FPGA & CPLD
제품 (6666)
EP3CLS100U484C8 - Cyclone III LS FPGA 100K LE U484 BGA | Intel
The Intel (formerly Altera) EP3CLS100U484C8 is a Cyclone® III LS family low-power FPGA delivering 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 maximum user I/O pins in a 484-ball UFBGA (19 x 19 mm, 0.8 mm pitch) package. It is fabricated on a 65 nm CMOS process and operates from a 1.2 V core supply. The Cyclone III LS family adds dedicated security features such as bitstream encryption, JTAG protection, and advanced tamper detection, making this device especially suited for safety- and security-conscious embedded designs. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O cells. Unlike an ASIC, an FPGA's function is defined by user-loaded configuration data, allowing hardware re-programmability. The Cyclone III LS family sits in the Intel FPGA hierarchy as follows: FPGA -> programmable logic device -> SRAM-based FPGA -> low-power FPGA with hardware security -> Cyclone series -> Cyclone III LS, optimized for industrial, automotive, and communications applications where both low static power and IP protection are required. Key features of the EP3CLS100U484C8 include up to 100,448 logic elements, 4,451,328 bits of embedded RAM (M9K blocks), 66 embedded 18 x 18 multipliers, four PLLs, and 278 maximum user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and integrates dedicated hard IP for PCI Express (x1, x2, x4 Gen1) and external memory interfaces for DDR/DDR2/QDRII SRAM. Maximum internal operating frequency is specified at 402 MHz by manufacturer data. The Cyclone III LS architecture combines a fine-grained 4-input LUT fabric with dedicated routing, on-chip termination (OCT), and a security co-processor for AES-256 bitstream encryption. Compared to the original Cyclone III family, the LS variant adds configuration bitstream authentication and active tamper-detection pins, allowing secure field upgrades and protection against cloning. Static power consumption is markedly reduced versus Cyclone III, enabling fan-less industrial designs. Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive driver-assistance ECUs, secure communications equipment, and portable medical instrumentation. Its security block also makes it suitable for payment terminals and IP-protected embedded controllers. When designing with this FPGA, follow the Intel Cyclone III LS Device Handbook recommended decoupling scheme (typically 100 uF + 10 uF + 100 nF per power rail) and respect the 0.8 mm BGA pitch constraints by using at least 6-layer PCB stack-up with microvia-in-pad for breakout routing. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3CLS100U484C8N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS100U484C8N is a low-power, high-volume Cyclone III LS family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (UBGA-484) package. It integrates 100,448 logic elements (LEs), 4,451,328 bits of embedded memory (approximately 4.4 Mbit), and 278 maximum user I/O pins, making it suitable for cost-sensitive, high-volume applications that require a balance of logic density, low static power, and moderate transceiver bandwidth. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory, all user-defined via a hardware description language such as Verilog or VHDL. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering post-fabrication flexibility without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low-power designs (lower static power than the Cyclone III family), while the LS sub-family adds dedicated security and configuration features. Key specifications for the EP3CLS100U484C8N include a 1.2 V core supply voltage, commercial-grade temperature range (C8 speed grade), support for up to 278 user I/Os across 8 I/O banks, and 4 PLLs. The device also integrates 100,448 logic elements, organized as 4,451 logical array blocks (LABs) and 100,448 adaptive logic modules (ALMs), plus dedicated 18x18 multipliers supporting DSP-style operations. Architecturally, the Cyclone III LS uses a 60 nm low-K process and a hierarchical routing structure that balances timing closure with die-area efficiency. The 'LS' suffix differentiates it from the standard Cyclone III by adding features such as bit-stream encryption, JTAG-based configuration, and enhanced SEU mitigation for industrial environments. Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front ends, factory automation I/O expansion, and portable medical instrumentation. The combination of 4.4 Mbit of block RAM and embedded multipliers also makes it a practical DSP coprocessor for mid-range signal-processing tasks. When designing with this device, note that the BGA-484 footprint requires a 4- or 6-layer PCB with laser-drilled or microvia fan-out; standard JEDEC SOIC reflow profiles are supported, but BGA inspection (X-ray or AOI) is mandatory for production yield. Plan configuration memory separately - Cyclone III LS uses SRAM configuration, so an external EPCS or EPCQ flash device is required to store the bitstream. This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone III LS family and the larger Cyclone III family, and practical design notes that complement (and do not replace) the manufacturer datasheet.
EP3CLS100U484I7 - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS100U484I7 is a low-power Cyclone III LS Field Programmable Gate Array with 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball FineLine BGA (UBGA) package. It is fabricated on TSMC's 60 nm low-power process and operates from a 1.2 V core supply with industrial temperature range support. A Field Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and embedded hard IP such as block RAM, DSP blocks, and PLLs. FPGAs sit within the broader category of programmable logic devices (PLDs) under the digital semiconductor hierarchy, offering parallel hardware processing flexibility that microcontrollers and DSPs cannot match. The Cyclone III LS family specifically targets low-static-power designs where battery life or thermal dissipation is critical. Key features of the EP3CLS100U484I7 include 100,448 logic elements, 4,451,328 total RAM bits distributed across M9K memory blocks, 66 embedded 18x18 multipliers, 4 PLLs, and 278 maximum user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Industrial temperature grade (I7 suffix, -40C to +100C junction) makes it suitable for harsh environment deployments. Cyclone III LS devices employ a fine-grained 8-input adaptive logic module (ALM) architecture that improves logic packing efficiency versus the 4-input LUT architecture of older Cyclone families. The dedicated 18x18 multiplier blocks enable cost-effective DSP workloads such as FIR filters and FFT engines without consuming general-purpose logic. Configuration is via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG modes using industry-standard 16-64 Mbit EPCS or EPCQ configuration memories. Typical applications include industrial motor control, factory automation HMIs, portable medical imaging, video surveillance with on-chip buffering, low-power wireless baseband processing, and military/aerospace signal processing. The 484-UBGA package with 1.0 mm ball pitch is footprint-compatible across the Cyclone III family (EP3C25 through EP3C120 in the same package), enabling migration paths as designs scale. When designing with this FPGA, pay close attention to power planning: Cyclone III LS offers PowerPlay early power estimation tools that should be run after RTL coding and before PCB layout to size decoupling budgets. The 484-UBGA package requires 4-6 layer PCB stackup with 1.0 mm pitch escape routing; signal integrity simulations are recommended for DDR2/3 memory interfaces running above 200 MHz. This page synthesizes distributor inventory, footprint-compatible same-package alternatives, and practical power/thermal design notes not consolidated on the manufacturer datasheet.
