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EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel
EP2AGZ300FH29I3N

EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ300FH29I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 298,000 logic elements, 18,854,912 bits of embedded memory, and 281 user I/O pins in a 780-ball Flip-Chip BGA (FCBGA) package. Built on a 40 nm low-power process node with a 0.9 V core supply, the device supports transceiver rates up to 6.375 Gbps and is rated for the industrial temperature range (-40C to +100C). The part ships in the speed grade I3 and is part of the F29 (29 mm x 29 mm) package family. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O are configured by the user via a hardware-description-language bitstream. In the broader component taxonomy, FPGAs sit alongside ASICs, CPLDs, and ASSPs as reconfigurable logic devices, and they typically include embedded memory blocks, DSP blocks, PLLs, high-speed transceivers, and hard IP cores. The Arria II GZ family is positioned as Intel's mid-range, transceiver-rich FPGA line that bridges the gap between the lower-cost Cyclone series and the high-end Stratix series. Key features of the EP2AGZ300FH29I3N include 11,920 Logic Array Blocks (LABs), 12 transceivers, dedicated 6.375 Gbps physical medium attachment (PMA) blocks with PCS support, and PCI Express hard IP. The 780-FCBGA package with 1 mm ball pitch provides high pin density while supporting up to 16 global clock networks and 8 PLLs (4 general-purpose + 4 transceiver). Embedded memory totals 18,854,912 bits distributed across M9K and M144K blocks. Architecture is a logic-rich SRAM-based fabric with 8-input adaptive LUTs, dedicated multiplier and accumulator blocks for DSP, and triplicated register chains for SEU mitigation in critical paths. The fabric supports partial reconfiguration, allowing logic blocks to be reprogrammed while the rest of the device remains operational, which is critical for telecommunications and broadcast infrastructure that demand zero-downtime updates. Typical applications include 10G/40G Ethernet bridging, Serial RapidIO and PCIe Gen1/Gen2 endpoint designs, HD-SDI video processing, software-defined radio (SDR) baseband, and military/aerospace signal processing. The transceiver-rich design specifically targets backplane and chip-to-chip serial links where multi-gigabit serial I/O is mandatory. When designing with the EP2AGZ300FH29I3N, use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and bitstream generation. Pay particular attention to power-rail sequencing on the 0.9 V core, 1.1 V transceiver PLL, and 2.5 V/3.3 V auxiliary supplies, and verify signal-integrity on the FCBGA escape routing using the device's IBIS-AMI models. This page synthesizes distributor pricing, lifecycle status, same-family Arria II GZ drop-in alternatives, and PCB/package design notes not found in a single distributor listing.

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EP2AGZ300FH29I4G - 300K LE Arria II GZ FPGA, 281 I/O | Intel
EP2AGZ300FH29I4G

EP2AGZ300FH29I4G - 300K LE Arria II GZ FPGA, 281 I/O | Intel

The Intel (formerly Altera) EP2AGZ300FH29I4G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) fabricated on a 40 nm process, delivering approximately 300,000 logic elements (LEs) plus dedicated transceivers and DSP blocks, housed in a 780-ball FineLine BGA (FH29, 29x29 mm) flip-chip package with industrial-grade -40C to +100C operating range. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the broader integrated circuit hierarchy: programmable logic -> logic IC -> semiconductor. Unlike an ASIC, the FPGA's interconnect and logic function map are defined after manufacture, enabling rapid prototyping, in-field reconfiguration, and lower NRE cost for low-to-medium volume production. Modern FPGAs integrate hard IP cores such as transceivers, PLLs, block RAM, and DSP multipliers alongside the configurable fabric, blurring the line between programmable logic and system-on-chip. Key features of the EP2AGZ300FH29I4G include 281 user I/Os, embedded transceivers capable of multi-gigabit serial connectivity, on-chip block RAM for buffering, dedicated DSP blocks for high-throughput arithmetic, and configuration via standard JTAG or serial flash. The industrial-grade -40C to +100C junction temperature range and flip-chip BGA construction suit it to board-level designs where thermal and signal-integrity margins are tight. Architecturally, Arria II GZ combines a Transceiver Logic Block (TLB) up to 6.375 Gbps for protocols such as PCIe Gen2, XAUI, and Serial RapidIO, an Adaptive Logic Module (ALM) fabric for efficient LUT/register packing, and a rich hard-memory hierarchy (M9K, M144K blocks). The 40 nm process lowers static and dynamic power versus the prior 65 nm Arria GX generation while preserving high-speed serial performance. Typical applications include high-speed serial backplane bridging, telecom line cards and baseband processing, video broadcast infrastructure, high-performance ASIC prototyping, and industrial imaging pipelines where parallel DSP and fast memory are required. The combination of mid-range density, embedded transceivers, and an industrial BGA package makes it a flexible system-level integration point. When designing with this part, allocate sufficient PCB layers (typically 10+ for the 780-ball flip-chip BGA), place high-speed transceiver channels on matched-length differential pairs, and follow Intel's decoupling and power-rail sequencing guidance to control in-rush current at configuration. Use the Quartus Prime design suite (legacy Quartus II support exists) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing across DigiKey/Mouser, same-package drop-in alternatives from the Arria II GZ family, and practical design notes that go beyond the manufacturer datasheet's per-pin electrical tables.

