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Micron Technology

MT29F64G08AFAAAWP-ITZ:A - 64Gb SLC Parallel NAND Flash 48-TSOP

料号: MT29F64G08AFAAAWP-ITZ:A ✓ 量产中
有现货 1-3 个工作日内发货
2.7 V to 3.6 V Vdss 48-pin TSOP-I (12 mm x 20 mm, 0.5 mm pitch) Package Non-Volatile NAND Flash Memory
低至 $9.95 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-04
批量定价
数量 单价 小计
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.85 $1,385.00
500 $11.4 $5,700.00
1,000 $9.95 $9,950.00
ℹ️ 所有价格均以 USD 计价

MT29F64G08AFAAAWP-ITZ:A 概述

The Micron MT29F64G08AFAAAWP-ITZ:A is a 64-Gbit asynchronous SLC NAND Flash memory device organized as 8G x 8 bits, housed in a 48-pin TSOP type-I (0.5 mm pitch) package. Operating from a 2.7 V to 3.6 V supply and based on Micron's 25 nm SLC NAND process, this industrial-temperature (IT) part is designed for embedded and high-reliability designs that require predictable endurance and data retention.

A NAND Flash memory is a non-volatile storage technology that retains data without power and is organized as an array of memory cells connected in series (strings) per bitline, with each cell storing charge on a floating gate. SLC (Single-Level Cell) NAND stores one bit per cell, delivering the highest endurance and lowest bit-error-rate of any NAND technology. In the broader hierarchy, this device is a parallel (asynchronous) NAND IC, which sits below managed NAND (eMMC, UFS) but above serial NOR flash in capacity and below DRAM in performance.

Key specifications include a 64-Gbit density (8 GB), 8-bit bus width, ONFI 1.0-compatible asynchronous interface, typical page size of 8 Kbytes (plus spare), 25 ns typical access time, and industrial temperature range of -40 C to +85 C. The 48-TSOP I package is a 12 mm x 20 mm surface-mount form factor that has been the industry-standard pinout for parallel NAND for two decades.

The device uses Micron's two-plane architecture with interleaved plane operations to maximize sequential write bandwidth. Built-in ECC is required externally (typically BCH or LDPC in the host controller). The industrial-temperature grade and SLC endurance make this part well suited to systems that cannot tolerate the higher bit-error rate of MLC or TLC NAND.

Typical applications include industrial embedded controllers, networking line cards with boot storage, automotive infotainment (where AEC-Q100 is not required), factory automation PLCs, and legacy designs that already have a parallel NAND controller and ECC engine. The 48-TSOP form factor is also commonly used in set-top boxes and printers.

When designing with this part, ensure the host controller supplies a 1.8 V or 3.3 V Vccq and routes 8-bit data with impedance-controlled traces. The WP#, CE#, ALE, CLE, RIO, and R/B pins must be tied or driven correctly to avoid bus contention during power-up.

This page synthesizes real-time distributor pricing, verified drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.

直接替换替代料: MT29F64G08AFAAAWP-ITZ:A ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

快速对比工具——选择替代料号进行并排对比:

MT29F64G08AFAAAWP-ITZ

✅ 直接替换
📦 48-TSOP I (0.5 mm pitch)
same die, 0 C to +70 C commercial temp (vs -40 C to +85 C industrial); pin-to-pin compatible

📋 参考替代料(不在目录中)

MT29F64G08AFAAAWP-IT

✅ 直接替换 ⚠️ 规格未核验
📦 48-TSOP I (0.5 mm pitch)
same die/package, identical IT grade -40 C to +85 C; OEM packing code variant

📋 参考替代料(不在目录中)

MT29F128G08AJAAAWP:A

✅ 直接替换
📦 48-TSOP I (0.5 mm pitch)
128 Gbit density (2x), same package/pinout, dual-plane architecture timing

📋 参考替代料(不在目录中)

MT29F128G08AJAAAWP

✅ 直接替换 ⚠️ 规格未核验
📦 48-TSOP I (0.5 mm pitch)
128 Gbit density (2x), commercial-temp variant of higher-density part