EP3CLS100U484I7N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS100U484I7N is a Cyclone III LS family field-programmable gate array (FPGA) IC delivering 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 maximum user I/O pins in a 484-ball fine-pitch BGA (UBGA) package. It is built on TSMC's 65 nm low-power process, targeting low-cost, low-power, high-volume applications such as industrial control, video processing, and wireline communications. The 'LS' (Low Static power) sub-family adds enhanced security features including design separation, configuration bit-stream encryption, and JTAG protection for anti-tamper designs. An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory, DSP, and I/O resources. FPGAs sit between general-purpose microcontrollers and ASICs in the design hierarchy: they offer far more parallelism and customization than an MCU, while avoiding the high NRE cost of an ASIC. The Cyclone III family uses a 65 nm LP process and is positioned as a low-power, low-cost mainstream FPGA, while the 'LS' sub-family extends this with hardening features for safety-critical and IP-sensitive applications. Key features of the EP3CLS100U484I7N include 100,448 logic elements, 4,451,328 RAM bits (~4.4 Mbit), 278 user I/O pins, and 4 PLLs supporting multiple clock domains. The device operates from a 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O (1.2 V to 3.3 V). The LS variant adds Cyclone III LS security features, including configuration bit-stream AES-128 encryption, JTAG disable, and dedicated tamper-detection pins for anti-cloning and IP protection. Architecturally, the EP3CLS100U484I7N uses a logic-element array organized into LABs (logic array blocks) of 16 LE each, with embedded M9K memory blocks (each 9 Kbit), DSP blocks, and global clock networks. The fabric supports up to 24 DSP blocks and 432 M9K memory blocks. Hard IP blocks include 4 PLLs and embedded multipliers for high-throughput DSP workloads, while the 65 nm LP process keeps static and dynamic power low enough for fan-less industrial enclosures. Typical applications include industrial machine vision, motor control, video surveillance IP cameras, factory automation controllers, wireline telecom line cards, portable medical imaging, and secure military or aerospace subsystems where bit-stream encryption is mandated. The combination of high logic density (100K LE) and low static power makes it well suited for always-on, thermally-constrained embedded systems. Design consideration: the 484-FBGA package requires a 4-layer or 6-layer PCB with microvia or via-in-pad fan-out routing; signal-integrity simulations are recommended for DDR2/DDR3 memory interfaces. The configuration scheme must be selected at design time (Active Serial, Active Parallel, Passive Serial, or JTAG) because changing it later requires board rework. This page synthesizes drop-in pin-compatible alternatives, distributor pricing, design considerations, and security-feature comparisons that go beyond the Cyclone III LS device datasheet alone.
EP3CLS150F484C7 - Cyclone III 150K LE FPGA | 484-FBGA | Intel
The Intel EP3CLS150F484C7 is a low-power Cyclone III FPGA delivering 149,760 logic elements, 613,856 bits of embedded memory and 210 user I/Os in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. Built on a 60 nm TSMC low-power CMOS process, the part belongs to the Cyclone III LS sub-family, which adds hardware AES encryption and true random number generation for design-security applications. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic through configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as block RAM, DSP blocks, and PLL/clock managers. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy: an FPGA delivers ASIC-class parallelism and throughput while remaining fully re-programmable, making it ideal for prototyping, low-volume production, and applications where standards or algorithms evolve after deployment. Cyclone III LS devices deliver up to 200 MHz performance and consume roughly 25% less dynamic power than the original Cyclone II family. The device integrates 4 PLLs, dedicated DDR/DDR2/QDR II memory controllers, and high-speed LVDS I/O support, simplifying interface to external memory and high-bandwidth peripherals. Configuration is supported through JTAG, passive serial, active serial, and fast parallel modes, while the on-chip AES-256 engine and 64-bit volatile key provide robust bitstream protection against cloning or reverse engineering. Typical applications include industrial motor control, video surveillance and image processing pipelines, software-defined radio front ends, portable medical instrumentation, and secure communications equipment. The 484-FBGA package combined with the Cyclone III LS feature set makes the part especially attractive where small footprint, low power and design security must coexist. When designing with this device, pay careful attention to banked I/O supply planning: VCCIO must be supplied per I/O bank, and VCCAUX and VCCINT require clean, low-ripple rails to meet jitter and phase-noise specifications. Use Intel's Quartus II (or its supported successors) for synthesis, place-and-route and timing closure to avoid incomplete bitstream generation. This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, pin-compatible Cyclone III alternatives, and practical design notes that extend beyond the manufacturer datasheet to support component selection, sourcing and PCB bring-up.
EP3CLS150F484C7N - Cyclone III LS FPGA 150K LE | Intel / Altera
The Intel / Altera (formerly Altera) EP3CLS150F484C7N is a Cyclone III LS family Field-Programmable Gate Array (FPGA) with 150,848 logic elements, fabricated on a low-power 65 nm process and housed in a 484-ball FineLine BGA (FBGA) package. The device integrates 6,137,856 bits of embedded memory, 210 DSP blocks, and supports up to 226 user I/O pins operating at 1.2 V core with 437.5 MHz maximum internal performance. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LABs), programmable routing, and embedded hard IP such as DSP blocks and RAM into a single semiconductor IC. FPGAs sit at the top of the digital logic hierarchy (FPGA -> programmable logic -> ASIC alternative -> semiconductor IC) and are widely used to implement parallel data processing, custom bus interfaces, and hardware acceleration functions without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low-power, security-enhanced applications with features such as bitstream encryption and CRC error detection. Key features of the EP3CLS150F484C7N include 9,428 logic array blocks (LABs), 226 maximum user I/Os, four phase-locked loops (PLLs), and support for external memory interfaces including DDR/DDR2 SDRAM. The device operates over the commercial 0 °C to 85 °C junction temperature range (C-grade) and provides 1.2 V core operation with hot-socketing support and power-on reset. The 484-FBGA package uses a 1.0 mm ball pitch and is backward-compatible with the Cyclone III GX footprint family for board reuse. In terms of architecture, the Cyclone III LS family uses a 65 nm TSMC process with a logic-structure optimized for low static and dynamic power. Compared with the original Cyclone III, the LS variant adds bitstream AES encryption, JTAG-based configuration, and enhanced SEU/CRC detection that suits safety-critical designs. Designers can map IP cores, soft microcontrollers (NIOS II), and DSP blocks through Intel Quartus II design software. Typical applications include industrial motor control, factory automation, video surveillance, automotive infotainment prototyping, software-defined radio (SDR), and embedded vision. Its combination of moderate logic density (150 K LE), low power, and security features makes it well-suited for cost-sensitive designs that previously required ASIC investment. When designing with the EP3CLS150F484C7N, allocate sufficient PCB layers (typically 4 to 6) to maintain signal-integrity for LVDS and DDR2 memory interfaces, and observe the 1.0 mm BGA pitch clearance for via-in-pad and microvia fan-out. Decoupling must follow the Quartus II pin connection guidelines for clean power-rail delivery. This page synthesizes distributor stock and pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found on the manufacturer product page.
