PIC32MZ0512EFK100-E/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
Référence : PIC32MZ0512EFK100-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.95 | $129,50 |
| 100 | $11.5 | $1 150,00 |
| 500 | $10.4 | $5 200,00 |
| 1 000 | $9.65 | $9 650,00 |
PIC32MZ0512EFK100-E/GJX Présentation
A 32-bit microcontroller is an integrated circuit combining a high-performance processor core (here the MIPS32 M-Class), program Flash, data SRAM, and a rich set of peripherals (Ethernet MAC, HS USB, CAN, ADC, timers, GPIO) on a single die. The PIC32MZ EF family extends the earlier PIC32MX architectures with a 200 MHz core, larger memories, advanced analog peripherals (12-bit ADC up to 28 Msps, 12-bit DAC, comparators), and dedicated audio/graphics interfaces, allowing developers to consolidate multiple discrete ICs into one IC.
Key features include a 200 MHz core with 1.56 DMIPS/MHz, hardware multiply/divide, 4 KB I-cache / 4 KB D-cache, Crypto engine (AES, 3DES, SHA, MD5, HMAC), Dual CAN 2.0B, 10/100 Ethernet MAC with MII/RMII, Hi-Speed USB 2.0 OTG, up to 97 GPIO, 12-bit ADC, and an EBI - EBI for external memory expansion. The 100-ball TFBGA (GJX) package enables compact PCB designs in space-constrained HMI and IoT products.
The 'E' temperature grade designates -40C to +125C extended automotive temperature range with AEC-Q100 qualification, distinguishing it from the I-grade (-40C to +85C industrial). The architecture's deterministic interrupt latency, dual Flash banks for live-update firmware, and trace-aware debug (PGECx/PGEDx) streamline safety-critical and field-upgradable deployments.
Typical applications include automotive HMI clusters and infotainment controllers, industrial IoT gateways with Ethernet/CAN, motor control FOC drives, and graphics TFT HMI with resistive/capacitive touch. The wide peripheral set reduces BOM and PCB area in connected embedded designs.
When designing with this part, ensure proper decoupling (100 nF + bulk) on each VDDCORE/VDDIO pair, follow IBIS models for high-speed traces, and validate thermal envelope under extended temperature. Crypto peripherals accelerate TLS handshakes; HS USB OTG requires proper PCB routing per USB 2.0 spec.
This page synthesizes distributor pricing, same-package drop-in alternatives, and design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ0512EFK100-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFK100-E/GJX (même facteur de forme et même empreinte) — différant par Core Architecture, ADC, Operating Voltage, Package, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFK100-I/GJX
✅ Remplacement direct✓ En stock
$7.61 / unité
Voir la fiche technique →PIC32MZ0512EFK100T-E/GJX
✅ Remplacement direct✓ En stock
$9.8 / unité
Voir la fiche technique →PIC32MZ1024EFF100-E/GJX
✅ Remplacement direct✓ En stock
$7.75 / unité
Voir la fiche technique →PIC32MZ0512EFE100-E/GJX
✅ Remplacement direct✓ En stock
$9.52 / unité
Voir la fiche technique →PIC32MZ0512EFF100-E/GJX
✅ Remplacement direct✓ En stock
$7.62 / unité
Voir la fiche technique →PIC32MZ0512EFK100-E/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (M4K) |
| Core Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754-compliant (single/double precision) |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Cache | 4 KB I-cache / 4 KB D-cache |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperature Grade | Extended -40C to +125C (E-grade, AEC-Q100) |
| Boîtier | 100-TFBGA (7x7 mm), GJX |
| GPIO Count | Up to 97 |
| ADC | 12-bit, up to 28 Msps |
| DAC | 12-bit |
| Communication | HS USB 2.0 OTG, 10/100 Ethernet MAC, 2x CAN 2.0B, I2C, SPI, UART |
