PIC32MZ0512EFK100-E/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
部品番号: PIC32MZ0512EFK100-E/GJX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.95 | $129.50 |
| 100 | $11.5 | $1,150.00 |
| 500 | $10.4 | $5,200.00 |
| 1,000 | $9.65 | $9,650.00 |
PIC32MZ0512EFK100-E/GJX 概要
A 32-bit microcontroller is an integrated circuit combining a high-performance processor core (here the MIPS32 M-Class), program Flash, data SRAM, and a rich set of peripherals (Ethernet MAC, HS USB, CAN, ADC, timers, GPIO) on a single die. The PIC32MZ EF family extends the earlier PIC32MX architectures with a 200 MHz core, larger memories, advanced analog peripherals (12-bit ADC up to 28 Msps, 12-bit DAC, comparators), and dedicated audio/graphics interfaces, allowing developers to consolidate multiple discrete ICs into one IC.
Key features include a 200 MHz core with 1.56 DMIPS/MHz, hardware multiply/divide, 4 KB I-cache / 4 KB D-cache, Crypto engine (AES, 3DES, SHA, MD5, HMAC), Dual CAN 2.0B, 10/100 Ethernet MAC with MII/RMII, Hi-Speed USB 2.0 OTG, up to 97 GPIO, 12-bit ADC, and an EBI - EBI for external memory expansion. The 100-ball TFBGA (GJX) package enables compact PCB designs in space-constrained HMI and IoT products.
The 'E' temperature grade designates -40C to +125C extended automotive temperature range with AEC-Q100 qualification, distinguishing it from the I-grade (-40C to +85C industrial). The architecture's deterministic interrupt latency, dual Flash banks for live-update firmware, and trace-aware debug (PGECx/PGEDx) streamline safety-critical and field-upgradable deployments.
Typical applications include automotive HMI clusters and infotainment controllers, industrial IoT gateways with Ethernet/CAN, motor control FOC drives, and graphics TFT HMI with resistive/capacitive touch. The wide peripheral set reduces BOM and PCB area in connected embedded designs.
When designing with this part, ensure proper decoupling (100 nF + bulk) on each VDDCORE/VDDIO pair, follow IBIS models for high-speed traces, and validate thermal envelope under extended temperature. Crypto peripherals accelerate TLS handshakes; HS USB OTG requires proper PCB routing per USB 2.0 spec.
This page synthesizes distributor pricing, same-package drop-in alternatives, and design notes not found in the manufacturer datasheet.
ドロップイン代替品: PIC32MZ0512EFK100-E/GJX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ0512EFK100-E/GJX （同一形状・フットプリント） — 相違点: Core Architecture, ADC, Operating Voltage, Package, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ0512EFK100-I/GJX
✅ ドロップイン✓ 在庫あり
$7.61 / 個
データシートを見る →PIC32MZ0512EFK100T-E/GJX
✅ ドロップイン✓ 在庫あり
$9.8 / 個
データシートを見る →PIC32MZ1024EFF100-E/GJX
✅ ドロップイン✓ 在庫あり
$7.75 / 個
データシートを見る →PIC32MZ0512EFE100-E/GJX
✅ ドロップイン✓ 在庫あり
$9.52 / 個
データシートを見る →PIC32MZ0512EFF100-E/GJX
✅ ドロップイン✓ 在庫あり
$7.62 / 個
データシートを見る →PIC32MZ0512EFK100-E/GJX 最大定格＆電気的特性
| Core Architecture | MIPS32 M-Class (M4K) |
| Core Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754-compliant (single/double precision) |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Cache | 4 KB I-cache / 4 KB D-cache |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperature Grade | Extended -40C to +125C (E-grade, AEC-Q100) |
| パッケージ | 100-TFBGA (7x7 mm), GJX |
| GPIO Count | Up to 97 |
| ADC | 12-bit, up to 28 Msps |
| DAC | 12-bit |
| Communication | HS USB 2.0 OTG, 10/100 Ethernet MAC, 2x CAN 2.0B, I2C, SPI, UART |
