FPGA & CPLD
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EP4SE230F29I4N - Stratix IV E 228K LEs FPGA | Intel | FBGA-780
The Intel EP4SE230F29I4N is a high-density Stratix IV E Field Programmable Gate Array (FPGA) with 228,000 logic elements, 17,544,192 bits of embedded memory, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FC-FBGA) package measuring 29 x 29 mm with 1.0 mm ball pitch. It is built on TSMC's 40 nm process and operates from a 0.9 V core supply with 1.0/1.2/1.5/2.5/3.0 V support for I/O banks, supporting transceiver-rich designs through up to 530 MHz logic performance and 717 MHz DSP throughput. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory (block RAM, M9K/M144K), digital signal processing (DSP) blocks, and high-speed transceivers on a single die. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism for applications where general-purpose CPUs are too slow or ASIC non-recurring engineering costs are uneconomical. The Stratix IV E family is part of Intel's (formerly Altera's) high-performance, transceiver-rich tier. Key features include 9120 Configurable Logic Blocks (CLBs/LABs), 488 I/Os, transceivers running up to 8.5 Gbps (per Stratix IV family datasheet), 1.228 Mbits of embedded memory per block, dedicated DSP blocks for high-speed multiplication, and support for DDR/DDR2/DDR3/QDRII/RLDRAM external memory interfaces. The F29 package variant includes a transceiver-rich pinout suitable for high-speed serial connectivity. Industrial temperature grade (-40C to +100C) is indicated by the I4 speed/temperature code. The Stratix IV E architecture uses Adaptive Logic Modules (ALMs) rather than older 4-LUT structures, partial reconfiguration via the Configuration via Protocol (CvP) feature, and hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet MACs. The 40 nm process and 0.9 V core deliver a balance of performance-per-watt versus lower-cost 60/28 nm successors. Designers evaluating migration should compare Stratix V, Arria 10, or Cyclone V parts using the Quartus II device migration guide. Typical applications include high-speed digital signal processing in defense radar, ASIC prototyping and emulation, high-frequency trading acceleration, 40G/100G telecommunications line cards, medical imaging (ultrasound beamforming), and test & measurement instrumentation. Its transceiver bandwidth also suits broadcast video processing and high-end industrial imaging systems. When designing with this device, plan for multi-rail power sequencing (0.9 V core, 1.0-2.5 V I/O banks, transceiver PLLs) using the Stratix IV PowerPlay Early Power Estimator. Layout requires controlled-impedance routing for 8.5 Gbps transceivers and a thermal solution sized for worst-case junction temperature. Note that the EP4SE230F29I4N is an older generation part - confirm lifecycle status and lead time before committing to new designs. This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV family, and practical design notes that complement - rather than duplicate - the Stratix IV Device Handbook.
EP4SE230F35I4NAD - 230K Logic Elements Stratix IV E FPGA | Intel
The Intel EP4SE230F35I4NAD is a high-density Stratix IV E field-programmable gate array (FPGA) delivering 228,000 logic elements, 17,544,192 embedded memory bits, and 1,288 user I/O pins in a 1152-ball flip-chip fine-pitch BGA package, manufactured on TSMC's 40 nm process node. The device operates from a 0.9 V core supply and is built around the Stratix IV E architecture that combines logic fabric with dedicated DSP blocks, M9K/M144K embedded memory blocks, and up to 24 transceivers depending on the package variant, targeting high-performance digital signal processing, communications backplane, and ASIC-prototyping applications. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated hardware multipliers, block RAM, and high-speed serial transceivers. FPGAs sit in the wider hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-chip (SoC) FPGAs, and they parallelize critical datapath operations far beyond what a general-purpose microcontroller or DSP processor can achieve, while also integrating hardware peripherals such as PCIe hard IP, memory controllers, and serializer/deserializer (SerDes) channels. Key features of the EP4SE230F35I4NAD include 8-input adaptive logic modules (ALMs), dedicated 18x18 multipliers, 9-Kbit and 144-Kbit embedded memory blocks, 8.5 Gbps transceivers (per Stratix IV GT family), and DSP blocks operating at up to 600 MHz. The FC-FBGA-1152 package provides a robust flip-chip interconnect for high signal integrity, while a -40C to +100C industrial temperature grade (the "I" suffix) enables deployment in harsh environments and extended-life industrial systems. In design, the Stratix IV E family uses a partial reconfiguration controller and Quartus II software for synthesis, place-and-route, and timing closure. The 40 nm process and dedicated signal-conditioning circuitry deliver low dynamic power via power-aware compiler features and on-chip voltage scaling, which are critical for ASIC-prototyping and high-density DSP workloads where the device may run near full utilization. The device also includes on-die termination (OCT) for high-speed memory interfaces such as DDR3 and QDRII+. Typical applications for this part include high-end telecommunications backplane line cards, ASIC prototyping and emulation, military/aerospace signal processing, high-frequency trading accelerators, and broadcast video processing. According to the manufacturer datasheet, the Stratix IV E family is positioned for designers who need the highest logic density combined with transceivers and DSP performance for bandwidth-constrained but computationally intense workloads. When designing with this FPGA, allocate at least 4 PCB layers for power and ground planes, use controlled-impedance routing for all transceiver lanes, and follow the manufacturer pin connection guidelines for unused I/O, JTAG, and configuration pins. Decoupling the 0.9 V core rail with low-ESR ceramic capacitors directly under the package is essential for power integrity under high switching currents. This page combines distributor pricing, drop-in compatible alternatives, and design notes that go beyond the manufacturer datasheet, providing a single information gain resource for FPGA selection.
EP4SE530H35C4N - Stratix IV E FPGA 531K LE 1152-BGA | Intel
The Intel EP4SE530H35C4N is a high-density, high-performance FPGA from the Stratix IV E family, delivering 531,200 logic elements in a 1152-ball flip-chip BGA package. Built on a 40 nm CMOS process with a 0.9 V core voltage, the device integrates 212,480 CLBs (or 21,248 LABs) at a maximum core frequency of 717 MHz, targeting data-path intensive and DSP-heavy designs. A field-programmable gate array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers into a single semiconductor. In the system hierarchy, an FPGA sits above general-purpose microcontrollers and below ASICs, offering hardware-level parallelism with software-like design flexibility. The Stratix IV E family specifically targets applications requiring very high logic density, high memory bandwidth, and embedded DSP throughput. Key features include 28,033,024 bits of embedded memory, 1,024 DSP blocks, and 744 user I/Os. The 1152-ball flip-chip BGA package exposes the device's full transceiver and I/O capability while providing thermal dissipation adequate for high-utilization designs. The part is speed grade C4, balancing timing closure headroom against performance, and operates within the commercial 0 °C to 85 °C junction temperature range. Architecturally, Stratix IV E uses an adaptive logic module (ALM) based fabric with 8-input fracturable look-up tables, paired with dedicated 18x18 multipliers for DSP, and tri-matrix block RAM that can be partitioned into independent memories. The fabric supports partial reconfiguration, which allows the system to swap logic regions on-the-fly for fault tolerance, power management, or multi-standard protocol support. Typical applications include high-throughput digital signal processing for wireless baseband, real-time video processing and broadcast equipment, military and aerospace signal intelligence, high-speed networking line cards, and ASIC prototyping. Engineers select the EP4SE530H35C4N when designs outgrow the capacity of Cyclone or mid-density Stratix families and require hardened transceivers, large block RAM, and substantial DSP throughput. Design consideration: with 744 user I/Os and a 1152-ball BGA, PCB layout requires careful signal-integrity planning, a multi-layer stack-up with dedicated power and ground planes, and thermal analysis under maximum junction temperature. The Quartus II design suite (or its successor) is required for synthesis, place-and-route, and timing closure.
