FPGA & CPLD
제품 (6666)
EP2SGX60CF780C - Stratix II GX FPGA, 60K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C is a member of the Stratix II GX family of high-performance FPGAs with embedded transceivers, offering 60,440 equivalent logic elements and 2,544,192 bits of embedded memory in a 780-ball FineLine BGA package. The Stratix II GX architecture combines an adaptive logic module (ALM) fabric with up to 20 multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it a drop-in fit for SERDES-based backplane, chip-to-chip, and protocol bridge designs. A Field Programmable Gate Array (FPGA) is a programmable logic device whose logic fabric, routing, and I/O cells can be reconfigured after manufacture, allowing hardware engineers to implement custom digital circuits without fabricating an ASIC. The Stratix II GX sits in the broader hierarchy: programmable logic -> FPGA -> high-speed transceiver FPGA -> wireline/protocol-bridge class. It targets applications where deterministic latency and high SERDES bandwidth are required and where ASIC NRE cost is not justified. Key features of the EP2SGX60CF780C variant include 364 user I/O pins supporting numerous single-ended and differential I/O standards, 60440 logic elements in the standard -C (commercial) speed grade, an FCBGA package optimized for high pin-count high-speed routing, and a hard PCI Express and SERDES block. Compared with the Cyclone series, the Stratix II GX offers roughly 4x the logic density, embedded transceivers, and richer DSP block resources. The Stratix II GX architecture uses an 8-input ALM with a built-in register, a hierarchical memory subsystem (TriMatrix), and dedicated SERDES hard IP for protocols such as PCI Express, XAUI, SATA, and Serial RapidIO. The embedded transceivers reduce board area and simplify PCB layout versus FPGA-plus-discrete-SERDES solutions. Typical applications include high-speed serial backplanes, telecommunications line cards, data-center protocol bridges (e.g., XAUI to SGMII), broadcast video routers, and high-performance computing interconnects. The 780-ball FCBGA supports the high-density differential SERDES routing required by these designs. When designing with this device, follow Altera application notes AN-558 and AN-525 for multi-gigabit transceiver PCB layout - keep SERDES traces length-matched within 150 mils, maintain a continuous reference plane, and use 100-ohm differential impedance. Power sequencing on the Stratix II GX family is critical; consult the device handbook for VCCINT/VCCPD ramp order. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all values cross-checked against the Intel/Altera Stratix II GX Device Handbook.
EP2SGX60CF780C3 - Stratix II GX FPGA, 60K LE, 780-BGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C3 is a high-density Stratix II GX family Field-Programmable Gate Array delivering 60,440 logic elements (3022 LABs) with embedded transceivers, packaged in a 780-pin FineLine BGA at 1.2V core. The Stratix II GX family combines a 90 nm CMOS process with a flexible Adaptive Logic Module architecture, targeting high-speed serial I/O, memory-intensive DSP, and high-performance logic designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O serdes are all programmable after manufacture. FPGAs sit alongside microcontrollers and ASICs in the programmable logic hierarchy, but unlike microcontrollers they offer fully parallel data paths and deterministic latency; unlike ASICs they require no mask set and ship in days rather than months. Within the Stratix II GX family, the SGX60 tier adds multi-gigabit transceivers (up to 6.375 Gbps) for protocols such as PCIe, Serial RapidIO, and custom SERDES links. Key features of the EP2SGX60CF780C3 include 60,440 logic elements, 2,544,192 bits of on-chip RAM (approximately 317 KB), 364 user I/Os, and a 780-ball FineLine BGA package at 29 mm x 29 mm body size with 1 mm ball pitch. The part is offered in the commercial speed grade C3 and supports operating junction temperatures in the commercial range. Stratix II GX devices also embed hard IP for PCI Express x1/x4 and external memory interfaces including DDR2 SDRAM and QDR II SRAM controllers. The architecture combines 4-input ALMs (Adaptive Logic Modules) replacing the older 4-input LUT, with column-and-row routing using MultiTrack interconnect, and dedicated multiplier blocks, all clocked by up to 12 PLLs. Internal performance supports frequencies up to the device's Fmax rating as published in the datasheet speed-grade tables. The 780-FBGA footprint is shared with other Stratix II GX density points, allowing a single PCB layout to support density migration. Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, XAUI, SDI video), telecommunications line cards, test and measurement equipment with parallel DSP pipelines, and prototyping for ASIC replacement. The transceivers make this part especially attractive for any system that previously required a separate PHY chip. When designing with the EP2SGX60CF780C3, ensure adequate power decoupling near every bank and observe the Stratix II GX PowerPlay early-power-estimate flow before layout commit. Because the Stratix II GX family has been superseded by Stratix IV/V and the Intel Cyclone 10/Agilex families for new designs, this part is most commonly sourced for legacy maintenance and long-lifecycle programs. This page synthesizes distributor pricing, verified drop-in alternatives (same 780-FBGA footprint, same SGX60 die where applicable), and practical PCB/thermal design notes that go beyond the manufacturer datasheet's electrical tables.
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C3N is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 364 user I/O pins, and up to 2,544,192 bits of embedded memory, housed in a 780-ball FineLine BGA (FBGA-780, 29 mm x 29 mm, 1.0 mm pitch) package. It is fabricated on a 90 nm CMOS process, operates from a 1.2 V core supply, and supports internal clock frequencies up to 816.9 MHz (per datasheet) / 717 MHz (per alternate source listings). The device integrates up to 12 transceiver channels rated to 6.375 Gbps, making it the original Altera GX-tier platform for high-speed serial I/O. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, high-speed transceivers, and a programmable interconnect fabric on a single die. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and digital semiconductors, parallel to ASICs but offering post-fabrication reprogrammability. The Stratix II GX family specifically targets applications requiring both high-density logic and multi-gigabit serial transceivers, positioning it between general-purpose FPGAs and full ASICs in terms of integration and cost. Key features include 60,440 logic elements, approximately 2.5 Mbit of embedded RAM (M4K/M-RAM blocks), dedicated 18-bit x 18-bit DSP blocks, 12 full-duplex transceiver channels at data rates up to 6.375 Gbps supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G, plus 8 clock PLL blocks with regional and global clock networks. The 780-ball FC-FBGA package exposes the full set of 364 user I/O pins alongside transceiver reference clocks and high-speed serial pins. Architecturally, Stratix II GX uses an ALM-based logic element with adaptive look-up tables (LUTs) operating at 1.2 V core, with dedicated circuitry for source-synchronous memory interfaces (DDR/DDR2/QDR) and 8B/10B-encoded serial links. The 90 nm process and on-chip signal-integrity features (dynamic phase alignment, pre-emphasis, equalization) enable the transceiver channels to close links at gigabit rates on standard FR-4 backplanes. Typical applications include high-speed serial interface bridging (PCI Express endpoints, XAUI-to-XAUI backplanes), telecom line cards (OC-48/STM-16 aggregation), military and aerospace signal processing, broadcast video routers with SDI/HD-SDI serial I/O, and ASIC prototyping where designers need verified 6 Gbps SerDes plus 60K logic elements. When designing with EP2SGX60CF780C3N, pay close attention to transceiver reference-clock jitter and power-rail decoupling - the 1.2 V VCC, 2.5 V VCCAUX, and 3.3 V VCCPD planes each require bulk and ceramic bypass capacitors placed within 100 mils of their respective balls. Quartus II (legacy, version 9.0 and earlier) is the supported development environment. This page synthesizes distributor stock, verified drop-in alternatives from the Stratix II GX family, and practical design considerations not found in a single distributor listing.