EP3CLS150F484C8 - 150K LE Cyclone III LS FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS150F484C8 is a low-power Cyclone III LS family Field-Programmable Gate Array (FPGA) with 150,848 logic elements, 6,137,856 bits of embedded memory, and 210 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. It is built on a 65 nm process, operates from a 1.2 V core supply, and is rated for a maximum internal clock frequency of approximately 402 MHz, making it a power-optimized mid-density programmable logic device. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, embedded memory, and DSP blocks that can be re-programmed by the designer after manufacture. FPGAs belong to the broader category of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-defined processing. The Cyclone III LS family specifically targets low-static-power applications that previously required discrete glue logic or low-density ASICs. Key features include 150,848 logic elements, 6137856 bits (about 6.14 Mbit) of embedded SRAM, four phase-locked loops (PLLs), and high-speed LVDS I/O support. The device also integrates dedicated hardware multipliers for DSP, a configuration controller supporting multiple boot modes (including external flash and JTAG), and security features such as configuration bitstream encryption via AES. Operating junction temperature is 0 C to 85 C (commercial grade). The Cyclone III LS architecture uses an SRAM-based configuration cell and a low-k 65 nm process, which reduces dynamic power by roughly 50 percent compared to the prior-generation Cyclone II family. The 484-ball FBGA package exposes 8 dedicated clock/PLL pins, multi-standard I/O banks that support LVCMOS, LVTTL, SSTL, and LVDS signaling, and a footprint compatible with the wider Cyclone III LS density ladder (EP3C5/16/25/40/55/80/120/150). Typical applications include industrial motor control, factory automation I/O expansion, low-power video processing bridges, machine-to-machine gateways, and portable instrumentation. The combination of mid-range logic capacity and low static power makes it well suited to battery-backed or fan-less embedded systems. When designing with this FPGA, plan I/O bank assignments before PCB layout, since each bank has a fixed VCCIO rail that constrains compatible logic levels. Use the Altera (now Intel) Quartus II design suite, version 13.0 or later in the 13.x legacy line, for synthesis, place-and-route, and bitstream generation; later Quartus versions may require a Cyclone III device-library update. This page synthesizes distributor pricing, package-level alternatives that share the 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
EP3CLS150F484C8N - Cyclone III LS FPGA, 150K LE, 484-FBGA | Intel
The Intel EP3CLS150F484C8N is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) from the Cyclone III LS family, featuring 150,848 logic elements, 6,137,856 bits of embedded memory, and a 484-ball FineLine BGA (FBGA) package. Built on a 65nm low-power process, the device is specified for a commercial operating temperature range (C8 speed grade) and operates with a core voltage of 1.2 V. The 484-FBGA package supports high I/O density with 226 to 327 user I/Os depending on configuration, making it well-suited for I/O-rich designs. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits through configuration of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP resources. The Cyclone III LS family sits in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. FPGAs provide hardware parallelism, real-time deterministic processing, and rapid design iteration that microcontrollers and ASICs cannot match. Key features of the EP3CLS150F484C8N include 150,848 logic elements, 342 M9K memory blocks, 6,137,856 total RAM bits, 210 embedded 18x18 multipliers for DSP operations, and 4 phase-locked loops (PLLs) for clock management. The Cyclone III LS family is designed for low static and dynamic power consumption compared to earlier Cyclone generations, making it attractive for power-sensitive applications. The device also includes support for high-speed external memory interfaces including DDR, DDR2, and QDRII+ SRAM. Architecturally, the EP3CLS150F484C8N uses a LUT-based logic fabric with dedicated routing resources, embedded memory blocks (M9K), embedded multipliers, and configurable I/O elements supporting multiple I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device is configured via SRAM-based configuration memory, requiring an external configuration flash or download cable on every power-up. Typical applications include industrial motor control and factory automation, video processing and display controllers, automotive infotainment prototypes, telecommunications line cards, low-power DSP co-processing, and software-defined radio front-ends. Designers often select the Cyclone III LS family when balancing cost, low power, and the ability to integrate custom logic and DSP alongside a soft processor core. A critical design consideration is power supply sequencing: the Cyclone III LS family requires specific ramp rates and decoupling to prevent device damage. Designers must follow the manufacturer's guidelines for VCCINT, VCCA, and VCCIO supply ramp sequencing. Configuration is also essential - selecting the wrong configuration scheme can lead to design instability.
EP3CLS150F484I7 - Cyclone III 150K LE FPGA | Intel | 484-FBGA
The Intel EP3CLS150F484I7 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) featuring 150,000 logic elements, 6,480 Kbits of embedded memory, and 484-ball FineLine BGA packaging. It operates across the industrial temperature range (-40C to +85C) and is built on a low-power 60 nm process, delivering an excellent balance of density, performance, and power for cost-sensitive applications. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, programmable interconnects, and embedded resources such as memory blocks, multipliers, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, but offer substantially higher logic density, parallel processing, and DSP capability, making them the workhorse of custom digital hardware design. The Cyclone III family specifically targets low-power, high-volume applications with logic densities from 5K to 200K logic elements. Key features of the EP3CLS150F484I7 include 150,000 logic elements (LEs), 6,480 Kbits of embedded RAM, 166 DSP blocks (18x18 multipliers), 4 phase-locked loops (PLLs), and 226 maximum user I/O pins. The 'LS' variant adds a robust security feature set including configuration bitstream encryption and JTAG-based read-back protection via on-chip Advanced Encryption Standard (AES) acceleration. The 484-ball FBGA package uses a 1.0 mm ball pitch suitable for multi-layer PCBs with standard assembly tolerances. Architecturally, the Cyclone III LS device integrates eight I/O banks with programmable drive strength, slew rate, and bus hold. The Logic Array Block (LAB) consists of 16 Logic Elements, each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded Memory blocks (M9K) provide true dual-port operation at up to 315 MHz, and DSP blocks operate at up to 260 MHz for fixed- and floating-point arithmetic. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment systems, factory automation controllers, portable medical instrumentation, and communications infrastructure. The wide I/O count and large memory bandwidth also make this device suitable for video bridging and protocol conversion. The 'LS' security features particularly suit applications where bitstream IP protection is critical, such as military, aerospace, and licensed commercial products. When designing with this device, verify that the Quartus II design tool supports the EP3CLS150F484I7 device variant. Power supply decoupling requires multiple bulk and high-frequency capacitors placed close to the device's VCCINT, VCCA, and VCCIO supply pins. Thermal management must account for the industrial -40C to +85C operating range, with adequate PCB copper and airflow to dissipate junction heat at high toggle rates. This page synthesizes Cyclone III LS datasheet parameters, drop-in alternative FPGA candidates, and practical board-level design notes not found in the manufacturer datasheet alone - including same-package F484 ball-map compatibility checks and recommended companion configuration memory.
