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Micron Technology

MT40A256M16GE-075E AAT:B - 4Gb DDR4 SDRAM 256Mx16 96-FBGA | Micron

部品番号: MT40A256M16GE-075E AAT:B ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.14 V to 1.26 V (1.2 V nominal) Vdss 96-FBGA (9 x 14 mm) Package 1.33 GHz Speed Volatile DRAM (DDR4 SDRAM) Memory
開始価格 $6.5625 USD / 個
MOQ: 1 |
価格更新日: 2026-10-14
ボリューム価格
数量 単価 小計
1 $11.25 $11.25
10 $8.125 $81.25
100 $7.1875 $718.75
500 $6.875 $3,437.50
1,000 $6.5625 $6,562.50
ℹ️ すべての価格はUSDです

MT40A256M16GE-075E AAT:B 概要

The Micron MT40A256M16GE-075E AAT:B is a 4 Gbit DDR4 SDRAM organized as 256M x 16 bits, operating at a 1.33 GHz clock frequency (DDR4-2666 speed grade, -075E timing) and housed in a 96-ball Fine-pitch Ball Grid Array (FBGA) measuring 9x14 mm. The part carries the AAT suffix designating automotive-grade qualification (AEC-Q100) and is supplied on tape and reel (TR suffix) for high-volume surface-mount assembly.

DDR4 SDRAM (Double Data Rate 4 Synchronous DRAM) is the fourth generation of DDR memory, introduced in 2014 as the successor to DDR3. It doubles the data rate per pin compared with DDR3, operates at a lower 1.2 V VDD/VDDQ supply (versus 1.5 V for DDR3), and introduces POD (Pseudo Open Drain) signalling, bank-grouping, and finer-grained refresh. DDR4 occupies the position DRAM -> volatile memory -> memory IC -> semiconductor in the component hierarchy and remains the dominant PC/server/embedded DRAM standard as of 2026, coexisting with the newer DDR5 in mainstream compute.

Key features of the MT40A256M16GE-075E AAT:B include a 1.33 GHz maximum clock rate translating to 2666 MT/s peak transfer rate, a 1.14 V to 1.26 V supply-voltage window (1.2 V nominal), and a parallel interface supporting x16 data width. The die is organized as 8 banks with bank-grouping for improved concurrency, and on-die termination (ODT) is included for signal-integrity control. Temperature-controlled refresh (TCR) is supported to lower self-refresh current at moderate temperatures. The 96-FBGA (9x14 mm) footprint follows the JEDEC-standard x16 DDR4 outline, enabling PCB layout compatibility with industry-standard 4 Gbit x16 DDR4 parts.

Architecturally, this device uses Micron's advanced 20 nm-class process node and a sub-byte-write capable 16-bit I/O. The -075E speed sort yields a tCK of 0.75 ns (1333 MHz base, 2666 MT/s effective). On-chip DLL and 1.2 V VPP support simplify board design versus legacy DDR3 platforms that need 2.5 V VPP.

Typical applications include automotive infotainment, digital instrument clusters, ADAS compute platforms, industrial embedded controllers, and ruggedized networking gear where AEC-Q100 reliability is mandated. The wide 256M x 16 organization suits frame-store, lookup-table memory, and graphics frame buffers. The AAT suffix denotes the automotive temperature grade (-40C to +105C), and the AAT:B marking indicates lead-free RoHS compliance.

A key design consideration is that this part is reported by Micron as obsolete/legacy in their part catalog (referenced May 2026); engineering teams planning new designs should evaluate MT40A256M16GE-075E-IT (industrial) or -AUT (extended automotive) suffixes, or migrate to MT40A512M16 DDR4 8 Gbit or 16 Gbit density migration paths. Signal-integrity, terminations, and VTT must follow JEDEC DDR4 layout rules.

This page synthesizes distributor pricing, drop-in alternatives (including the verified HGCHIPS HGD44G16M26 cross-vendor replacement), and engineering guidance not found in the standalone manufacturer datasheet.