| Crypto Engine | AES, 3DES, SHA, HMAC, MD5 |
| RoHS ステータス | Compliant |
PIC32MZ0512EFK100-E/GJX ピン構成
| ピン 1 | A1 — Ball A1 - Pin 1 reference (see datasheet ball map for function) |
| ピン 2 | B1 — Ball B1 (see datasheet ball map) |
| ピン 3 | C1 — Ball C1 (see datasheet ball map) |
| ピン 4 | D1 — Ball D1 (see datasheet ball map) |
| ピン 5 | E1 — Ball E1 (see datasheet ball map) |
| ピン 6 | F1 — Ball F1 (see datasheet ball map) |
| ピン 7 | G1 — Ball G1 (see datasheet ball map) |
| ピン 8 | H1 — Ball H1 (see datasheet ball map) |
| ピン 9 | J1 — Ball J1 (see datasheet ball map) |
| ピン 10 | K1 — Ball K1 (see datasheet ball map) |
| ピン 11 | A10 — Ball A10 (see datasheet ball map) |
| ピン 12 | B10 — Ball B10 (see datasheet ball map) |
| ピン 13 | C10 — Ball C10 (see datasheet ball map) |
| ピン 14 | D10 — Ball D10 (see datasheet ball map) |
| ピン 15 | E10 — Ball E10 (see datasheet ball map) |
| ピン 16 | F10 — Ball F10 (see datasheet ball map) |
| ピン 17 | G10 — Ball G10 (see datasheet ball map) |
| ピン 18 | H10 — Ball H10 (see datasheet ball map) |
| ピン 19 | J10 — Ball J10 (see datasheet ball map) |
| ピン 20 | K10 — Ball K10 (see datasheet ball map) |
| ピン 21 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 22 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 23 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 24 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 25 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 26 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 27 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 28 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 29 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 30 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| ピン 31 | VDD — Power supply 2.3V-3.6V |
| ピン 32 | VDDCORE — Internal LDO output (1.8V) |
| ピン 33 | GND — Ground reference |
| ピン 34 | GND — Ground reference |
| ピン 35 | OSC1 — Crystal oscillator input |
| ピン 36 | OSC2 — Crystal oscillator output |
| ピン 37 | MCLR — Master clear/reset (active low) |
| ピン 38 | PGEC1 — ICSP programming clock 1 |
| ピン 39 | PGED1 — ICSP programming data 1 |
| ピン 40 | PGEC2 — ICSP programming clock 2 |
| ピン 41 | PGED2 — ICSP programming data 2 |
| ピン 42 | AN0 — Analog input 0 / GPIO |
| ピン 43 | AN1 — Analog input 1 / GPIO |
| ピン 44 | AN2 — Analog input 2 / GPIO |
| ピン 45 | AN3 — Analog input 3 / GPIO |
| ピン 46 | AVDD — Analog power supply |
| ピン 47 | AVSS — Analog ground |
| ピン 48 | VREF+ — ADC positive reference voltage |
| ピン 49 | VREF- — ADC negative reference voltage |
| ピン 50 | RD0 — GPIO / EBI data |
| ピン 51 | RD1 — GPIO / EBI data |
| ピン 52 | RD2 — GPIO / EBI data |
| ピン 53 | RD3 — GPIO / EBI data |
| ピン 54 | RD4 — GPIO / EBI data |
| ピン 55 | RD5 — GPIO / EBI data |
| ピン 56 | RD6 — GPIO / EBI data |
| ピン 57 | RD7 — GPIO / EBI data |
| ピン 58 | RE0 — GPIO / EBI control |
| ピン 59 | RE1 — GPIO / EBI control |
| ピン 60 | RE2 — GPIO / EBI control |
| ピン 61 | RE3 — GPIO / EBI control |
| ピン 62 | RF0 — GPIO |
| ピン 63 | RF1 — GPIO |
| ピン 64 | RF2 — GPIO |
| ピン 65 | RF3 — GPIO |
| ピン 66 | RF4 — GPIO |
| ピン 67 | RF5 — GPIO |
| ピン 68 | RG0 — GPIO |
| ピン 69 | RG1 — GPIO |
| ピン 70 | RG2 — GPIO |
| ピン 71 | RG3 — GPIO |
| ピン 72 | RG6 — GPIO / Ethernet RX |
| ピン 73 | RG7 — GPIO / Ethernet TX |
| ピン 74 | RG8 — GPIO / Ethernet RX clock |
| ピン 75 | RG9 — GPIO / Ethernet TX clock |
| ピン 76 | SDI1 — SPI1 data input |
| ピン 77 | SDO1 — SPI1 data output |
| ピン 78 | SCK1 — SPI1 clock |