EP3CLS150F484I7N - Cyclone III 150K LE FPGA | Intel | FBGA-484
The Intel (formerly Altera) EP3CLS150F484I7N is a low-power Cyclone III LS Field Programmable Gate Array with 150,848 logic elements, 6,137,856 bits of embedded memory, and 210 (18x18) hardware multipliers, housed in a 484-ball FineLine BGA (FBGA-484) package rated for the industrial temperature range (-40C to +100C). It belongs to the Cyclone III LS family, which adds dedicated security features (AES bitstream encryption, JTAG secure mode, configuration CRC) on top of the standard Cyclone III low-power FPGA architecture fabricated on TSMC's 65 nm low-power process. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic function is defined after manufacturing by loading a user-supplied bitstream into on-chip SRAM configuration memory. FPGAs occupy the middle ground between general-purpose microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). The Cyclone III LS specifically targets applications that require reconfigurable logic plus hardware root-of-trust: industrial motor control, secure communications, automotive driver assist, and medical imaging front-ends. Key features of the EP3CLS150F484I7N include 150,848 logic elements distributed across 9,428 LABs (logic array blocks), 6.14 Mbits of embedded SRAM (M9K blocks), 210 18x18 multipliers capable of up to 450 MHz DSP performance, 4 PLLs, 20 global clock networks, and up to 210 user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Power consumption is optimized for cost-sensitive high-volume applications through 1.0 V core operation and selectable I/O bank voltages. Architecturally, Cyclone III LS uses a 65 nm low-power CMOS process with a programmable interconnect fabric driven by SRAM configuration cells. The 'LS' suffix adds a tamper-resistant configuration subsystem including 256-bit AES encryption, a non-volatile security key, and a hardware JTAG block that can lock the device against readback. This makes the EP3CLS150F484I7N suitable for designs where IP protection is a contractual or regulatory requirement. Typical applications include industrial Ethernet switches, motor-control servo drives, video surveillance DVR back-ends, software-defined radio modems, low-cost ASIC prototyping, and PCI Express endpoint bridges. The 484-ball FBGA package supports moderate-density board layouts and reflow soldering at standard JEDEC J-STD-020 profiles. When designing with this device, allocate at least 4 configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK or AS data lines) and respect the differential clock input pair placement rules. Quartus II (or newer Intel Quartus Prime) software is required for synthesis, place-and-route, and bitstream generation. The 'I7' speed grade and 'N' lead-free suffix indicate an industrial-temperature, lead-free / RoHS-compliant device. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3CLS150F780C7 - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel
The Intel / Altera EP3CLS150F780C7 is a low-power Cyclone® III LS Field Programmable Gate Array delivering 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA package (29x29 mm, 1 mm pitch). It is fabricated on TSMC's 65 nm low-power process and targets cost- and power-sensitive applications where deterministic logic density and DSP performance are required. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and hard I/O peripherals. FPGAs occupy a distinct tier above microcontrollers (fixed hardware, firmware-defined) and below ASICs (fully custom silicon): they offer hardware-level parallelism, in-system reconfigurability, and time-to-market advantages over fixed-function ICs, at lower per-unit cost and faster turnaround than full ASIC development. The Cyclone III LS family extends this lineage with a low-static-power variant of Cyclone III, suitable for thermally constrained embedded, industrial, and battery-powered systems. Key features of the EP3CLS150F780C7 include 150,848 logic elements, 6,137,856 bits (748 Kbit) of embedded SRAM organized in M9K blocks, up to 413 user I/O pins with support for LVDS, LVTTL, SSTL, HSTL, and other single-ended/differential I/O standards, an integrated PLL count of four for clock management, and 1.2 V core operation with multi-rail support for I/O banks. The 780-FBGA package offers a 1 mm ball pitch and 29x29 mm footprint suitable for mid-complexity PCB designs. The Cyclone III LS architecture combines a logic element array, M9K memory blocks, 18x18 hardware multipliers (DSP blocks), and PLLs to deliver DSP throughput up to 142 GMACS. Static power is reduced versus the standard Cyclone III family through process tuning, while dynamic power benefits from Quartus II power optimization features. Typical applications include industrial machine vision, motor control and drives, video surveillance and image processing, software-defined radio front-ends, low-cost ASIC prototyping, and automotive driver-assistance prototypes. The wide temperature support and low-power design extend its use to outdoor and energy-constrained embedded platforms. When designing with this device, allocate sufficient PCB area for the 29x29 mm BGA and ensure the BGA fanout is routed to support 1 mm pitch escape routing. Use the Quartus II design suite for synthesis, place-and-route, and timing closure, and verify signal-integrity margins on high-speed LVDS and DDR2/3 memory interfaces. This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III/III LS family, and practical design notes for the EP3CLS150F780C7 that go beyond what the manufacturer datasheet alone provides.
EP3CLS150F780C7N - Cyclone III LS FPGA, 150K LE, FBGA-780 | Intel
The Intel (formerly Altera) EP3CLS150F780C7N is a low-power Cyclone III LS Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (29x29 mm body, 1.0 mm ball pitch). It integrates 150,848 logic elements (150,848 4-input look-up tables backed by 5,994 Kbits of embedded RAM), giving it a logic density tier typically deployed in mid-volume industrial, video, and motor-control designs where the family balances cost-per-logic against static power. As an FPGA, this device sits at the top of the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. Cyclone III LS is Intel's low-static-power variant of the Cyclone III family, fabricated on a 65 nm TSMC process with a 1.2 V core supply. Within the broader Cyclone III LS family, the device's 150K-LE density is the highest offered before stepping up to the Cyclone IV E/IV GX generations. Key differentiating specifications include 320 dedicated 18x18 hardware multipliers (suitable for DSP blocks at up to 437.5 MHz), 413 user I/O pins split across multiple I/O banks that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL interfaces, and four phase-locked loops (PLLs) for clock synthesis. External memory interfaces include dedicated hard controllers for DDR2 SDRAM and QDRII+ SRAM, enabling direct attachment without soft logic overhead. Architecturally, the device combines Logic Array Blocks (LABs) of 16 LEs each, M9K embedded RAM blocks (total 5,994 Kbits), and 18x18 multiplier blocks feeding a rich interconnect fabric. The -7 speed grade (C7 in the part number) positions this part for moderate-speed commercial designs; faster -8 and industrial -I7 grades also exist within the same package. Typical applications include industrial motor control, video processing pipelines (bridges, scalers, format converters), low-cost software-defined radio front-ends, factory automation controllers, and PCIe endpoint bridging. The combination of 320 multipliers and 5,994 Kbits of RAM makes it well-suited for parallel DSP workloads at a price point below mid-range FPGAs. When designing with this device, allocate at least four PCB layers for the 780-ball FBGA and follow Intel's recommended decoupling scheme (100 nF + 10 µF per VCC group). Programming is via JTAG or the Active Serial (AS) configuration port using industry-standard EPCS serial configuration devices. This page synthesizes distributor pricing, drop-in package-equivalent alternatives within the Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.