📋 参考替代料(不在目录中)

MT29F64G08AFABAWP-IT

✅ 直接替换 ⚠️ 规格未核验
📦 48-TSOP I (0.5 mm pitch)
same die family, AB-revision wafer; industrial temp, pin-to-pin compatible

📋 参考替代料(不在目录中)

MX30LF4G18AC-XKI

✅ 直接替换
📦 48-TSOP I (0.5 mm pitch)
4 Gbit density (vs 64 Gbit) - pin-compatible but 1/16th the capacity; only suitable if density is acceptable

📋 参考替代料(不在目录中)

MT29F64G08AFAAAWP-ITZ:A 最大额定值与电气特性

存储器类型 Non-Volatile NAND Flash
Technology SLC (Single-Level Cell)
Density 64 Gbit (8 Gbyte)
存储组织 8 G x 8 bits
Bus Width 8-bit parallel / asynchronous
接口 Parallel ONFI-compatible asynchronous
Supply Voltage (Vcc) 2.7 V to 3.6 V
Page Size 8 Kbytes + spare (typ.)
Block Size 512 Kbytes (typ.)
Access Time 25 ns (typ.)
工作温度 -40 C to +85 C (Industrial, IT)
封装 48-pin TSOP-I (12 mm x 20 mm, 0.5 mm pitch)
安装类型 Surface Mount
RoHS 状态 Compliant
Endurance (SLC) 100,000 P/E cycles (typ.)

MT29F64G08AFAAAWP-ITZ:A 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 NC — Not connected
引脚 2 NC — Not connected
引脚 3 NC — Not connected
引脚 4 NC — Not connected
引脚 5 NC — Not connected
引脚 6 NC — Not connected
引脚 7 R/B# — Ready/Busy output (open-drain)
引脚 8 RE# — Read enable (active low)
引脚 9 CE# — Chip enable (active low)
引脚 10 NC — Not connected
引脚 11 NC — Not connected
引脚 12 Vcc — Power supply (2.7 V - 3.6 V)
引脚 13 Vss — Ground
引脚 14 NC — Not connected
引脚 15 NC — Not connected
引脚 16 CLE — Command latch enable
引脚 17 ALE — Address latch enable
引脚 18 WE# — Write enable (active low)
引脚 19 WP# — Write protect (active low)
引脚 20 NC — Not connected
引脚 21 NC — Not connected
引脚 22 NC — Not connected
引脚 23 NC — Not connected
引脚 24 NC — Not connected
引脚 25 NC — Not connected
引脚 26 NC — Not connected
引脚 27 NC — Not connected
引脚 28 NC — Not connected
引脚 29 I/O0 — Data I/O bit 0
引脚 30 I/O1 — Data I/O bit 1
引脚 31 I/O2 — Data I/O bit 2
引脚 32 I/O3 — Data I/O bit 3
引脚 33 Vss — Ground
引脚 34 I/O4 — Data I/O bit 4
引脚 35 I/O5 — Data I/O bit 5
引脚 36 I/O6 — Data I/O bit 6
引脚 37 I/O7 — Data I/O bit 7
引脚 38 Vcc — Power supply (2.7 V - 3.6 V)
引脚 39 NC — Not connected
引脚 40 NC — Not connected
引脚 41 NC — Not connected
引脚 42 NC — Not connected
引脚 43 NC — Not connected
引脚 44 NC — Not connected
引脚 45 NC — Not connected
引脚 46 NC — Not connected
引脚 47 NC — Not connected
引脚 48 NC — Not connected

典型应用

MT29F64G08AFAAAWP-ITZ:A 适用于 7 应用s: Industrial Embedded Controllers, Networking Line Cards / Router Modules, Automotive Infotainment Storage, Set-Top Box & Printer Boot Storage, Factory Automation PLCs & HMI Panels, Medical Device Data Logging, Military & Aerospace Avionics (Non-Screened).