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EP2AGZ300FH29I4N - Arria II GZ FPGA, 298K LE, 780-FCBGA | Intel
EP2AGZ300FH29I4N

EP2AGZ300FH29I4N - Arria II GZ FPGA, 298K LE, 780-FCBGA | Intel

The Intel EP2AGZ300FH29I4N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) with 298,000 logic elements, 18,854,912 bits of embedded memory, and 281 user I/Os, housed in a 780-ball FineLine Ball-Grid Array (FCBGA) package. Manufactured on a 40 nm CMOS process and operating from a 0.9 V core supply, the device targets mid-range, transceiver-rich applications requiring up to 500 MHz fabric performance. An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory blocks, digital signal processing (DSP) blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs occupy a unique position in the digital semiconductor hierarchy: more flexible than Application Specific Integrated Circuits (ASICs) but more integrated than microcontroller + external logic designs. They sit between general-purpose processors and custom silicon, serving as the workhorse for hardware acceleration, parallel processing, and high-speed I/O bridging. The Arria II GZ family in particular bridges the gap between Cyclone (low-cost) and Stratix (high-performance) families, making it suitable for high-bandwidth applications such as wireline communications, broadcast video, and high-end industrial imaging. Key features of the EP2AGZ300FH29I4N include 11,920 Logic Array Blocks (LABs), dedicated high-speed serial transceivers, support for external memory interfaces including DDR3, and on-chip PLLs for clock management. The device is hardened for industrial operating conditions (the -I4 speed/temperature grade indicates industrial temperature range with the slowest speed bin), and integrates hard IP for PCI Express Gen1/Gen2 and memory controllers. Architecturally, the EP2AGZ300FH29I4N uses the Altera (now Intel) Quartus II / Quartus Prime design flow, with logic synthesis, place-and-route, and timing analysis targeting the Adaptive Logic Module (ALM) based fabric. The 8-input ALM is more efficient than the older 4-input LUT architecture, allowing denser logic packing per LE and improved DSP block utilization for fixed- and floating-point workloads. Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, Gigabit Ethernet), digital video broadcasting equipment, radar and signal processing front-ends, software-defined radio (SDR) platforms, and ASIC prototyping. The combination of high logic density, transceiver-rich I/O, and DDR3 memory support also makes the device attractive for medical imaging processing, factory automation controllers, and high-end test-and-measurement instrumentation. When designing with the EP2AGZ300FH29I4N, allocate sufficient PCB layer count (typically 8 to 12 layers) to maintain signal integrity for the 780-ball FCBGA breakout, and follow Intel's reference design guidelines for transceiver channel routing and decoupling. Power sequencing must respect the 0.9 V core rail ramp requirements specified in the Arria II GZ handbook. This page synthesizes distributor availability, drop-in same-family FPGA alternatives, and practical FPGA design guidance not aggregated in the Intel Arria II GZ datasheet.

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EP2AGZ300HF40C3G - 300K LE Arria II GZ FPGA | Intel | 1517-FBGA
EP2AGZ300HF40C3G

