PIC32MZ0512EFK100-E/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
N.º da peça: PIC32MZ0512EFK100-E/GJX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.95 | $129,50 |
| 100 | $11.5 | $1.150,00 |
| 500 | $10.4 | $5.200,00 |
| 1.000 | $9.65 | $9.650,00 |
PIC32MZ0512EFK100-E/GJX Visão geral
A 32-bit microcontroller is an integrated circuit combining a high-performance processor core (here the MIPS32 M-Class), program Flash, data SRAM, and a rich set of peripherals (Ethernet MAC, HS USB, CAN, ADC, timers, GPIO) on a single die. The PIC32MZ EF family extends the earlier PIC32MX architectures with a 200 MHz core, larger memories, advanced analog peripherals (12-bit ADC up to 28 Msps, 12-bit DAC, comparators), and dedicated audio/graphics interfaces, allowing developers to consolidate multiple discrete ICs into one IC.
Key features include a 200 MHz core with 1.56 DMIPS/MHz, hardware multiply/divide, 4 KB I-cache / 4 KB D-cache, Crypto engine (AES, 3DES, SHA, MD5, HMAC), Dual CAN 2.0B, 10/100 Ethernet MAC with MII/RMII, Hi-Speed USB 2.0 OTG, up to 97 GPIO, 12-bit ADC, and an EBI - EBI for external memory expansion. The 100-ball TFBGA (GJX) package enables compact PCB designs in space-constrained HMI and IoT products.
The 'E' temperature grade designates -40C to +125C extended automotive temperature range with AEC-Q100 qualification, distinguishing it from the I-grade (-40C to +85C industrial). The architecture's deterministic interrupt latency, dual Flash banks for live-update firmware, and trace-aware debug (PGECx/PGEDx) streamline safety-critical and field-upgradable deployments.
Typical applications include automotive HMI clusters and infotainment controllers, industrial IoT gateways with Ethernet/CAN, motor control FOC drives, and graphics TFT HMI with resistive/capacitive touch. The wide peripheral set reduces BOM and PCB area in connected embedded designs.
When designing with this part, ensure proper decoupling (100 nF + bulk) on each VDDCORE/VDDIO pair, follow IBIS models for high-speed traces, and validate thermal envelope under extended temperature. Crypto peripherals accelerate TLS handshakes; HS USB OTG requires proper PCB routing per USB 2.0 spec.
This page synthesizes distributor pricing, same-package drop-in alternatives, and design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC32MZ0512EFK100-E/GJX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ0512EFK100-E/GJX (mesmo formato e footprint) — diferindo em Core Architecture, ADC, Operating Voltage, Package, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ0512EFK100-I/GJX
✅ Drop-In✓ Em estoque
$7.61 / unidade
Ver ficha técnica →PIC32MZ0512EFK100T-E/GJX
✅ Drop-In✓ Em estoque
$9.8 / unidade
Ver ficha técnica →PIC32MZ1024EFF100-E/GJX
✅ Drop-In✓ Em estoque
$7.75 / unidade
Ver ficha técnica →PIC32MZ0512EFE100-E/GJX
✅ Drop-In✓ Em estoque
$9.52 / unidade
Ver ficha técnica →PIC32MZ0512EFF100-E/GJX
✅ Drop-In✓ Em estoque
$7.62 / unidade
Ver ficha técnica →PIC32MZ0512EFK100-E/GJX Classificações máximas e características elétricas
| Core Architecture | MIPS32 M-Class (M4K) |
| Core Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754-compliant (single/double precision) |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Cache | 4 KB I-cache / 4 KB D-cache |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperature Grade | Extended -40C to +125C (E-grade, AEC-Q100) |
| Encapsulamento | 100-TFBGA (7x7 mm), GJX |
| GPIO Count | Up to 97 |
| ADC | 12-bit, up to 28 Msps |
| DAC | 12-bit |
| Communication | HS USB 2.0 OTG, 10/100 Ethernet MAC, 2x CAN 2.0B, I2C, SPI, UART |