🏭

Industrial Embedded Controllers

The MT29F64G08AFAAAWP-ITZ:A's 8 Gbyte SLC density and -40 C to +85 C industrial temperature rating make it an ideal boot+storage device for industrial PLCs, HMIs, and motion controllers. SLC's 100,000 P/E cycle endurance supports heavy write workloads from data loggers, while the 8-bit asynchronous bus drops directly onto legacy MCU and SoC external memory buses without high-speed signal conditioning. Compared with managed NAND (eMMC), this part gives the firmware engineer direct ONFI command-level control for deterministic wear-leveling and bad-block management - critical when the host must guarantee 10-year product lifetimes in factory-floor equipment.

🌐

Networking Line Cards / Router Modules

Telecom line cards, GPON ONTs, and edge routers commonly use the MT29F64G08AFAAAWP-ITZ:A as bulk non-volatile storage for firmware images, routing tables, and event logs. The 8-bit asynchronous interface integrates into a PowerPC, MIPS, or ARM SoC's static memory controller with simple address-latch-based timing. The 64-Gbit capacity is enough to hold dual redundant firmware A/B partitions plus a recovery image, enabling field-upgradable designs. Industrial temperature ensures reliable operation in outdoor-cabinet and unconditioned-shelf environments.

🚗

Automotive Infotainment Storage

In automotive infotainment head units and digital instrument clusters that do not require AEC-Q100 grade, the MT29F64G08AFAAAWP-ITZ:A provides 8 Gbyte of reliable storage for map data, firmware, audio buffers, and diagnostics logs. SLC endurance exceeds the typical write pattern of infotainment systems, while the industrial temperature rating handles the under-dash thermal envelope. Designers pair this NAND with an SoC's parallel memory controller plus an external ECC engine (typically BCH) to correct the rare bit errors that occur over the device's lifetime.

📺

Set-Top Box & Printer Boot Storage

The MT29F64G08AFAAAWP-ITZ:A remains the legacy parallel-NAND workhorse in set-top boxes, digital video recorders, and office printers. Its 8 Gbyte capacity is sufficient to hold the bootloader, factory image, runtime OS, and user-data partition in a single chip. The 48-TSOP form factor allows PCB reuse across product generations, reducing tooling costs. Combined with a BCH-4 or BCH-8 ECC controller in the main SoC, this part delivers a proven, cost-effective non-volatile storage subsystem.

🏭

Factory Automation PLCs & HMI Panels

PLC CPUs and HMI panels use the MT29F64G08AFAAAWP-ITZ:A for recipe storage, program retention, and historical data logs. The 64-Gbit SLC device survives the 100,000+ write cycles typical of recipe-management use cases where data is rewritten daily for years. Its 48-TSOP package fits the 12 mm x 20 mm PCB land pattern standard for decades, allowing drop-in upgrades from older 8/16/32-Gbit generations. The industrial temperature grade supports unheated control cabinets.

💊

Medical Device Data Logging

Patient monitors, infusion pumps, and diagnostic analyzers use the MT29F64G08AFAAAWP-ITZ:A to record audit trails, calibration logs, and patient-data archives between network uploads. SLC's lower bit-error rate compared with MLC/TLC reduces the risk of corrupted records - critical for FDA-regulated designs where data integrity is auditable. The 8-bit asynchronous interface connects to most medical SoCs without requiring an additional controller, and the industrial-temperature rating handles sterilizer-area thermal exposure.

✈️

Military & Aerospace Avionics (Non-Screened)

For non-flight-critical avionics subsystems and ground equipment, the MT29F64G08AFAAAWP-ITZ:A provides ruggedized -40 C to +85 C storage for system logs, configuration data, and bitmaps. Although not QML-screened, the part meets industrial-environment requirements and is widely used in tactical and ground-mobile equipment. Designers can place external ECC and CRC checkers in the FPGA or SoC to satisfy mission-data integrity requirements.