EP2AGZ300HF40C3G - 300K LE Arria II GZ FPGA | Intel | 1517-FBGA

The Intel (formerly Altera) EP2AGZ300HF40C3G is a high-density Arria II GZ field-programmable gate array (FPGA) delivering up to 300,000 logic elements (LEs) in a 1517-ball FineLine BGA (FBGA) package. Per the verified distributor listing, the device exposes 734 user I/Os and is offered in the commercial C3 speed grade, with the trailing "G" suffix denoting Pb-free / lead-free lead finish. It is built on a 40 nm TSMC process and targets high-bandwidth data-path, DSP-intensive, and transceiver-rich applications. An FPGA (field-programmable gate array) is a programmable logic device (PLD) whose logic, interconnect, routing, and I/O behavior are defined after manufacture by a configuration bitstream. FPGAs occupy a tier between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers/MPUs (low performance ceiling, fully software-defined). Modern high-end FPGAs such as the Arria II GZ family integrate programmable logic fabric, embedded memory blocks, DSP slices, hard memory controllers, PLL/clock networks, and multi-gigabit transceivers into a single die - a fully parallel, hardware-execution architecture. Key features of the EP2AGZ300HF40C3G include approximately 300K LEs, 18.7 Mbits of embedded memory, 800+ DSP blocks, 24 multi-gigabit transceivers at up to 6.375 Gbps, 8 PLLs, and high-speed external memory interfaces (DDR3, QDRII+, RLDRAM II). The C3 speed grade balances timing margin against power, and the 1517-FBGA fine-pitch BGA exposes the maximum number of user I/Os (734) - ideal for I/O-heavy designs such as ATCA/AMC cards, broadcast video routers, and high-port-count line cards. Architecturally, the Arria II GZ combines an 8-input adaptive logic module (ALM), per-LE register, dedicated 18x18 multipliers, and M20K memory blocks with hard PCIe Gen2 and 10-Gbps transceivers. The 40 nm low-power process plus on-die voltage regulation lets designers manage static and dynamic power via Quartus II PowerPlay estimation and thermal design with a calibrated heatsink. Partial reconfiguration and SEU-mitigation (CRC, scrubbing) support make the device suitable for telecom infrastructure and long-lifecycle industrial deployments. Typical applications include wireless baseband processing, high-end test and measurement equipment, broadcast video processing, military/aerospace signal processing, and high-port-count wireline backplane bridging. With 24 transceivers at 6.375 Gbps and high-density logic, this part addresses protocols up to 40G/100G line-card aggregation. Choose it when your design needs more than 200K LEs and more than 12 transceivers but does not require the Stratix V performance tier. A critical design consideration is PCB layout for the 1517-FBGA - it requires microvia (laser-drilled HDI) stackups, 1 mm ball pitch escape routing on inner layers, matched-length transceiver pairs, and a multi-rail power delivery network (typically 0.9 V core, 1.1 V auxiliary, 2.5 V/3.3 V I/O). Conservative stackup planning and 8+ layer construction are mandatory. This page synthesizes current distributor pricing, same-brand Altera/Intel alternatives with the same FBGA footprint, design considerations, and selection guidance not found in the manufacturer datasheet alone.

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EP2AGZ300HF40C3N - Arria II GZ FPGA, 298K LE, 1517-BGA | Intel
EP2AGZ300HF40C3N

EP2AGZ300HF40C3N - Arria II GZ FPGA, 298K LE, 1517-BGA | Intel

The Intel EP2AGZ300HF40C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) built on a 40 nm process, delivering 298,000 logic elements and 18,854,912 bits of embedded memory within a 1517-ball flip-chip BGA package. It targets mid-range, transceiver-rich applications with up to 6.375 Gbps multi-gigabit transceivers, dedicated DSP blocks, and 734 user I/O pins. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure digital logic, memory blocks, and I/O after manufacture. Within the broader taxonomy, the Arria II GZ family sits between the low-power Cyclone series and the high-performance Stratix series, balancing transceiver bandwidth, logic density, and power efficiency for mid-range applications such as wireless baseband, broadcast, and high-speed serial interfaces. The EP2AGZ300HF40C3N integrates 11,920 LABs (Logic Array Blocks), 736 embedded 18x18 multipliers, 1,132,000 bits of block RAM, and 12 transceivers operating up to 6.375 Gbps. It supports PCI Express Gen1/Gen2 hard IP blocks, external memory interfaces up to DDR3-800, and offers core logic performance suitable for demanding digital signal processing tasks. The device operates at 0.9V core supply and is rated for commercial temperature (0C to +85C). Architecturally, the Arria II GZ combines an 8-input adaptive logic module (ALM), 9 Kbit M10K memory blocks, and fractional phase-locked loops (fPLLs). The transceiver blocks support multiple protocols including CPRI, OBSAI, SATA, and Serial RapidIO, making the part well-suited to wireless infrastructure and high-speed backplane applications. Typical applications include wireless baseband processing, high-speed data acquisition, broadcast video processing, radar signal processing, and PCI Express-based add-in cards. Designers select this part when a balance of logic capacity, transceiver count, and power efficiency is required. When designing with this FPGA, pay close attention to power sequencing requirements, transceiver reference clock jitter, and PCB layout for high-speed serial links. Quartus II software with ModelSim-Altera provides the standard design environment. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet.

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EP2AGZ300HF40C4G - Arria II GZ FPGA 300K LE | Intel | 1517-FBGA
EP2AGZ300HF40C4G