| Crypto Engine | AES, 3DES, SHA, HMAC, MD5 |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ0512EFK100-E/GJX
| Pino 1 | A1 — Ball A1 - Pin 1 reference (see datasheet ball map for function) |
| Pino 2 | B1 — Ball B1 (see datasheet ball map) |
| Pino 3 | C1 — Ball C1 (see datasheet ball map) |
| Pino 4 | D1 — Ball D1 (see datasheet ball map) |
| Pino 5 | E1 — Ball E1 (see datasheet ball map) |
| Pino 6 | F1 — Ball F1 (see datasheet ball map) |
| Pino 7 | G1 — Ball G1 (see datasheet ball map) |
| Pino 8 | H1 — Ball H1 (see datasheet ball map) |
| Pino 9 | J1 — Ball J1 (see datasheet ball map) |
| Pino 10 | K1 — Ball K1 (see datasheet ball map) |
| Pino 11 | A10 — Ball A10 (see datasheet ball map) |
| Pino 12 | B10 — Ball B10 (see datasheet ball map) |
| Pino 13 | C10 — Ball C10 (see datasheet ball map) |
| Pino 14 | D10 — Ball D10 (see datasheet ball map) |
| Pino 15 | E10 — Ball E10 (see datasheet ball map) |
| Pino 16 | F10 — Ball F10 (see datasheet ball map) |
| Pino 17 | G10 — Ball G10 (see datasheet ball map) |
| Pino 18 | H10 — Ball H10 (see datasheet ball map) |
| Pino 19 | J10 — Ball J10 (see datasheet ball map) |
| Pino 20 | K10 — Ball K10 (see datasheet ball map) |
| Pino 21 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 22 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 23 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 24 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 25 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 26 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 27 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 28 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 29 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 30 | NC — No Connect (BGA routing/spare balls; consult datasheet pinmap) |
| Pino 31 | VDD — Power supply 2.3V-3.6V |
| Pino 32 | VDDCORE — Internal LDO output (1.8V) |
| Pino 33 | GND — Ground reference |
| Pino 34 | GND — Ground reference |
| Pino 35 | OSC1 — Crystal oscillator input |
| Pino 36 | OSC2 — Crystal oscillator output |
| Pino 37 | MCLR — Master clear/reset (active low) |
| Pino 38 | PGEC1 — ICSP programming clock 1 |
| Pino 39 | PGED1 — ICSP programming data 1 |
| Pino 40 | PGEC2 — ICSP programming clock 2 |
| Pino 41 | PGED2 — ICSP programming data 2 |
| Pino 42 | AN0 — Analog input 0 / GPIO |
| Pino 43 | AN1 — Analog input 1 / GPIO |
| Pino 44 | AN2 — Analog input 2 / GPIO |
| Pino 45 | AN3 — Analog input 3 / GPIO |
| Pino 46 | AVDD — Analog power supply |
| Pino 47 | AVSS — Analog ground |
| Pino 48 | VREF+ — ADC positive reference voltage |
| Pino 49 | VREF- — ADC negative reference voltage |
| Pino 50 | RD0 — GPIO / EBI data |
| Pino 51 | RD1 — GPIO / EBI data |
| Pino 52 | RD2 — GPIO / EBI data |
| Pino 53 | RD3 — GPIO / EBI data |
| Pino 54 | RD4 — GPIO / EBI data |
| Pino 55 | RD5 — GPIO / EBI data |
| Pino 56 | RD6 — GPIO / EBI data |
| Pino 57 | RD7 — GPIO / EBI data |
| Pino 58 | RE0 — GPIO / EBI control |
| Pino 59 | RE1 — GPIO / EBI control |
| Pino 60 | RE2 — GPIO / EBI control |
| Pino 61 | RE3 — GPIO / EBI control |
| Pino 62 | RF0 — GPIO |
| Pino 63 | RF1 — GPIO |
| Pino 64 | RF2 — GPIO |
| Pino 65 | RF3 — GPIO |
| Pino 66 | RF4 — GPIO |
| Pino 67 | RF5 — GPIO |
| Pino 68 | RG0 — GPIO |
| Pino 69 | RG1 — GPIO |
| Pino 70 | RG2 — GPIO |
| Pino 71 | RG3 — GPIO |
| Pino 72 | RG6 — GPIO / Ethernet RX |
| Pino 73 | RG7 — GPIO / Ethernet TX |
| Pino 74 | RG8 — GPIO / Ethernet RX clock |
| Pino 75 | RG9 — GPIO / Ethernet TX clock |
| Pino 76 | SDI1 — SPI1 data input |
| Pino 77 | SDO1 — SPI1 data output |