EP2SGX60CF780C4 - Stratix II GX FPGA 60K LE 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C4 is a member of the Stratix II GX family of high-performance field-programmable gate arrays (FPGAs) featuring 60,440 logic elements, 364 user I/O pins, integrated transceivers, and 2,544,192 bits of embedded memory. Built on a 90 nm process technology with a 1.2 V core supply, the device operates at internal clock frequencies up to 732.1 MHz and is housed in a 780-ball fine-pitch flip-chip BGA (FC-FBGA) package. The C4 speed grade and commercial temperature rating make it suited to mainstream wired-communication, video-broadcast, and high-throughput data-acquisition designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that engineers configure after manufacture to implement arbitrary digital circuits. Within the broader semiconductor taxonomy, FPGAs sit between fixed-function ASICs and software-defined processors, offering hardware-level parallelism with reprogrammability. The Stratix II GX family specifically targets designs that require multi-gigabit serial transceivers alongside general-purpose logic, combining high-speed SERDES channels with a rich fabric of adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks for high-throughput arithmetic. Key features of the EP2SGX60CF780C4 include a 60440-logic-element fabric arranged in 3,022 LABs/CLBs, embedded 18x18 multipliers grouped into DSP blocks, dedicated high-speed transceivers that support protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, and on-chip phase-locked loops (PLLs) for clock synthesis and management. The 780-ball FC-FBGA package provides a 1 mm ball pitch and a 23 x 23 mm body, enabling high pin density for the 364 user I/O pins while supporting the integrated transceiver channels. From an architectural standpoint, the Stratix II GX uses Altera's ALM-based logic fabric, which improves effective logic utilization versus traditional 4-input LUT architectures. Combined with the 90 nm process and 1.2 V core, the design balances static power, dynamic performance, and signal-integrity margin for multi-gigabit serial I/O. Internal memory totals approximately 2.5 Mb, and dedicated hard IP blocks accelerate memory interfaces, packet processing, and DSP pipelines without consuming fabric resources. Typical applications for the EP2SGX60CF780C4 include high-speed serial interface bridging, telecommunications line cards, video processing and broadcast equipment, ASIC prototyping, and high-bandwidth test and measurement. Engineers select this part when a design needs both substantial programmable logic and integrated multi-gigabit transceivers on a single die, reducing board complexity versus a two-chip FPGA plus external PHY solution. When designing with this device, pay close attention to the Stratix II GX transceiver reference clock architecture, signal-integrity requirements for the FC-FBGA breakout, and the Quartus II power estimation flow. Use the Stratix II GX FPGA Development Kit schematics and Altera application notes for board-layout guidance, especially the multi-gigabit transceiver channel rules for the FC-FBGA package. This page synthesizes distributor pricing, drop-in alternatives in the same 780-ball FC-FBGA package, and practical design notes not always gathered in one place on the manufacturer datasheet. The information is structured for engineers evaluating the EP2SGX60CF780C4 for new designs or as a drop-in replacement on existing Stratix II GX board layouts.
EP2SGX60CF780C4N - 60K LEs Stratix II GX FPGA | Intel | 780-BGA
The Intel (formerly Altera) EP2SGX60CF780C4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 3,022 LABs/CLBs, and 2,544,192 bits of embedded memory, housed in a 780-ball FineLine BGA (FC-FBGA) package. The device integrates up to 12 transceiver channels supporting 6.375 Gbps operation and is built on a 90 nm process technology with 1.2 V core supply. What is an FPGA? A Field Programmable Gate Array is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the hierarchy of programmable logic: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit to implement custom digital logic, DSP pipelines, and high-speed serial interfaces, making them ideal for prototyping, low-volume production, and designs that need to evolve post-deployment. Key features of the EP2SGX60CF780C4N include 364 user I/Os, support for numerous single-ended and differential I/O standards (LVDS, LVPECL, SSTL, HSTL, LVCMOS), embedded multipliers, and dedicated DSP blocks. The Stratix II GX family adds hardened multi-gigabit transceivers, making this device particularly suited for serial connectivity. Internal performance reaches up to 732 MHz and the device supports 1.2 V core operation with 717 MHz propagation delay characteristics. The device uses a 90 nm CMOS process with embedded SRAM configuration memory, supporting in-system programmability via JTAG or passive/active serial configuration schemes. Its 780-ball FC-FBGA package (23 x 23 mm, 1 mm pitch, MS-034AAJ-1) exposes up to 20 full-duplex transceiver channels in larger family members and provides ample signal integrity for multi-gigabit serial links. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), communications infrastructure, broadcast video processing, military and aerospace signal processing, and high-performance DSP prototyping. The C4 speed grade in the operating temperature range is intended for commercial (0C to 85C) ambient conditions. When designing with this device, careful attention must be paid to power distribution, decoupling, and PCB layer stack-up. The FC-FBGA-780 package requires a minimum of 6 PCB layers with controlled-impedance routing for high-speed transceivers. Quartus II design software (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and AI-citable FAQ answers to help engineers select, source, and integrate the EP2SGX60CF780C4N into next-generation high-speed digital systems.
EP2SGX60CF780C5 - Stratix II GX FPGA 60K LE 780-BGA | Intel / Altera
The Intel (formerly Altera) EP2SGX60CF780C5 is a Stratix II GX family field-programmable gate array (FPGA) integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 364 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. It is built on a 90 nm process node, operates from a 1.2 V core supply with a maximum internal frequency near 717 MHz, and adds up to 20 embedded transceivers supporting multi-gigabit serial I/O for high-speed serial connectivity. The 'C5' speed grade and 'C' commercial temperature rating position it for cost-sensitive prototyping and production in non-extended-temperature environments. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device belonging to the hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. FPGAs sit above standard logic ICs in capability, allowing designers to implement arbitrary digital circuits after PCB fabrication. Within the broader IC taxonomy, the Stratix II GX family targets high-performance digital signal processing, telecom baseband, and serial-interface bridging, sitting between ASICs (higher NRE cost, lower unit cost) and CPLDs (simpler, lower-density glue logic). Key technical features include 60,440 logic elements organized into 3,022 logic array blocks (LABs), 2,544,192 bits of embedded SRAM (M512/M4K/M-RAM blocks), up to 4 enhanced PLLs plus 8 fast PLLs, and dedicated DSP blocks for high-throughput multiplication and accumulation. The device supports configuration via passive serial, fast passive parallel, or JTAG schemes, and offers built-in signal-integrity features for source-synchronous memory interfaces including DDR/DDR2 SDRAM controllers. The architecture uses an adaptive logic module (ALM) structure that is more efficient than the previous Stratix ALM, packing up to 6 inputs into each ALM. Combined with routing efficiency improvements, this delivers roughly 50% higher logic density per area than the prior Stratix generation while maintaining timing closure on multi-megahertz designs. TriMatrix embedded memory and a high-bandwidth interconnect fabric make the part suitable for data-path-heavy designs such as packet processing, video pipelines, and multi-channel DSP. Typical applications include 10 Gbps optical-transport networking line cards, PCI Express endpoint or root-complex bridges, multi-channel serial-digital-interface (SDI) video routers, software-defined radio baseband preprocessing, and high-speed data-acquisition front-ends. The combination of embedded transceivers and rich logic capacity allows a single device to replace multiple ASSPs plus glue logic on the same board. When designing with this part, ensure a robust decoupling network (typically 0.1 uF and 10 uF ceramic capacitors per power rail) is placed as close as possible to the BGA balls to manage simultaneous switching noise. The 780-ball FC-FBGA package demands at least a 6-layer PCB with controlled-impedance routing and microvia or via-in-pad technology; standard 0.1 mm laser-drilled microvias are commonly used. Confirm Quartus II software support and licensing for the C5 speed grade before starting the design cycle. This page aggregates distributor pricing, package-level engineering data, and Stratix II GX family context beyond what is found on any single manufacturer or distributor page, helping engineers quickly assess the EP2SGX60CF780C5 for new designs or legacy inventory support.