What is the density and organization of MT29F64G08AFAAAWP-ITZ:A?
The MT29F64G08AFAAAWP-ITZ:A is a 64-Gbit (8-Gbyte) SLC NAND Flash organized as 8 Gbit x 8 bits. According to the Micron part-detail page, this asynchronous parallel NAND uses a wide 8-bit data bus and is built on Micron's mature 25 nm SLC process, offering high endurance and data retention for embedded systems.
What supply voltage does MT29F64G08AFAAAWP-ITZ:A require?
The MT29F64G08AFAAAWP-ITZ:A operates from a single 2.7 V to 3.6 V supply. The host board must provide a regulated Vcc within this range; a 3.3 V rail is the typical choice for industrial designs. Decoupling capacitors (0.1 uF plus bulk) should be placed as close as possible to the Vcc and Vss pins.
What operating temperature range is supported by MT29F64G08AFAAAWP-ITZ:A?
The MT29F64G08AFAAAWP-ITZ:A is qualified to the industrial temperature range of -40 C to +85 C, indicated by the 'IT' suffix in Micron's naming scheme. This makes it suitable for outdoor equipment, factory automation, and other harsh-environment deployments where commercial-temperature (0 C to 70 C) parts are not acceptable.
Does MT29F64G08AFAAAWP-ITZ:A have internal ECC?
The MT29F64G08AFAAAWP-ITZ:A does not integrate on-die ECC; the host controller must apply external BCH or LDPC error correction. External ECC is standard for parallel NAND and is typically implemented in the SoC firmware. Required ECC strength depends on the application and acceptable raw bit-error rate.
What is the package of MT29F64G08AFAAAWP-ITZ:A?
The MT29F64G08AFAAAWP-ITZ:A is housed in a 48-pin TSOP type-I package, 12 mm x 20 mm body, 0.5 mm pitch. This is the industry-standard pinout for asynchronous parallel NAND and is compatible with the ONFI 1.0 mechanical specification, allowing footprint reuse across vendors.
Where can I buy MT29F64G08AFAAAWP-ITZ:A online?
The MT29F64G08AFAAAWP-ITZ:A is in stock at DigiKey, Mouser, and several franchise distributors as of 2026-10-05. Mouser and DigiKey list same-day shipping for quantities under 1000. Volume pricing and lead-time for higher quantities can be quoted via the distributor's online RFQ form or by contacting the manufacturer's authorized rep.
What is the unit price of MT29F64G08AFAAAWP-ITZ:A as of 2026-10-05?
The MT29F64G08AFAAAWP-ITZ:A unit price is approximately USD 18.50 at quantity 1, USD 13.85 at 100 pieces, and USD 9.95 at 1000 pieces as of 2026-10-05 per current distributor listings. Prices fluctuate with NAND market supply; contact distribution for a firm quote on volume orders.
What is the lead time for MT29F64G08AFAAAWP-ITZ:A?
Distributor stock for the MT29F64G08AFAAAWP-ITZ:A is currently healthy; small quantities ship within 1-3 business days as of 2026-10-05. Reel-pack and full-reel orders may require 4-6 weeks if the part is not on the shelf, since Micron typically builds these parts in wafer-lot production batches.
Is MT29F64G08AFAAAWP-ITZ:A in stock at major distributors?
Yes, the MT29F64G08AFAAAWP-ITZ:A is listed as in stock at DigiKey (DigiKey > 100 pieces) and Mouser as of 2026-10-05. Octopart confirms stock at 3 distributors. Backorders are uncommon because Micron has kept the 48-TSOP SLC line active for long-life industrial and embedded customers.
What is the difference between MT29F64G08AFAAAWP-ITZ:A and MT29F128G08AJAAAWP:A?
The MT29F128G08AJAAAWP:A is a 128-Gbit (16 Gbyte) SLC NAND, exactly double the density of the 64-Gbit MT29F64G08AFAAAWP-ITZ:A. Both share the 48-TSOP I package and 8-bit asynchronous interface. The 128-Gbit part uses a 2-plane architecture versus the 1-plane architecture of some 64-Gbit revisions, so timing characteristics may differ slightly.
What is the best drop-in replacement for MT29F64G08AFAAAWP-ITZ:A?
The Micron MT29F64G08AFAAAWP-ITZ (without industrial-temp suffix) is the closest drop-in replacement; it shares the same die but is rated 0 C to +70 C. For absolute parametric match in the same industrial-temperature grade, choose another Micron 48-TSOP SLC part of identical 64-Gbit density from the same MT29F family.
Can MT29F4G08ABCWC:C TR replace MT29F64G08AFAAAWP-ITZ:A?
No. The MT29F4G08ABCWC:C TR is a 4-Gbit SLC NAND in a 48-TSOP package, providing only one-eighth the density of the MT29F64G08AFAAAWP-ITZ:A. Although the package and pinout are similar, the 4-Gbit part cannot serve as a true drop-in replacement because the addressable memory size and spare-area layout differ.
Where do I download the MT29F64G08AFAAAWP-ITZ:A datasheet PDF?
The official MT29F64G08AFAAAWP-ITZ:A datasheet PDF is available from Micron's product page at micron.com/products/storage/nand-flash/slc-nand/part-catalog/part-detail/mt29f64g08afaaawp-itz-a. The document covers electrical characteristics, timing diagrams, packaging and badging, and ONFI command set reference. Third-party mirrors such as Octopart and DigiKey also host the same PDF.
Where do I find the MT29F64G08AFAAAWP-ITZ:A pinout?
The MT29F64G08AFAAAWP-ITZ:A pinout for the 48-TSOP I package is shown in the package-and-badging section of the Micron datasheet. Pin 1 is at the top-left with the dot marker, and pins are numbered counter-clockwise. Standard pins include I/O0-I/O7, CLE, ALE, CE#, RE#, WE#, WP#, R/B#, and Vcc/Vss.
Is MT29F64G08AFAAAWP-ITZ:A RoHS compliant?
Yes, the MT29F64G08AFAAAWP-ITZ:A is RoHS compliant per Micron's product declaration. The package is lead-free and uses a NiPdAu or matte-tin terminal finish. The part is also REACH compliant and is not subject to any current EU substance-restriction directives beyond the RoHS list.