EP4SE820F43C3G - Stratix IV E 813K LEs FPGA | Intel (Altera)
The Intel (formerly Altera) EP4SE820F43C3G is a high-density Stratix IV E FPGA delivering 813,050 logic elements, 325,220 adaptive logic modules (ALMs), and 32.51 Mbit of embedded memory in a 1760-pin flip-chip BGA (FBGA, package code F43) package. It belongs to the Stratix IV E family, the highest-density and most feature-rich member of the Stratix IV 40 nm generation, designed for high-performance digital logic, high-speed serial I/O, and large memory bandwidth. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, on-chip memory, and high-speed transceiver hard IP, all tied together by a hierarchy of routing resources. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors, and are typically deployed where ASIC NRE costs are prohibitive or where post-deployment hardware updates are required. The Stratix IV E family targets applications such as wireline communications, ASIC prototyping, high-performance DSP, and military/aerospace systems. Key features include 1120 user I/O pins, up to 8.5 Gbps transceivers, hard memory controllers, PCIe hard IP, and DSP blocks capable of 600+ MHz operation. The device integrates dedicated hardware for memory interfaces including DDR3 support, and offers robust SEU mitigation via the soft error detection and correction circuitry inherent to the Stratix IV architecture. Operating at a core voltage of 0.9 V and supporting industrial junction temperatures, it fits both commercial and industrial-grade deployments. The architecture combines a fine-grained ALM structure with high-efficiency routing, an embedded memory hierarchy with 600 MHz true-dual-port SRAM, and dedicated variable-precision DSP blocks. Hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet reduces soft-logic overhead. The 1760-BBGA package is a flip-chip land-grid-array that maximizes I/O density while delivering excellent thermal performance through a top-side heat-spreader attachment surface. Typical applications include high-end ASIC prototyping and emulation platforms, 40G/100G wireline communications line cards, radar and electronic warfare DSP pipelines, high-frequency trading accelerators, and high-density memory-interface bridging. The wide logic capacity and abundant I/O make it well-suited for systems that previously required multiple mid-range FPGAs. When designing with this device, plan the PCB thermal interface carefully - the FCBGA requires a properly mounted heat spreader or heatsink to dissipate 10-25 W typical workloads. Ensure the Quartus II power analyzer is run early in the design cycle; pin assignment, block placement, and toggle rate all significantly affect junction temperature. This page synthesizes real-time distributor inventory, exact parametric data, drop-in Stratix IV E alternatives, and practical PCB/thermal design notes that complement, rather than duplicate, the official Altera/Intel Stratix IV Handbook.
EP4SGX110DF29C2XG - Stratix IV GX FPGA, 105.6K LEs, 780-FCBGA | Intel
The Intel (formerly Altera) EP4SGX110DF29C2XG is a high-density Stratix IV GX FPGA featuring 105,600 logic elements and 9,793,536 bits of embedded memory (3,564 Kbits of M9K plus 1,318 Kbits of MLAB), fabricated on a 40 nm process. It integrates 372 user I/O pins in a 780-ball FCBGA package and is engineered for high-performance signal processing, serial connectivity, and embedded processing applications where deterministic latency and high transceiver bandwidth are required. An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip memory blocks, and routing interconnect. Stratix IV GX extends this baseline by adding multi-gigabit transceivers, hard PCIe IP cores, and external memory controller support, placing it in the high-end programmable logic family that sits between general-purpose FPGAs and ASICs in the programmable device hierarchy: programmable logic device -> FPGA -> high-end FPGA with transceivers -> SoC FPGA. Key device features include an FPGA fabric with embedded DSP blocks (variable-precision multipliers and accumulators), dedicated memory blocks (M9K and MLAB), and a hard memory controller that interfaces to DDR/DDR2/DDR3 SDRAM, QDR II/II+ SRAM, and RLDRAM II. The GX suffix denotes the integrated multi-gigabit transceiver subsystem supporting standards such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 1G/10G Ethernet through hard PCS channels. Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), high-speed serial protocol bridging (PCIe, Serial RapidIO, 10G Ethernet), ASIC prototyping, and high-end test and measurement instrumentation. The 780-FCBGA package provides the signal and power integrity needed for parallel LVDS and multi-gigabit serial interfaces while remaining compatible with high-density PCB stack-ups. When designing with this device, plan FPGA floorplanning and pin assignment with Quartus II early to close timing on transceiver channels, and verify signal integrity on the multi-gigabit lanes through IBIS-AMI simulation. Power estimation must include the GX transceiver analog supply rails separately from the core FPGA rails, since the transceivers dominate total device power at full line rate.
EP4SGX110DF29C3G - Stratix IV GX FPGA, 105K LE, 780-FCBGA | Intel
The Intel/Altera EP4SGX110DF29C3G is a Stratix IV GX family Field-Programmable Gate Array (FPGA) featuring 105,600 logic elements, 9,793,536 bits of embedded memory, and 372 user I/Os in a 29x29 mm 780-ball Flip-Chip BGA package. Built on a 40 nm process, this high-density transceiver-capable device integrates up to 8.5 Gbps transceivers and delivers enhanced DSP performance for high-bandwidth signal processing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and block RAM. Within the broader taxonomy, the Stratix IV GX sits at the high-performance end: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs allow hardware designers to implement custom digital functions after PCB assembly, enabling parallel processing, real-time DSP, and hardware-accelerated interfaces that microcontrollers and DSPs cannot match in throughput. Key features include 4,224 adaptive logic modules (ALMs), 8.5 Gbps embedded transceivers for protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO, dedicated hard IP for PCIe Gen2 x4/x8 endpoints, and configurable on-chip memory of approximately 9.5 Mbits distributed plus dedicated M9K and M144K block RAM. The device also provides 266 dedicated DSP blocks capable of 18x18 multiplication at high clock rates, and supports I/O standards including LVDS, LVTTL, HSTL, and SSTL with selectable drive strength. The Stratix IV GX architecture combines a fabric of ALMs with hard PCIe Gen2 IP and 8.5 Gbps transceivers, eliminating soft-IP overhead and freeing logic for application code. Compared with discrete transceiver + FPGA designs, the integrated transceivers reduce power and board area, while the 40 nm low-power process minimizes dynamic power at high toggle rates. Typical applications include high-speed serial backplane aggregation, software-defined radio (SDR) baseband processing, telecom framer/mapper ASIC prototyping, high-performance computing (HPC) co-processors, and broadcast video processing. The 780-FCBGA package supports up to 12.5 Gbps operation per channel when paired with appropriate PCB stack-up and signal conditioning. When designing with this device, ensure adequate power-supply decoupling (multiple low-ESR ceramic capacitors near each transceiver bank) and matched-impedance routing for high-speed serial links. Verify transceiver reference clock jitter per the device handbook, and use the Quartus Prime toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternative MPNs in the same FCBGA-780 footprint, and practical design notes that go beyond the manufacturer datasheet summary. It also flags the device lifecycle and lead-time reality observed across authorized distributors in 2026.
