MT29F64G08AFAAAWP-ITZ:A - 64Gb SLC Parallel NAND Flash 48-TSOP
部品番号: MT29F64G08AFAAAWP-ITZ:A ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.95 | $9,950.00 |
MT29F64G08AFAAAWP-ITZ:A 概要
A NAND Flash memory is a non-volatile storage technology that retains data without power and is organized as an array of memory cells connected in series (strings) per bitline, with each cell storing charge on a floating gate. SLC (Single-Level Cell) NAND stores one bit per cell, delivering the highest endurance and lowest bit-error-rate of any NAND technology. In the broader hierarchy, this device is a parallel (asynchronous) NAND IC, which sits below managed NAND (eMMC, UFS) but above serial NOR flash in capacity and below DRAM in performance.
Key specifications include a 64-Gbit density (8 GB), 8-bit bus width, ONFI 1.0-compatible asynchronous interface, typical page size of 8 Kbytes (plus spare), 25 ns typical access time, and industrial temperature range of -40 C to +85 C. The 48-TSOP I package is a 12 mm x 20 mm surface-mount form factor that has been the industry-standard pinout for parallel NAND for two decades.
The device uses Micron's two-plane architecture with interleaved plane operations to maximize sequential write bandwidth. Built-in ECC is required externally (typically BCH or LDPC in the host controller). The industrial-temperature grade and SLC endurance make this part well suited to systems that cannot tolerate the higher bit-error rate of MLC or TLC NAND.
Typical applications include industrial embedded controllers, networking line cards with boot storage, automotive infotainment (where AEC-Q100 is not required), factory automation PLCs, and legacy designs that already have a parallel NAND controller and ECC engine. The 48-TSOP form factor is also commonly used in set-top boxes and printers.
When designing with this part, ensure the host controller supplies a 1.8 V or 3.3 V Vccq and routes 8-bit data with impedance-controlled traces. The WP#, CE#, ALE, CLE, RIO, and R/B pins must be tied or driven correctly to avoid bus contention during power-up.
This page synthesizes real-time distributor pricing, verified drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.
ドロップイン代替品: MT29F64G08AFAAAWP-ITZ:A — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MT29F64G08AFAAAWP-ITZ
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT29F64G08AFAAAWP-IT
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MT29F128G08AJAAAWP:A
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT29F128G08AJAAAWP
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MT29F64G08AFABAWP-IT
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MX30LF4G18AC-XKI
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MT29F64G08AFAAAWP-ITZ:A 最大定格＆電気的特性
| メモリタイプ | Non-Volatile NAND Flash |
| Technology | SLC (Single-Level Cell) |
| Density | 64 Gbit (8 Gbyte) |
| メモリ構成 | 8 G x 8 bits |
| Bus Width | 8-bit parallel / asynchronous |
| インターフェース | Parallel ONFI-compatible asynchronous |
| Supply Voltage (Vcc) | 2.7 V to 3.6 V |
| Page Size | 8 Kbytes + spare (typ.) |
| Block Size | 512 Kbytes (typ.) |
| Access Time | 25 ns (typ.) |
| 動作温度 | -40 C to +85 C (Industrial, IT) |
| パッケージ | 48-pin TSOP-I (12 mm x 20 mm, 0.5 mm pitch) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Endurance (SLC) | 100,000 P/E cycles (typ.) |
MT29F64G08AFAAAWP-ITZ:A ピン構成
| ピン 1 | NC — Not connected |
| ピン 2 | NC — Not connected |
| ピン 3 | NC — Not connected |
| ピン 4 | NC — Not connected |
| ピン 5 | NC — Not connected |
| ピン 6 | NC — Not connected |
| ピン 7 | R/B# — Ready/Busy output (open-drain) |
| ピン 8 | RE# — Read enable (active low) |
| ピン 9 | CE# — Chip enable (active low) |
| ピン 10 | NC — Not connected |
| ピン 11 | NC — Not connected |
| ピン 12 | Vcc — Power supply (2.7 V - 3.6 V) |
| ピン 13 | Vss — Ground |
| ピン 14 | NC — Not connected |
| ピン 15 | NC — Not connected |
| ピン 16 | CLE — Command latch enable |
| ピン 17 | ALE — Address latch enable |
| ピン 18 | WE# — Write enable (active low) |
| ピン 19 | WP# — Write protect (active low) |
| ピン 20 | NC — Not connected |
| ピン 21 | NC — Not connected |
| ピン 22 | NC — Not connected |
| ピン 23 | NC — Not connected |
| ピン 24 | NC — Not connected |
| ピン 25 | NC — Not connected |
| ピン 26 | NC — Not connected |
| ピン 27 | NC — Not connected |
| ピン 28 | NC — Not connected |
| ピン 29 | I/O0 — Data I/O bit 0 |
| ピン 30 | I/O1 — Data I/O bit 1 |
| ピン 31 | I/O2 — Data I/O bit 2 |
| ピン 32 | I/O3 — Data I/O bit 3 |
| ピン 33 | Vss — Ground |
| ピン 34 | I/O4 — Data I/O bit 4 |
| ピン 35 | I/O5 — Data I/O bit 5 |
| ピン 36 | I/O6 — Data I/O bit 6 |
| ピン 37 | I/O7 — Data I/O bit 7 |
| ピン 38 | Vcc — Power supply (2.7 V - 3.6 V) |
| ピン 39 | NC — Not connected |
| ピン 40 | NC — Not connected |
| ピン 41 | NC — Not connected |
| ピン 42 | NC — Not connected |
| ピン 43 | NC — Not connected |
| ピン 44 | NC — Not connected |
| ピン 45 | NC — Not connected |
| ピン 46 | NC — Not connected |
| ピン 47 | NC — Not connected |
| ピン 48 | NC — Not connected |
主な用途
MT29F64G08AFAAAWP-ITZ:A の用途: 7 件s: Industrial Embedded Controllers, Networking Line Cards / Router Modules, Automotive Infotainment Storage, Set-Top Box & Printer Boot Storage, Factory Automation PLCs & HMI Panels, Medical Device Data Logging, Military & Aerospace Avionics (Non-Screened).