ドロップイン代替品: MT40A256M16GE-075E AAT:B — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

クイック比較ツール — 並列比較する代替部品を選択:

MT40A256M16GE-075E:B

Micron Technology
DDR4 SDRAM · 4 Gbit · 256M x 16 · Parallel · 1.33 GHz · 2666 MT/s (DDR4-2666) · 1.2 V +/-60 mV · 2.5 V, -125 mV/+250 mV

✓ 在庫あり

$3.95 / 個

データシートを見る →

MT40A256M16GE-075E AIT:B

Same 96-FBGA 9x14 mm footprint, -075E speed, 4 Gbit / 256M x 16; difference is industrial grade (-40C to +85C) vs automotive grade (-40C to +105C)

📋 参考代替品(カタログ未掲載)

MT40A256M16GE-075E AUT:B

Same 96-FBGA 9x14 mm footprint, -075E speed, 4 Gbit / 256M x 16; AUT denotes higher AEC-Q100 grade-1 screening for ADAS

📋 参考代替品(カタログ未掲載)

MT40A256M16GE-075E-IT

Same die and 96-FBGA 9x14 mm footprint, industrial temperature grade (no AEC-Q100 screening)

📋 参考代替品(カタログ未掲載)

MT40A256M16GE-083E AIT:B

Same 96-FBGA 9x14 mm footprint and 4 Gbit density; -083E speed grade is slower (DDR4-2400 vs DDR4-2666), ~10% throughput reduction

📋 参考代替品(カタログ未掲載)

HGD44G16M26

Same 96-FBGA 9x14 mm footprint, ball map and function verified item-by-item per HGCHIPS; second-source to MT40A256M16GE-075E

📋 参考代替品(カタログ未掲載)

MT40A256M16GE-075E AAT:B 最大定格&電気的特性

メモリタイプ Volatile DRAM (DDR4 SDRAM)
メモリサイズ 4 Gbit
Memory Organization 256M x 16
インターフェース Parallel
最大クロック周波数 1.33 GHz
データレート DDR4-2666 MT/s
Speed Grade -075E (tCK 0.75 ns)
Access Time 19 ns
Write Cycle Time (Word/Page) 15 ns
Supply Voltage (VDD/VDDQV) 1.14 V to 1.26 V (1.2 V nominal)
パッケージ 96-FBGA (9 x 14 mm)
実装タイプ Surface Mount
Automotive Grade (AAT suffix) AEC-Q100 qualified
動作温度 -40C to +105C (AAT automotive grade)
RoHS / Lead-Free Status Compliant (lead-free, AAT:B)
Packaging Tape & Reel (TR)
Bank Organization 8 banks (with bank-grouping)
On-Die Termination (ODT) Supported
Temperature Controlled Refresh (TCR) Supported

MT40A256M16GE-075E AAT:B 96-fbga (9 x 14 mm) ピン配置ガイド

MT40A256M16GE-075E AAT:B (96-fbga (9 x 14 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

MT40A256M16GE-075E AAT:B の 96-fbga (9 x 14 mm) パッケージピン配置図

詳細なピン配置データはありません: MT40A256M16GE-075E AAT:B.

詳細は データシート をご参照ください。

主な用途

MT40A256M16GE-075E AAT:B の用途: 7 件s: Automotive Infotainment System Memory, Digital Instrument Cluster Memory, ADAS Domain Controller Memory, Industrial Embedded Controller Memory, Networking and Telecommunications Equipment, Medical Imaging and Diagnostic Equipment, Ruggedized Server and Storage Memory.

🚗

Automotive Infotainment System Memory

The MT40A256M16GE-075E AAT:B serves as main DRAM for automotive infotainment head units, where 4 Gbit capacity and 2666 MT/s bandwidth handle HMI graphics, navigation maps, and audio/video buffering. Its AEC-Q100 AAT qualification (-40C to +105C) is required for cabin-mounted modules that experience wide thermal swings. The 256M x 16 organization provides 512 MB, sufficient for entry-level infotainment OS images. Compared with LPDDR4, DDR4 x16 offers lower per-bit cost at moderate bandwidth.

📺

Digital Instrument Cluster Memory

The MT40A256M16GE-075E AAT:B is well-matched to digital instrument cluster designs that need AEC-Q100 reliability and a moderate 512 MB frame buffer for rendering gauges, HUD projections, and 2D/3D graphics. Its 2666 MT/s bandwidth comfortably handles dual-display cluster rendering at 60-120 Hz refresh. The 96-FBGA 9x14 mm footprint simplifies PCB routing alongside the cluster SoC, and its 1.2 V operation keeps power dissipation within automotive thermal budgets of 5-7W per module.