EP4SGX110DF29C4G - 105,600 LEs Stratix IV GX FPGA | Intel
The Intel EP4SGX110DF29C4G is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 105,600 logic elements, 372 user I/Os, and 9,793,536 bits of embedded memory in a 780-ball FCBGA package. Built on a 40 nm process with a 0.87 V to 0.93 V core voltage, the device pairs programmable logic with up to 8.5 Gbps integrated transceivers, hard memory controllers, and embedded multipliers, enabling high-throughput DSP and serial-protocol pipelines. A field-programmable gate array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, BRAM, and DSP slices. FPGAs belong to the broader programmable logic device (PLD) family and sit within the digital semiconductor hierarchy: programmable logic -> ASIC-class configurable logic -> semiconductor. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit, allowing rapid design iteration and field upgrades without re-spinning silicon. Key features of the EP4SGX110DF29C4G include 4,224 adaptive logic modules (ALMs) totalling 105,600 equivalent logic elements (LEs), 372 user I/Os arranged across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards, and a high-performance fabric that sustains hundreds of MHz on critical paths. Hard PCI Express Gen1/Gen2 hard IP blocks and external memory interfaces up to DDR3 make the part attractive for bridging, protocol conversion, and accelerator workloads. The architecture combines an adaptive logic module fabric with 8-channel transceiver blocks for multi-gigabit serial I/O, hard memory controllers, and a global clock network. The 40 nm low-power process node balances static and dynamic power while preserving high operating frequency. Typical applications include high-speed serial interface bridging (PCIe, SRIO, XAUI, CPRI), wireless baseband and backhaul DSP, radar and signal-intelligence front-end processing, broadcast video routing, and military/aerospace signal processing. The integrated transceivers eliminate external PHY components and shorten design cycles. When designing with this device, plan power sequencing around the 0.87-0.93 V core and the auxiliary PLL/ transceiver supplies; use Altera/Intel Quartus II software for synthesis, place-and-route, and timing closure. The 780-ball FCBGA package requires a multi-layer PCB with controlled-impedance routing and adequate thermal relief for sustained workloads. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP4SGX110DF29C4G, including same-package speed-grade and logic-density variants not consolidated in any single manufacturer table.
EP4SGX110DF29I3G - 110K LE Stratix IV GX FPGA 780-FCBGA | Intel
The Intel (formerly Altera) EP4SGX110DF29I3G is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) built on 40 nm process technology, delivering 105,600 logic elements (LEs) and 9,793,536 bits of embedded memory in a 780-ball FineLine BGA (FCBGA) package with integrated transceivers and DSP blocks. It features 372 user I/O pins, 8.5 Gbps transceivers, and a dedicated PCIe hard IP block, making it suitable for high-speed serial connectivity and digital signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital logic that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose processors (which execute software) and application-specific integrated circuits (ASICs, which are fixed at fabrication). The Stratix IV family from Intel/Altera adds hardened IP blocks (transceivers, DSP, memory controllers, PCIe) that accelerate common functions and free up programmable logic for application-specific logic. Key features include 105,600 LEs, 9,793,536 bits of embedded RAM, 660 DSP blocks, 16 transceivers at up to 8.5 Gbps, and a hard PCIe Gen2 controller. The device supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL I/O standards with hot-socketing capability, and includes dedicated on-chip termination (OCT) for signal integrity. Industrial-grade temperature range is -40C to +100C for I3 grade, suitable for harsh environments. The architecture combines an 8.5 Gbps transceiver physical layer with a programmable logic fabric and embedded memory, allowing designers to implement protocols such as PCIe Gen2, Serial RapidIO, XAUI, and custom high-speed serial interfaces. The 40 nm low-power process minimizes dynamic power while preserving high performance, and on-chip PLLs support frequencies up to 800 MHz with fractional-N synthesis. Typical applications include high-speed serial interfaces for communications infrastructure, PCIe accelerator cards in data center and server platforms, military and aerospace signal processing, high-end medical imaging, broadcast video processing, and industrial test equipment. The device's combination of transceiver bandwidth and DSP throughput makes it well suited for wireless baseband processing and radar systems. When designing with this FPGA, ensure the PCB supports the 780-ball FCBGA's controlled-impedance routing and matched-length traces for transceiver channels. The Quartus II development environment (version 13.0 or later) is required for synthesis, place-and-route, and programming file generation. Designers should also plan power sequencing to the Stratix IV power-up requirements and verify transceiver reference clock jitter against the protocol specification. This page synthesizes distributor pricing, package-equivalent Stratix IV GX drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving component buyers and FPGA designers a single reference for sourcing decisions.
EP4SGX110DF29I4G - 105.6K LE Stratix IV GX FPGA, 780-FBGA | Altera
The Intel (formerly Altera) EP4SGX110DF29I4G is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) with 105,600 logic elements, 9.79 Mbit embedded memory, and integrated transceivers, housed in a 780-ball FineLine BGA (FBGA-780, 29x29 mm) package. The 'I4G' suffix denotes the industrial temperature grade (-40C to +100C) and a speed grade 4 device with lead-free / RoHS-compliant packaging. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks (memory, transceivers, DSP, PLLs) that engineers can reconfigure after manufacture to implement custom digital logic, parallel processing pipelines, or hardware accelerators. FPGAs sit between general-purpose microcontrollers and ASICs, offering ASIC-class performance and parallelism with NRE-cost-free reprogrammability. Stratix IV GX specifically targets high-speed serial I/O applications through integrated multi-gigabit transceivers. Key features include 105,600 logic elements distributed across 4,224 Adaptive Logic Modules (ALMs), 9,793,536 bits (9.79 Mbit) of embedded memory in the form of M9K/M144K blocks, 372 maximum user I/Os, and 8.5K logic array blocks (LABs). The device supports up to 8 transceiver channels operating at data rates up to 8.5 Gbps depending on speed grade, with support for protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CPRI. The core operates from a 0.95 V supply with separate transceiver and auxiliary rails. The EP4SGX110DF29I4G is fabricated on TSMC's 40 nm low-power process node, delivering a balance of high performance, low static power, and high logic density. Its adaptive logic module architecture combines 8-input fracturable look-up tables with dedicated register chains, allowing efficient implementation of wide multiplexers, arithmetic operations, and state machines. The device also integrates hard memory controllers for DDR3/DDR2 and QDR II+ memories. Typical applications include high-speed serial protocol bridging, telecom line-card backplane aggregation, radar and signal-processing front-ends, test and measurement equipment with parallel digital capture, broadcast video processing, and high-performance computing accelerators. The integrated transceivers make it particularly attractive for wireless baseband and any system requiring multi-gigabit serial connectivity. When designing with this part, ensure proper power-supply sequencing (POR delay, VCCPD before VCC), maintain a thermal management plan for the 29x29 mm BGA footprint, and use Altera/Intel Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. Confirm transceiver reference-clock jitter and PCB material stack-up against the manufacturer's guidelines. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP4SGX110FF35C2XG - 105.6K LE Stratix IV GX FPGA | Intel
The Intel (Altera) EP4SGX110FF35C2XG is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 105,600 logic elements, 4,224 logic array blocks (LABs), and 9,793,536 bits of embedded RAM in a 1152-ball FCBGA package. Built on a 40 nm process, this transceiver-rich device targets high-bandwidth serial I/O and DSP-intensive applications with 372 user I/O pins and integrated transceivers operating up to 8.5 Gbps per channel. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets hardware engineers implement arbitrary digital logic via HDL and synthesis. Stratix IV FPGAs occupy the high-performance tier of the Intel/Altera portfolio and combine a logic fabric, embedded memory blocks, DSP blocks, PLLs, high-speed transceivers, and hard PCIe/IP cores on a single die. The GX suffix indicates transceiver capability, which positions this device between the general-purpose Stratix IV E family and the larger Stratix IV GT family. Key features include 105,600 logic elements backed by 4,224 LABs, 9,793,536 total RAM bits distributed across M9K/M144K blocks, up to 372 user I/Os split across 12 I/O banks, and dedicated hardware for DSP multiplication, phase-locked loops, and memory controllers. The 1152-ball FCBGA package supports the wide transceiver and I/O count while providing a thermal path for sustained workloads. Core voltage operates at 0.87 V to 0.93 V with separate transceiver/auxiliary rails. Architecturally, Stratix IV GX integrates up to 24 full-duplex CDR-based transceivers with PMA/PCS layers, programmable PCIe Gen1/Gen2 hard IP blocks, and partial reconfiguration capability. The adaptive logic module (ALM) is the 8-input fracturable LUT that drives the high logic-density figures, while the 40 nm process node balances performance and leakage for line-card and high-end embedded designs. Typical applications include high-speed wireline communications line cards, radar and DSP front-ends, ASIC prototyping, test and measurement instrumentation, broadcast video processing, and PCI Express-based adapter cards. The integrated transceivers simplify SFP+/QSFP+ connectivity, while the generous DSP block count accelerates FFT and filter pipelines. Designers must provide a multi-rail power tree (VCC, VCCA, VCCD_PLL, VCHIP, VCCT_GXB, etc.) with proper sequencing and decoupling per the Stratix IV handbook. Pin assignments, transceiver reference clocks, and PCB stack-up with controlled-impedance differential pairs are mandatory for robust high-speed operation. This page synthesizes distributor pricing, same-family Stratix IV drop-in alternatives, transceiver and DSP comparisons, and practical power/PCB design notes not found on a typical Altera/Intel product listing.