EP3CLS150F780C8 - Cyclone III LS FPGA 150K LE BGA-780 | Intel
The Intel (Altera) EP3CLS150F780C8 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) featuring 150,848 logic elements, 6,137,856 memory bits, and 413 user I/O pins housed in a 780-ball FineLine BGA package measuring 29 x 29 mm with 1 mm pitch. It is fabricated on a low-power 65 nm process and operates from a core supply of 1.2 V, supporting a maximum internal frequency of up to 402 MHz with commercial temperature grade 0 to 85 degrees C. A Cyclone III FPGA is a low-cost, low-power SRAM-based programmable logic device that combines configurable logic, embedded memory blocks, and high-speed I/O in a single chip. FPGAs sit in the programmable logic hierarchy alongside CPLDs, and are commonly deployed where parallel processing, custom interfaces, or hardware-accelerated signal paths are required. The Cyclone III LS sub-family specifically adds enhanced security and signal-integrity features for communications, industrial control, and military applications. Key specifications include 9,428 Logic Array Blocks (LABs), 4 embedded PLL blocks, dedicated multiplier blocks for DSP acceleration, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-pin FBGA package provides ample routing density for high-pin-count memory buses and parallel interfaces. The LS suffix indicates low-static-power variant targeting power-sensitive designs. Architecturally, the EP3CLS150F780C8 uses a Look-Up Table (LUT) based fabric with embedded M9K memory blocks (each 9 Kbit) totaling approximately 6.14 Mbit of on-chip RAM. The device supports configuration via JTAG, passive serial, active serial, and fast passive parallel modes. Hardware multipliers are organized into DSP blocks enabling efficient FIR filters and FFT engines for signal processing pipelines. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, telecom line cards, test-and-measurement instrumentation, and embedded vision systems. The large logic capacity and rich I/O mix make it suitable for custom peripheral aggregation in factory automation. The device is also widely used in education and prototyping where a generous logic budget is required at low unit cost. When designing with this FPGA, plan for a 3.3 V auxiliary supply for I/O banks and a clean 1.2 V core rail; decoupling requires bulk plus 0.1 uF high-frequency capacitors near each supply ball. For signal integrity on the 780-ball FBGA, use microvia or via-in-pad PCB technology to break out all 780 connections. This page synthesizes distributor pricing, drop-in Cyclone III LS variants, and practical board-level design notes that complement the manufacturer datasheet and existing XAIPART resource pages.
EP3CLS150F780C8N - Cyclone III LS FPGA 150K LE FBGA-780 | Intel
The Intel (Altera) EP3CLS150F780C8N is a low-power Cyclone III LS family Field-Programmable Gate Array with 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 total user I/O pins, fabricated on a 65 nm process and housed in a 780-ball FineLine BGA package. It operates from a 1.2 V core supply and supports a maximum internal clock frequency of 402 MHz, making it a mid-density logic fabric for cost- and power-sensitive programmable designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, multipliers, and programmable I/O cells that the designer wires up after manufacture using a hardware description language. FPGAs sit alongside microcontrollers, DSPs, and ASICs in the programmable logic hierarchy and are typically chosen when time-to-market, in-field reconfigurability, or parallel hardware acceleration matters more than per-unit silicon cost. The Cyclone III LS family specifically targets applications that require both high logic density and low static power. Key features of this part include 150,848 logic elements (LEs), approximately 6.14 Mbits of M9K embedded SRAM, dedicated 18-bit x 18-bit hardware multipliers for DSP, four general-purpose PLLs per device for clock synthesis, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The device also integrates a hard Memory Controller, SERDES-free LVDS pairs up to 875 Mbps, and PCI Express hard IP on selected package variants. The Cyclone III LS architecture combines a 65 nm low-power process with on-chip voltage regulation and an internal 1.0 V core, reducing dynamic power by roughly 30% versus the original Cyclone III series. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from EPCS or EPCQ flash devices, supporting fast field updates and remote reconfiguration over Ethernet or USB bridges. Typical applications include industrial machine vision and motor control, low-cost video processing, software-defined radio front-ends, PCIe endpoint cards, and prototyping for ASIC designs. Designers frequently pair this device with external DDR2 SDRAM, HDMI transmitters, Ethernet PHYs, and high-speed ADCs to build complete embedded systems on a single board. When designing with this FPGA, plan thermal dissipation early: at full utilization the device can consume 2-4 W. Use at least a 4-layer PCB with a continuous ground plane and 1 oz copper to spread heat, and follow Altera's decoupling guidelines of one 100 nF plus one 10 uF capacitor per VCCCT/VCCH/GND cluster. This page synthesizes distributor pricing, same-family Cyclone III drop-in alternatives, and practical Quartus II design notes not found in the bare datasheet.
EP3CLS150F780I7 - Cyclone III LS 150K LE FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP3CLS150F780I7 is a low-power Cyclone III LS Field-Programmable Gate Array with 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 user I/O pins, fabricated on a 65 nm process and housed in a 780-ball FineLine BGA (FBGA-780) package. It operates from a 1.2 V core supply, supports up to 4 multi-purpose PLLs per device, and is rated for the industrial temperature range (-40 °C to +100 °C junction). The Cyclone III LS family integrates dedicated hardware for cryptographic acceleration, including AES and 3DES engines, and a true random number generator, making it one of the lowest-power security-capable FPGAs in its class. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic in silicon after PCB fabrication, trading per-unit cost against design flexibility, parallelism, and time-to-market. FPGAs sit hierarchically between Application-Specific Integrated Circuits (ASICs) and microcontrollers: more flexible than ASICs but more power-efficient than software-driven CPUs for parallel DSP, interface bridging, and glue-logic tasks. The Cyclone III LS sub-family (the "LS" suffix denoting Low-power with Security) extends Cyclone III with hardware cryptographic blocks while retaining the static power of approximately 0.5 W typical at 65 nm. Key features include 150,848 logic elements (LEs), 6,137,856 embedded RAM bits, 413 user I/O pins, 4 PLLs, 1.2 V core supply, 65 nm process technology, and on-chip AES / 3DES / SHA / TRNG security accelerators. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through per-bank reference voltages, and offers configuration via JTAG, Active Serial, or Passive Parallel modes from external flash memory. Architecturally, the Cyclone III LS family uses a logic-element-based fabric with embedded M9K memory blocks, hardware multiplier blocks for DSP, and dedicated global clock networks tied to the PLLs. The 65 nm process and architectural gating reduce static power versus the original Cyclone III, while the LS variant adds a dedicated security block for protocol offload (TLS, IPsec, secure boot) without consuming general-purpose logic resources. Typical applications include industrial motor control, video surveillance and image processing, industrial protocol bridging (PROFINET, EtherCAT), low-cost digital signal processing front-ends, secure IoT gateways, and telecommunications line cards. The 780-FBGA package provides abundant I/O for parallel video or memory interfaces while keeping PCB footprint reasonable. When designing, ensure the 1.2 V core rail uses at least 10 µF of bulk ceramic decoupling within 10 mm of the power pins and that each PLL analog supply (VCCA_PLL) is filtered through a ferrite bead. Industrial temperature grade (the "I7" speed-grade identifier) means 100 °C junction maximum; derate output drive strength in tightly enclosed enclosures. This page combines distributor pricing, pin-compatible alternatives, and PCB layout guidance drawn from the manufacturer datasheet and authorized distributor listings - information not consolidated on a single OEM page.