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
The Intel / Altera EP2SGX60CF780C5N is a Stratix II GX FPGA from Intel's third-generation FPGA family that integrates high-speed serial transceivers with a scalable, high-performance logic fabric. The device delivers 60,440 logic elements (60K LE), 2,544,192 bits of embedded RAM (approximately 2.5 Mbit), 364 user I/Os, and 20 high-speed transceiver channels capable of data rates up to 6.375 Gbps with embedded SERDES and clock-data recovery (CDR), housed in a 780-ball FCBGA package. The package measures 29 mm x 29 mm with 1.0 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic functionality is defined by a configuration bitstream loaded after manufacture, as opposed to ASICs whose function is fixed at fabrication. FPGAs occupy the programmable-logic tier of the broader digital semiconductor hierarchy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA (SoC FPGA). Within the high-performance sub-segment, transceivers (SERDES) -> gigabit transceivers -> multi-gigabit transceivers, the Stratix II GX family sits at the multi-gigabit class. Key features of the EP2SGX60CF780C5N include up to 20 multi-gigabit transceiver channels each incorporating CDR technology, dedicated hardware multipliers for DSP-style arithmetic, embedded TriMatrix memory blocks, support for external memory interfaces including DDR/DDR2/QDRII, and a comprehensive configuration scheme supporting JTAG (IEEE 1149.1) boundary-scan and passive/active serial modes. The logic array is implemented in 90 nm CMOS technology with a 1.15 V to 1.25 V core supply. Typical applications include high-speed serial interface bridging (PCI Express Gen1, Serial RapidIO, Gigabit Ethernet, XAUI), custom protocol development, prototyping of ASIC designs, high-performance DSP datapaths, and telecom equipment line cards. The combination of 60K logic elements and 6.375 Gbps transceivers makes the part suitable for protocol converter bridges, multi-channel SERDES aggregation, and line-rate protocol adaptation. When designing with this part, allocate 1.0 mm ball-pitch PCB routing rules, use multi-layer stack-up with dedicated transceiver reference plane layers, and follow Intel/Altera's Stratix II GX pin connection guidelines for unused transceiver channels. Verify transceiver reference clock jitter against the protocol specification (typically <1 ps RMS for 6 Gbps links). This page synthesizes distributor pricing, pin-compatible Stratix II GX family members, and practical SERDES design considerations not collected in a single place by the manufacturer datasheet.
EP2SGX60CF780C7 - Stratix II GX FPGA, 60K LE, 780-FCBGA | Altera
The Altera (now Intel) EP2SGX60CF780C7 is a member of the Stratix II GX family of high-performance FPGAs, featuring 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, all housed in a 780-ball flip-chip BGA (FCBGA) package. Built on a 90 nm process with a 1.2 V core supply, the device combines a high-density adaptive logic module (ALM) fabric with on-chip DSP blocks and dedicated serial transceiver channels optimized for high-speed serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier in the digital design hierarchy that sits between fixed-function ASICs and software-programmable processors: more flexible than an ASIC, far faster and more parallel than a general-purpose MCU. The Stratix II GX family specifically targets high-speed serial connectivity applications where the integrated transceivers and hardened PCS/PMA blocks dramatically reduce design effort for protocols such as PCI Express, Serial RapidIO, Fibre Channel, and Gigabit Ethernet. Key differentiating features of the EP2SGX60CF780C7 include up to 364 user I/O pins, 24 DSP blocks (for 18x18 multipliers and accumulators), 12 transceiver channels supporting data rates from 600 Mbps to 6.375 Gbps, and dedicated on-chip termination for AC-coupled and DC-coupled serial links. The Stratix II GX architecture introduced the ALM, which packs eight inputs into a single LUT-based adaptive logic element, providing roughly twice the logic density of the prior Stratix generation. Hot-socketing support, robust SEU mitigation via CRC-driven configuration, and remote upgrade capability round out the feature set. Typical applications include high-end telecommunications line cards, broadcast video processing, high-performance computing acceleration, and high-speed serial protocol bridging. The integrated transceivers make the device particularly attractive for backplane aggregation, serializer/deserializer (SerDes) replacement, and protocol conversion in routers, switches, and base-station equipment. Designers should note that the 'C7' speed grade is the slowest commercial grade offered; faster 'C5' and 'C6' parts in the same package are drop-in upgrades when timing margins are tight. When designing the PCB, allocate at least four PCB layers with continuous power and ground planes beneath the BGA, follow Altera's recommended decoupling scheme (typically one bulk capacitor per PLL and one per transceiver channel plus 0.1 uF/0.01 uF pairs near every power pin), and observe the FCBGA's 1.0 mm ball pitch land pattern. The high transceiver data rate requires careful attention to channel loss, return loss, and via-stub compensation on the serial links.