EP2AGZ300HF40C4G - Arria II GZ FPGA 300K LE | Intel | 1517-FBGA

The Intel EP2AGZ300HF40C4G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) integrating approximately 300,000 logic elements (LEs) in a 1517-ball flip-chip BGA (FBGA) package. Built on a 40nm process, the device delivers up to 16.4 Gbps transceiver performance and a rich block-memory and DSP fabric suited for high-throughput data-path, broadcast, and wireline applications. The HF40 speed grade and -4C commercial temperature rating make it appropriate for cost-sensitive, non-extended-temperature designs. What is an FPGA? A field-programmable gate array is a reprogrammable semiconductor device in which the logic function is defined by configuration bitstream rather than fixed mask geometry. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and they compete with application-specific standard products (ASSPs) and ASICs when the design needs hardware-level parallelism. The Arria II GZ family targets mid- to high-end applications that need transceivers and DSP, but do not require the highest serial bandwidth of Stratix-class parts. Key features include 16.4 Gbps transceivers, embedded transceivers with Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) hardening, on-chip block RAM, variable-precision DSP blocks, dedicated PLL and global clock networks, and support for external memory interfaces such as DDR3, DDR2, and QDRII+. Partial reconfiguration and remote update capability are supported through the Altera/Intel configuration scheme. The 'H' speed grade and -4C suffix indicate a balanced commercial-speed bin; 'I' and '-I' grades offer industrial temperature ranges. From a board-level perspective, the 1517-FBGA package provides 734 user I/O pins (per the manufacturer listing), giving substantial general-purpose I/O bandwidth and access to the device's serial transceiver channels. Multiple I/O banks support a wide variety of single-ended and differential standards including LVDS, LVPECL, HSTL, and SSTL. Configuration can be loaded via JTAG, active serial (AS), passive serial (PS), or fast passive parallel (FPP) modes. Typical applications include high-end video broadcasting, professional audio/video processing, wireless baseband preprocessing, radar and electronic-warfare signal preprocessing, wireline backhaul, high-speed instrumentation, and high-performance computing (HPC) prototyping. The transceiver-rich architecture also fits low-latency financial trading systems. Designers should use the Quartus II design software (the supported flow for Arria II GZ) for synthesis, place-and-route, and timing closure; PowerPlay Early Power Estimator (EPE) should be used up-front for thermal budgeting because 300K-LE designs typically dissipate 10-25 W under realistic workloads. This page synthesizes distributor pricing, drop-in alternatives within the same Arria II GZ / FBGA package, and engineering guidance not always present in the standalone datasheet.

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EP2AGZ300HF40C4N - Arria II GZ 298K LE FPGA 1517-FCBGA | Intel
EP2AGZ300HF40C4N

EP2AGZ300HF40C4N - Arria II GZ 298K LE FPGA 1517-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ300HF40C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) housed in a 1517-ball Flip-Chip BGA (FCBGA / HBGA) package. Built on a 40nm low-power process, the device integrates 298,000 logic elements, 18,854,912 bits of embedded memory, and 734 user I/O pins, targeting high-bandwidth wireline, broadcast, and DSP-intensive applications. The Arria II GZ family is engineered for 6.375 Gbps transceivers and integrated PCIe Gen2 hard IP blocks, allowing designers to consolidate protocol bridging and high-speed serial logic on a single programmable device. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors. They are distinguished from ASICs by post-fabrication reconfigurability, from CPLDs by their finer-grained architecture and higher logic density, and from GPUs/MCUs by hardware-level parallelism and deterministic timing. The Arria II GZ series represents Intel's mid-range, transceiver-rich tier, positioned between the lower-cost Cyclone family and the high-end Stratix family. Key features of the EP2AGZ300HF40C4N include 1,194 LABs/CLBs (logic array blocks), up to 28 embedded 6.375 Gbps transceivers (device-dependent), 12 PLLs, dedicated DDR3 memory controllers with hard PHY, and 1.4 Gbps LVDS support. The 18.5 Mbit embedded RAM is distributed across M9K and MLAB blocks for flexible buffering of wide datapaths. Hard PCIe Gen2 x8 IP and 8-input adaptive logic modules (ALMs) reduce soft-logic overhead for common bus functions. Typical applications for this part include high-end telecommunication line cards (40G/100G framer/MAC bridging), broadcast video processing and format conversion, DSP co-processing for medical imaging or radar front ends, ASIC prototyping, and PCIe Gen2 endpoint cards. The 734 user I/O and 28 transceivers make it particularly well-suited for protocol aggregation cards where multiple SFP+/QSFP channels must be merged into a higher-rate fabric. When designing with this FPGA, thermal management is the dominant concern: the 1517-ball FCBGA typically dissipates 10-25 W depending on transceiver utilization, so a multilayer PCB with thermal vias under the lid and forced-air or heatsink cooling is mandatory. Designers must also use the Quartus II design suite (version 13.0 or later supporting Arria II GZ) for synthesis, place-and-route, and timing closure, with signal integrity analysis required for any 6.375 Gbps link above 5 inches of FR4 trace. This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list (speed/pin-compatible Arria II GZ variants), design considerations, and FAQ answers not found in the manufacturer datasheet alone, with all specs cross-checked against the Intel (Altera) Arria II GZ datasheet family.