✈️

ADAS Domain Controller Memory

The MT40A256M16GE-075E AAT:B provides 512 MB of DDR4 storage for ADAS domain controllers handling sensor-fusion data, where AEC-Q100 AAT grade supports cabin-edge thermal environments. Its 16-bit-wide parallel interface simplifies layout versus x8/x32 parts, and the 1.33 GHz clock delivers the throughput required for radar pre-processing buffers. Engineers should note that newer ADAS designs typically require 8-16 Gbit densities, so this part suits legacy ADAS only.

🏭

Industrial Embedded Controller Memory

The MT40A256M16GE-075E AAT:B is well-suited to industrial PCs, edge gateways, and HMI controllers requiring automotive-grade reliability in factory environments. Its wide 1.14-1.26 V supply tolerance enables robust operation across noisy industrial rails, while the 2666 MT/s data rate handles machine-vision frame buffering and PLC scan cycles. Although marked obsolete by Micron in 2026, it remains popular for sustaining legacy industrial platforms where redesign is impractical.

🌐

Networking and Telecommunications Equipment

The MT40A256M16GE-075E AAT:B serves as packet-buffer memory in ruggedized routers, switches, and base-station controllers where AEC-Q100 reliability is mandated for outdoor or vehicular deployments. The x16 organization provides an optimal match for 64-bit datapath designs using four parts in parallel, and the 2666 MT/s throughput handles 10 GbE line-rate buffering. The AAT temperature range suits outdoor cabinet installations facing wide daily thermal swings.

💊

Medical Imaging and Diagnostic Equipment

The MT40A256M16GE-075E AAT:B suits regulated medical devices such as portable ultrasound, patient monitors, and imaging carts where AEC-Q100 automotive reliability translates to long-term field-proven quality. Its 512 MB capacity stores ultrasound frame buffers and patient-record databases, while 2666 MT/s bandwidth handles real-time B-mode imaging at 30 fps. Note: medical-grade certification requires separate IEC 60601 qualification beyond AEC-Q100; verify full system compliance.

🖥️

Ruggedized Server and Storage Memory

The MT40A256M16GE-075E AAT:B is used in ruggedized servers and storage appliances deployed in defense, transportation, and energy markets where wide-temperature, high-reliability DRAM is required. Its 4 Gbit density supports 16 GB DIMMs using 36 parts per rank group. The 96-FBGA 9x14 mm footprint integrates cleanly with standard server DIMM PCB layouts, and its 1.2 V operation minimizes power per GB versus older DDR3 parts.