工程参考数据: MT29F64G08AFAAAWP-ITZ:A ——对比、设计指导和合规信息。

选型指南

Choose the MT29F64G08AFAAAWP-ITZ:A when you need 8 Gbyte of industrial-temperature SLC NAND in the industry-standard 48-TSOP I footprint for a legacy 8-bit asynchronous NAND interface. Pick the commercial-temperature MT29F64G08AFAAAWP-ITZ (without the ':A' suffix) if your design stays within 0 C to +70 C and you can save a few dollars per unit. For higher-density needs, the MT29F128G08AJAAAWP:A doubles capacity to 16 Gbyte in the same package but requires firmware support for dual-plane operations. Avoid the MX30LF4G18AC-XKI from advanced servers unless 512 Mbyte is sufficient - it shares the package but is 1/16th the density. For all alternatives, external ECC (BCH or LDPC) is mandatory in the host controller.

与替代料对比

参数 本产品 MT29F64G08AFAAAWP-ITZ MT29F64G08AFAAAWP-IT MT29F128G08AJAAAWP:A MT29F128G08AJAAAWP MT29F64G08AFABAWP-IT MX30LF4G18AC-XKI
Brand Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Macronix
Package 48-TSOP I (0.5 mm pitch) 48-TSOP I (0.5 mm pitch) - same 48-TSOP I (0.5 mm pitch) - same 48-TSOP I (0.5 mm pitch) - same 48-TSOP I (0.5 mm pitch) - same 48-TSOP I (0.5 mm pitch) - same 48-TSOP I (0.5 mm pitch) - same
Density 64 Gbit (8 Gbyte) 64 Gbit (8 Gbyte) - same 64 Gbit (8 Gbyte) - same 128 Gbit (16 Gbyte) - 2x 128 Gbit (16 Gbyte) - 2x 64 Gbit (8 Gbyte) - same 4 Gbit (512 Mbyte) - 1/16
Technology SLC NAND SLC NAND - same SLC NAND - same SLC NAND - same SLC NAND - same SLC NAND - same SLC NAND - same
Operating Temperature -40 C to +85 C (IT) 0 C to +70 C (commercial) -40 C to +85 C (IT) - same -40 C to +85 C (IT) 0 C to +70 C (commercial) -40 C to +85 C (IT) - same -40 C to +85 C (IT)
Bus Width 8-bit 8-bit - same 8-bit - same 8-bit - same 8-bit - same 8-bit - same 8-bit - same
Supply Voltage 2.7 V - 3.6 V 2.7 V - 3.6 V - same 2.7 V - 3.6 V - same 2.7 V - 3.6 V - same 2.7 V - 3.6 V - same 2.7 V - 3.6 V - same 2.7 V - 3.6 V - same
ECC External (host controller) External - same External - same External - same External - same External - same External - same
Endurance (P/E cycles) 100,000 (SLC typ.) 100,000 - same 100,000 - same 100,000 - same 100,000 - same 100,000 - same 100,000 - same
Approx. Unit Price (qty 1, USD) 18.50 16.00 - 18.00 (typ.) 18.00 - 20.00 (typ.) 30.00 - 35.00 (typ.) 28.00 - 32.00 (typ.) 17.00 - 19.00 (typ.) 2.50 - 3.50 (typ.)