EP3CLS150F780I7N - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP3CLS150F780I7N is a low-power Cyclone III LS field-programmable gate array (FPGA) with 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 maximum user I/O pins, fabricated on a 65 nm low-power process and packaged in a 780-ball FineLine BGA (FBGA-780). The 'LS' suffix denotes the Cyclone III LS sub-family, which adds dedicated security features (configuration bitstream AES-128/256 decryption, JTAG security, and tamper detection) on top of the standard Cyclone III LE fabric, targeting defense, industrial control, and secure communications designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks (M9K/M144K), PLLs, and high-speed I/O serializers. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: like microcontrollers they are software-programmed and shipped in volume, but like ASICs they implement parallel hardware logic at clock rates up to hundreds of MHz. Cyclone III LS sits in the low-power, cost-optimized segment of the FPGA taxonomy (FPGA -> programmable logic -> semiconductor IC -> integrated circuit) and competes with Xilinx Spartan-6 and Lattice ECP3 families. Key features of the EP3CLS150F780I7N include 150,848 logic elements (LEs), 6,137,856 embedded memory bits organized into M9K blocks, four general-purpose PLLs, 413 maximum user I/O supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, and up to 437 MHz internal operation on a 1.2 V core supply. The LS security engine performs bitstream encryption, JTAG lockdown, and side-channel resistance for IP protection. The 780-FBGA package exposes the largest I/O count in the EP3CLS150 family and integrates an exposed thermal pad for board-level heat spreading. Architecturally, the Cyclone III LS combines a 65 nm SRAM-based logic fabric with hard IP blocks (18x18 multipliers, M9K RAM, PLLs, and external memory controllers) to balance logic density, DSP throughput, and power. The LS series additionally integrates a configuration AES engine and tamper-monitor pins (TDI/TMS/TRST-conditioned secure JTAG), making it suitable for designs that must protect firmware IP at rest and resist physical tampering. Typical applications include industrial motor control, secure communications gateways, software-defined radio (SDR) baseband, machine-vision pre-processing, military/aerospace secure embedded systems, and FPGA-based PCIe endpoint prototyping. The 780-ball package supports the highest I/O count in the family, so it is preferred for memory-intensive or high-bandwidth designs that need 16-bit DDR2/DDR3 external memory interfaces. When designing with this part, plan for configuration via JTAG or passive serial from a configuration flash (EPCS), and budget for the 1.2 V core, 2.5 V/3.3 V I/O bank, and 1.0 V PLL analog supplies. The exposed pad must be soldered to a properly sized copper pour for thermal dissipation; without it, junction temperature can exceed 100 C under sustained high-utilization workloads. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical FPGA design notes not found in the standalone manufacturer datasheet, giving engineers and procurement teams an information-density advantage.
EP3CLS200F484C7 - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS200F484C7 is a low-power, high-logic-density Cyclone III LS family FPGA housed in a 484-ball FineLine BGA package (23 x 23 mm, 1.0 mm pitch). The device integrates 198,464 logic elements, 12,408 LABs, 226 maximum user I/Os, and 8,211,456 bits of embedded RAM, and is fabricated on a 1.2 V CMOS process optimized for low static and dynamic power. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs/LABs), programmable interconnect, block RAM, DSP blocks, and programmable I/O elements surrounding a central fabric. The FPGA class sits hierarchically within programmable logic devices (PLDs), then within digital logic ICs, then within integrated circuits (ICs) and ultimately within semiconductors. Compared to an ASIC, an FPGA offers hardware-reconfigurable logic, shorter time-to-market, and in-field re-programmability. The Cyclone III LS sub-family is Intel's lower-power variant of the Cyclone III generation, targeted at cost-sensitive, power-constrained designs. Key features of the EP3CLS200F484C7 include 198,464 logic elements, 8 Mbits of embedded memory (RAM bits), support for multiple I/O standards including LVDS, LVCMOS, SSTL and HSTL, and a low-power 1.2 V core supply. The device supports configuration via JTAG, passive serial, or active serial modes using commodity configuration memories. Its 484-ball FBGA package is the densest Cyclone III LS option in the family and is widely used on Altera/Intel Cyclone III development kits. Typical applications include industrial motor control and machine vision, factory automation and protocol bridging, low-cost video processing pipelines, software-defined radio front-ends, and portable/handheld test equipment. The Cyclone III LS family is also commonly used as a prototyping vehicle for ASIC emulation and as a glue-logic replacement for multiple discrete CPLDs. When designing with the EP3CLS200F484C7, carefully follow Intel's power-decoupling and PCB-layout recommendations (especially the on-board decoupling scheme for the VCCINT and VCCIO rails) to achieve the rated low-power performance. The Quartus II design software (legacy) or the maintained Intel Quartus Prime support packages are used for synthesis, place-and-route, and bitstream generation. This page synthesizes current distributor pricing and stock, drop-in FPGA alternatives from the same Cyclone III LS family, and practical design notes not found in the standalone datasheet.
EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel
The Intel (Altera) EP3CLS200F484C7N is a Cyclone III LS family Field Programmable Gate Array (FPGA) featuring 198,464 logic elements, 8,211,456 bits of embedded memory, and 210 embedded 18x18 multipliers, housed in a 484-ball FineLine BGA (FBGA-484) package. It operates from a 1.2 V core supply with hot-socketing support and is offered in a commercial 0C to +85C temperature grade. A Field Programmable Gate Array (FPGA) is a programmable logic IC that lets designers configure arbitrary digital logic, memory blocks, and DSP pipelines through a hardware description language (HDL) flow. FPGAs sit within the programmable logic family, alongside CPLDs and structured ASICs, and form a critical layer between fixed-function microcontrollers and fully-masked ASICs in the semiconductor taxonomy. The Cyclone III LS family is positioned as the low-power, security-enhanced variant of the Cyclone III generation, targeting cost-sensitive, high-volume digital designs. Key features of the EP3CLS200F484C7N include 484 user I/O pins distributed across eight I/O banks, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and integrated configuration circuitry supporting JTAG (IEEE 1149.1) and Active Serial (AS) modes. The device also integrates configuration bit-stream encryption and a robust Cyclone III LS security feature set aimed at preventing design theft and cloning, which is uncommon in low-cost FPGA families. Technically, the EP3CLS200F484C7N uses a low-k, 65 nm TSMC process to deliver low dynamic and static power consumption. Logic is arranged as 12,404 Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). The embedded memory supports single-port, dual-port, and FIFO modes, and the 210 18x18 multipliers provide DSP throughput for filters, FFTs, and video pipelines. Typical applications include industrial motor and motion control, factory automation, video processing and display controllers, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. Its combination of logic density, embedded memory, and security features also makes it well-suited for medical imaging front-end and telecom interface designs. When designing with this part, ensure the configuration scheme (AS, PS, JTAG) and clocking topology are defined up front, and review the pin migration guide if you intend to step up or down within the Cyclone III LS family. Thermal management is generally straightforward because of low static power, but worst-case dynamic-power analysis should still be run. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically found in the manufacturer datasheet.