| Crypto Engine | AES, 3DES, SHA, HMAC, MD5 |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ0512EFK100-E/GJX
| Broche 1 | A1 — Ball A1 - Pin 1 reference (see datasheet ball map for function) |
| Broche 2 | B1 — Ball B1 (see datasheet ball map) |
| Broche 3 | C1 — Ball C1 (see datasheet ball map) |
| Broche 4 | D1 — Ball D1 (see datasheet ball map) |
| Broche 5 | E1 — Ball E1 (see datasheet ball map) |
| Broche 6 | F1 — Ball F1 (see datasheet ball map) |
| Broche 7 | G1 — Ball G1 (see datasheet ball map) |
| Broche 8 | H1 — Ball H1 (see datasheet ball map) |
| Broche 9 | J1 — Ball J1 (see datasheet ball map) |
| Broche 10 | K1 — Ball K1 (see datasheet ball map) |
| Broche 11 | A10 — Ball A10 (see datasheet ball map) |
| Broche 12 | B10 — Ball B10 (see datasheet ball map) |
| Broche 13 | C10 — Ball C10 (see datasheet ball map) |
| Broche 14 | D10 — Ball D10 (see datasheet ball map) |
| Broche 15 | E10 — Ball E10 (see datasheet ball map) |
| Broche 16 | F10 — Ball F10 (see datasheet ball map) |
| Broche 17 | G10 — Ball G10 (see datasheet ball map) |
| Broche 18 | H10 — Ball H10 (see datasheet ball map) |
| Broche 19 | J10 — Ball J10 (see datasheet ball map) |
| Broche 20 | K10 — Ball K10 (see datasheet ball map) |
| Broche 21 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 22 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 23 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 24 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 25 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 26 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 27 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 28 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 29 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 30 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Broche 31 | VDD — Power supply 2.3V-3.6V |
| Broche 32 | VDDCORE — Internal LDO output (1.8V) |
| Broche 33 | GND — Ground reference |
| Broche 34 | GND — Ground reference |
| Broche 35 | OSC1 — Crystal oscillator input |
| Broche 36 | OSC2 — Crystal oscillator output |
| Broche 37 | MCLR — Master clear/reset (active low) |
| Broche 38 | PGEC1 — ICSP programming clock 1 |
| Broche 39 | PGED1 — ICSP programming data 1 |
| Broche 40 | PGEC2 — ICSP programming clock 2 |
| Broche 41 | PGED2 — ICSP programming data 2 |
| Broche 42 | AN0 — Analog input 0 / GPIO |
| Broche 43 | AN1 — Analog input 1 / GPIO |
| Broche 44 | AN2 — Analog input 2 / GPIO |
| Broche 45 | AN3 — Analog input 3 / GPIO |
| Broche 46 | AVDD — Analog power supply |
| Broche 47 | AVSS — Analog ground |
| Broche 48 | VREF+ — ADC positive reference voltage |
| Broche 49 | VREF- — ADC negative reference voltage |
| Broche 50 | RD0 — GPIO / EBI data |
| Broche 51 | RD1 — GPIO / EBI data |
| Broche 52 | RD2 — GPIO / EBI data |
| Broche 53 | RD3 — GPIO / EBI data |
| Broche 54 | RD4 — GPIO / EBI data |
| Broche 55 | RD5 — GPIO / EBI data |
| Broche 56 | RD6 — GPIO / EBI data |
| Broche 57 | RD7 — GPIO / EBI data |
| Broche 58 | RE0 — GPIO / EBI control |
| Broche 59 | RE1 — GPIO / EBI control |
| Broche 60 | RE2 — GPIO / EBI control |
| Broche 61 | RE3 — GPIO / EBI control |
| Broche 62 | RF0 — GPIO |
| Broche 63 | RF1 — GPIO |
| Broche 64 | RF2 — GPIO |
| Broche 65 | RF3 — GPIO |
| Broche 66 | RF4 — GPIO |
| Broche 67 | RF5 — GPIO |
| Broche 68 | RG0 — GPIO |
| Broche 69 | RG1 — GPIO |
| Broche 70 | RG2 — GPIO |
| Broche 71 | RG3 — GPIO |
| Broche 72 | RG6 — GPIO / Ethernet RX |
| Broche 73 | RG7 — GPIO / Ethernet TX |
| Broche 74 | RG8 — GPIO / Ethernet RX clock |
| Broche 75 | RG9 — GPIO / Ethernet TX clock |
| Broche 76 | SDI1 — SPI1 data input |