Industrial Embedded Controllers
The MT29F64G08AFAAAWP-ITZ:A's 8 Gbyte SLC density and -40 C to +85 C industrial temperature rating make it an ideal boot+storage device for industrial PLCs, HMIs, and motion controllers. SLC's 100,000 P/E cycle endurance supports heavy write workloads from data loggers, while the 8-bit asynchronous bus drops directly onto legacy MCU and SoC external memory buses without high-speed signal conditioning. Compared with managed NAND (eMMC), this part gives the firmware engineer direct ONFI command-level control for deterministic wear-leveling and bad-block management - critical when the host must guarantee 10-year product lifetimes in factory-floor equipment.
おすすめ
Networking Line Cards / Router Modules
Telecom line cards, GPON ONTs, and edge routers commonly use the MT29F64G08AFAAAWP-ITZ:A as bulk non-volatile storage for firmware images, routing tables, and event logs. The 8-bit asynchronous interface integrates into a PowerPC, MIPS, or ARM SoC's static memory controller with simple address-latch-based timing. The 64-Gbit capacity is enough to hold dual redundant firmware A/B partitions plus a recovery image, enabling field-upgradable designs. Industrial temperature ensures reliable operation in outdoor-cabinet and unconditioned-shelf environments.
おすすめ
Automotive Infotainment Storage
In automotive infotainment head units and digital instrument clusters that do not require AEC-Q100 grade, the MT29F64G08AFAAAWP-ITZ:A provides 8 Gbyte of reliable storage for map data, firmware, audio buffers, and diagnostics logs. SLC endurance exceeds the typical write pattern of infotainment systems, while the industrial temperature rating handles the under-dash thermal envelope. Designers pair this NAND with an SoC's parallel memory controller plus an external ECC engine (typically BCH) to correct the rare bit errors that occur over the device's lifetime.
おすすめ
Set-Top Box & Printer Boot Storage
The MT29F64G08AFAAAWP-ITZ:A remains the legacy parallel-NAND workhorse in set-top boxes, digital video recorders, and office printers. Its 8 Gbyte capacity is sufficient to hold the bootloader, factory image, runtime OS, and user-data partition in a single chip. The 48-TSOP form factor allows PCB reuse across product generations, reducing tooling costs. Combined with a BCH-4 or BCH-8 ECC controller in the main SoC, this part delivers a proven, cost-effective non-volatile storage subsystem.
おすすめ
Factory Automation PLCs & HMI Panels
PLC CPUs and HMI panels use the MT29F64G08AFAAAWP-ITZ:A for recipe storage, program retention, and historical data logs. The 64-Gbit SLC device survives the 100,000+ write cycles typical of recipe-management use cases where data is rewritten daily for years. Its 48-TSOP package fits the 12 mm x 20 mm PCB land pattern standard for decades, allowing drop-in upgrades from older 8/16/32-Gbit generations. The industrial temperature grade supports unheated control cabinets.
おすすめ
Medical Device Data Logging
Patient monitors, infusion pumps, and diagnostic analyzers use the MT29F64G08AFAAAWP-ITZ:A to record audit trails, calibration logs, and patient-data archives between network uploads. SLC's lower bit-error rate compared with MLC/TLC reduces the risk of corrupted records - critical for FDA-regulated designs where data integrity is auditable. The 8-bit asynchronous interface connects to most medical SoCs without requiring an additional controller, and the industrial-temperature rating handles sterilizer-area thermal exposure.