おすすめ製品の概要

NXP i.MX 8 Application processor pairing for automotive infotainment 使用用途: Automotive Infotainment System Memory Renesas R-Car SoC used in cluster/infotainment requiring DDR4 memory 使用用途: Automotive Infotainment System Memory NXP S32K3 Automotive MCU pairing 使用用途: Digital Instrument Cluster Memory TI Jacinto Cluster/display SoC partner 使用用途: Digital Instrument Cluster Memory NXP S32V Vision/ADAS processor pairing 使用用途: ADAS Domain Controller Memory TI TDA4VM ADAS SoC with DDR4 interface 使用用途: ADAS Domain Controller Memory NXP i.MX 8M Industrial application processor 使用用途: Industrial Embedded Controller Memory TI Sitara Industrial SoC pairing 使用用途: Industrial Embedded Controller Memory NXP Layerscape Networking SoC pairing 使用用途: Networking and Telecommunications Equipment Broadcom StrataXGS Switch ASIC requiring DDR4 使用用途: Networking and Telecommunications Equipment TI Sitara AM57x Medical imaging processor 使用用途: Medical Imaging and Diagnostic Equipment NXP i.MX 8M Plus Medical edge-compute SoC 使用用途: Medical Imaging and Diagnostic Equipment Intel Xeon D Ruggedized server CPU pairing 使用用途: Ruggedized Server and Storage Memory AMD EPYC Embedded Embedded server processor 使用用途: Ruggedized Server and Storage Memory
What is the MT40A256M16GE-075E AAT:B?
The MT40A256M16GE-075E AAT:B is a Micron 4 Gbit DDR4 SDRAM organized 256M x 16 in a 96-ball FBGA (9x14 mm) package. According to Micron's part catalog, the AAT suffix denotes AEC-Q100 automotive qualification and the -075E speed grade yields a 1.33 GHz clock (DDR4-2666). It is supplied on tape and reel and is reported as a legacy/obsolete part by Micron.
What is the operating voltage of MT40A256M16GE-075E AAT:B?
The MT40A256M16GE-075E AAT:B operates from 1.14 V to 1.26 V (1.2 V nominal) on VDD/VDDQ, consistent with JEDEC DDR4 specifications. Micron's datasheet also requires a 2.5 V VPP supply for word-line activation. Operating outside this 1.14-1.26 V window risks data corruption or device damage.
What is the data rate of MT40A256M16GE-075E AAT:B?
The MT40A256M16GE-075E AAT:B delivers DDR4-2666 MT/s, equivalent to a peak transfer rate of 21.3 GB/s per byte lane. According to Micron's datasheet, the -075E speed sort specifies a tCK of 0.75 ns (1333 MHz base clock, doubled by DDR sampling). Real-world throughput depends on bus width (x16) and command overhead.
Where can I buy MT40A256M16GE-075E AAT:B online?
As of 2026-10-05, MT40A256M16GE-075E AAT:B stock is reported by distributors including DigiKey, Mouser, Octopart-listed channels, Win-Source, Avaq, and Microchip USA. Pricing for 1-piece is around $8.45 USD; bulk discounts reach ~$5.20 USD at 1000 pieces. Since Micron lists this part as obsolete, verify availability and consider AEC-Q100 equivalents such as MT40A256M16GE-075E AIT or -AUT suffixes.
What is the lead time for MT40A256M16GE-075E AAT:B?
Lead time for MT40A256M16GE-075E AAT:B varies by distributor and date. As of 2026-10-05, DigiKey indicates ships-today on certain rows of the same digital component (the -B variant), but the AAT:B automotive-tape variant may carry 6-12 week lead time or require quote-only ordering due to Micron's obsolete listing. Contact your franchised distributor for current schedules.
Is MT40A256M16GE-075E AAT:B still in production?
Micron's part catalog (referenced May 2026) marks the MT40A256M16GE-075E AAT:B under the obsolete DDR5-SDRAM list (per Micron's in.micron.com obsolete catalog). Last-time-buy windows have closed; remaining supply is limited to distributor inventory and aftermarket. New designs should target MT40A512M16 8 Gbit or migrate to DDR5.
What is the difference between MT40A256M16GE-075E AAT:B and MT40A256M16GE-075E AIT:B?
The MT40A256M16GE-075E AAT:B (AEC-Q100 automotive grade) and MT40A256M16GE-075E AIT:B (industrial grade) share identical speed grade (-075E, DDR4-2666), density (4 Gbit), package (96-FBGA 9x14 mm), and pinout. The differences are temperature range and qualification: AAT targets -40C to +105C automotive, while AIT targets -40C to +85C industrial. Both are obsolete.
What is the difference between MT40A256M16GE-075E AAT:B and MT40A256M16GE-075E AUT:B?
AUT denotes Micron's higher-tier automotive qualification for ADAS and engine-compartment exposure; AAT denotes standard automotive infotainment/cluster grade. Both MT40A256M16GE-075E AAT:B and -AUT:B share the same 96-FBGA 9x14 mm package, pinout, and 4 Gbit / 256M x 16 organization. The AUT variant extends to higher temperature and includes tighter AEC-Q100 grade-1 screening.
What is the best drop-in replacement for MT40A256M16GE-075E AAT:B?
The best drop-in replacement is HGCHIPS HGD44G16M26, which HGCHIPS confirms is pin-to-pin compatible with MT40A256M16GE-075E in the 96-FBGA 9x14 mm package, with verified ball map and item-by-item functional equivalence. As a Micron second-source, it ships with per-lot test reports. Within Micron's own catalog, MT40A256M16GE-075E AIT:B and -AUT:B share the same footprint.
Where can I download the MT40A256M16GE-075E AAT:B datasheet PDF?
The MT40A256M16GE-075E AAT:B datasheet is available from Micron's part-detail page at https://www.micron.com/products/memory/dram-components/ddr4-sdram/part-catalog/part-detail/mt40a256m16ge-075e-aat. The automotive-grade datasheet is also archived on alldatasheet.com (928169) and datasheets.com. The PDF includes speed-bin tables, AC timing, and FBGA ball-out.
Where can I find the MT40A256M16GE-075E AAT:B pinout?
The MT40A256M16GE-075E AAT:B pinout follows the JEDEC-standard 96-ball FBGA (9x14 mm) x16 DDR4 ball map, documented on page 1 of the Micron datasheet. Standard signal assignments include CK/CK# at ball F7/G8, A0-A15 across the address balls, and DQ0-DQ15 on the data balls. The full ball map is reproduced on Micron's part-detail page.
What is the package of MT40A256M16GE-075E AAT:B?
The MT40A256M16GE-075E AAT:B is housed in a 96-ball Fine-pitch BGA measuring 9 mm x 14 mm, conforming to the JEDEC-standard x16 DDR4 SDRAM outline. The package uses lead-free (RoHS-compliant) solder balls and supports surface-mount assembly. Tape-and-reel packaging is denoted by the TR suffix; tray packing is the alternate option.
Is MT40A256M16GE-075E AAT:B suitable for automotive applications?
Yes, the MT40A256M16GE-075E AAT:B is AEC-Q100 qualified by Micron for automotive applications, including infotainment, digital instrument clusters, telematics, and ADAS compute platforms. The AAT suffix specifically targets the automotive temperature range of -40C to +105C. Note that Micron lists this part as obsolete in 2026, so production programs should consider -AUT or DDR5 migration paths.
When should I choose MT40A256M16GE-075E AAT:B over a DDR5 alternative?
Choose the MT40A256M16GE-075E AAT:B over a DDR5 alternative when the host SoC only supports DDR4, when re-spinning a mature DDR4 design is not cost-effective, or when sourcing aftermarket inventory for an in-production automotive platform. Per Micron's May 2026 obsolete listing, this part should NOT be chosen for new designs; engineers should evaluate DDR5 alternatives.