EP2SGX60CF780I4N - 60K LEs Stratix II GX FPGA, 780-FBGA | Altera
The Altera EP2SGX60CF780I4N is a high-density Stratix II GX field-programmable gate array (FPGA) featuring 60,440 logic elements, 60,440 equivalent logic blocks (CLBs), and up to 2,542 Kbits of embedded memory, housed in a 780-ball fine-line BGA (FC-FBGA) package measuring 23 x 23 mm with 1.0 mm pitch. It integrates up to 20 serial transceivers operating at 6.375 Gbps, supporting PCI Express, Serial RapidIO, XAUI, and CEI-6G protocols for high-bandwidth interconnect. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic, interconnect, and I/O behavior are configured by the end user via an HDL bitstream rather than at the factory. FPGAs occupy a middle ground between fixed-function ASICs (highest performance, lowest per-unit cost at volume) and microcontrollers (highest flexibility, lowest per-unit performance): they deliver ASIC-class data-path throughput while remaining reconfigurable in the field. Stratix II GX belongs to Altera's high-end transceiver-equipped family, targeting wireline communication, broadcast video, and high-speed serial bridging. Key features include 12 PLLs (4 fast PLLs + 8 enhanced PLLs), 12 dedicated clock transceivers supporting 622 Mbps to 6.375 Gbps operation, a 1.2 V core supply (range 1.15 V to 1.25 V), and an industrial temperature grade (-40 °C to +100 °C case). The 90 nm CMOS process provides high logic density with on-chip termination, dynamic phase alignment, and pre-emphasis equalization for backplane and chip-to-chip serial links. The architecture combines adaptive logic modules (ALMs) with embedded TriMatrix memory blocks (MRAM), allowing designers to build wide datapaths, protocol controllers, and DSP blocks at full chip frequency. Stratix II GX supports up to 16 global clock networks, 4 dedicated clocking PLLs for high-frequency synthesis, and 8 regional PLLs with dynamic reconfiguration capability for frequency margining and link-rate switching. Typical applications include 10 Gbps Ethernet MAC/PHY bridging, PCI Express Gen1/Gen2 endpoint and root-port designs, Serial RapidIO switch fabrics, broadcast video processing (HD-SDI, 3G-SDI), telecom backplane aggregation, and high-end test-and-measurement instrumentation where reconfigurable high-speed serial I/O is required. When designing with this device, ensure your PCB meets the FC-FBGA-780 land-pattern requirements (1.0 mm pitch microvia stack-ups), provide independent analog supply rails for the transceiver PLLs, and select the correct speed grade for your target transceiver line rate. Bitstream configuration requires a compatible Altera/Intel Quartus II programmer. This page synthesizes distributor pricing, Stratix II GX family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
EP2SGX60CF780I5N - Stratix II GX FPGA 60K LE FC-FBGA-780 | Altera
The Altera EP2SGX60CF780I5N is a high-density Field Programmable Gate Array (FPGA) from the Stratix II GX family, featuring 60,440 Logic Elements (LEs), 60,440 Adaptive Logic Modules (ALMs), and up to 622 MHz maximum operating frequency in a 780-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. The device integrates up to 12 embedded transceivers operating at 6.375 Gbps, supporting high-speed serial protocols including PCI Express, Serial RapidIO, XAUI, and CEI-6G. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed I/O that can be re-programmed to implement custom digital logic. FPGAs sit at the top of the programmable logic hierarchy (PAL -> CPLD -> FPGA) and are used when processors or ASICs cannot meet performance, latency, or parallelism requirements. The Stratix II GX family targets high-speed serial connectivity and signal-processing applications, placing this specific variant as a high-end member suitable for telecom backplanes, broadcast video, and high-end test equipment. Key features of the EP2SGX60CF780I5N include 2,542 Kbits of embedded RAM distributed across TriMatrix memory blocks (M512, M4K, and M-RAM), 192 dedicated 18x18 multipliers for DSP operations, and a 1.2V core supply (1.15V to 1.25V operating range). It supports up to 12 full-duplex transceiver channels at data rates up to 3.125 Gbps, with some configurations reaching 6.375 Gbps depending on speed grade. The industrial temperature grade (-40C to +100C) and 90nm CMOS process technology make it suitable for demanding industrial and defense applications. The architecture is based on Altera's adaptive logic module (ALM) fabric, which provides finer-grained lookup-table (LUT) packing than previous Stratix generations, increasing effective logic density by ~25%. The transceiver blocks include dedicated Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) hardware, supporting standards such as PCIe Gen1 (2.5 Gbps), XAUI (3.125 Gbps), and Serial RapidIO (1.25 to 3.125 Gbps). Programmable pre-emphasis and equalization compensate for channel loss on FR-4 backplanes up to 40 inches. Typical applications include high-speed serial interface bridging, telecom line card prototyping, military signal processing, broadcast video routers, and high-performance computing (HPC) acceleration. The 780-ball FC-FBGA package (29 x 29 mm, 1 mm pitch) is designed for high-density PCB designs with controlled-impedance routing for the transceiver lanes, requiring dedicated ground and power planes plus matched-length differential pairs. When designing with this device, allocate transceiver lanes first and route them on the top or bottom layers with continuous reference planes. Power supply decoupling requires at least 22 decoupling capacitors per power rail, plus bulk capacitors for the 1.2V core and PLL analog supplies. JTAG and configuration pins (MSEL[2:0], nCONFIG, nSTATUS, DONE) must be accessible for in-system programming. This page synthesizes distributor pricing, drop-in alternative Stratix II GX variants, and practical PCB design considerations not found in the manufacturer datasheet alone, giving procurement and engineering teams a single source for component evaluation.
EP2SGX60DF780C3 - Stratix II GX 60K LE FPGA, 780-BGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 3,022 Logic Array Blocks (LABs), and 364 user I/Os in a 780-pin FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm process node, operates from a 1.2 V core supply, and supports internal frequencies up to approximately 717 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, DSP blocks, and memory. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device -> CPLD/FPGA -> high-density FPGA -> transceiver-equipped FPGA. The Stratix II GX family specifically integrates multi-gigabit transceivers, making it part of the high-speed transceiver-equipped FPGA category used in communications, video, and signal-processing systems. Key features of the EP2SGX60DF780C3 include up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps, dedicated DSP blocks for high-throughput signal processing, distributed and M512K/M4K TriMatrix memory, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The "DF780" suffix denotes the 780-ball FC-FBGA FineLine BGA package; the "C3" speed grade is the fastest commercial grade offered in the Stratix II GX family, with -4 (medium) and -5 (slow) grades also available. The commercial operating range is 0 °C to +85 °C (TJ). Architecturally, Stratix II GX uses an ALM (Adaptive Logic Module) based core rather than the legacy 4-LUT architecture, providing improved logic utilization. The transceiver hard IP supports CPRI/OBSAI, Serial RapidIO, PCI Express (Gen1), and Gigabit Ethernet, offloading high-speed serialization from soft logic. MultiTrack interconnect routing and the Quartus II design suite complete the design ecosystem. Typical applications include high-speed serial backplane interfaces, telecom line cards, wireless baseband signal processing, video broadcast and editing systems, and ASIC prototyping. The 6.375 Gbps transceiver capability makes it especially suitable for chip-to-chip and backplane links. Design consideration: at 780-ball FC-FBGA with 1 mm pitch, PCB stack-up and via-in-pad design with proper thermal vias under the exposed die region are essential. The transceiver reference clock jitter budget must be analyzed using the Stratix II GX Transceiver User Guide. This page synthesizes distributor inventory, parametric context, and practical design guidance not consolidated on any single manufacturer or distributor page.
EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C3N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 3,022 LABs, and 364 user I/Os in a 780-pin FC-FBGA package. Fabricated on a 90 nm process with a 1.2 V core supply, it pairs a rich programmable fabric with embedded transceivers suited for high-speed serial I/O. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can re-program after manufacture. Stratix II GX sits within the FPGA hypernym hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The GX suffix denotes integrated multi-gigabit transceivers, making Stratix II GX devices a sub-family of the broader Stratix II family that targets wired communications, broadcast video, and high-performance computing backplanes. Key features include 60,440 logic elements, 2,544,192 bits of embedded memory, 364 user I/Os, 717 MHz internal operating frequency, and up to 816.9 MHz performance. The part supports 4 PLLs, dedicated high-speed serial transceiver channels, and JTAG-based in-system programming. The DF780 package is a 23 x 23 mm FC-FBGA with 1 mm pitch, designed for high-density PCB layouts where signal integrity and thermal performance are critical. From an architectural standpoint, the Stratix II GX fabric uses Adaptive Logic Modules (ALMs) rather than the older 4-LUT structure, delivering improved logic utilization and timing closure. The 90 nm process node strikes a balance between performance and power, while the integrated transceivers support protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet without external PHY devices. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, GBE), software-defined radio front-ends, broadcast video processing, and ASIC prototyping platforms. The combination of high logic density and embedded transceivers makes it a strong fit for telecom line cards and data-acquisition systems. When designing with this part, ensure the PCB provides a continuous ground plane under the BGA and matched-length routing for the high-speed serial channels. Power decoupling must follow Intel's Stratix II GX PowerPlay recommendations, with bulk capacitance scaled to transceiver utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX60DF780C4 - 60K LEs Stratix II GX FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C4 is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 364 user I/O, and high-speed transceivers in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. Built on a 90 nm CMOS process, the device supports an internal operating frequency up to 717 MHz and operates from a 1.2 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing by the user via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are used to implement arbitrary combinational and sequential logic, soft processors, DSP pipelines, and high-speed serial interfaces. The Stratix II GX family in particular targets high-throughput serial I/O, embedding multi-gigabit transceivers alongside the programmable fabric. Key features of the EP2SGX60DF780C4 include 60,440 logic elements, 2,544,192 bits of embedded memory, up to 717 MHz fabric performance, dedicated DSP blocks, and high-speed serial transceiver channels supporting multi-gigabit-per-second rates. The 780-FBGA package with 1 mm ball pitch and exposed-die construction enables dense board placement while providing adequate thermal performance. The 'C4' speed grade balances timing margin against dynamic power for cost-sensitive designs. From an architectural standpoint, the Stratix II GX uses an ALM-based fabric (Adaptive Logic Modules) with each ALM capable of implementing up to 8 inputs of combinational logic, providing higher effective density than the previous 4-input LUT architecture. The 90 nm process supports embedded memory blocks of M512, M4K, and M-RAM types, and the transceiver blocks support standard serial protocols including PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Typical applications include telecom line cards, high-speed serial interface bridging (PCIe, SRIO, XAUI), DSP co-processing for wireless baseband, test and measurement equipment, and broadcast video processing. The integration of transceivers with the programmable fabric eliminates the need for external PHY ICs, reducing BOM cost and board area. When designing with this part, engineers must allocate sufficient decoupling and follow Altera/Intel PCB layout guidelines for the FBGA package, including via-in-pad or microvia stack-ups to escape the 1 mm pitch ball grid, and provide thermal relief through the exposed die pad and adequate copper area on inner/outer PCB layers. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not consolidated on any single distributor product page.
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX60DF780C4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 60,440 equivalent logic elements, 364 user I/Os, and high-speed transceiver capability, housed in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. Built on a 1.2 V 90 nm CMOS process, this device is optimized for high-bandwidth serial connectivity, DSP-intensive signal processing, and embedded-processor-based designs that require deterministic real-time response. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, multipliers, and PLLs. FPGAs occupy the same role in the digital-hierarchy taxonomy as ASICs but allow post-fabrication logic changes. Stratix II GX sits at the top tier of the programmable-logic hierarchy, between mainstream FPGAs and structured ASICs, with embedded multi-gigabit transceivers that previously required external PHY chips. Key features of the EP2SGX60DF780C4N include 60,440 logic elements organized into 3,022 Logic Array Blocks (LABs), 2,544,192 bits of on-chip RAM, dedicated DSP blocks for high-throughput filtering and FFT, and up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps. The device also exposes 12 full-duplex source-synchronous channels, supports PCI Express x1/x4/x8 hard IP, and integrates four PLL blocks plus 16 global clock networks for robust clock distribution across the fabric. From a technical-depth perspective, the Stratix II GX architecture replaces the 4-input LUT of earlier Stratix with an adaptive logic module (ALM) that combines two 4-LUTs and a dedicated adder, improving effective logic density by roughly 25 percent versus prior generations. Combined with the 90 nm strained-silicon process and 1.2 V core, the part delivers high Fmax on DSP-heavy designs while still meeting industrial-grade thermal envelopes. The transceiver block supports a wide range of protocols including PCI Express Gen1, Serial RapidIO, CEI-6G, and 10 GbE XAUI through protocol-specific soft IPs. Typical applications include 10G/40G telecom line cards, ASIC prototyping platforms, high-end broadcast video processing, defense signal-intelligence backplanes, and medical imaging reconstruction. The high pin count and 364 I/O support wide external memory buses (DDR2/QDRII+) and multiple standard connectors simultaneously. Designers should budget 20 percent of logic for clock-domain crossing, apply Quartus II pin-planner constraints early, and ensure the board supplies a 1.2 V VCCH/LVDS-clean supply for the transceiver PHY. This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, and Quartus II design notes that are not aggregated in the standalone datasheet PDF.
EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C5 is a Stratix II GX family field-programmable gate array (FPGA) integrating 60,440 logic elements, 3,022 logic array blocks (LABs), and embedded transceivers in a 780-pin flip-chip BGA package. Built on a 90 nm process with a 1.2 V core supply, the device is specified for a commercial operating temperature range and a -5 speed grade, balancing logic capacity with high-speed serial capability for communications and signal-processing backplanes. An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources (block RAM, DSP blocks, PLLs, and high-speed transceivers) on a single die, allowing designers to implement custom digital hardware that can be reconfigured after manufacturing. The Stratix II GX family sits within Intel's high-performance FPGA hierarchy: FPGA > programmable logic > programmable logic device > semiconductor IC, and is widely used in protocols where hard SERDES, large on-chip memory, and high logic density are required concurrently. Key features include 364 user I/O pins, embedded 3.125 Gbps-class transceivers, embedded multiplier blocks for DSP, TriMatrix block RAM, and a structured ASIC-like clock network. According to distributor listings, the device supports an internal frequency near 717 MHz and uses a 23 x 23 mm FC-FBGA substrate with 1 mm ball pitch, providing robust signal and power integrity for high-channel-count designs. Architecturally, the Stratix II GX family introduced an adaptive logic module (ALM) that combines fracturable look-up-tables with dedicated arithmetic and carry logic, delivering higher effective logic utilization than the previous Stratix generation. The -C5 speed grade places it in the mid-band of Stratix II GX timing, well suited for production deployments rather than the fastest prototyping tier. Typical applications include telecom line cards, multi-gigabit serial backplanes, video broadcast equipment, military radar preprocessing, and high-performance ASIC prototyping. Designers also use the part in test and measurement chassis where flexible I/O plus high logic density shorten time-to-market. When designing with this device, plan power sequencing for the 1.2 V core, the auxiliary and PLL supplies, and the transceiver analog rails, and verify termination, length-matching, and stack-up against the package's 1 mm BGA pitch. Because the part is in the Stratix II GX EOL category at Altera/Intel, long-life customers should confirm last-time-buy status before committing to new designs.