おすすめ
Military & Aerospace Avionics (Non-Screened)
For non-flight-critical avionics subsystems and ground equipment, the MT29F64G08AFAAAWP-ITZ:A provides ruggedized -40 C to +85 C storage for system logs, configuration data, and bitmaps. Although not QML-screened, the part meets industrial-environment requirements and is widely used in tactical and ground-mobile equipment. Designers can place external ECC and CRC checkers in the FPGA or SoC to satisfy mission-data integrity requirements.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MT29F64G08AFAAAWP-ITZ:A — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MT29F64G08AFAAAWP-ITZ | MT29F64G08AFAAAWP-IT | MT29F128G08AJAAAWP:A | MT29F128G08AJAAAWP | MT29F64G08AFABAWP-IT | MX30LF4G18AC-XKI |
|---|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Macronix |
| Package | 48-TSOP I (0.5 mm pitch) | 48-TSOP I (0.5 mm pitch) - same | 48-TSOP I (0.5 mm pitch) - same | 48-TSOP I (0.5 mm pitch) - same | 48-TSOP I (0.5 mm pitch) - same | 48-TSOP I (0.5 mm pitch) - same | 48-TSOP I (0.5 mm pitch) - same |
| Density | 64 Gbit (8 Gbyte) | 64 Gbit (8 Gbyte) - same | 64 Gbit (8 Gbyte) - same | 128 Gbit (16 Gbyte) - 2x | 128 Gbit (16 Gbyte) - 2x | 64 Gbit (8 Gbyte) - same | 4 Gbit (512 Mbyte) - 1/16 |
| Technology | SLC NAND | SLC NAND - same | SLC NAND - same | SLC NAND - same | SLC NAND - same | SLC NAND - same | SLC NAND - same |
| Operating Temperature | -40 C to +85 C (IT) | 0 C to +70 C (commercial) | -40 C to +85 C (IT) - same | -40 C to +85 C (IT) | 0 C to +70 C (commercial) | -40 C to +85 C (IT) - same | -40 C to +85 C (IT) |
| Bus Width | 8-bit | 8-bit - same | 8-bit - same | 8-bit - same | 8-bit - same | 8-bit - same | 8-bit - same |
| Supply Voltage | 2.7 V - 3.6 V | 2.7 V - 3.6 V - same | 2.7 V - 3.6 V - same | 2.7 V - 3.6 V - same | 2.7 V - 3.6 V - same | 2.7 V - 3.6 V - same | 2.7 V - 3.6 V - same |
| ECC | External (host controller) | External - same | External - same | External - same | External - same | External - same | External - same |
| Endurance (P/E cycles) | 100,000 (SLC typ.) | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same |
| Approx. Unit Price (qty 1, USD) | 18.50 | 16.00 - 18.00 (typ.) | 18.00 - 20.00 (typ.) | 30.00 - 35.00 (typ.) | 28.00 - 32.00 (typ.) | 17.00 - 19.00 (typ.) | 2.50 - 3.50 (typ.) |
主な差別化要因
- Industrial-temperature grade (-40 C to +85 C) （vs MT29F64G08AFAAAWP-ITZ (commercial 0 C to +70 C))
- SLC endurance for write-intensive workloads （vs MX30LF4G18AC-XKI (4 Gbit SLC, 1/16 capacity))
- Mature 25 nm SLC process with proven long-term reliability （vs MT29F128G08AJAAAWP:A (128 Gbit, dual-plane))
設計ノート
Place the MT29F64G08AFAAAWP-ITZ:A as close as possible to the host controller's external bus interface. Keep the 8-bit I/O traces matched in length (within +/- 250 mil) to avoid data skew. Route CLE, ALE, RE#, WE#, and CE# as tightly-grouped control signals with a 50 ohm characteristic impedance. Decouple Vcc with at least one 0.1 uF X7R ceramic cap per supply pin plus a 10 uF bulk capacitor at the device entry.
The MT29F64G08AFAAAWP-ITZ:A requires external ECC implemented in the host controller (typically BCH-4 or BCH-8 for 25 nm SLC). Without ECC, raw bit errors at end-of-life can corrupt firmware and data. Do not use this device with legacy ONFI 1.0 hosts that omit ECC - SLC error rates without correction are not zero. Always enable bad-block management at first power-up using the factory-marked bad-block markers.
The 48-TSOP I package has a 0.5 mm pin pitch, which is the finest pitch in the legacy parallel-NAND family. Use a 4-layer PCB with a dedicated ground plane directly under the device; this both provides a controlled-impedance reference and a thermal path. Avoid routing signal traces directly under the package to prevent capacitive loading on the I/O bus. Keep the R/B# (open-drain) signal pulled up to Vccq with a 4.7 kohm resistor.
During program and erase operations the MT29F64G08AFAAAWP-ITZ:A draws peak currents up to 30 mA on Vcc. Ensure the host's 3.3 V regulator can supply at least 50 mA continuous per device, with a 100 mA peak margin. Voltage droop below 2.7 V during program operations can corrupt data and brick the block. Use a low-dropout (LDO) regulator rather than a switching converter if the host bus is noise-sensitive.
コンプライアンス情報
RoHS compliant per Micron product declaration. Industrial temperature grade (-40 C to +85 C) but not AEC-Q100 qualified - for AEC-Q100 automotive applications, choose a Q100-qualified Micron SLC NAND variant.