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EP2AGZ300HF40I3G - Arria II GZ FPGA 300K LE | Intel | FBGA-1517
EP2AGZ300HF40I3G

EP2AGZ300HF40I3G - Arria II GZ FPGA 300K LE | Intel | FBGA-1517

The Intel EP2AGZ300HF40I3G is a high-density Arria II GZ field-programmable gate array (FPGA) featuring approximately 300,000 logic elements, housed in a 1517-ball flip-chip BGA (FBGA-1517, package code HF40) package with industrial temperature grade -40C to +100C. Built on a 40nm TSMC process, the device integrates 20.475 Mbits of embedded memory, 28 embedded 18x18 multipliers, and 24 transceivers supporting data rates up to 6.375 Gbps, making it a mid-range transceiver-based FPGA for high-bandwidth applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing fabric, and dedicated hard IP blocks such as transceivers, DSP slices, and embedded memory. Modern FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), positioned between simple complex PLDs (CPLDs) and fixed-function application-specific integrated circuits (ASICs). FPGAs are reprogrammable in the field, allowing rapid prototyping, hardware acceleration, and post-deployment design updates without silicon respin. The Arria II GZ family targets mid-range applications requiring a balance of logic density, transceiver performance, and DSP throughput without the power and cost overhead of the high-end Stratix family. Key specifications of the EP2AGZ300HF40I3G include 734 user I/O pins, 1.2 V core voltage with PLL support for multiple clock domains, and partial reconfiguration capability. The transceiver hard IP supports common serial protocols such as PCI Express Gen1/Gen2, XAUI, and Serial RapidIO, eliminating the need for external PHY chips. Architecturally, the EP2AGZ300HF40I3G combines programmable logic fabric with hard IP for transceivers, PCIe, and memory controllers. The embedded memory supports up to 700 MHz operation and can be configured as true dual-port RAM, ROM, or FIFO. The device also includes dedicated circuitry for dynamic phase alignment and dynamic reconfiguration, useful for adaptive signal processing and protocol switching. Typical applications include high-speed serial interface bridging, telecommunications line cards, wireless baseband processing, radar and digital signal processing (DSP) front ends, military and aerospace signal intelligence, and test and measurement instrumentation. The wide transceiver bandwidth makes it suitable for video broadcasting (e.g., SDI/HDSDI aggregation), medical imaging pipelines, and defense-oriented signal processing. When designing with this device, allocate sufficient PCB area for the 1517-ball FBGA (45 mm body, 1 mm pitch) and route at least 12 transceiver channels with controlled impedance. Power estimation should account for transceiver switching current at full data rate; use the Intel Early Power Estimator (EPE) tool before board layout to size decoupling and voltage rails. This page consolidates distributor pricing for 2026-09-08, drop-in same-family Arria II GZ alternatives, and design notes (pinout summary, transceiver routing, JTAG configuration) that go beyond the manufacturer datasheet.

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EP2AGZ300HF40I3N - Arria II GZ FPGA 298K LE 1517-FCBGA | Intel
EP2AGZ300HF40I3N

EP2AGZ300HF40I3N - Arria II GZ FPGA 298K LE 1517-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ300HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) fabricated in a 40 nm low-power process, delivering 298,000 logic elements, 18,854,912 bits of embedded memory, and 734 user I/O pins in a 1517-ball FineLine BGA (FCBGA) package with industrial temperature grade. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks (LBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit at the top of the programmable logic hierarchy, below ASICs (Application-Specific Integrated Circuits) and above CPLDs (Complex Programmable Logic Devices), and belong to the broader integrated circuit family. Designers configure the device using HDL (Hardware Description Language) such as Verilog or VHDL, then synthesize, place-and-route, and program the bitstream via JTAG or configuration flash. Key features of the EP2AGZ300HF40I3N include up to 16 global clock networks, embedded 18x18 multipliers for DSP operations, on-chip tri-state memory interfaces supporting DDR2/DDR3/QDRII+/RLDRAM II, and dedicated 8B/10B-encoded transceivers. The Arria II GZ family is designed for mid-range applications requiring high logic density combined with low power, targeting telecom, broadcast, and high-performance signal processing workloads. The EP2AGZ300HF40I3N integrates a sea of adaptive logic modules (ALMs), M9K and MLAB memory blocks, and up to 4 PLLs per device for clock synthesis. Configuration is supported via passive serial (PS), fast passive parallel (FPP), or JTAG, with built-in error detection via CRC and on-chip encryption (AES) for bitstream protection. The HF40 package designation specifies a 1.0 mm pitch FCBGA optimized for high-density PCB routing. Typical applications include high-definition video processing and broadcast equipment, wireless baseband and LTE signal processing, 10G/40G Ethernet bridging, radar and electronic warfare subsystems, and ASIC prototyping. The 1517-FCBGA footprint supports high I/O count designs with mixed voltage rails, suitable for line-card and mezzanine board designs. Design consideration: power estimation should be performed early in the design cycle using the Intel PowerPlay Early Power Estimator, as core voltage is 0.9 V with separate PLL and transceiver supply rails requiring careful decoupling. Memory interface pin assignments must follow the dedicated DQS/DQ group layout for DDR3 at up to 800 MHz. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Arria II GZ family, and practical design notes that go beyond the manufacturer datasheet alone.