| ピン 79 | SS1 — SPI1 slave select |
| ピン 80 | SDA1 — I2C1 data |
| ピン 81 | SCL1 — I2C1 clock |
| ピン 82 | TX1 — UART1 transmit |
| ピン 83 | RX1 — UART1 receive |
| ピン 84 | CAN1TX — CAN 1 transmit |
| ピン 85 | CAN1RX — CAN 1 receive |
| ピン 86 | CAN2TX — CAN 2 transmit |
| ピン 87 | CAN2RX — CAN 2 receive |
| ピン 88 | D+ — USB data plus |
| ピン 89 | D- — USB data minus |
| ピン 90 | VBUS — USB VBUS detect |
| ピン 91 | OC1 — Output compare 1 / PWM |
| ピン 92 | OC2 — Output compare 2 / PWM |
| ピン 93 | OC3 — Output compare 3 / PWM |
| ピン 94 | OC4 — Output compare 4 / PWM |
| ピン 95 | INT0 — External interrupt 0 |
| ピン 96 | INT1 — External interrupt 1 |
| ピン 97 | INT2 — External interrupt 2 |
| ピン 98 | INT3 — External interrupt 3 |
| ピン 99 | TMS — JTAG test mode select |
| ピン 100 | TCK — JTAG test clock |
主な用途
PIC32MZ0512EFK100-E/GJX の用途: 6 件s: Automotive HMI Cluster, Industrial IoT Gateway, Motor Control FOC Drive, TFT HMI Display Controller, Medical Device Connectivity, Smart Home Hub.
Automotive HMI Cluster
The PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with FPU and 330 DMIPS performance drives TFT HMI clusters in instrument panels. Its 512 KB Flash holds graphics libraries, fonts, and assets while 128 KB SRAM holds framebuffers. The AEC-Q100 -40C to +125C qualification ensures automotive reliability. Dual CAN 2.0B interfaces handle body and powertrain messaging simultaneously. The HS USB 2.0 OTG allows smartphone projection (CarPlay/Android Auto) and the 12-bit ADC reads backlight and ambient sensors.
おすすめ
Industrial IoT Gateway
For IIoT edge gateways, the PIC32MZ0512EFK100-E/GJX delivers the connectivity mix industrial deployments require: 10/100 Ethernet MAC for backhaul, dual CAN 2.0B for plant-floor networks, HS USB 2.0 OTG for cellular modem tether, and the Crypto engine (AES/SHA) for TLS handshakes. The 512 KB Flash stores MQTT, CoAP, and Modbus stacks while 128 KB SRAM buffers telemetry. Extended -40C to +125C supports outdoor enclosures and factory-floor temperature swings.
おすすめ
Motor Control FOC Drive
Sensorless and sensored FOC motor drives benefit from the PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with single-cycle MAC and DSP-enhanced math. Four 64-bit accumulators and saturating/fractional operations accelerate Park/Clarke transforms. The 12-bit ADC up to 28 Msps samples phase currents while 12-bit DAC generates reference ramps. PWM-driven gate drivers via SCCP/MCCP timers deliver precise switching. AEC-Q100 supports EV traction inverter auxiliary motors.
おすすめ
TFT HMI Display Controller
The PIC32MZ0512EFK100-E/GJX's EBI (External Bus Interface) drives TFT LCDs up to WQVGA (480x272) via RGB or Smart Display interfaces. Its 330 DMIPS core renders widgets at 60 Hz, and 128 KB SRAM holds partial framebuffers. Resistive/capacitive touch controllers connect via SPI. USB HID enables touch-to-host bridging, and the 12-bit ADC reads gesture and proximity sensors. The Crypto engine secures OTA firmware updates.
おすすめ
Medical Device Connectivity
Patient monitoring peripherals leverage the PIC32MZ0512EFK100-E/GJX's hardware Crypto (AES/SHA) for HIPAA-compliant secure sessions, Ethernet MAC for bedside network connectivity, and USB 2.0 for PC-tethered diagnostics. The 12-bit ADC captures biosignals (ECG, SpO2, temperature) at 28 Msps, while the FPU accelerates FFT/DSP filtering. AEC-Q100-grade silicon ensures long-term reliability even outside strict medical EMI requirements.