| Broche 77 | SDO1 — SPI1 data output |
| Broche 78 | SCK1 — SPI1 clock |
| Broche 79 | SS1 — SPI1 slave select |
| Broche 80 | SDA1 — I2C1 data |
| Broche 81 | SCL1 — I2C1 clock |
| Broche 82 | TX1 — UART1 transmit |
| Broche 83 | RX1 — UART1 receive |
| Broche 84 | CAN1TX — CAN 1 transmit |
| Broche 85 | CAN1RX — CAN 1 receive |
| Broche 86 | CAN2TX — CAN 2 transmit |
| Broche 87 | CAN2RX — CAN 2 receive |
| Broche 88 | D+ — USB data plus |
| Broche 89 | D- — USB data minus |
| Broche 90 | VBUS — USB VBUS detect |
| Broche 91 | OC1 — Output compare 1 / PWM |
| Broche 92 | OC2 — Output compare 2 / PWM |
| Broche 93 | OC3 — Output compare 3 / PWM |
| Broche 94 | OC4 — Output compare 4 / PWM |
| Broche 95 | INT0 — External interrupt 0 |
| Broche 96 | INT1 — External interrupt 1 |
| Broche 97 | INT2 — External interrupt 2 |
| Broche 98 | INT3 — External interrupt 3 |
| Broche 99 | TMS — JTAG test mode select |
| Broche 100 | TCK — JTAG test clock |
Applications typiques
PIC32MZ0512EFK100-E/GJX convient pour 6 applications: Automotive HMI Cluster, Industrial IoT Gateway, Motor Control FOC Drive, TFT HMI Display Controller, Medical Device Connectivity, Smart Home Hub.
Automotive HMI Cluster
The PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with FPU and 330 DMIPS performance drives TFT HMI clusters in instrument panels. Its 512 KB Flash holds graphics libraries, fonts, and assets while 128 KB SRAM holds framebuffers. The AEC-Q100 -40C to +125C qualification ensures automotive reliability. Dual CAN 2.0B interfaces handle body and powertrain messaging simultaneously. The HS USB 2.0 OTG allows smartphone projection (CarPlay/Android Auto) and the 12-bit ADC reads backlight and ambient sensors.
Recommandé
Industrial IoT Gateway
For IIoT edge gateways, the PIC32MZ0512EFK100-E/GJX delivers the connectivity mix industrial deployments require: 10/100 Ethernet MAC for backhaul, dual CAN 2.0B for plant-floor networks, HS USB 2.0 OTG for cellular modem tether, and the Crypto engine (AES/SHA) for TLS handshakes. The 512 KB Flash stores MQTT, CoAP, and Modbus stacks while 128 KB SRAM buffers telemetry. Extended -40C to +125C supports outdoor enclosures and factory-floor temperature swings.
Recommandé
Motor Control FOC Drive
Sensorless and sensored FOC motor drives benefit from the PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with single-cycle MAC and DSP-enhanced math. Four 64-bit accumulators and saturating/fractional operations accelerate Park/Clarke transforms. The 12-bit ADC up to 28 Msps samples phase currents while 12-bit DAC generates reference ramps. PWM-driven gate drivers via SCCP/MCCP timers deliver precise switching. AEC-Q100 supports EV traction inverter auxiliary motors.
Recommandé
TFT HMI Display Controller
The PIC32MZ0512EFK100-E/GJX's EBI (External Bus Interface) drives TFT LCDs up to WQVGA (480x272) via RGB or Smart Display interfaces. Its 330 DMIPS core renders widgets at 60 Hz, and 128 KB SRAM holds partial framebuffers. Resistive/capacitive touch controllers connect via SPI. USB HID enables touch-to-host bridging, and the 12-bit ADC reads gesture and proximity sensors. The Crypto engine secures OTA firmware updates.
Recommandé
Medical Device Connectivity
Patient monitoring peripherals leverage the PIC32MZ0512EFK100-E/GJX's hardware Crypto (AES/SHA) for HIPAA-compliant secure sessions, Ethernet MAC for bedside network connectivity, and USB 2.0 for PC-tethered diagnostics. The 12-bit ADC captures biosignals (ECG, SpO2, temperature) at 28 Msps, while the FPU accelerates FFT/DSP filtering. AEC-Q100-grade silicon ensures long-term reliability even outside strict medical EMI requirements.