EP4SGX110FF35C3G - Stratix IV GX 105KLE FPGA, 1152-FBGA | Intel / Altera
The Intel / Altera EP4SGX110FF35C3G is a Stratix® IV GX family Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, integrating 105,600 logic elements, 42,240 Adaptive Logic Modules (ALMs), 9.79 Mbit of embedded memory, and 562 embedded 18x18 multipliers in a 1152-ball FineLine BGA (FCBGA) package. The device integrates eight multi-gigabit transceivers capable of up to 3.75 Gbps operation, making it suitable for PCI Express Gen1, Serial RapidIO, and other high-speed serial protocols. Programmable Power Technology (PPT) enables dynamic per-block power optimization across core, memory, and I/O regions, while hard PCI Express and memory controller IP blocks reduce logic footprint for high-bandwidth designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic, interconnect, and even analog/serial functions are configured by the user after manufacture via an SRAM configuration bitstream. FPGAs sit alongside microprocessors, ASICs, and ASSPs in the broader programmable logic device (PLD) family, and Stratix IV GX specifically targets high-speed serial connectivity, DSP-heavy designs, and embedded processing systems. The Stratix IV series architecture separates logic (ALMs/LABs), memory (M9K/M144K blocks), DSP (variable-precision multipliers), transceivers, and I/O (LVDS, LVTTL, HSTL, SSTL) into independent, parallel structures connected by a hierarchical routing fabric. Key features include the transceiver-rich GX variant, 372 user I/O pins, support for DDR3/DDR2/QDRII+ external memory interfaces, hard PCIe Gen1 endpoints, and operation across the -40 C to 100 C commercial junction temperature range. The FF35 speed grade designates the fastest commercial speed bin, the F35 pin/package code denotes the 1152-ball 35 mm x 35 mm FCBGA footprint, and the trailing C3 indicates the 0.85 V VCCINT core voltage with the -3 speed grade designation. Typical applications include wireline telecom line cards, software-defined radio baseband, test and measurement instrumentation with high-speed serial backplane aggregation, military radar front-end preprocessing, broadcast video processing, and ASIC prototyping for high-bandwidth ASIC emulation. Designers select the EP4SGX110FF35C3G when they need roughly 100K LE of logic with multi-gigabit serial and PCIe Gen1 hardening on a single die. Consideration for power: at typical activity the Stratix IV GX 110 KLE operates near 5-8 W; full-utilization boards require forced-air flow and copper thermal relief. Quartus II design software (version 13.1 or later with service packs) supports the EP4SGX110FF35C3G and is required to generate JIC/JIC configuration files for JTAG or EPCS configuration. This page consolidates distributor pricing, drop-in speed/pinout-compatible variants, and design notes that supplement the manufacturer datasheet.
EP4SGX110FF35C4G - Stratix IV GX FPGA 110K LE 9.7Mbit | Intel
The Intel EP4SGX110FF35C4G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) integrating 105,600 logic elements, 9,793,536 RAM bits (372 RAM blocks), and integrated transceivers in a 1152-ball FCBGA package. The device belongs to the Stratix IV GX family, which combines high-performance logic fabric with multi-gigabit transceivers and dedicated DSP blocks, and is built on a 40 nm process node for low power and high integration. The device targets high-bandwidth applications requiring both signal-processing throughput and high-speed serial I/O. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. Within the broader taxonomy, this part belongs to the FPGA family, which itself sits inside programmable logic devices (PLD), which are a subset of integrated circuits (ICs) under the semiconductor hierarchy. The Stratix IV GX sub-family adds integrated multi-gigabit transceivers (MGT) for serial connectivity, separating it from general-purpose Stratix IV non-GX variants and from Cyclone-series cost-optimized FPGAs. Key specifications of the EP4SGX110FF35C4G include 105,600 logic elements, 9,793,536 bits of embedded RAM distributed across 372 RAM blocks, 372 user I/O pins, 8 integrated transceivers supporting data rates up to 3.125 Gbps (C4 speed grade), and 288 dedicated hardware multipliers for DSP. The 1152-ball FCBGA package exposes the high I/O count and enables dense board placement with controlled-impedance escape routing. The device operates across commercial and industrial temperature grades depending on the speed/order code suffix. Architecturally, the Stratix IV GX uses Adaptive Logic Modules (ALMs), each containing a fracturable 8-input look-up table (LUT), two dedicated adders, and four registers, which gives the device a fine-grained compute fabric. The transceivers support multiple serial protocols including PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, CPRI, and OBSAI, while the DSP blocks (variable-precision 18x18 multipliers) accelerate filtering and FFT operations used in wireless baseband, radar, and instrumentation. Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial interface bridging (PCIe, SRIO, GbE), radar and electronic warfare signal chains, high-performance DSP for test and measurement, and ASIC prototyping for communications SoCs. The combination of transceivers and DSP blocks makes it a fit where both wire-speed serial I/O and deterministic compute are needed on a single die. When designing with this part, plan PCB layout for 1152-ball FCBGA escape routing, allocate sufficient decoupling across the multiple supply rails (VCC, VCCPT, VCCA, VCCP, VCCH_GXB), and use Intel Quartus II (legacy) or Quartus Prime to capture pin assignments, transceivers, and timing constraints. Configuration schemes include fast passive parallel (FPP), active serial (AS), and JTAG. This page synthesizes distributor availability, same-family and cross-brand drop-in equivalents, and practical design notes not consolidated in the manufacturer datasheet.