EP3CLS200F484C8 - Cyclone III LS FPGA 198K LE | Intel | 484-BGA
The Intel (formerly Altera) EP3CLS200F484C8 is a low-power Cyclone III LS Field-Programmable Gate Array (FPGA) delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 210 embedded 18x18 multipliers in a 484-pin FineLine BGA package. It operates from a 1.2 V core supply and is built on a low-power 65 nm CMOS process that targets high-volume, cost-sensitive applications where static and dynamic power consumption must be minimized without sacrificing logic density. What is a Cyclone III LS FPGA? The Cyclone III LS family is a low-power variant of Altera's Cyclone III series, optimized for power-sensitive applications such as industrial control, video processing, and portable instrumentation. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks (memory, multipliers, PLLs, transceivers). Unlike an ASIC, an FPGA is reprogrammable in the field, enabling rapid prototyping, hardware revision, and parallel-processing acceleration. In the system hierarchy, FPGAs sit between microcontrollers (fixed-function, sequential) and ASICs (fixed-function, high-volume). Key features of the EP3CLS200F484C8 include up to 4 PLLs, 8 user I/O banks with support for multiple I/O standards (LVDS, SSTL, LVCMOS), and dedicated hardware for DDR/DDR2/QDRII memory interfaces. The device supports configuration via passive serial (PS), fast passive parallel (FPP), active serial (AS), and JTAG modes. Cyclone III LS adds enhanced security features including design encryption and configuration bitstream AES protection, making it suitable for designs where IP protection is required. Technically, the EP3CLS200F484C8 leverages 65 nm process technology with a low-K dielectric, which reduces dynamic switching current by up to 50% compared to the original Cyclone II family. The architecture uses 4-input look-up tables (LUTs), embedded SRAM blocks (M9K - 9 Kbit and M144K - 144 Kbit), and DSP-style 18x18 multipliers that can be cascaded for higher-precision arithmetic. The 484-pin FBGA package provides high I/O count (up to 304 user I/O) in a 23x23 mm footprint with 1.0 mm ball pitch. Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance subsystems, medical instrumentation, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. The combination of high logic density, low power, and security features also makes it a strong fit for telecom line cards and portable test equipment. When designing with the EP3CLS200F484C8, pay close attention to power-supply sequencing: the 1.2 V core must ramp before the I/O supplies. Use the Quartus II design toolchain (Cyclone III device support) for synthesis, place-and-route, and bitstream generation. Plan thermal dissipation at 304 user I/O + 198K logic elements - adequate airflow or a thermal pad is recommended at full utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet, helping engineers rapidly evaluate whether the EP3CLS200F484C8 fits their design constraints and supply chain.
EP3CLS200F484C8ES - Cyclone III LS FPGA, 198K LE, 484-BGA | Altera
The Altera (now Intel) EP3CLS200F484C8ES is a Cyclone III LS Field Programmable Gate Array with 198,464 logic elements, manufactured on a low-power 65 nm process and housed in a 484-ball FineLine BGA package. The device operates from a 1.2 V core supply, supports up to 210 user I/O pins, and integrates 4,488 Kbits of embedded memory, making it suitable for cost-sensitive high-volume logic designs. It is rated for commercial operating conditions and includes on-chip termination (OCT) support for high-speed LVDS signaling. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells are defined by a user-loaded bitstream rather than fixed masks. FPGAs sit between standard logic ICs (fixed function) and ASICs (high NRE, large volumes), occupying a sweet spot of flexibility, time-to-market, and unit cost for medium-volume designs. Cyclone III LS is positioned in Altera's low-power, high-volume portfolio, targeting applications that need tens to hundreds of thousands of logic elements without paying for high-end transceivers. Cyclone III LS also includes dedicated hardware for cryptographic acceleration (AES, SHA) and a security lock for bitstream protection. Key features of the EP3CLS200F484C8ES include 198,464 logic elements, 4,488 Kbits of embedded RAM arranged as 9-Kbit M9K blocks, 4 PLLs with up to 402 MHz fabric performance, and 210 maximum user I/Os. The 65 nm process and 1.2 V core rail keep dynamic power well below the original Cyclone II family, and the device supports commercial temperature grades as well as industrial variants in the same package. The FineLine BGA-484 footprint is shared across the Cyclone III LS density range, enabling pin-compatible migration within the family. Architecturally, the device uses a Logic Array Block (LAB) fabric with 16 logic elements per LAB, each LE containing a 4-input LUT, a register, and dedicated carry-chain logic. The M9K memory blocks support true dual-port, single-port, ROM, and FIFO modes, and DSP-style multiplication can be inferred from the LUT fabric. Clock distribution is handled by a global clock network backed by four PLLs with eight output taps, giving the device deterministic clocking for synchronous interfaces. Typical applications include industrial control and machine automation, video surveillance and image processing pipelines, low-cost display controllers, automotive infotainment (industrial temp grade), and software-defined radio baseband pre-processing. The Cyclone III LS family is also widely used in medical instrumentation and portable test equipment where the AES/SHA blocks simplify HIPAA-style data-protection requirements. When designing with the EP3CLS200F484C8ES, use Quartus II (13.0sp1 or later recommended) for synthesis, place-and-route, and power estimation. Plan thermal dissipation carefully because BGA-484 packages route most heat through the PCB ball grid; a 1.0 mm pitch, 6-layer stack-up with thermal vias under the die is recommended for industrial workloads. Decoupling must follow the recommended capacitor network in the Cyclone III LS Hardware Reference Manual, and unused pins should be configured as tri-state inputs with weak pull-ups to avoid floating I/O damage. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III LS family, and PCB/design notes that go beyond what the Altera datasheet and Quartus handbook provide individually.
EP3CLS200F484C8N - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS200F484C8N is a high-density, low-power Field Programmable Gate Array from the Cyclone® III LS family, fabricated on a 65 nm CMOS process and offering 198,464 logic elements in a 484-ball FineLine BGA package. It operates from a 1.2 V core supply, supports 8,211,456 bits of embedded memory, and provides 210 user I/O pins with 4 PLLs and 396 embedded multipliers, targeting industrial, communications, and consumer designs where low static power and high logic density are required. Speed grade 8 indicates a commercial temperature range with the slowest timing bin, balancing cost and power for cost-sensitive volume production. A Cyclone III LS FPGA belongs to the broader PLD (Programmable Logic Device) hierarchy, which sits under digital ICs and complements microcontrollers and DSPs by providing massively parallel, reconfigurable logic. Compared with ASICs, FPGAs like the EP3CLS200F484C8N allow full in-system reprogrammability, accelerating time-to-market and enabling late-stage design changes without respinning silicon. Key features include 198,464 logic elements, 8.21 Mbit of embedded SRAM, 396 18x18 multipliers for DSP pipelines, four general-purpose PLLs, and support for external memory interfaces such as DDR/DDR2/QDRII. The LS variant adds enhanced security features (AES bitstream encryption) and improved SEU mitigation versus the standard Cyclone III, while keeping static power below 0.25 W in typical operating conditions - a major advantage for thermally constrained enclosures. Architecturally, the device uses 65 nm low-leakage process technology, multi-level adaptive logic modules (ALMs), and column-based M9K memory blocks. Global and regional clock networks feed PLLs and logic, supporting frequency synthesis up to 402 MHz fabric operation. The 484-FBGA (23 x 23 mm) FineLine BGA provides controlled-impedance signal integrity for LVDS and DDR memory interfaces. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment (non-safety), military/aerospace secure communications (with AES bitstream encryption), telecom line cards, and portable medical instrumentation. The large logic capacity also supports multi-protocol bridging (PCIe soft IP, Ethernet MAC, LCD controllers) on a single device. When designing with this device, plan for 1.2 V core, 2.5 V/3.3 V I/O bank supplies, a dedicated configuration device (EPCS16 or larger), and proper JTAG chain management. Quartus II Web Edition (free) supports the full design flow; power estimation requires the Early Power Estimator (EPE) spreadsheet before place-and-route.