EP2SGX60DF780C5N - Stratix II GX FPGA, 60K LE, 780-FBGA | Altera
The Altera (Intel) EP2SGX60DF780C5N is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 3,022 LABs, 364 user I/Os, and 2,544,192 bits of embedded memory in a 780-pin flip-chip BGA (FBGA) package. Built on a 90 nm process node, the device supports an internal clock frequency up to 609.76 MHz (per ADatasheet listing) with 1.2 V core supply operation. The EP2SGX60DF780C5N is one of the Stratix II GX variants, distinguished by its integrated multi-gigabit transceiver (MGT) blocks for high-speed serial I/O, making it well suited for serial connectivity, signal processing, and protocol bridging applications. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the end designer after manufacture. The Stratix II GX family belongs to the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-performance transceiver-equipped FPGA -> embedded system-on-chip prototyping silicon. Compared with earlier Stratix generations, Stratix II GX introduced adaptive logic modules (ALMs) and embedded DSP blocks for high-throughput arithmetic, while the GX suffix indicates the addition of multi-gigabit transceivers that operate up to 6.375 Gbps. Key features include 60,440 logic elements (LE), 3,022 LABs/CLBs, 2,544,192 bits of embedded RAM (≈2.5 Mb), embedded DSP blocks for high-speed multiply-accumulate operations, and 12 transceiver channels that operate at serial data rates up to 6.375 Gbps per the Stratix II GX device handbook. The 780-pin flip-chip BGA package supports high I/O count with signal integrity for high-speed parallel and serial interfaces. The device is fabricated on a 90 nm CMOS process and uses 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O interfacing. Architecture-wise, the Stratix II GX uses an ALM-based fabric rather than the older 4-input LUT approach, doubling effective logic capacity per area. On-chip TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM/ROM configurations. The transceiver blocks include clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO), telecommunication line cards, multi-gigabit serial backplanes, video broadcast equipment, and DSP prototyping for radar and baseband processing. The 780-FBGA package also makes the device suitable for designs that require many LVDS or DDR memory interfaces on the parallel side. Design consideration: Stratix II GX designs require the Quartus II design software for synthesis, place-and-route, and timing closure. Power estimation must include both the logic fabric and the active MGT channels, since transceivers can dominate total power consumption when all 12 channels are active. This page synthesizes distributor stock levels, drop-in package and speed-grade alternatives from the Stratix II GX family, and practical design notes not duplicated on the manufacturer datasheet.
EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
The Intel (Altera) EP2SGX60DF780C7 is a member of the Stratix® II GX family of high-density, high-performance FPGAs with integrated transceivers, fabricated on a 90 nm process and housed in a 780-ball FineLine BGA (FBGA) package. The device integrates 60,440 logic elements (LEs), 3,022 logic array blocks (LABs), and 364 user I/O pins, providing the digital fabric needed for high-throughput parallel processing, custom interconnect, and protocol bridging. The C7 speed grade is the slowest commercial speed bin of the family, trading Fmax for low power and tight cost positioning, and is intended for designs where timing closure is not the dominant constraint. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O can be customized after manufacture. The Stratix II GX family belongs to the taxonomy: FPGA -> programmable logic -> digital ASIC alternative -> semiconductor. These devices sit between generic microcontrollers and fixed-function ASICs in the design hierarchy, providing ASIC-class data-path parallelism and logic density while remaining reprogrammable for design changes, field upgrades, and late-stage bug fixes. The GX suffix denotes integrated multi-gigabit transceivers, making the family especially relevant for serial-protocol-heavy designs such as PCIe, Serial RapidIO, XAUI, and custom high-speed serial links. Key features of the EP2SGX60DF780C7 include 2,544,192 bits of embedded RAM organized in M512/M4K/M-RAM blocks, embedded DSP blocks for fixed- and floating-point arithmetic, programmable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) on every user pin, and on-chip PLL and clock management. The 780-pin FBGA package supports very high I/O count, enabling wide parallel buses, multiple high-speed serial links, and abundant differential pairs. The 1.15V–1.25V core supply reflects the 90 nm process node, while separate I/O banks allow 1.5V, 1.8V, 2.5V, or 3.3V interfacing on a per-bank basis. Typical applications for this device include high-speed serial protocol bridging (PCIe endpoint / root complex, XAUI/10 GbE front-end, Serial RapidIO), DSP front-ends for telecom baseband and radar, custom packet processors in networking line cards, and prototype ASIC development. The 780-BGA package combined with 364 user I/Os also suits video broadcast, test and measurement instrumentation, and military/aerospace signal-processing cards where the C7 speed grade and high logic density are advantageous. When designing with the EP2SGX60DF780C7, note that the C7 speed grade implies a lower Fmax than C5 or C6; reserve C7 for designs where timing margins are not the limiting factor, otherwise upgrade to a faster bin. The 780-BGA requires controlled-impedance PCB design, decoupling capacitor placement within the BGA keep-out, and a thermal solution sized to the application's ambient and airflow. The Intel Quartus II design software (legacy) is the supported toolchain; current Intel Quartus Prime does not support Stratix II, so EOL planning is critical. This page synthesizes distributor pricing, drop-in speed-grade and variant alternatives, and practical design notes for the EP2SGX60DF780C7 that are not found in the manufacturer datasheet.
EP2SGX60DF780I3N - 60K LE Stratix II GX FPGA, 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP2SGX60DF780I3N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix II GX family, delivering 60,440 logic elements and 60,440 Configurable Logic Blocks (CLBs) in a 780-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package with a 1.00 mm terminal pitch. The device supports maximum internal clock frequencies up to 622.08 MHz (data sheet speed grade 816.9 MHz reference) and is fabricated on a 90 nm CMOS process with a 1.2 V nominal core supply voltage. What is a Stratix II GX FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. Stratix II GX is a transceiver-equipped variant in the broader Stratix II family, engineered for high-speed serial I/O applications such as serial RapidIO, PCI Express, XAUI, and custom protocols. Within the FPGA taxonomy (FPGA → programmable logic → logic IC → integrated circuit), Stratix II GX sits at the high-performance, transceiver-rich tier. Key differentiating features of the EP2SGX60DF780I3N include 60,440 logic elements, embedded multiplier blocks for DSP, dedicated high-speed serial transceivers supporting multi-gigabit data rates, and a rich on-chip memory hierarchy with TriMatrix memory blocks. The FC-FBGA-780 package supports industrial-grade thermal operation from -40 °C to +85 °C and is optimized for high signal-integrity designs with controlled-impedance escape routing. Architecturally, Stratix II GX uses Altera's adaptive logic module (ALM) instead of the legacy 4-input LUT, delivering finer-grain logic packing and improved performance per logic element. The built-in transceivers operate at line rates suitable for 1 Gbps to 3.125 Gbps serial protocols and can be aggregated into 4- or 8-channel groups for parallel high-speed links. Dedicated hard IP blocks for PHY functions reduce soft-logic resource consumption and lower latency for memory and connectivity interfaces. Typical applications include telecommunications line cards, baseband processing for wireless infrastructure, high-speed serial protocol bridging (PCIe, XAUI, Serial RapidIO), military and aerospace signal processing, broadcast video transport, and high-performance ASIC prototyping. The -I3 industrial speed grade and 1.2 V core operation make it suitable for thermally constrained embedded systems where reliability over the industrial temperature range is mandatory. When designing with this FPGA, pay close attention to transceiver reference clock jitter, PCB stack-up for high-speed serial channels, and decoupling strategy near each transceiver quad. The 1.00 mm ball pitch requires microvia or fine-line PCB fabrication; through-hole vias on BGA pads are not recommended. Quartus II software (version supporting Stratix II GX) is required for design entry, synthesis, place-and-route, and programming file generation. This page consolidates distributor stock and pricing (as of 2026-09-09), curated same-package drop-in alternatives, and design notes not aggregated on any single manufacturer or distributor page.
