EP4SGX110DF29C4G - 105,600 LEs Stratix IV GX FPGA | Intel
부품 번호: EP4SGX110DF29C4G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1650 | $165,000.00 |
| 500 | $1580 | $790,000.00 |
| 1,000 | $1495 | $1,495,000.00 |
EP4SGX110DF29C4G 개요
A field-programmable gate array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, BRAM, and DSP slices. FPGAs belong to the broader programmable logic device (PLD) family and sit within the digital semiconductor hierarchy: programmable logic -> ASIC-class configurable logic -> semiconductor. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit, allowing rapid design iteration and field upgrades without re-spinning silicon.
Key features of the EP4SGX110DF29C4G include 4,224 adaptive logic modules (ALMs) totalling 105,600 equivalent logic elements (LEs), 372 user I/Os arranged across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards, and a high-performance fabric that sustains hundreds of MHz on critical paths. Hard PCI Express Gen1/Gen2 hard IP blocks and external memory interfaces up to DDR3 make the part attractive for bridging, protocol conversion, and accelerator workloads.
The architecture combines an adaptive logic module fabric with 8-channel transceiver blocks for multi-gigabit serial I/O, hard memory controllers, and a global clock network. The 40 nm low-power process node balances static and dynamic power while preserving high operating frequency.
Typical applications include high-speed serial interface bridging (PCIe, SRIO, XAUI, CPRI), wireless baseband and backhaul DSP, radar and signal-intelligence front-end processing, broadcast video routing, and military/aerospace signal processing. The integrated transceivers eliminate external PHY components and shorten design cycles.
When designing with this device, plan power sequencing around the 0.87-0.93 V core and the auxiliary PLL/ transceiver supplies; use Altera/Intel Quartus II software for synthesis, place-and-route, and timing closure. The 780-ball FCBGA package requires a multi-layer PCB with controlled-impedance routing and adequate thermal relief for sustained workloads.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP4SGX110DF29C4G, including same-package speed-grade and logic-density variants not consolidated in any single manufacturer table.
드롭인 대체품: EP4SGX110DF29C4G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX110DF29C4G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX110DF29C3G
✅ 드롭인✓ 재고 있음
$2610.5 / 개
데이터시트 보기 →EP4SGX110DF29C2XG
✅ 드롭인✓ 재고 있음
$1265 / 개
데이터시트 보기 →EP4SGX110DF29I4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX110DF29C4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX110FF35C4G
✅ 드롭인✓ 재고 있음
$2400 / 개
데이터시트 보기 →EP4SGX110DF29C4G 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements (LE) | 105,600 |
| Adaptive Logic Modules (ALM) | 4,224 |
| Embedded Memory (bits) | 9,793,536 |
| User I/Os | 372 |
| Operating Voltage (Vcore) | 0.87 V to 0.93 V |
| Process Technology | 40 nm |
| 패키지 | 780-ball FCBGA (DF29) |
| Speed Grade | C4 |
| 실장 유형 | Surface Mount |
| Transceivers | Up to 8.5 Gbps (GX) |
| Hard PCIe Blocks | Gen1/Gen2 |
| Memory Interfaces | DDR3, DDR2, QDR II+ |
| 동작 온도 | 0C to +85C (commercial) |
| RoHS 상태 | Compliant |
EP4SGX110DF29C4G 780-ball fcbga (df29) 핀 구성 가이드
EP4SGX110DF29C4G(780-ball fcbga (df29) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX110DF29C4G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX110DF29C4G 적합 용도: 6 애플리케이션s: PCIe Gen2 Endpoint Bridge, Wireless Baseband DSP Pipeline, Serial RapidIO Switch Fabric, Radar and SIGINT Front-End Processing, Broadcast Video Routing and Processing, Industrial High-Speed Data Acquisition.
PCIe Gen2 Endpoint Bridge
The EP4SGX110DF29C4G fits PCIe Gen2 bridge designs because its hard PCI Express Gen1/Gen2 IP block implements the transaction, data link, and physical layers without consuming FPGA fabric. The 105,600 LEs handle user logic such as DMA engines, BAR mapping, MSI-X interrupt generation, and application-specific register sets, while 9,793,536 bits of embedded memory buffer payload bursts. The integrated 8.5 Gbps transceivers drive the PCIe lanes directly, eliminating external PHY cost and jitter. At a 0.9 V Vcore, the part sits within typical 25 W server-card power envelopes. For PCIe Gen2 x4 or x8 endpoints, the EP4SGX110DF29C4G offers the optimal density-versus-power balance versus larger Stratix IV members.
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Wireless Baseband DSP Pipeline
In LTE and 5G baseband designs the EP4SGX110DF29C4G implements PHY-layer DSP at hundreds of MHz per stage. Its variable-precision DSP blocks deliver up to 18 x 18 multiplies with accumulate, and 9,793,536 bits of M9K/M144K block RAM hold coefficient tables and circular sample buffers. The Stratix IV GX fabric sustains >300 MHz on long FIR chains, while integrated transceivers support CPRI up to 6.144 Gbps for fronthaul links to remote radio heads. 372 user I/Os interface to ADC/DAC sample buses, JTAG, and baseband ASICs. The 40 nm process and 0.9 V core balance static and dynamic power for fan-cooled RRH chassis.