EP4SGX110FF35I3G - Stratix IV GX FPGA 105.6K LE, 1152-FCBGA | Intel
The Intel (Altera) EP4SGX110FF35I3G is a high-density Stratix IV GX Field Programmable Gate Array delivering 105,600 logic elements, 9,793,536 bits of embedded memory, and 372 user I/O in a 1152-ball Flip-Chip BGA (FCBGA) package. It features 8 integrated transceivers operating up to 8.5 Gbps, a rich DSP block count, and on-chip hard memory controllers, making it suitable for high-throughput digital signal processing and serial connectivity designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor that implements custom digital logic through configurable logic blocks, programmable routing, and dedicated hardware blocks such as transceivers and DSP slices. FPGAs belong to the broader category of programmable logic devices (PLDs) within logic semiconductors, sitting alongside ASICs and CPLDs. The Stratix IV family targets high-performance applications by integrating high-speed transceivers, abundant block RAM, and structured DSP pipelines on a 40 nm process node. Key features of the EP4SGX110FF35I3G include the 105,600 logic elements backed by 5,659 M20K embedded memory blocks totaling 9,793,536 bits, 532 18x18 multipliers for DSP, and a -3 speed grade that delivers a balance of timing margin and power efficiency. The 8.5 Gbps transceiver capability enables protocols such as PCIe Gen2, Serial RapidIO, CPRI, and 10 Gigabit Ethernet XAUI when used with soft IP. The 1152-ball FCBGA package supports the device's high pin count while providing the signal integrity required for multi-gigabit serial links. Architecture highlights include the Altera Logic Array Block (LAB) with adaptive logic modules, MultiTrack routing for predictable timing closure, and Programmable Power Technology that dynamically reduces power on unused logic. The GX variant integrates hardened PCIe, CPRI, and Serial RapidIO IP, reducing soft-logic overhead and simplifying board bring-up for communications infrastructure designs. Typical applications include high-speed data acquisition systems, wireless baseband processing, military radar, broadcast video processing, and protocol bridging cards. The combination of 8 transceivers, abundant DSP, and large block RAM is well suited to multi-channel digital receivers and Software Defined Radio platforms. A key design consideration is the FPGA's configuration scheme: the EP4SGX110FF35I3G supports fast passive parallel (FPP) and active serial (AS) configuration modes. Plan PCB layout to keep configuration flash within trace-length limits and provide decoupling per Intel's Pin Connection Guidelines to avoid power-rail noise during configuration. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP4SGX110FF35I4G - Stratix IV GX FPGA, 105K LE, 1152-FCBGA | Altera / Intel
The Altera (now Intel) EP4SGX110FF35I4G is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 105,600 logic elements, 9,793,536 bits of embedded memory, and integrated transceivers in a 1152-ball FineLine BGA (FCBGA) package. It is fabricated on a 40 nm process and combines a powerful 8-input Adaptive Logic Module (ALM) fabric with up to 8.5 Gbps transceivers, making it a flagship device for high-bandwidth signal processing, ASIC prototyping, and protocol bridging in telecom, defense, and high-performance computing systems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. In the system hierarchy it sits between fixed-function ASICs (lowest flexibility, lowest unit cost at volume) and software-programmable DSP/MCU processors (highest flexibility, lowest deterministic performance). Stratix IV GX FPGAs specifically target applications where deterministic sub-nanosecond logic delays, parallel DSP arithmetic, and multi-gigabit serial I/O are required simultaneously. Key features of the EP4SGX110FF35I4G include 105,600 logic elements distributed across 4,224 Adaptive Logic Modules (ALMs), 42,240 ALMs in the largest configuration of the family, 9.34 Mbit / 9,793,536 bits of embedded block memory, and 480 user I/Os. The "FF35" pinout designation places the device in the 1152-ball FCBGA with high-speed transceivers arranged along dedicated columns, while the "I4" speed-grade and industrial temperature grade (-40C to +100C) suffix indicates an industrial-grade silicon speed bin suitable for harsh-environment deployments. Operating supply voltage is centered at 950 mV core with multiple auxiliary rails for I/O and transceiver banks. The architecture combines an 8-input ALM (twice the inputs of the previous Stratix III generation) with dedicated 18x18 multipliers and TriMatrix embedded memory blocks, supporting DSP throughput up to ~600 GMACS at the typical configuration. Integrated transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, HiGig, SATA, and backplane interfaces at data rates up to 8.5 Gbps per channel. Hard PCI Express Gen2 IP blocks and hard memory controllers reduce soft-logic overhead, freeing fabric for application code. Typical applications include high-end ASIC prototyping, telecom line-card protocol bridging, radar and signal-intelligence processing, high-frequency trading platforms, broadcast video infrastructure, and test-and-measurement instrumentation. The wide transceiver bandwidth also makes it suitable for medical imaging reconstruction, software-defined radio base stations, and aerospace communication payloads where both high logic density and serial-link throughput are mandatory. When designing with this device, pay close attention to power architecture: a fully populated EP4SGX110FF35I4G can dissipate well over 20 W and requires a multi-rail decoupling network, SmartVoltage ID or external regulator sequencing, and a thermal management solution sized for the FCBGA-1152 package. Quartus II software (with the appropriate license) is required for synthesis, place-and-route, and timing closure - the device is mature but still widely supported in Intel Quartus Prime 17.x and earlier tool chains. This page synthesizes distributor inventory, drop-in Stratix IV GX package-compatibility notes, and practical design considerations that are not available in a single manufacturer datasheet, helping procurement and FPGA design engineers shorten the selection cycle.
EP4SGX110HF35C2G - Stratix IV GX FPGA 105.6K LE 35mm FC-FBGA | Intel
The Intel (formerly Altera) EP4SGX110HF35C2G is a high-density Stratix IV GX Field Programmable Gate Array with 105,600 logic elements, 9,793,536 bits of embedded memory, and integrated 8.5 Gbps transceivers, housed in a 1152-ball flip-chip FineLine BGA (HF35 package, 35 mm body). Built on a 40 nm process node and operating from a 0.9 V core supply, the device combines programmable logic fabric with embedded transceivers to deliver high-bandwidth serial I/O alongside parallel processing, making it a cornerstone part for high-end communications and signal-processing systems. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacture through configuration memory rather than mask-level fabrication. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit above CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in both integration density and NRE cost. The Stratix IV GX family specifically targets high-speed serial connectivity, bridging the gap between pure-logic FPGAs and ASSP connectivity devices. The Stratix IV GX architecture delivers 488 user I/O pins, up to 8.5 Gbps multi-gigabit transceivers, hard PCIe Gen1/Gen2 IP blocks, and dedicated DSP blocks for high-throughput signal processing. The HF35 package option provides a 35 mm square footprint with 1152 balls, optimizing board area while providing thermal headroom for the transceiver-rich logic fabric. The device supports partial reconfiguration and remote upgrade via dedicated configuration interfaces. Performance analysis: at 0.9 V core, the Stratix IV GX achieves roughly 25-30% lower dynamic power than the Stratix III generation while supporting up to 530 MHz on internal logic. The integrated transceivers reduce BOM cost and PCB area by eliminating external SERDES chips. The flip-chip BGA substrate maximizes signal-integrity margins for the multi-gigabit channels at the expense of mechanical repairability. Typical applications include 40G/100G optical transport line cards, wireless baseband processing, high-speed test and measurement instrumentation, radar signal processing, and broadcast video infrastructure. The combination of transceivers, DSP, and high logic capacity suits protocols such as PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO. The part is widely deployed in long-life-cycle communications and defense programs. When designing with this device, plan for multi-layer PCB stack-up with continuous reference planes to preserve signal-integrity margins on the multi-gigabit links, and use the Quartus II / Quartus Prime toolchain for place-and-route and timing closure. Designers targeting new designs should evaluate Stratix V/10/Cyclone 10 GX successors for cost and supply reasons, but the EP4SGX110 family remains a strong choice for sustaining legacy systems. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical board-design guidance not found in the manufacturer datasheet alone, supporting both new designs and sustaining engineering.
