133（hbga, bga-256 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC870CZT133.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC870CZT133 适用于 6 应用s: Legacy Telecom Control Boards, Industrial Serial Concentrators, Low-End Routers and Bridges, Factory Automation Controllers, Embedded Networking Equipment, Legacy System Maintenance and Repair.
Legacy Telecom Control Boards
The MPC870CZT133's integrated Communications Processor Module (CPM) with native HDLC, UART, and USB support makes it well suited for legacy telecom line cards and control boards requiring PowerPC instruction-set compatibility. At 133 MHz the core delivers adequate throughput for T1/E1 aggregation, signaling protocol termination, and supervisory control tasks common in legacy central-office equipment. The 32-bit PowerPC architecture simplifies migration of existing firmware from older MPC860 designs.
推荐
Industrial Serial Concentrators
Multi-port serial concentrators in industrial automation frequently use the MPC870CZT133 to aggregate UART-based fieldbus traffic from RS-232, RS-422, or RS-485 links. The CPM's multiple SCC (Serial Communication Controller) channels handle the protocol framing in hardware, freeing the PowerPC core for higher-level routing and management functions. The 256-PBGA package's robust thermal characteristics and 133 MHz performance are well matched to DIN-rail mounted industrial gateways.
推荐
Low-End Routers and Bridges
Small-office router and bridge designs from the early 2000s frequently used the MPC870CZT133, leveraging its integrated CPM for WAN serial interface termination alongside the PowerPC core running routing protocols. The 133 MHz clock provides adequate packet processing for sub-100 Mbps aggregate throughput. While the part is now legacy, fielded router installations continue to require replacement units for maintenance windows.
推荐
Factory Automation Controllers
Programmable Logic Controller (PLC) and distributed control system (DCS) modules deployed in factory automation historically used the MPC870CZT133 for deterministic real-time processing of sensor and actuator data. The PowerPC core's deterministic interrupt latency and the CPM's hardware-protocol-offload capabilities simplify real-time control loop implementation. The industrial temperature variants of the MPC870 family support deployment in harsh factory-floor environments.
推荐
Embedded Networking Equipment
Small-footprint embedded networking appliances such as protocol converters, print servers, and embedded web servers leveraged the MPC870CZT133's combination of PowerPC processing throughput and CPM peripheral integration. The integrated USB controller simplifies connection to external storage or peripheral devices. The 256-PBGA package and 133 MHz core provide a balance of capability and power consumption suitable for fanless embedded designs.
推荐
Legacy System Maintenance and Repair
Fielded systems using the MPC870CZT133 continue to require spare parts for repair and maintenance throughout their operational lifetime. With the part now in last-time-buy status, identifying verified pin-compatible alternatives is essential for sustaining production of repair components. The MPC870ZT133 and MPC875ZT133 serve as drop-in replacements in many legacy applications, allowing continued support without redesign.
推荐
推荐产品汇总
工程参考数据： MPC870CZT133 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC870ZT133 | MPC875ZT133 | MPC870CVR133 | MPC860DTZQ133D4 |
|---|---|---|---|---|---|
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Core Speed | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Integrated Ethernet MAC | No (external required) | No | Yes (Fast Ethernet) | No | No |
| Number of SCC Channels | 2 | 2 | 4 | 2 | 4 |
| USB Controller | Yes (USB 1.1) | Yes | Yes | Yes | No |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete |
关键差异点
- Integrated Communications Processor Module （对比 MPC860DTZQ133D4)
- Compact 256-PBGA footprint （对比 MPC875ZT133)
- Last-time-buy availability for legacy support （对比 Modern alternatives like QorIQ P1010)
设计说明
The 256-PBGA package has thermal resistance theta_JA that depends heavily on PCB layout. For continuous 133 MHz operation, ensure at least four thermal vias under the central ground balls and a ground plane on the opposite PCB layer. Estimated: with theta_JA of approximately 15 C/W on a standard 4-layer PCB, the junction temperature rise at 2W typical dissipation is about 30C above ambient. Add thermal relief copper pours if operating near maximum ambient temperature.
The 256-PBGA requires a PCB with BGA-compatible land pattern and reflow soldering profile. Use non-solder-mask-defined (NSMD) pads with a diameter approximately 80% of the ball diameter for optimal joint reliability. Place multiple GND and VCC balls with direct via connections to inner planes. The high-speed external memory bus traces must be length-matched within timing specifications documented in the hardware specifications document.
Do not design new products with the MPC870CZT133 - the part is in last-time-buy status per the NXP product page. Existing designs must plan for last-time-buy procurement: place orders for full lifetime requirements before the part reaches end-of-life. Verify silicon revision and errata against the latest hardware specifications document before substitution with the MPC870ZT133 or MPC875ZT133.
合规信息
Compliance status unknown because the part is in last-time-buy phase and the manufacturer may not have updated compliance documentation. Request the latest material declaration directly from NXP or Rochester Electronics for regulatory compliance verification.