EP4SGX110DF29I3G - 110K LE Stratix IV GX FPGA 780-FCBGA | Intel
부품 번호: EP4SGX110DF29I3G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2455 | $245,500.00 |
| 500 | $2230 | $1,115,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
EP4SGX110DF29I3G 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital logic that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose processors (which execute software) and application-specific integrated circuits (ASICs, which are fixed at fabrication). The Stratix IV family from Intel/Altera adds hardened IP blocks (transceivers, DSP, memory controllers, PCIe) that accelerate common functions and free up programmable logic for application-specific logic.
Key features include 105,600 LEs, 9,793,536 bits of embedded RAM, 660 DSP blocks, 16 transceivers at up to 8.5 Gbps, and a hard PCIe Gen2 controller. The device supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL I/O standards with hot-socketing capability, and includes dedicated on-chip termination (OCT) for signal integrity. Industrial-grade temperature range is -40C to +100C for I3 grade, suitable for harsh environments.
The architecture combines an 8.5 Gbps transceiver physical layer with a programmable logic fabric and embedded memory, allowing designers to implement protocols such as PCIe Gen2, Serial RapidIO, XAUI, and custom high-speed serial interfaces. The 40 nm low-power process minimizes dynamic power while preserving high performance, and on-chip PLLs support frequencies up to 800 MHz with fractional-N synthesis.
Typical applications include high-speed serial interfaces for communications infrastructure, PCIe accelerator cards in data center and server platforms, military and aerospace signal processing, high-end medical imaging, broadcast video processing, and industrial test equipment. The device's combination of transceiver bandwidth and DSP throughput makes it well suited for wireless baseband processing and radar systems.
When designing with this FPGA, ensure the PCB supports the 780-ball FCBGA's controlled-impedance routing and matched-length traces for transceiver channels. The Quartus II development environment (version 13.0 or later) is required for synthesis, place-and-route, and programming file generation. Designers should also plan power sequencing to the Stratix IV power-up requirements and verify transceiver reference clock jitter against the protocol specification.
This page synthesizes distributor pricing, package-equivalent Stratix IV GX drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving component buyers and FPGA designers a single reference for sourcing decisions.
드롭인 대체품: EP4SGX110DF29I3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX110DF29I3G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Transceivers, Mounting Type, Adaptive Logic Modules (ALM).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX110DF29C3G
✅ 드롭인✓ 재고 있음
$2610.5 / 개
데이터시트 보기 →EP4SGX110DF29C4G
✅ 드롭인✓ 재고 있음
$1495 / 개
데이터시트 보기 →EP4SGX110DF29I4G
✅ 드롭인✓ 재고 있음
$1085 / 개
데이터시트 보기 →EP4SGX110DF29C2XG
✅ 드롭인✓ 재고 있음
$1265 / 개
데이터시트 보기 →EP4SGX110DF29I3G 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Family | Stratix IV |
| Process Technology | 40 nm |
| Logic Elements (LE) | 105,600 |
| Adaptive Logic Modules (ALM) | 41,250 |
| Embedded Memory Bits | 9,793,536 |
| Embedded Memory Blocks (M9K) | 660 |
| DSP Blocks | 660 (18x18 multipliers) |
| Maximum User I/O | 372 |
| Transceivers | 16 (up to 8.5 Gbps) |
| PCIe Hard IP | Gen2 x4 (8.5 Gbps) |
| 패키지 | 780-ball FCBGA, 29x29 mm |
| Package Code | DF29 |
| 동작 온도 | -40C to +100C (Industrial I3 grade) |
| Speed Grade | 3 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EP4SGX110DF29I3G df29 핀 구성 가이드
EP4SGX110DF29I3G(df29 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX110DF29I3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX110DF29I3G 적합 용도: 6 애플리케이션s: Telecom Baseband and Backhaul, PCIe Accelerator Card (Data Center), Military and Aerospace Signal Processing, Medical Imaging Systems, Broadcast Video Processing, Industrial Test and Measurement.
Telecom Baseband and Backhaul
The EP4SGX110DF29I3G suits telecom baseband and backhaul designs because its 16 transceivers up to 8.5 Gbps handle CPRI, OBSAI, and Serial RapidIO links between baseband units and remote radio heads. The 105,600 LEs and 660 DSP blocks process PHY-layer functions such as channel coding, FFT/iFFT, and digital pre-distortion. The industrial -40C to +100C temperature range meets outdoor base-station specs.
추천
PCIe Accelerator Card (Data Center)
In PCIe Gen2 x4 accelerator cards, the EP4SGX110DF29I3G integrates a hard PCIe controller that handles transaction layer and link layer offload without burning programmable logic. The remaining 105,600 LEs run user workloads such as compression, encryption, or analytics. The 780-ball FCBGA's matched-length transceiver lanes support PCIe Gen2 signaling at 5 Gbps per lane with low jitter.