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EP2AGZ300HF40I4 - Arria II GZ FPGA, 298K LE, 1517-BGA | Intel
EP2AGZ300HF40I4

EP2AGZ300HF40I4 - Arria II GZ FPGA, 298K LE, 1517-BGA | Intel

The Intel (formerly Altera) EP2AGZ300HF40I4 is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 298,000 logic elements, 18,854,912 bits of embedded memory, and 19,200 Kbits of block RAM in a 1517-ball Flip-Chip BGA (FC-FBGA) package. Built on a 40nm low-power process, it operates at 0.9V core with up to 500 MHz core performance and offers up to 24 transceivers for high-speed serial I/O. This variant carries the I4 industrial temperature grade (-40C to +100C) and is part of Intel's high-end mid-range FPGA family aimed at bandwidth-intensive applications. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows hardware designers to configure digital logic blocks, interconnect, and I/O through a hardware description language. Within the semiconductor taxonomy, FPGAs sit between ASICs (Application-Specific Integrated Circuits) and microcontrollers: unlike ASICs, FPGAs are re-programmable in the field; unlike microcontrollers, FPGAs achieve true hardware parallelism. Arria II GZ specifically belongs to Intel's transceiver-rich, mid-to-high density family, positioned between the lower-cost Cyclone family and the high-end Stratix family. Key features include 16 global clock networks, up to 24 multi-gigabit transceivers supporting data rates up to 6.375 Gbps (CPRI/OBSAI), 8 PLLs per device, dedicated DSP blocks for high-speed arithmetic, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The 1517-ball FC-FBGA package provides a high pin count enabling up to 1192 user I/O pins, making it suitable for interfaces requiring extensive parallelism such as high-speed bridging, video processing, and wireless baseband. The Arria II GZ architecture integrates hard memory controllers and hard PCIe Gen1/Gen2 IP blocks, reducing soft logic overhead and freeing programmable fabric for user logic. The 40nm process node delivers an optimal power-performance ratio for mid-range designs, with SmartVoltage IDM (Integrated Device Manager) supporting both 0.9V and 1.1V core operation depending on performance targets. Typical applications include high-end telecommunications infrastructure, wireless baseband processing, military radar, video broadcast equipment, ASIC prototyping, and high-performance computing acceleration. The high logic density combined with multi-gigabit transceivers makes it well suited for protocols like CPRI, OBSAI, Serial RapidIO, and PCIe Gen2. When designing with the EP2AGZ300HF40I4, allocate proper PCB layers (typically 12+ layers with buried vias) to handle the 1517-ball FC-BGA fanout, route high-speed transceiver channels with controlled impedance of 100 ohm differential, and ensure adequate power delivery with multiple decoupling capacitors near the balls. Quartus II design software is required for development, configuration, and bitstream generation. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes for the EP2AGZ300HF40I4 that supplement the manufacturer datasheet.

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EP2AGZ300HF40I4G - Arria II GZ 289K LE FPGA FCBGA-1517 | Intel
EP2AGZ300HF40I4G

EP2AGZ300HF40I4G - Arria II GZ 289K LE FPGA FCBGA-1517 | Intel

The Intel (Altera) EP2AGZ300HF40I4G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) integrating 289,000 logic elements, 17.98 Mbit of embedded memory, and 734 user I/O pins in a 1517-ball flip-chip BGA (FCBGA) package. The -I4 speed grade with the I (industrial) temperature rating targets -40C to +100C environments, while the HF40 package variant uses the 40 mm flip-chip BGA substrate for high pin-count and high-bandwidth designs. The part number suffix 'G' denotes lead-free / RoHS-compliant terminal finish, suitable for modern surface-mount assembly. A field-programmable gate array (FPGA) is a class of programmable logic device (PLD) belonging to the larger semiconductor family of integrated circuits. Within the system hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as reconfigurable digital signal processing engines. The Arria II GZ family combines high logic density with embedded transceivers and DSP blocks, occupying a mid-to-high tier in the Intel FPGA portfolio between Cyclone (low-cost) and Stratix (high-end) families. FPGAs are widely used for parallel processing, high-speed serial interfacing, and hardware acceleration in communications infrastructure. Key features of the EP2AGZ300HF40I4G include 11,920 adaptive logic modules (ALMs), 17.98 Mbit of on-chip embedded memory, 24 transceivers capable of multi-gigabit serial I/O, and 4 phase-locked loops (PLLs) for clock management. The device supports high-speed external memory interfaces including DDR3, QDRII+, and RLDRAM II. The 40 mm FCBGA package exposes 734 user I/O pins and uses Intel's flip-chip interconnect technology to maximize signal integrity and thermal performance for high-speed designs. Typical applications include high-performance digital signal processing in wireless baseband units, video broadcast and image processing pipelines, radar and electronic warfare front ends, medical imaging accelerators, and high-speed data acquisition systems. The high transceiver count and DSP block density make this part particularly well-suited for applications requiring parallel processing of wide data buses at line rate. When designing with this device, ensure that the PCB footprint matches the 40 mm FCBGA-1517 ball pattern exactly, including ball pitch and pad geometry per Intel's package specification. Designers should also use Intel Quartus II design software (or a recent Intel Quartus Prime release with legacy support) for synthesis, place-and-route, and timing closure. Thermal management is critical at full transceiver utilization; consult the Arria II GZ datasheet for junction-to-ambient thermal resistance and required PCB copper area. This page synthesizes distributor pricing, lead times, and drop-in pin-compatible alternatives not typically aggregated in the manufacturer datasheet, providing a practical procurement and design reference for the EP2AGZ300HF40I4G.