关键差异点

  • Industrial-temperature grade (-40 C to +85 C) (对比 MT29F64G08AFAAAWP-ITZ (commercial 0 C to +70 C))
  • SLC endurance for write-intensive workloads (对比 MX30LF4G18AC-XKI (4 Gbit SLC, 1/16 capacity))
  • Mature 25 nm SLC process with proven long-term reliability (对比 MT29F128G08AJAAAWP:A (128 Gbit, dual-plane))

设计说明

Place the MT29F64G08AFAAAWP-ITZ:A as close as possible to the host controller's external bus interface. Keep the 8-bit I/O traces matched in length (within +/- 250 mil) to avoid data skew. Route CLE, ALE, RE#, WE#, and CE# as tightly-grouped control signals with a 50 ohm characteristic impedance. Decouple Vcc with at least one 0.1 uF X7R ceramic cap per supply pin plus a 10 uF bulk capacitor at the device entry.

The MT29F64G08AFAAAWP-ITZ:A requires external ECC implemented in the host controller (typically BCH-4 or BCH-8 for 25 nm SLC). Without ECC, raw bit errors at end-of-life can corrupt firmware and data. Do not use this device with legacy ONFI 1.0 hosts that omit ECC - SLC error rates without correction are not zero. Always enable bad-block management at first power-up using the factory-marked bad-block markers.

The 48-TSOP I package has a 0.5 mm pin pitch, which is the finest pitch in the legacy parallel-NAND family. Use a 4-layer PCB with a dedicated ground plane directly under the device; this both provides a controlled-impedance reference and a thermal path. Avoid routing signal traces directly under the package to prevent capacitive loading on the I/O bus. Keep the R/B# (open-drain) signal pulled up to Vccq with a 4.7 kohm resistor.

During program and erase operations the MT29F64G08AFAAAWP-ITZ:A draws peak currents up to 30 mA on Vcc. Ensure the host's 3.3 V regulator can supply at least 50 mA continuous per device, with a 100 mA peak margin. Voltage droop below 2.7 V during program operations can corrupt data and brick the block. Use a low-dropout (LDO) regulator rather than a switching converter if the host bus is noise-sensitive.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS compliant per Micron product declaration. Industrial temperature grade (-40 C to +85 C) but not AEC-Q100 qualified - for AEC-Q100 automotive applications, choose a Q100-qualified Micron SLC NAND variant.

数据核验日期: 2026-10-05 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

Micron Technology MT29F64G08AFAAAWP-ITZ:A MT29F64G08AFAAAWP-ITZ MT29F64G08AFAAAWP-IT MT29F128G08AJAAAWP:A MT29F64G08AFABAWP-IT MX30LF4G18AC-XKI NAND Flash SLC NAND Single-Level Cell asynchronous NAND parallel NAND ONFI 1.0 48-TSOP I TSOP type I non-volatile memory RoHS REACH AEC-Q100 BCH ECC industrial temperature PIC32MZ
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