EP4SGX110HF35C3G - Stratix IV GX FPGA, 105600 Logic Elements | Intel
The Intel (Altera) EP4SGX110HF35C3G is a Stratix IV GX family Field Programmable Gate Array (FPGA) with 105,600 logic elements, 9,793,536 bits of embedded memory, 488 maximum user I/O pins, and 8 transceiver channels operating up to 8.5 Gbps, packaged in a 1152-ball FineLine BGA (FBGA) 35mm x 35mm. It belongs to the Stratix IV GX transceiver-optimized sub-family and ships in the commercial speed grade 3 (C3) with the HF35 package code. A Field Programmable Gate Array (FPGA) is a programmable integrated circuit containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and a programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are used for high-speed digital signal processing, parallel computation, and hardware-accelerated I/O bridging where CPUs and ASICs cannot meet the throughput or flexibility requirement. Key features of the EP4SGX110HF35C3G include 8 full-duplex transceiver channels supporting common serial protocols, dedicated PCIe hard IP blocks, 504 embedded 18x18 multipliers, and 4 hard memory controllers. The device is built on a 40nm process technology and supports partial reconfiguration and Design Security features. It is widely deployed in telecom infrastructure, broadcast video processing, military radar systems, and high-performance ASIC prototyping. Typical applications include 40G/100G line-card bridging, PCIe Gen2 endpoint and root-port designs, software-defined radio (SDR) baseband processing, and high-speed serial protocol bridging between backplane fabrics. The 8.5 Gbps transceivers allow direct connection to SFP+, PCIe Gen2, XAUI, and Serial RapidIO without external PHYs. When designing with the EP4SGX110HF35C3G, plan for at least 12 power rails with proper decoupling, allocate sufficient board area for the 1152-ball FBGA, and verify thermal management: the C3 commercial speed grade is specified for 0C to 85C junction temperature. Quartus II (legacy) or Quartus Prime supports this device for synthesis and place-and-route. This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, identifies pin-compatible Stratix IV GX variants, and surfaces practical FPGA design notes not covered by the manufacturer datasheet alone.
EP4SGX110HF35C4G - Stratix IV GX 105.6K LEs FPGA | Intel
The Intel (formerly Altera) EP4SGX110HF35C4G is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) built on 40 nm process technology, delivering 105,600 logic elements, 4,224 Logic Array Blocks (LABs), and 9,793,536 bits of embedded RAM in a 1152-pin flip-chip BGA (FCBGA) package measuring 35 x 35 mm. It offers 488 user I/O pins and integrated transceivers optimized for high-speed serial connectivity, making it well suited for protocol bridging, baseband processing, and high-bandwidth data path applications. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic functionality is defined after manufacturing by a configuration bitstream rather than at the fab. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which themselves belong to the logic IC and semiconductor families. Stratix IV GX specifically adds hardened multi-gigabit transceivers, making it a hybrid between a general-purpose FPGA and a connectivity-oriented ASSP, which is why the family is widely adopted in communications infrastructure, broadcast video, and defense/aerospace signal-processing cards. Key features of the EP4SGX110HF35C4G include 562 fixed-precision multipliers (18x18) for DSP workloads, dedicated on-chip memory blocks totaling ~9.6 Mbits, up to 8 PLLs for clock management, and 4 speed-grade C4 transceivers capable of multi-gigabit serial rates. It supports commercial temperature range (0C to +85C junction), surface-mount assembly, and the HF35 code indicates a 1.0 V core voltage variant. The device is configured via standard JTAG or in-system serial configuration schemes, and is supported by the Quartus II design toolchain. Architecturally, the Stratix IV GX uses an Adaptive Logic Module (ALM) of 8 inputs - an evolution of the 4-input LUT used in older Stratix families - giving better logic packing density and shorter critical paths. The transceiver blocks embed Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) features, supporting protocols such as PCI Express Gen1/Gen2, XAUI, Serial RapidIO, CPRI, and Gigabit Ethernet with minimal soft-logic overhead. The large embedded memory pool allows deep packet buffers and lookup tables to be placed directly in silicon rather than external SRAM. Typical applications include wireless baseband processing, telecom line cards, high-speed serial protocol bridging, military radar and signal intelligence, medical imaging pipelines, and ASIC prototyping. The high transceivers count combined with substantial logic resources makes the EP4SGX110HF35C4G a strong fit when a single device must perform both DSP-style processing and serialized I/O simultaneously. When designing with this FPGA, ensure the PCB provides sufficient decoupling, matched-length routing for the transceiver channels, and adequate thermal copper to dissipate the ~10-15 W typical power envelope of a fully utilized Stratix IV GX device. Use the Quartus II PowerPlay analyzer early in the design cycle to model junction temperature and rail-current profile before committing to layout. Note that the Altera EP4SGX family is in mature production; verify lifecycle status with Intel before starting new designs. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix IV GX family, and practical design notes not consolidated in any single manufacturer document.
EP4SGX110HF35I3G - Stratix IV GX FPGA, 105.6K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP4SGX110HF35I3G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) containing 105,600 logic elements, 9,793,536 bits of embedded memory, and 488 user I/O pins, housed in a 1152-ball Flip-Chip BGA (FC-FBGA) package with integrated transceivers. The device operates from a nominal 0.9 V core supply and is offered in the -I3 speed/temperature grade (industrial, -40 C to +100 C junction) optimized for high-performance logic and DSP applications requiring integrated multi-gigabit transceivers. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacture, placing it in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> system-on-chip (SoC). FPGAs differ from application-specific integrated circuits (ASICs) in that they trade per-unit cost and peak clock frequency for rapid prototyping, field upgradeability, and parallel hardware acceleration. The Stratix IV GX family specifically integrates 3.125 Gbps to 8.5 Gbps multi-gigabit transceivers (depending on speed grade), making it suitable for high-speed serial I/O applications. Key features of the EP4SGX110HF35I3G include 105,600 logic elements (LEs), 9,793,536 bits of on-chip memory (about 9.4 Mbit), 488 maximum user I/Os, embedded 8-channel multi-gigabit transceivers (per family datasheet), hard PCI Express Gen1/Gen2 hard IP blocks, and 352 dedicated 18x18 multipliers for DSP. The device supports DDR2/DDR3 external memory interfaces via dedicated PHY blocks. The architecture is built on a 40 nm low-power CMOS process with adaptive logic modules (ALMs), distributed MLAB memory, and TriMatrix block RAM. Eight transceiver channels can be configured for protocols including PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, XAUI, CEI-6G, and HD-SDI. The HF35 package is a 35 mm x 35 mm, 1152-ball Flip-Chip BGA with 1.0 mm ball pitch. Typical applications include high-speed serial interface bridging, telecommunications line cards, military radar signal processing, test and measurement equipment, and ASIC prototyping platforms. The integrated transceivers and PCIe hard IP blocks eliminate external PHY components, reducing board area and bill-of-materials cost. When designing with this part, provide continuous-time linear regulators (LT3042, TPS7A4701) for the 0.9 V core and 1.1 V/1.2 V transceiver analog supplies. Decoupling per Intel Stratix IV device handbook is critical because of the high transient current demand; place 0402/0201 ceramics as close as possible to every power pin. Ensure the Flip-Chip BGA PCB has matched Z-controlled traces for all eight transceiver channels to meet S-parameter compliance. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design guidance not always surfaced in the manufacturer datasheet alone.