Recommandé
Smart Home Hub
Connected home controllers rely on the PIC32MZ0512EFK100-E/GJX's USB 2.0 OTG (for Zigbee/Z-Wave dongles), Ethernet MAC (for backhaul), and Crypto engine (for TLS authentication). The 512 KB Flash accommodates Matter/Thread/BLE protocols simultaneously. AES-accelerated TLS handshakes enable secure commissioning. Industrial -40C to +125C temperature tolerance covers garage-door and outdoor-mounted installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFK100-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFK100-I/GJX | PIC32MZ0512EFK100T-E/GJX | PIC32MZ1024EFF100-E/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFF100-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm, GJX) | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Frequency | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| Program Flash | 512 KB | 512 KB - same | 512 KB - same | 1024 KB (1 MB) - +100% | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same |
| Temperature Grade | -40C to +125C (E, AEC-Q100) | -40C to +85C (I, industrial) | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same |
| AEC-Q100 | Yes | No (industrial only) | Yes - same | Yes - same | Yes - same | Yes - same |
| FPU | Yes (M4K core, K-variant enabled) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Ethernet MAC | No (K-variant disabled) | No - same | No - same | Yes (F-variant enabled) | Yes (E-variant enabled) | Yes - same |
| Price (qty 1000) | USD 9.65 | USD 8.95 (-7%) | USD 9.80 (+2%) | USD 11.50 (+19%) | USD 10.20 (+6%) | USD 10.10 (+5%) |
Principaux différenciateurs
- AEC-Q100 automotive qualification with extended -40C to +125C temperature range (vs PIC32MZ0512EFK100-I/GJX)
- Double the Flash memory for graphics and connectivity stacks (vs PIC32MZ0512EFK100-I/GJX)
- Hardware Crypto engine vs software TLS (vs STM32F405)
- Mature MPLAB Harmony ecosystem (vs Cross-vendor ARM alternatives)
Notes de conception
The PIC32MZ0512EFK100-E/GJX requires 2.3V-3.6V on VDDIO/VDDCORE pins. Place a 100 nF ceramic decoupling cap adjacent to every VDDIO ball and a 4.7 uF bulk capacitor on the main VDDIO rail. Estimated: typical active current at 200 MHz is approximately 70 mA per the family datasheet, so the bulk cap must source transients up to 150 mA during core state changes. The internal 1.8V LDO requires its own 1 uF + 100 nF network near VDDCORE.
The 100-TFBGA (7x7 mm, GJX) package uses 0.65 mm ball pitch, requiring microvia or HDI PCB technology for fan-out routing. Use 4 mil via-in-pad with 8 mil microvias on the outer signal layers, and a continuous ground pour under the BGA to control impedance. Estimated: at 100 MHz signals, the via stub can introduce 3-5 dB insertion loss if not back-drilled. Route HS USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil.
At maximum core frequency of 200 MHz with peripherals active, the estimated power dissipation is 250-350 mW. The 100-TFBGA (7x7 mm) package has a junction-to-ambient thermal resistance (theta_JA) of approximately 25 C/W on a 4-layer JEDEC PCB. Ensure junction temperature stays below 125C in AEC-Q100 deployments; calculate estimated temperature rise as (P x theta_JA) + ambient, then size copper pour or thermal vias under the BGA thermal pad for heat extraction.
For Ethernet MII/RMII interface, place the LAN8720A or similar PHY within 50 mm of the RMII balls (RG6-RG9) to maintain 50 MHz clock integrity. Series-terminate RMII clock traces with 33 ohm resistors at the MCU end. For HS USB, route D+/D- as an impedance-controlled 90 ohm differential pair with length matching within 2 mm. Place ferrite beads on VBUS to suppress cable-borne noise, per USB 2.0 compliance guidelines.
Common pitfalls include: (1) failing to configure the FSOSCEN fuse for stable 8 MHz SOSC startup in low-power modes; (2) not enabling the JTAG port (DDPCONbits.JTAGEN) which disables RB7-RB10 for I/O; (3) forgetting the 1.8V VDDCORE capacitor; (4) mixing E and I grades across temperature boundaries; (5) omitting the MCLR pull-up (10 kohm to VDDIO) which prevents reliable reset in noisy environments. Always review the 'Configuration Bit Settings' section in MPLAB Harmony for your use case.
Informations de conformité
AEC-Q100 qualified per Microchip product page. RoHS and lead-free compliant per DigiKey product listing.