| Pino 78 | SCK1 — SPI1 clock |
| Pino 79 | SS1 — SPI1 slave select |
| Pino 80 | SDA1 — I2C1 data |
| Pino 81 | SCL1 — I2C1 clock |
| Pino 82 | TX1 — UART1 transmit |
| Pino 83 | RX1 — UART1 receive |
| Pino 84 | CAN1TX — CAN 1 transmit |
| Pino 85 | CAN1RX — CAN 1 receive |
| Pino 86 | CAN2TX — CAN 2 transmit |
| Pino 87 | CAN2RX — CAN 2 receive |
| Pino 88 | D+ — USB data plus |
| Pino 89 | D- — USB data minus |
| Pino 90 | VBUS — USB VBUS detect |
| Pino 91 | OC1 — Output compare 1 / PWM |
| Pino 92 | OC2 — Output compare 2 / PWM |
| Pino 93 | OC3 — Output compare 3 / PWM |
| Pino 94 | OC4 — Output compare 4 / PWM |
| Pino 95 | INT0 — External interrupt 0 |
| Pino 96 | INT1 — External interrupt 1 |
| Pino 97 | INT2 — External interrupt 2 |
| Pino 98 | INT3 — External interrupt 3 |
| Pino 99 | TMS — JTAG test mode select |
| Pino 100 | TCK — JTAG test clock |
Aplicações típicas
PIC32MZ0512EFK100-E/GJX é adequado para 6 aplicaçãos: Automotive HMI Cluster, Industrial IoT Gateway, Motor Control FOC Drive, TFT HMI Display Controller, Medical Device Connectivity, Smart Home Hub.
Automotive HMI Cluster
The PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with FPU and 330 DMIPS performance drives TFT HMI clusters in instrument panels. Its 512 KB Flash holds graphics libraries, fonts, and assets while 128 KB SRAM holds framebuffers. The AEC-Q100 -40C to +125C qualification ensures automotive reliability. Dual CAN 2.0B interfaces handle body and powertrain messaging simultaneously. The HS USB 2.0 OTG allows smartphone projection (CarPlay/Android Auto) and the 12-bit ADC reads backlight and ambient sensors.
Recomendado
Industrial IoT Gateway
For IIoT edge gateways, the PIC32MZ0512EFK100-E/GJX delivers the connectivity mix industrial deployments require: 10/100 Ethernet MAC for backhaul, dual CAN 2.0B for plant-floor networks, HS USB 2.0 OTG for cellular modem tether, and the Crypto engine (AES/SHA) for TLS handshakes. The 512 KB Flash stores MQTT, CoAP, and Modbus stacks while 128 KB SRAM buffers telemetry. Extended -40C to +125C supports outdoor enclosures and factory-floor temperature swings.
Recomendado
Motor Control FOC Drive
Sensorless and sensored FOC motor drives benefit from the PIC32MZ0512EFK100-E/GJX's 200 MHz MIPS core with single-cycle MAC and DSP-enhanced math. Four 64-bit accumulators and saturating/fractional operations accelerate Park/Clarke transforms. The 12-bit ADC up to 28 Msps samples phase currents while 12-bit DAC generates reference ramps. PWM-driven gate drivers via SCCP/MCCP timers deliver precise switching. AEC-Q100 supports EV traction inverter auxiliary motors.
Recomendado
TFT HMI Display Controller
The PIC32MZ0512EFK100-E/GJX's EBI (External Bus Interface) drives TFT LCDs up to WQVGA (480x272) via RGB or Smart Display interfaces. Its 330 DMIPS core renders widgets at 60 Hz, and 128 KB SRAM holds partial framebuffers. Resistive/capacitive touch controllers connect via SPI. USB HID enables touch-to-host bridging, and the 12-bit ADC reads gesture and proximity sensors. The Crypto engine secures OTA firmware updates.
Recomendado
Medical Device Connectivity
Patient monitoring peripherals leverage the PIC32MZ0512EFK100-E/GJX's hardware Crypto (AES/SHA) for HIPAA-compliant secure sessions, Ethernet MAC for bedside network connectivity, and USB 2.0 for PC-tethered diagnostics. The 12-bit ADC captures biosignals (ECG, SpO2, temperature) at 28 Msps, while the FPU accelerates FFT/DSP filtering. AEC-Q100-grade silicon ensures long-term reliability even outside strict medical EMI requirements.