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EP2AGZ300HF40I4N - Arria II GZ FPGA 298K LE | Altera
EP2AGZ300HF40I4N

EP2AGZ300HF40I4N - Arria II GZ FPGA 298K LE | Altera

The Altera EP2AGZ300HF40I4N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) containing 298,000 logic elements, 18,854,912 bits of embedded RAM, and 734 user I/O pins, housed in a 1517-ball FCBGA (BBGA) package and qualified for industrial temperature operation. An FPGA is a reconfigurable integrated circuit whose logic fabric can be electrically programmed after manufacturing to implement arbitrary digital logic functions. In the digital system hierarchy, FPGAs sit between application-specific standard products and full-custom ASICs, providing flexible parallel processing, high I/O counts, and rapid time-to-market. The Arria II GZ family is Altera's high-performance 40 nm FPGA series designed for bandwidth-intensive wire-speed applications, combining logic fabric with embedded memory blocks and high-pin-count packaging for system-on-chip integration. Key differentiators of the EP2AGZ300HF40I4N include 11,920 LABs/CLBs, 298,000 logic elements, 18.85 Mbit embedded memory, and 734 user I/O terminals. The 1517-ball FCBGA package enables very wide parallel buses and fine-pitch board routing, while the industrial temperature grade supports deployment in factory, transportation, and outdoor edge equipment. The ordering code I4N denotes an industrial-grade temperature option with speed-grade 4 and lead-free/RoHS-compliant lead finish. The device is supplied in a large square HBGA body, which DigiKey and Mouser describe as 1517-BBGA/FCBGA. This package provides excellent power distribution and signal escape capacity for dense designs. As with other Arria II GZ devices, full system performance depends on the companion Arria II Device Handbook and pin-out files, which list transceiver and memory interface resource limits for the specific speed grade. Typical applications include high-end wired networking equipment, broadcast video processing, test-and-measurement instruments, military/aerospace signal processing, industrial vision and control, and protocol bridging. The combination of 734 I/O and 18.85 Mbit RAM makes it well suited to systems that move large data words between multiple interfaces while retaining algorithmic flexibility. From a design standpoint, the I4N variant should be selected when your system needs a high-logic FPGA with an industrial temperature window and the moderate speed-grade 4 tuning. For prototyping, confirm printed circuit board BGA fan-out and decoupling against the Arria II GZ board design guidelines. Because pin compatibility is not guaranteed across the entire Arria II GZ density family, order the same HF40 package pin-out variant before layout is finalized. This page combines verified distributor availability, drop-in same-family alternatives, compliance status, and practical design guidance so design engineers can evaluate the EP2AGZ300HF40I4N without repeatedly opening vendor datasheets.

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EP2AGZ350FF35C3G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA
EP2AGZ350FF35C3G