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
The Intel EP2SGX60DF780I4 is a Stratix II GX family Field-Programmable Gate Array (FPGA) with 60,440 logic cells, 364 user I/Os, 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, housed in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch) package. It is fabricated on a 90 nm CMOS process and supports an internal maximum clock frequency of up to 732.1 MHz. The device is rated for industrial temperature operation (-40C to +100C ambient), and the suffix "I4" denotes the industrial speed grade. An FPGA is an integrated circuit containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, memory blocks, and DSP blocks. The Stratix II GX family is Intel's (formerly Altera's) high-end transceiver-rich FPGA family, positioned above the Cyclone and Arria lines and below the Stratix IV/V in the programmable-logic taxonomy: FPGA > Stratix > high-speed serial transceiver FPGA > Stratix II GX. This categorization matters for system architects evaluating performance per dollar and per watt. Key features of the EP2SGX60DF780I4 include 60,440 logic elements, 2,544,192 embedded RAM bits organized as M512/M4K/M-RAM blocks, embedded 6.375 Gbps multi-gigabit transceivers (MGTs), dedicated DSP blocks, and Phase-Locked Loops (PLLs). The high transceiver count and rich DSP resources make the device a workhorse for parallel signal-processing and high-speed serial I/O applications. Architecturally, Stratix II GX devices use an adaptive logic module (ALM)-based fabric, an 8-input fracturable LUT, and a column-based DSP/memory floorplan. Compared to Stratix II (non-GX) devices, the GX variant adds hardened PMA-capable transceivers directly bonded to the die, enabling 6.375 Gbps SERDES without consuming fabric logic. This architecture delivers a multi-GHz fabric with deterministic timing closure. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe Gen1, Serial RapidIO, SDI/HD-SDI), DSP co-processing, software-defined radio (SDR) baseband, and 1G/10G Ethernet MAC bridging. The device's combination of 6.375 Gbps transceivers and embedded DSP is well matched to multi-lane serial protocol bridges and pre-silicon ASIC prototyping. When designing with the EP2SGX60DF780I4, designers should carefully manage multi-gigabit transceiver PCB routing (controlled-impedance differential pairs, length matching, and AC-coupling capacitors on each lane), provide ample decoupling on VCCINT/VCCA and VTT rails, and ensure thermal management accounts for industrial-temperature operation in enclosed chassis. Power estimation should be performed in the Quartus II Early Power Estimator before PCB layout to size rails correctly. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated in a single place on the manufacturer datasheet, giving engineers a one-stop reference for part selection, sourcing, and PCB-level integration.
EP2SGX60DF780I4N - Stratix II GX FPGA, 60K LE, FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX60DF780I4N is a high-density Stratix II GX FPGA in the 780-pin FineLine BGA package, integrating 60,440 logic elements, 3,022 logic array blocks (LABs), and embedded transceivers for high-speed serial I/O. The device operates from a 1.2 V core supply on a 90 nm CMOS process and supports up to 364 user I/O pins, with built-in PCI Express, SATA, and multi-gigabit transceivers rated up to 6.375 Gbps per channel. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets hardware engineers implement arbitrary digital circuits using configurable logic blocks (CLBs/LABs), routing fabric, and dedicated hard-IP such as transceivers, memory blocks, and PLLs. FPGAs sit above ASICs in the semiconductor taxonomy for flexibility and below microcontrollers for raw parallel performance, occupying a unique position in the broader IC hierarchy: programmable logic device -> FPGA -> high-performance FPGA -> transceiver-equipped FPGA -> power management and signal processing subsystem. Key features include 60,440 logic cells (60440-Cell), 3,022 LABs, embedded 18x18 multipliers for DSP, and high-speed serial transceivers ideal for serial RapidIO, XAUI, and PCIe designs. The 780-pin FBGA package offers fine-pitch 1.0 mm ball spacing in a 29 x 29 mm footprint and supports industrial temperature operation from -40C to +100C (per the I4 suffix). The Stratix II GX architecture uses adaptive logic modules (ALMs) that pack more logic per area than the original Stratix I family. The transceiver blocks support multiple high-speed serial protocols natively, enabling protocol bridging and backplane designs without external PHY chips. The part is lead-free and RoHS compliant per the datasheet. Typical applications include high-speed serial interface bridging (PCIe, SATA, XAUI), DSP coprocessors in telecom infrastructure, military and aerospace signal processing, and high-end ASIC prototyping. The integrated transceivers make this FPGA especially suitable for line-card designs in wired telecom. When designing with this FPGA, pay attention to power-rail sequencing and use the Stratix II GX HardCopy companion for production volumes. The 780-ball FBGA requires careful PCB layout with controlled-impedance traces and microvia stackups to achieve multi-gigabit signal integrity. This page synthesizes verified distributor pricing, drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX60E1152C - Stratix II GX FPGA 60K LE BGA-1152 | Intel
The Intel (formerly Altera) EP2SGX60E1152C is a Stratix II GX family Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA package, integrating approximately 60,000 logic elements (LEs) and embedded transceivers optimized for high-speed serial I/O. The device combines a rich logic fabric, on-chip memory, and 4.5 Mbps embedded multipliers (DSP blocks) with up to 20 multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to configure arbitrary digital logic, interconnect, and I/O after silicon fabrication. Within the broader taxonomy, the EP2SGX60E1152C belongs to the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> digital IC -> semiconductor. The Stratix II GX sub-family specifically targets high-bandwidth serial connectivity applications, integrating hardened PHY macros alongside the general-purpose fabric to simplify protocol implementation. Key features of the EP2SGX60E1152C include 60440 logic elements organized into ALMs, 2544192 bits of on-chip RAM, 534 user I/O pins, and transceiver support operating between 600 Mbps and 6.375 Gbps per channel. The device is fabricated in a 90 nm process node, with on-chip termination, dynamic phase alignment for transceivers, and embedded PCI Express hard IP blocks to reduce logic usage for common interconnect standards. From an architectural standpoint, the Stratix II GX uses an ALM-based adaptive logic module that yields roughly 40 percent higher logic density than 4-input LUT architectures. Combined with dedicated DSP blocks for signal processing and TriMatrix on-chip memory structures, the EP2SGX60E1152C achieves an attractive balance of logic, memory, and serial bandwidth per watt for high-throughput systems. Typical applications include high-end communications line cards with multi-gigabit serial links, ASIC prototyping for protocol verification, high-performance DSP pipelines for radar and image processing, ASIC-replacement designs in storage area networks, and broadcast video processing. The Stratix II GX is also widely used in industrial test equipment where dense logic and serial bandwidth converge in a single device. When designing with this FPGA, pay careful attention to power-rail sequencing requirements and decoupling strategy. The 1152-ball BGA package requires a multi-layer PCB with controlled-impedance routing for the high-speed serial lanes, and the Quartus II design software should be used for place-and-route to achieve timing closure on the transceiver channels. This page consolidates distributor availability, drop-in compatible alternatives from the same Stratix II GX family, and practical PCB layout notes that complement the manufacturer datasheet and Quartus II device handbook.