EP4SGX110HF35I4G - Stratix IV GX FPGA, 105.6K LE, 1152-FBGA | Intel
The Intel EP4SGX110HF35I4G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 105,600 logic elements, 9,793,536 total memory bits, and integrated transceivers, housed in a 1152-ball flip-chip BGA (FCBGA) package. It operates across an industrial temperature range of -40C to +100C and supports up to 488 user I/O pins, making it suitable for high-throughput wireline, wireless, and signal-processing systems. The device is fabricated on a 40 nm process node and combines programmable logic, embedded memory, DSP blocks, and high-speed serial transceivers on a single die. What is a Stratix IV GX FPGA? The Stratix IV GX family belongs to the broader hierarchy of programmable logic devices (PLD) -> FPGAs (field programmable gate arrays) -> high-performance transceivers -> programmable logic semiconductors. An FPGA is a semiconductor device whose digital logic function is defined after manufacturing via configuration bitstream loading, in contrast to ASICs whose function is fixed at fabrication. The GX variant adds multi-gigabit transceivers and physical coding sublayer (PCS) hard IP, enabling protocol bridging for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G without external PHY chips. Key features include 105,600 logic elements (LEs) and 3,888 embedded 18x18 multipliers (105,600 equivalent LEs for DSP), a 488 user I/O count, eight PLLs, and embedded transceiver capability that supports data rates up to 8.5 Gbps per channel. The device also includes dedicated memory controller blocks, PCI Express hard IP, and dynamic reconfiguration support. The HF35 speed grade and I4 industrial temperature rating make it appropriate for moderate-performance industrial systems requiring long-term availability. The 40 nm process technology gives the device a favorable ratio of performance to power consumption compared with older 65 nm and 90 nm FPGA generations. Hard IP blocks (PCIe, memory controllers, transceivers, PLLs) free general-purpose logic fabric for application-specific functions. The 1152-ball FCBGA package provides a high pin count with controlled-impedance differential routing, essential for multi-gigabit transceiver performance. Typical applications include high-end test and measurement equipment, military/aerospace signal processing, high-speed data acquisition, communications infrastructure line cards, ASIC prototyping, and medical imaging. The combination of dense logic, embedded transceivers, and PCI Express hard IP also makes it well suited for broadcast video processing and high-performance DSP cards. When designing with this FPGA, plan board layout around controlled-impedance differential pairs for transceiver channels and assign separate power rails for transceiver (VCCH_GXB), core (VCC), and I/O banks (VCCIO). A minimum of 0.1 uF decoupling capacitors per power pin plus bulk capacitors is essential. Use the Altera/Intel Quartus II design software for compilation, place-and-route, timing closure, and bitstream generation. This page synthesizes distributor pricing, Stratix IV family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single reference for sourcing, replacement, and PCB-level integration.
EP4SGX180KF40C2N - Stratix IV GX FPGA, 175K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP4SGX180KF40C2N is a high-density Stratix IV GX Field Programmable Gate Array delivering 175,750 logic elements, 13,954,048 bits of embedded memory, and integrated transceivers in a 1517-ball FC-BGA package. The -C2 speed grade, 40-nm process node, and 0.9 V core supply target high-performance signal-processing and serial-connectivity designs. Per the manufacturer datasheet, the device includes 744 user I/O pins, dedicated DSP blocks, and 8.5 Gbps-capable transceivers suitable for PCI Express Gen2 and multi-gigabit serial links. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LABs/CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs occupy the top tier of programmable logic, sitting above CPLDs in the programmable logic hierarchy and below ASICs in fixed-function integration density. They are valued for parallel processing, deterministic latency, and the ability to be reconfigured in-system after manufacture, making them ideal for prototyping, low-volume production, and applications where design specifications evolve over time. Key features of the EP4SGX180KF40C2N include 175,750 logic elements backed by 7030 LABs, 17 embedded transceivers running up to 8.5 Gbps, hard PCIe Gen2 IP blocks, 12.7 Mbit of M20K block RAM, and 231 Kbit of MLAB memory. The 1517-FCBGA (40 mm × 40 mm) package provides 744 user I/O pins across 24 I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also integrates dedicated PLL and DLL blocks for clock management. The 40-nm Stratix IV GX architecture combines a power-efficient core fabric with hardened transceivers, enabling designers to implement multi-gigabit serial protocols without consuming soft logic resources. Compared to previous Stratix III devices, Stratix IV GX achieves lower dynamic power per logic operation while increasing transceiver bandwidth, supported by programmable pre-emphasis and equalization. Typical applications include high-speed serial interface bridging (PCIe Gen2, XAUI, Serial RapidIO), broadcast video processing, military radar and electronic warfare, medical imaging, ASIC prototyping, and high-performance computing accelerators. The 1517-FCBGA package supports designs requiring hundreds of GPIO plus multiple serial links on a single device. When designing with the EP4SGX180KF40C2N, ensure the PCB supports the FC-BGA 1.0 mm ball pitch with proper microvia stack-up and matched-length routing for transceiver channels. Quartus II software with the Stratix IV device support is required for synthesis, place-and-route, and bitstream generation. Plan thermal dissipation carefully - the package has a substantial junction-to-ambient thermal resistance, and most Stratix IV GX designs require forced-air cooling. This page synthesizes real-time distributor pricing, verified Stratix IV GX family alternatives, and practical design guidance beyond what the manufacturer datasheet alone provides - enabling faster part selection and PCB re-spin decisions.
EP4SGX180KF40C4G - Stratix IV GX FPGA, 180K ALMs, 1517-FBGA | Altera
The Altera (now Intel) EP4SGX180KF40C4G is a high-density, high-performance Field-Programmable Gate Array (FPGA) from the Stratix IV GX family, packaged in a 1517-pin Fine-Pitch Ball Grid Array (FC-FBGA). The device integrates 175,750 logic cells (equivalent to approximately 180,000 adaptive logic modules / ~710,000 logic elements) and is built on a 40 nm process. It supports 744 maximum user I/Os and a 0.9 V core supply, and operates across industrial temperature grades with the 'C4' speed grade. A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) belonging to the broader semiconductor hierarchy of integrated circuits. FPGAs sit above standard logic ICs in capability: while ASICs are fixed at fabrication, FPGAs are reprogrammed post-manufacture using HDL bitstreams. Within Altera's portfolio, Stratix IV GX FPGAs are positioned above Cyclone IV (low-cost) and below Stratix V (high-end, 28 nm) — delivering high logic density with integrated transceivers. Key features include integrated transceivers up to 8.5 Gbps, embedded memory, dedicated DSP blocks, and a hard PCIe Gen2 / Gen1 controller. The 'GX' suffix denotes the transceiver-rich variant targeting high-speed serial I/O. The 'KF40' in the part number designates the 1517-ball FC-FBGA package, while 'C4' indicates the speed grade and 'G' the lead-free, RoHS-compliant tray packaging option. Stratix IV GX devices use a logic-structure based on adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), providing higher effective density than the 4-input LUTs used in older families. The architecture supports up to 1,300 MHz logic performance and includes dedicated on-chip memory, multipliers, and high-speed serial interface blocks for protocol bridging. Typical applications include high-end communications infrastructure (bridges, routers, OTN framer/mapper), high-performance digital signal processing (DDS, radar, beamforming), ASIC prototyping, broadcast video processing, and test & measurement equipment. The integrated multi-gigabit transceivers simplify PCB layout for protocols such as PCIe, Serial RapidIO, XAUI, and CEI-6G. When designing with this part, ensure adequate power supply decoupling with low-impedance planes, proper sequencing of the 0.9 V core and 1.1/1.2/2.5/3.0 V auxiliary rails, and thermal management given the 175,750-cell density dissipating several watts. Configure the device only with Quartus II (legacy) or the equivalent supported Intel FPGA toolchain. This page synthesizes distributor pricing from DigiKey/Mouser/Arrow, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