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Serial RapidIO Switch Fabric
The EP4SGX110DF29C4G suits Serial RapidIO (SRIO) switch fabrics thanks to its hard PCS supporting SRIO physical layer at 1.25 / 2.5 / 3.125 Gbps per lane, allowing 4x or 8x port implementations without external PHY. 105,600 LEs handle packet routing tables, congestion management, and maintenance functions, while 9.7 Mbits of block RAM store routing lookup tables. The 780-ball DF29 package exposes enough user I/Os for I2C management interfaces, GPIO status lines, and a host-side parallel port. Low-latency fabric interconnect (sub-1 ns between adjacent ALMs) keeps cut-through latency under protocol budgets for DSP-tile interconnect.
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Radar and SIGINT Front-End Processing
The EP4SGX110DF29C4G is well-suited to radar and signal-intelligence front ends where high-speed ADC data must be channelized, pulse-compressed, and detected in real time. Its 8.5 Gbps transceivers accept LVDS or serial ADC outputs directly, while the fabric implements FFT engines, moving-target-indicator filters, and pulse-Doppler banks. 9,793,536 bits of BRAM hold window coefficients and overlap-save buffers, and 372 user I/Os fan out detected tracks to back-end processors. The Stratix IV GX fabric's deterministic routing supports fixed-latency DSP pipelines essential for phase-coherent beamforming, and the commercial 0-85C operating range covers most ground-mobile platforms.
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Broadcast Video Routing and Processing
Broadcast studios and outside-broadcast vehicles route uncompressed SDI, HDMI, and DisplayPort streams through FPGAs for format conversion and embedding. The EP4SGX110DF29C4G supports SDI up to 3 Gbps (1080p60) using its transceivers, while 105,600 LEs implement up/down/cross converters, frame synchronizers, and audio embedders. The 9.7 Mbits of block RAM hold audio sample FIFOs and look-up tables for color-space conversion matrices. 372 user I/Os interface to HDMI receiver chips, audio codecs, and front-panel control. The commercial temperature grade and lead-free DF29 package suit fan-cooled 1U rack frames used in production switchers.
추천
Industrial High-Speed Data Acquisition
In industrial inspection and test systems the EP4SGX110DF29C4G aggregates streams from multi-MHz ADCs, performs real-time FFT or correlation, and forwards results over Ethernet or PCIe to host PCs. Its 372 user I/Os interface to parallel ADC/DAC buses, while the embedded transceivers support 10 Gigabit Ethernet via XAUI or Aurora for backhaul. 9.7 Mbits of BRAM cache time-domain samples during windowed processing, and the 40 nm process keeps typical board power under 15 W with proper thermal design. The 780-ball FCBGA's signal-integrity advantages suit designs with long parallel buses crossing backplane connectors.
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추천 제품 요약
엔지니어링 참조 데이터: EP4SGX110DF29C4G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX110DF29C3G | EP4SGX110DF29C2XG | EP4SGX110DF29I4N | EP4SGX110DF29C4N | EP4SGX110FF35C4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FCBGA (DF29) | 780-ball FCBGA (DF29) | 780-ball FCBGA (DF29) | 780-ball FCBGA (DF29) | 780-ball FCBGA (DF29) | 780-ball FCBGA (FF35) |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Embedded Memory (bits) | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 |
| User I/Os | 372 | 372 | 372 | 372 | 372 | 372 |
| Speed Grade | C4 | C3 (slower) | C2 (slowest) | I4 | C4 (same) | C4 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lead-Free Finish | Yes | Yes | Yes | Yes | Yes | Yes |
| Transceivers | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Same-footprint industrial-grade drop-in option available (vs EP4SGX110DF29I4N)
- Identical speed-grade alternative with lead-free finish (vs EP4SGX110DF29C4N)
- Slower speed grade option for power-constrained designs (vs EP4SGX110DF29C3G)
설계 노트
Estimated: at typical utilization (60% LEs, 50% block RAM, 4 active transceivers at 5 Gbps), the EP4SGX110DF29C4G consumes approximately 8-12 W on the 0.87-0.93 V Vcore rail. Use a multi-phase DC-DC regulator with output voltage accuracy of plus or minus 30 mV; the SmartVoltage pin on Stratix IV devices allows dynamic VID adjustment to reduce static power when transceivers are idle. Decouple each Vcore pin with 0.1 uF and 10 uF ceramic capacitors placed within 100 mils of the BGA ball, per the Stratix IV GX pin connection guidelines.
Estimated: with a junction-to-ambient thermal resistance (theta_JA) of approximately 8 C/W on a JEDEC 4-layer test board with airflow, a 10 W dissipation produces an 80C junction temperature rise above 25C ambient. For sustained workloads in commercial temperature range, design for less than 7 W total board power or add 200 LFM airflow. Avoid placing the FPGA adjacent to high-power regulators; route thermal vias through the BGA land pattern to inner ground planes.
The 780-ball DF29 FCBGA has a 1.0 mm ball pitch. Use a 4- or 6-layer PCB stackup with sequential lamination and microvia-in-pad construction for breakout routing. Each transceiver differential pair requires 100 ohm differential impedance with intra-pair length matching under 5 mils for 8.5 Gbps operation; consult the Stratix IV GX transceiver user guide for via-count and keep-out rules around reference planes.
Do not assume all 'EP4SGX110DF29' package code suffixes are pin-compatible: the DF29 package code applies only to the 780-ball FCBGA variant, while the FF35 suffix refers to a 780-ball package with a different ball map. Mixing DF29 and FF35 PCB footprints will fail board bring-up. Also note the C2 speed grade has measurable Fmax reduction versus C4, so timing closure margins must be re-validated if downgrading.
규정 준수 정보
RoHS and lead-free status confirmed by Intel product page and DigiKey part detail. AEC-Q100 not applicable as this is a commercial-grade FPGA; industrial-grade variants (I suffix) are not AEC-Q100 qualified either. Halogen-free status not stated in available data.