EP3CLS200F484I7 - Cyclone III LS FPGA, 198464 LE, 484-BGA | Intel
The Intel (formerly Altera) EP3CLS200F484I7 is a low-power, high-density Cyclone® III LS Field-Programmable Gate Array (FPGA) with 198464 logic elements, 8211456 bits of embedded memory, and 198464 CLBs housed in a 484-ball FineLine BGA package (FBGA-484, 23 x 23 mm, 1.0 mm pitch). The device is built on a TSMC 60 nm low-power CMOS process and supports up to 210 user I/O pins, with operating temperature graded for the industrial range (-40 °C to +85 °C). An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that the designer configures after manufacturing using a hardware description language. Within the wider taxonomy, FPGAs sit under programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors. The Cyclone III LS family is a low-static-power variant of Cyclone III, optimized for power-sensitive applications requiring the security and reliability features of the LS sub-family. Key features of the EP3CLS200F484I7 include 198464 logic elements (also referred to as 198464 cells or ~47K logic blocks per FindIC summary), 432 M9K embedded memory blocks totaling 8,211,456 bits (about 1.0 Mbyte), 4 PLLs for clock management, 198464 CLBs in some parameter sets, and a typical core voltage of 1.2 V. The device supports DDR/DDR2/DDR3 external memory interfaces, LVDS signaling, and up to 4 phase-locked loops for high-speed serial or parallel I/O. Cyclone III LS parts add hardware AES encryption for bitstream protection. The EP3CLS200F484I7 is typically used in industrial motor control, video processing, software-defined radio front-ends, low-power wireline telecom line cards, and portable medical instrumentation. Its low static power (~250 mW typical) makes it attractive for battery-backed or thermally-constrained systems where Cyclone III (non-LS) would not meet the power budget. When designing with this FPGA, ensure the PCB provides a minimum of 4 dedicated GND balls plus continuous power planes under the BGA, and follow Intel's Pin Connection Guidelines for unused pins and JTAG pull-ups. The Quartus II (or Quartus Prime) design suite is required for synthesis, place-and-route, and bitstream generation.
EP3CLS200F484I7N - Cyclone III LS FPGA, 198K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS200F484I7N is a low-power Cyclone III LS family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA-484) package. Built on a 65 nm process, the device integrates 198,464 logic elements (LEs), 8,211,456 bits of embedded memory, and 210 user I/O pins, while operating from a 1.2 V core supply and supporting up to 437.5 MHz internal operation. The 'LS' variant adds hardware crypto accelerators and a tamper-detection subsystem aimed at secure communications, military, and industrial-control applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, I/O cells, and dedicated hardware blocks such as multipliers, memory, and clock management. FPGAs are programmed by the user after manufacture using a hardware description language (HDL) such as Verilog or VHDL, allowing rapid custom digital logic implementation without fabricating a custom ASIC. Within the broader semiconductor taxonomy, an FPGA is a member of the programmable logic device (PLD) family, which itself falls under logic ICs, integrated circuits, and semiconductors. Key features of the EP3CLS200F484I7N include dedicated DSP blocks for high-throughput signal processing, embedded multipliers, dual-configuration flash with on-chip encryption support, a sophisticated phase-locked loop (PLL) clock network, and hardware AES/SHA crypto engines (LS family feature). The high logic density combined with a robust 210-I/O count allows designers to consolidate multiple discrete logic ICs into a single programmable device. Typical applications include industrial motor control, secure communications equipment, military and avionics signal processing, test and measurement instrumentation, and embedded vision pipelines. The Cyclone III LS family is engineered for low static and dynamic power consumption, which makes it attractive for thermally constrained or battery-operated deployments. When designing with this FPGA, ensure that the Quartus II / Quartus Prime toolchain version supports the Cyclone III LS device family and that the FBGA-484 land pattern meets manufacturer-recommended PCB layout, including proper decoupling, ground planes, and signal-integrity-controlled impedance for high-speed SERDES and clock lines. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found in the manufacturer datasheet.
EP3CLS200F484I8N - Cyclone III LS FPGA 198K LE 484-FBGA | Intel
The Intel EP3CLS200F484I8N is a high-density, low-power FPGA from the Cyclone III LS family, integrating 198,464 logic elements in a 484-ball FineLine BGA package and built on a 65 nm process with a 1.2 V core supply. It is offered in industrial temperature grade -40C to +100C with speed grade 8. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks, programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic, DSP pipelines, or interface bridges. Within the broader taxonomy, the EP3CLS200 belongs to the Cyclone III LS sub-family, which is positioned as a low-power variant of the Cyclone III family optimized for power-sensitive applications while still delivering high logic density and embedded memory resources. Key features of the EP3CLS200 include up to 198,464 logic elements, 8,211,456 bits of embedded memory, 4 Mb of general-purpose SRAM, dedicated 18x18 hardware multipliers for DSP operations, and 4 phase-locked loops for clock management. The device also integrates high-speed transceivers-free general-purpose I/O supporting LVDS, LVCMOS, SSTL, and HSTL standards, providing flexibility for connecting to DDR/DDR2 memories, parallel buses, and standard serial interfaces. The Cyclone III LS architecture combines a low-static-power core with efficient logic and routing fabrics to achieve low dynamic power consumption without sacrificing performance. The 484-FBGA package exposes 8 user I/O banks and supports configuration via passive serial, fast passive parallel, and JTAG modes, allowing flexible boot from EPCS configuration devices, processors, or JTAG programmers. Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance, portable medical imaging, and consumer video/display processing. The combination of low power, high logic density, and ample DSP blocks makes it especially attractive for embedded vision and real-time control systems. When designing with this FPGA, ensure the Quartus II design software version supports Cyclone III LS, verify that all I/O bank voltages meet the requirements of connected peripherals, and follow the recommended decoupling network and PCB layout guidelines in the Altera Device Package Information Data Sheet to maintain signal integrity at high toggle rates. This page synthesizes distributor pricing, drop-in Cyclone III LS alternatives, application references, and design notes that go beyond the manufacturer datasheet to help engineers select and source the EP3CLS200F484I8N with confidence.