추천
Military and Aerospace Signal Processing
Defense systems use the EP4SGX110DF29I3G for radar, electronic warfare, and secure communications due to its industrial temperature range and radiation-tolerant design practices available in Stratix IV. The 660 DSP blocks (18x18 multipliers) enable real-time FFT, pulse-Doppler processing, and digital down-conversion. Reprogrammability allows in-field firmware updates for evolving threat environments.
추천
Medical Imaging Systems
Medical imaging modalities such as ultrasound, MRI, and CT scanners use the EP4SGX110DF29I3G to process high-bandwidth data streams in real time. The 9.8 Mbit embedded memory buffers raw transducer samples, while the 660 DSP blocks execute beamforming and image reconstruction. Industrial temperature tolerance supports mobile and bedside medical equipment that must operate in varying environmental conditions.
추천
Broadcast Video Processing
Broadcast video infrastructure including 3G/HD-SDI routers, format converters, and video servers benefits from the EP4SGX110DF29I3G's transceiver bandwidth and DSP capacity. The 8.5 Gbps transceivers handle uncompressed SDI streams, while embedded memory acts as frame buffers for cross-point switching. The industrial temperature grade supports 24/7 rack-mount operation in broadcast facilities.
추천
Industrial Test and Measurement
Automated test equipment (ATE) and protocol analyzers use the EP4SGX110DF29I3G to implement multi-channel high-speed serial interfaces and parallel test pattern generators. The 16 transceivers support standards like PCIe, SATA, USB 3.0 (PIPE), and XAUI simultaneously. The 372 user I/Os drive parallel buses and trigger signals, while DSP blocks accelerate FFT-based signal analysis on captured waveforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX110DF29I3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX110DF29C3G | EP4SGX110DF29C4G | EP4SGX110DF29I4G | EP4SGX110HF35C3G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA (DF29) 29x29 mm | 780-ball FCBGA (DF29) 29x29 mm - same | 780-ball FCBGA (DF29) 29x29 mm - same | 780-ball FCBGA (DF29) 29x29 mm - same | 780-ball FCBGA (HF35) 35x35 mm - different |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Embedded Memory | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits |
| DSP Blocks | 660 | 660 | 660 | 660 | 660 |
| Transceivers | 16 x 8.5 Gbps | 16 x 8.5 Gbps | 16 x 8.5 Gbps | 16 x 8.5 Gbps | 16 x 8.5 Gbps |
| Speed Grade | 3 | 3 | 4 (+10-15% Fmax) | 4 (+10-15% Fmax) | 3 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
주요 차별점
- Industrial temperature range in same package (vs EP4SGX110DF29C3G)
- Higher Fmax via speed grade 4 (vs EP4SGX110DF29C4G and EP4SGX110DF29I4G)
- Compact 29x29 mm package for size-constrained designs (vs EP4SGX110HF35C3G (35x35 mm))
설계 노트
The 780-ball FCBGA requires 1.0 mm ball pitch and microvia/laser-drilled PCB stack-up for breakout. Use at least an 8-layer board with dedicated ground planes beneath the device and matched 50 ohm single-ended or 100 ohm differential impedance for transceiver channels. Allocate 4 transceiver reference clock inputs with matched-length routing to within 25 mils. Decoupling requires 0.1uF and 0.01uF ceramics within 200 mils of power pins, plus bulk polymer tantalum caps.
Estimated: at typical Stratix IV GX utilization around 60-70% with all 16 transceivers at 8.5 Gbps, total power reaches approximately 12-15 W. Without airflow or a heatsink, the 780-ball FCBGA's theta_JA of around 14 C/W causes junction temperature rise of 170-210C above ambient, exceeding the 100C industrial limit. A heatsink with thermal interface material and 200-400 LFM airflow is mandatory; consider also a cold plate for sealed enclosures.
Do not omit CONFIG_DONE pull-up or JTAG pull-ups on nCONFIG, nSTATUS, and TCK - missing pull-ups cause intermittent configuration failures. Ensure the 1.0V core, 2.5V analog, and 3.3V I/O rails come up in the Stratix IV specified power-up sequence. Cyclone IV and Cyclone V bitstreams are not compatible; use only Quartus II 13.0 or 13.1 for final programming file generation to ensure correct silicon support.
규정 준수 정보
RoHS compliant per Intel Stratix IV GX RoHS certificate. Lead-free ball finish (SAC405 or similar). MSL level not stated in available data - marked [DATA_NEEDED]. AEC-Q100 not applicable for FPGAs.