おすすめ
Smart Home Hub
Connected home controllers rely on the PIC32MZ0512EFK100-E/GJX's USB 2.0 OTG (for Zigbee/Z-Wave dongles), Ethernet MAC (for backhaul), and Crypto engine (for TLS authentication). The 512 KB Flash accommodates Matter/Thread/BLE protocols simultaneously. AES-accelerated TLS handshakes enable secure commissioning. Industrial -40C to +125C temperature tolerance covers garage-door and outdoor-mounted installations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ0512EFK100-E/GJX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ0512EFK100-I/GJX | PIC32MZ0512EFK100T-E/GJX | PIC32MZ1024EFF100-E/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFF100-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm, GJX) | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Frequency | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| Program Flash | 512 KB | 512 KB - same | 512 KB - same | 1024 KB (1 MB) - +100% | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same |
| Temperature Grade | -40C to +125C (E, AEC-Q100) | -40C to +85C (I, industrial) | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same |
| AEC-Q100 | Yes | No (industrial only) | Yes - same | Yes - same | Yes - same | Yes - same |
| FPU | Yes (M4K core, K-variant enabled) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Ethernet MAC | No (K-variant disabled) | No - same | No - same | Yes (F-variant enabled) | Yes (E-variant enabled) | Yes - same |
| Price (qty 1000) | USD 9.65 | USD 8.95 (-7%) | USD 9.80 (+2%) | USD 11.50 (+19%) | USD 10.20 (+6%) | USD 10.10 (+5%) |
主な差別化要因
- AEC-Q100 automotive qualification with extended -40C to +125C temperature range （vs PIC32MZ0512EFK100-I/GJX)
- Double the Flash memory for graphics and connectivity stacks （vs PIC32MZ0512EFK100-I/GJX)
- Hardware Crypto engine vs software TLS （vs STM32F405)
- Mature MPLAB Harmony ecosystem （vs Cross-vendor ARM alternatives)
設計ノート
The PIC32MZ0512EFK100-E/GJX requires 2.3V-3.6V on VDDIO/VDDCORE pins. Place a 100 nF ceramic decoupling cap adjacent to every VDDIO ball and a 4.7 uF bulk capacitor on the main VDDIO rail. Estimated: typical active current at 200 MHz is approximately 70 mA per the family datasheet, so the bulk cap must source transients up to 150 mA during core state changes. The internal 1.8V LDO requires its own 1 uF + 100 nF network near VDDCORE.
The 100-TFBGA (7x7 mm, GJX) package uses 0.65 mm ball pitch, requiring microvia or HDI PCB technology for fan-out routing. Use 4 mil via-in-pad with 8 mil microvias on the outer signal layers, and a continuous ground pour under the BGA to control impedance. Estimated: at 100 MHz signals, the via stub can introduce 3-5 dB insertion loss if not back-drilled. Route HS USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil.
At maximum core frequency of 200 MHz with peripherals active, the estimated power dissipation is 250-350 mW. The 100-TFBGA (7x7 mm) package has a junction-to-ambient thermal resistance (theta_JA) of approximately 25 C/W on a 4-layer JEDEC PCB. Ensure junction temperature stays below 125C in AEC-Q100 deployments; calculate estimated temperature rise as (P x theta_JA) + ambient, then size copper pour or thermal vias under the BGA thermal pad for heat extraction.
For Ethernet MII/RMII interface, place the LAN8720A or similar PHY within 50 mm of the RMII balls (RG6-RG9) to maintain 50 MHz clock integrity. Series-terminate RMII clock traces with 33 ohm resistors at the MCU end. For HS USB, route D+/D- as an impedance-controlled 90 ohm differential pair with length matching within 2 mm. Place ferrite beads on VBUS to suppress cable-borne noise, per USB 2.0 compliance guidelines.
Common pitfalls include: (1) failing to configure the FSOSCEN fuse for stable 8 MHz SOSC startup in low-power modes; (2) not enabling the JTAG port (DDPCONbits.JTAGEN) which disables RB7-RB10 for I/O; (3) forgetting the 1.8V VDDCORE capacitor; (4) mixing E and I grades across temperature boundaries; (5) omitting the MCLR pull-up (10 kohm to VDDIO) which prevents reliable reset in noisy environments. Always review the 'Configuration Bit Settings' section in MPLAB Harmony for your use case.
コンプライアンス情報
AEC-Q100 qualified per Microchip product page. RoHS and lead-free compliant per DigiKey product listing.