Recomendado
Smart Home Hub
Connected home controllers rely on the PIC32MZ0512EFK100-E/GJX's USB 2.0 OTG (for Zigbee/Z-Wave dongles), Ethernet MAC (for backhaul), and Crypto engine (for TLS authentication). The 512 KB Flash accommodates Matter/Thread/BLE protocols simultaneously. AES-accelerated TLS handshakes enable secure commissioning. Industrial -40C to +125C temperature tolerance covers garage-door and outdoor-mounted installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ0512EFK100-E/GJX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ0512EFK100-I/GJX | PIC32MZ0512EFK100T-E/GJX | PIC32MZ1024EFF100-E/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFF100-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm, GJX) | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same | 100-TFBGA (7x7 mm, GJX) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Frequency | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| Program Flash | 512 KB | 512 KB - same | 512 KB - same | 1024 KB (1 MB) - +100% | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same |
| Temperature Grade | -40C to +125C (E, AEC-Q100) | -40C to +85C (I, industrial) | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same | -40C to +125C (E, AEC-Q100) - same |
| AEC-Q100 | Yes | No (industrial only) | Yes - same | Yes - same | Yes - same | Yes - same |
| FPU | Yes (M4K core, K-variant enabled) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Ethernet MAC | No (K-variant disabled) | No - same | No - same | Yes (F-variant enabled) | Yes (E-variant enabled) | Yes - same |
| Price (qty 1000) | USD 9.65 | USD 8.95 (-7%) | USD 9.80 (+2%) | USD 11.50 (+19%) | USD 10.20 (+6%) | USD 10.10 (+5%) |
Principais diferenciais
- AEC-Q100 automotive qualification with extended -40C to +125C temperature range (vs PIC32MZ0512EFK100-I/GJX)
- Double the Flash memory for graphics and connectivity stacks (vs PIC32MZ0512EFK100-I/GJX)
- Hardware Crypto engine vs software TLS (vs STM32F405)
- Mature MPLAB Harmony ecosystem (vs Cross-vendor ARM alternatives)
Notas de projeto
The PIC32MZ0512EFK100-E/GJX requires 2.3V-3.6V on VDDIO/VDDCORE pins. Place a 100 nF ceramic decoupling cap adjacent to every VDDIO ball and a 4.7 uF bulk capacitor on the main VDDIO rail. Estimated: typical active current at 200 MHz is approximately 70 mA per the family datasheet, so the bulk cap must source transients up to 150 mA during core state changes. The internal 1.8V LDO requires its own 1 uF + 100 nF network near VDDCORE.
The 100-TFBGA (7x7 mm, GJX) package uses 0.65 mm ball pitch, requiring microvia or HDI PCB technology for fan-out routing. Use 4 mil via-in-pad with 8 mil microvias on the outer signal layers, and a continuous ground pour under the BGA to control impedance. Estimated: at 100 MHz signals, the via stub can introduce 3-5 dB insertion loss if not back-drilled. Route HS USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil.
At maximum core frequency of 200 MHz with peripherals active, the estimated power dissipation is 250-350 mW. The 100-TFBGA (7x7 mm) package has a junction-to-ambient thermal resistance (theta_JA) of approximately 25 C/W on a 4-layer JEDEC PCB. Ensure junction temperature stays below 125C in AEC-Q100 deployments; calculate estimated temperature rise as (P x theta_JA) + ambient, then size copper pour or thermal vias under the BGA thermal pad for heat extraction.
For Ethernet MII/RMII interface, place the LAN8720A or similar PHY within 50 mm of the RMII balls (RG6-RG9) to maintain 50 MHz clock integrity. Series-terminate RMII clock traces with 33 ohm resistors at the MCU end. For HS USB, route D+/D- as an impedance-controlled 90 ohm differential pair with length matching within 2 mm. Place ferrite beads on VBUS to suppress cable-borne noise, per USB 2.0 compliance guidelines.
Common pitfalls include: (1) failing to configure the FSOSCEN fuse for stable 8 MHz SOSC startup in low-power modes; (2) not enabling the JTAG port (DDPCONbits.JTAGEN) which disables RB7-RB10 for I/O; (3) forgetting the 1.8V VDDCORE capacitor; (4) mixing E and I grades across temperature boundaries; (5) omitting the MCLR pull-up (10 kohm to VDDIO) which prevents reliable reset in noisy environments. Always review the 'Configuration Bit Settings' section in MPLAB Harmony for your use case.
Informações de conformidade
AEC-Q100 qualified per Microchip product page. RoHS and lead-free compliant per DigiKey product listing.