エンジニアリング参考データ: MT40A256M16GE-075E AAT:B — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MT40A256M16GE-075E AAT:B for sustaining production automotive platforms that already validated this part - especially when re-spinning the SoC or board layout is impractical. For new designs targeting automotive infotainment, cluster, or ADAS, prefer MT40A256M16GE-075E AUT:B for higher AEC-Q100 grade-1 screening, or migrate to MT40A512M16 8 Gbit or DDR5. For non-automotive industrial applications, switch to MT40A256M16GE-075E AIT:B to avoid unnecessary automotive-grade cost. The HGCHIPS HGD44G16M26 cross-vendor option is the safest sourcing hedge for production sustaining programs after Micron's 2026 obsolete listing.

代替品との比較

パラメータ この製品 MT40A256M16GE-075E AIT MT40A256M16GE-075E AUT MT40A256M16GE-075E-IT MT40A256M16GE-075E MT40A256M16GE-083E AIT HGD44G16M26
Brand Micron Technology B: Micron Technology B: Micron Technology Micron Technology B: Micron Technology B: Micron Technology HGCHIPS
Package 96-FBGA (9x14 mm) B: 96-FBGA (9x14 mm) - same B: 96-FBGA (9x14 mm) - same 96-FBGA (9x14 mm) - same B: 96-FBGA (9x14 mm) - same B: 96-FBGA (9x14 mm) - same 96-FBGA (9x14 mm) - same
Memory Size 4 Gbit B: 4 Gbit B: 4 Gbit 4 Gbit B: 4 Gbit B: 4 Gbit 4 Gbit
Memory Organization 256M x 16 B: 256M x 16 B: 256M x 16 256M x 16 B: 256M x 16 B: 256M x 16 256M x 16
Speed Grade / Data Rate -075E / DDR4-2666 B: -075E / DDR4-2666 B: -075E / DDR4-2666 -075E / DDR4-2666 B: -075E / DDR4-2666 B: -083E / DDR4-2400 (slower) DDR4-2666 equivalent
Temperature Grade AAT (AEC-Q100, -40C to +105C) B: AIT (industrial -40C to +85C) B: AUT (AEC-Q100 grade-1) IT (industrial) B: Commercial grade B: AIT (industrial) Industrial equivalent
AEC-Q100 Qualified Yes (AAT grade) B: No (industrial) B: Yes (AUT grade-1) No B: No B: No Per HGCHIPS datasheet
Lifecycle Status (per Micron 2026 catalog) Obsolete (AAT:B) B: Obsolete B: Obsolete Obsolete B: Obsolete B: Obsolete Active (HGCHIPS)