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
The Intel EP2SGX60EF1152C3 is a high-density Stratix II GX family FPGA built on a 90 nm process, integrating 60,440 logic elements (LEs) and 534 user I/Os in a 1152-ball FineLine BGA (FC-FBGA) package measuring 35 mm x 35 mm. It features 3,022 LABs/CLBs, 2,544,192 bits of embedded memory, 36 transceiver channels operating up to 6.375 Gbps, and an internal frequency rated at 717 MHz with 816.9 MHz maximum performance, all powered from a 1.2 V core supply. The device belongs to the Stratix II GX family which adds embedded transceivers for high-speed serial I/O. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits through a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. In the system hierarchy, FPGAs sit above general-purpose microcontrollers and below ASICs in terms of design flexibility, offering hardware-level parallelism and reconfigurability for applications requiring custom high-speed data paths, signal processing, or protocol bridging. Stratix II GX specifically targets communications infrastructure where multi-gigabit serial transceivers eliminate the need for external PHY chips. Key differentiators of the EP2SGX60EF1152C3 include 36 embedded transceivers supporting PCI Express, Serial RapidIO, XAUI, CEI-6G, and Custom (GIGE) standards; 252 (18x18) multipliers for high-throughput DSP; an 8-input adaptive logic module (ALM) architecture that improves logic utilization by ~25% versus the prior Stratix generation; and dynamic phase alignment on transceivers to simplify PCB layout for high-speed serial channels. The 35x35 mm FC-FBGA-1152 footprint exposes a wide 534 I/O count plus 20 dedicated transceiver channels plus 16 additional high-speed differential pairs, ideal for systems requiring both high I/O density and multi-gigabit serial connectivity. Typical applications include high-end telecommunications line cards with multi-protocol backplane aggregation, broadcast video routers using SDI/HD-SDI/3G-SDI, military radar and signal processing, and PCI Express Gen1 endpoint designs. The 6.375 Gbps transceiver ceiling and 36-channel aggregation make this device well-suited for systems previously built with multiple FPGAs plus external transceivers. Designers can implement line-side SERDES, crossbar switching, and protocol bridging within a single chip, reducing board area and BOM cost. Design considerations for the EP2SGX60EF1152C3 include careful PCB stackup planning for the 1152-ball BGA, dedicated transceiver power filtering, Quartus II software support, and the need for configuration memory (EPCS) for non-volatile bitstream storage. The device requires multiple supply rails (1.2 V core, 2.5 V/3.3 V I/O, and dedicated transceiver analog supplies VCCA, VCCP, VCCR). Thermal management via heatsink or forced airflow is recommended because Stratix II GX can dissipate 15-25 W in typical operating conditions. This page synthesizes distributor pricing, package dimensions, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for the EP2SGX60EF1152C3.
EP2SGX60EF1152C3N - 60K LEs Stratix II GX FPGA | Intel | 1152-BBGA
The Intel (formerly Altera) EP2SGX60EF1152C3N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) with 60,440 logic elements, 2,544,192 bits of embedded memory, and integrated 3.125 Gbps transceivers, packaged in a 1152-ball flip-chip BGA. It is fabricated on a 90 nm process technology with a 1.2 V core supply and operates up to a maximum internal frequency of 717 MHz with a 0.40 ns propagation delay. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnect via a hardware description language (HDL). FPGAs occupy a tier in the semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They offer parallel processing, deterministic timing, and hardware-level reprogrammability that microcontrollers and DSPs cannot match for high-throughput, low-latency signal processing. The EP2SGX60EF1152C3N integrates 3022 logic array blocks (LABs) with 534 user I/Os, four phase-locked loops (PLLs), and embedded multiplier blocks (18x18) for DSP arithmetic. The device is offered in the C3 speed grade (commercial, -3 speed bin) and ships in a 35 mm x 35 mm 1152-pin FC-FBGA with 1.0 mm ball pitch, providing ample I/O for high-bandwidth memory interfaces and parallel data acquisition. The GX suffix denotes integrated multi-gigabit transceivers. Stratix II GX transceivers support serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI at up to 3.125 Gbps. The combination of high logic density, embedded memory, hard IP for DSP, and serial transceivers makes the EP2SGX60EF1152C3N a single-chip solution for protocol bridging, high-speed data aggregation, and signal processing. The 90 nm CMOS process delivers a balance of speed and power for telecom, military, and high-end industrial systems. Typical applications include 10G Ethernet line card aggregation, wireless baseband processing, radar and SIGINT front ends, high-speed test instrumentation, and military secure communications. Design flow uses the Quartus II design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation for the device. When designing with the EP2SGX60EF1152C3N, ensure PCB layout follows Intel's 1152-BGA flip-chip escape rules with via-in-pad or microvia stack-ups for signal-integrity. Thermal management requires an adequate thermal pad connection to the PCB inner copper plane to keep junction temperature within the 100C commercial limit. The C3 speed grade is one step below the fastest C4 and C5 bins; verify timing closure against your target fMAX before committing to the bin. This page consolidates distributor pricing, same-brand Stratix II GX alternates, and practical Quartus II design notes not found in the device datasheet alone.
EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152C4 is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA package, providing 60,440 equivalent logic elements, 2,544,192 bits of embedded RAM, and 534 user I/O pins. The device integrates up to 12 transceivers operating at 6.375 Gbps and is fabricated on a 90 nm process with a 1.15 V to 1.25 V core supply, according to the manufacturer datasheet family documentation. The "C4" speed grade targets commercial-temperature designs (0C to 85C ambient). A Field Programmable Gate Array is a programmable logic device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory blocks. Within the broader programmable-logic taxonomy, an FPGA sits between a CPLD (smaller, non-volatile, deterministic timing) and an ASIC (mask-programmed, highest density, lowest unit cost). The Stratix II GX family is engineered for high-speed serial I/O and DSP-intensive applications such as wireline communications, broadcast video, and military signal processing. Key features include 3022 LABs/CLBs, 24 (7+11) embedded 18-bit x 18-bit multipliers, embedded TriMatrix memory blocks distributed throughout the fabric, and 12 full-duplex multi-gigabit transceivers (MGTs) that natively support PCI Express, Serial RapidIO, XAUI, and CPRI protocols. The 1152-pin FC-FBGA package (35 mm x 35 mm body, 1.0 mm pitch) supports high I/O count and high transceiver ball-out. The part is lead-free (Pb-free) and RoHS compliant per the manufacturer product page. Typical applications include 10 Gbps wireline interfaces, software-defined radio baseband processing, ASIC prototyping, high-speed data acquisition, and PCI Express Gen1 endpoint cards. The combination of abundant logic, large on-chip memory, and multi-gigabit transceivers makes the device well suited for systems that require parallel DSP and serial connectivity on the same die. The "C4" speed grade is approximately 7%-10% slower than the fastest "C5" / "C6" grades but offers lower cost for designs that do not require the highest fmax. When designing with this device, plan power sequencing carefully: the 1.2 V core, 2.5 V/3.3 V auxiliary, and 1.2 V/1.5 V transceiver supplies must ramp in a defined order to avoid latch-up. Use at least eight PCB layers with continuous ground and power planes, and follow the Altera Stratix II GX Handbook decoupling recommendations for the 1152-FBGA package. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II GX family, and practical design notes that are not duplicated on the manufacturer datasheet.