EP4SGX180KF40I3N - 180K LEs Stratix IV GX FPGA | Intel
The Intel EP4SGX180KF40I3N is a high-density Stratix IV GX family Field-Programmable Gate Array (FPGA) delivering 175,750 logic elements, 13,954,048 bits of embedded memory, and 744 user I/Os in a 1517-ball Flip-Chip FineLine BGA package. Built on a 40 nm process with a 0.9 V core supply, the device integrates up to 8.7 Mbits of distributed RAM, dedicated DSP blocks, and embedded transceivers that operate up to 3.125 Gbps, making it a strong fit for high-bandwidth serial-interface designs. According to distributor inventory records, this part is the industrial temperature grade ("I" suffix) and speed-grade 3 variant within the Stratix IV GX lineup. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that lets designers implement arbitrary digital functions after PCB fabrication. Stratix IV GX extends this architecture with multi-gigabit transceivers (MGTs) and dedicated PCI Express hard IP blocks, classifying it as a high-end transceiver-equipped FPGA. Within the broader hierarchy, this places the EP4SGX180KF40I3N in the Stratix family > Cyclone/Stratix tier > Intel/Altera programmable-logic portfolio > semiconductor IC. Key features include a maximum operating frequency supported by 8-input adaptive logic modules (ALMs), support for external memory interfaces including DDR3 SDRAM up to 800 MHz, and up to 8 PCIe Gen1 hard IP blocks. The Flip-Chip BGA package provides a high-ball-count interconnect necessary for the 744 user I/Os. According to the original Altera Stratix IV GX family datasheet, transceivers support CPRI, OBSAI, Serial RapidIO, PCIe Gen1/Gen2, and Gigabit Ethernet protocols out of the box. Typical applications include high-end telecommunications line cards, wireless baseband processing, military radar systems, broadcast video infrastructure, and high-performance ASIC prototyping. The 175K LE capacity makes the EP4SGX180KF40I3N particularly suitable for designs that previously required an ASIC but need the time-to-market advantage of programmable logic. Designers frequently pair this FPGA with external DDR3 memory, multi-gigabit serial interfaces, and high-speed ADC/DAC converters for digital signal processing workloads. When designing with this part, engineers should plan PCB layout for the 1517-ball FC-FBGA package carefully, including controlled-impedance routing for the MGT channels, matched-length differential pairs, and proper decoupling. Designers should also note that this device is now considered obsolete per multiple distributor listings (see lifecycle_status), so new designs should consider Stratix V, Stratix 10, or Agilex families for long-term availability. This page synthesizes distributor pricing snapshots, drop-in same-package alternatives, and PCB design notes that go beyond the manufacturer datasheet to help engineers evaluate the EP4SGX180KF40I3N for both new and legacy designs.
EP4SGX230DF29I3N - Stratix IV GX FPGA 228K LE | Intel
The Intel EP4SGX230DF29I3N is a Stratix IV GX family Field-Programmable Gate Array (FPGA) delivering 228000 logic elements and 17544192 bits of embedded memory in a 780-ball FCBGA (29x29 mm) package. It provides 9120 LABs/CLBs, 372 user I/O pins, and integrated transceivers optimized for high-speed serial connectivity. The part operates across an industrial -40C to +100C junction temperature range, making it suitable for harsh-environment embedded systems. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose interconnect and logic fabric can be programmed after manufacturing to implement custom digital circuits, signal-processing functions, or hardware accelerators. FPGAs occupy a distinct tier in the digital logic hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in software programmability. The Stratix IV family targets high-performance applications where parallel hardware execution and very high I/O bandwidth are mandatory, such as high-speed communications, signal processing, and ASIC prototyping. The EP4SGX230DF29I3N combines a high-density programmable logic fabric with multi-gigabit transceivers, on-chip memory, and DSP blocks. The Stratix IV GX variant integrates transceivers capable of multi-gigabit-per-second serial links, supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and custom serial interfaces. The 17544192 bits of embedded RAM enable large buffer pools and on-chip data storage without external memory for many use cases. Architecturally, the device leverages a 40 nm process with adaptive logic modules (ALMs), M9K and M144K memory blocks, variable-precision DSP blocks, and a rich clock network with PLLs. The 780-pin FCBGA package exposes 372 general-purpose I/Os, multiple transceiver channels, and high-speed memory interfaces, allowing the part to interface to DDR3, QDRII+, and RLDRAM II external memories. Typical applications include high-speed serial communication cards, software-defined radio, ASIC and SoC prototyping, high-performance computing accelerators, and high-bandwidth signal processing platforms. Designers typically choose the EP4SGX230DF29I3N when the design requires the combination of high logic density, integrated transceivers, and large on-chip memory. When designing with this FPGA, ensure PCB layout supports the FCBGA-780 footprint with proper via-in-pad construction and controlled-impedance routing for the transceiver channels. Power delivery must cover the core, PLL, transceiver, and I/O rails independently, with decoupling placed close to the package. Configuration via JTAG or a supported boot memory should be planned early in the schematic. This page consolidates distributor pricing, drop-in and same-family alternatives, and practical design considerations for the EP4SGX230DF29I3N that are not duplicated from the manufacturer datasheet.
EP4SGX230HF35I4G - 230K LE Stratix IV GX FPGA | Intel
The Intel EP4SGX230HF35I4G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) containing 228,000 logic elements, 17,544,192 bits of embedded RAM, and 1,728 18x18 multipliers, housed in a 1152-ball Flip-Chip BGA package with 564 user I/O pins. Built on a 40 nm process, it integrates up to 8.5 Gbps transceivers, hard PCIe Gen2 and Gen1 IP cores, and dedicated DSP blocks, targeting high-bandwidth serial connectivity and parallel processing workloads. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy - below them in complexity are CPLDs (Complex Programmable Logic Devices), and above them in integration are SoCs that combine an FPGA fabric with a hard processor core. Stratix IV GX specifically targets transceiver-rich applications where multi-gigabit serial I/O must coexist with substantial parallel DSP and memory bandwidth. Key features include 8 transceiver channels per device, 1,728 18-bit x 18-bit hardware multipliers, 1,335 Mbit/s LVDS performance, support for PCIe Gen1 (x1/x4/x8) and Gen2 (x1/x4/x8) hard IP blocks, and the Quartus Prime design suite for synthesis, place-and-route, and timing closure. The device also embeds 24 phase-locked loops (PLLs) for clock management and 8.5 Gbps serial data rates on the GX transceiver channels, enabling protocols such as PCIe, Serial RapidIO, XAUI, and HiGig. The architecture combines logic array blocks (LABs), MLABs (memory logic array blocks), TriMatrix embedded memory blocks, DSP blocks, and PLL clock networks, all interconnected by a multi-tier routing fabric. The 1152-pin FCBGA package provides high signal density for the 564 user I/O pins plus dedicated transceiver, configuration, and supply pins, while Flip-Chip technology offers superior thermal and electrical performance for high-power operation. Typical applications include high-end telecommunications line cards, ASIC prototyping, broadcast video processing, high-performance computing (HPC) acceleration, military radar and signal intelligence systems, and medical imaging equipment. The combination of transceivers, DSP blocks, and on-chip memory makes it suitable for applications requiring both massive I/O bandwidth and signal processing throughput. When designing with this device, thermal management is critical: the FCBGA requires a heatsink and forced-air cooling, and the PCB must use high-density microvia stack-ups to escape the BGA. Designers must also implement the 0.93 V core supply sequencing carefully and follow the Stratix IV GX Handbook reference for transceiver channel placement to maintain signal integrity at 8.5 Gbps. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix IV GX family, and practical design notes that go beyond what is summarized in the manufacturer datasheet.