主な差別化要因

  • Verified cross-vendor drop-in replacement available (vs HGD44G16M26)
  • AEC-Q100 AAT automotive qualification built-in (vs MT40A256M16GE-075E:B)
  • DDR4-2666 speed grade (highest in 4 Gbit x16 family) (vs MT40A256M16GE-083E AIT:B)

設計ノート

Per JEDEC DDR4 layout guidelines, route the 96-FBGA (9x14 mm) ball-out with matched-impedance traces for CK/CK#, address/command, and DQ groups. Place VTT termination resistors within 200 mils of the DRAM balls. Use 100 ohm differential impedance for CK/CK# and 50 ohm single-ended for data/address. Maintain length matching within +/- 25 mils for byte-lane DQs. Failure to follow these rules will cause timing violations at DDR4-2666 speeds.

The MT40A256M16GE-075E AAT:B requires three supplies: VDD/VDDQ at 1.14-1.26 V (1.2 V nominal), VPP at 2.5 V, and VDDSPD for the optional serial presence detect EEPROM. Decouple each supply at the DRAM side with a 100 nF ceramic plus a 10 uF bulk capacitor, placed within 100 mils of the balls. Estimated: average IDD active current at DDR4-2666 is ~70 mA per device, so total per-rank power is ~85 mW.

Even though DRAM dissipates relatively low power per device, AEC-Q100 AAT applications must verify junction temperature stays below +105C ambient plus thermal rise. Estimated: 1-piece power is ~85 mW; placing the FBGA over a continuous ground plane provides theta-JA ~30 C/W, well within margin. If two ranks are stacked, monitor with on-die temperature sensor (TS feature) and throttle if reading exceeds 95C.

DDR4 requires on-die termination (ODT) to be enabled for proper signal integrity. Configure the SoC memory controller to use RZQ-based ODT values (typically 240 or 120 ohms) on data, strobe, and mask signals. Enable Write Leveling, Read Calibration, and Gate Training during controller initialization. Failure to run DDR4 training will cause eye-margin violations and intermittent read/write errors, particularly at the 2666 MT/s data rate.

Common pitfalls include omitting VPP decoupling (causes word-line failures during refresh), mis-programming the speed-bin register (causes tCK violations), and using non-AEC-Q100 parts in automotive modules (fails PPAP). Since Micron marks the AAT:B part obsolete in 2026, ensure last-time-buy inventory or migrate to MT40A512M16 8 Gbit or DDR5. Verify ZQ calibration and periodic read training for long-term margin retention.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
鉛フリー
ハロゲンフリー
Unknown
紛争鉱物
Compliant

AAT suffix denotes AEC-Q100 automotive qualification per Micron's part-catalog page. AAT:B marking confirms lead-free RoHS compliance. Halogen-free confirmation not present in verified web data - mark unknown.

データ検証日: 2026-10-05 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MT40A256M16GE-075E AAT:B datasheet MT40A256M16GE-075E AAT:B price Micron 4Gb DDR4 256Mx16 automotive DDR4-2666 96-FBGA 9x14 mm AEC-Q100 MT40A256M16GE-075E AAT:B equivalent MT40A256M16GE-075E AAT:B replacement MT40A256M16GE-075E AAT:B vs AIT:B Micron DDR4 SDRAM automotive infotainment HGD44G16M26 drop-in replacement MT40A256M16GE-075E AAT:B in stock MT40A256M16GE-075E AAT:B obsolete buy MT40A256M16GE-075E AAT:B online DDR4 4Gb x16 96-ball FBGA JEDEC Micron DDR4 AEC-Q100 memory what is the data rate of MT40A256M16GE-075E

関連部品&用語

Micron Technology MT40A256M16GE-075E AAT:B MT40A256M16GE-075E AIT:B MT40A256M16GE-075E AUT:B MT40A256M16GE-075E-IT MT40A256M16GE-075E:B HGD44G16M26 HGCHIPS DDR4 SDRAM DRAM volatile memory memory IC FBGA BGA JEDEC AEC-Q100 RoHS DDR4-2666 automotive infotainment digital instrument cluster ADAS on-die termination bank group pseudo open drain temperature controlled refresh
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