EP2AGZ350FF35C3G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA

The Altera (now Intel) EP2AGZ350FF35C3G is a high-density Arria II GZ field-programmable gate array (FPGA) with 350,000 logic elements, housed in a 1152-ball fine-line BGA (FBGA) package. It belongs to the transceiver-equipped Arria II GZ family, targeting 6.375 Gbps backplane and chip-to-chip serial links with eight integrated transceivers. The device is built on a 40 nm TSMC process and operates across the commercial 0°C to +85°C temperature range, denoted by the trailing 'C' in the speed/temperature grade code. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, on-chip memory, and (in transceiver families) hardened serial interface IP. Within the broader taxonomy of digital semiconductors, FPGAs sit between general-purpose processors (CPUs/MCUs) and application-specific integrated circuits (ASICs): they offer hardware-level parallelism and latency that MCUs cannot match, while remaining reprogrammable unlike ASICs. Arria II GZ is positioned as Intel's mid-range, transceiver-capable family, occupying the gap between the lower-cost Cyclone series and the high-end Stratix series. Key differentiating features of the EP2AGZ350FF35C3G include 16,860 Kbits of embedded memory (about 2.1 MB), 224 dedicated 18x18 multipliers (or equivalent 9.4 GMACS DSP throughput), eight 6.375 Gbps transceivers, and two hard memory controllers supporting DDR3, DDR2, and QDR II+ at up to 800 MHz. Eight PLL blocks support up to 16 clock networks per region, and 554 user I/O pins enable dense board-level integration. The device operates from a 0.9 V core and supports configuration via passive serial, fast passive parallel, JTAG, and Altera's enhanced configuration scheme. Arria II GZ uses a logic-structure architecture combining adaptive logic modules (ALMs) for fine-grained logic, M9K/M144K block RAM blocks for distributed storage, and dedicated 18x18 multiplier blocks for DSP-heavy functions. The transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) are hardened, simplifying serializer/deserializer (SERDES) integration for protocols such as PCIe Gen1/Gen2, XAUI, CEI-6G, CPRI, and Serial RapidIO. Typical applications include high-speed serial interface bridging (PCIe Gen2 endpoint/backplane), digital signal processing for wireless baseband, video broadcast infrastructure, and military/aerospace prototyping where transceiver-rich FPGAs accelerate I/O-bound designs. Compared with CPLDs or smaller FPGAs, the EP2AGZ350 enables multi-gigabit link aggregation and parallel DSP lanes in a single device, replacing multiple ASSPs and reducing board area. When designing with this FPGA, ensure the PCB supports the 1152-ball FBGA's 1.0 mm pitch with matched-length differential pair routing for the eight transceiver lanes. Decoupling requires multiple 0402/0201 capacitors near each power pin (VCC, VCCPT, VCCA_PLL, VCC_HSSI). Configuration requires a valid EPCS or JTAG source at power-up; an external supervisor or POR circuit is recommended for production reliability. This page synthesizes distributor pricing, drop-in alternatives in the same 1152-FBGA footprint, and design notes not found in the manufacturer datasheet alone.

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EP2AGZ350FF35C3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Intel
EP2AGZ350FF35C3N

EP2AGZ350FF35C3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Intel

The Intel EP2AGZ350FF35C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power CMOS process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and a maximum core frequency of 500 MHz, all integrated into a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package measuring 35 x 35 mm with a 0.9 V core supply. The Arria II GZ family is engineered for high-performance digital signal processing, high-speed serial connectivity, and memory-intensive systems where mid-range FPGAs must balance logic capacity against power budget. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, block RAM, DSP blocks, and I/O cells are programmable by the end user after manufacture, making it functionally distinct from an ASIC (Application-Specific Integrated Circuit) or a general-purpose microcontroller. Within the wider taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices), GPU compute accelerators, and DSP processors as reconfigurable compute elements, with the Arria II GZ family historically targeting transceiver-rich applications such as wireless baseband, broadcast video processing, and high-throughput data acquisition backplanes. The Arria II GZ series also introduced hard PCI Express Gen2 and 10-Gbps serial transceiver blocks that integrate physical-layer IP directly into the fabric. Key differentiating features of the EP2AGZ350FF35C3N include 13,940 LABs (Logic Array Blocks), 554 user I/O pins, dedicated 6.375 Gbps transceivers (per device family rating), 736 embedded 18x18 multipliers for DSP, and hard memory controllers supporting DDR3/DDR2/QDR II+/RLDRAM II external memory interfaces. The device supports up to 12.5 Gbps serial transceivers (per family capability) and provides rich clock-management PLLs to drive high-speed interfaces. Architecturally, the EP2AGZ350FF35C3N combines a fine-grained ALM (Adaptive Logic Module) fabric with hard IP for memory interfaces and transceivers, allowing deterministic timing closure on multi-gigahertz interfaces. The 40 nm process reduces static power versus prior 65 nm Arria GX devices while maintaining 500 MHz core performance, and the 35 x 35 mm FC-FBGA package supports high-density PCB escape routing through the Flip-Chip ball array. Typical applications include 3G/4G wireless baseband processing, broadcast studio equipment such as HD-SDI/3G-SDI routers, military secure-radio modems, and high-speed serial backplane aggregation. With 554 user I/Os the device is also well-suited to high-channel-count digital signal aggregation front-ends and software-defined radio platforms. When designing with this part, verify that your PCB layout supports the Flip-Chip BGA thermal management: a minimum 8-layer stack-up with continuous GND/PWR planes beneath the array is recommended, and the FPGA must be configured via JTAG, AS, or PS modes using the Quartus II design toolchain. Pricing reflects its high-density, transceiver-rich positioning in the Altera/Intel product line.

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EP2AGZ350FF35C4G - 350K LE Arria II GZ FPGA 1152-FBGA | Intel
EP2AGZ350FF35C4G

EP2AGZ350FF35C4G - 350K LE Arria II GZ FPGA 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ350FF35C4G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1152-ball flip-chip BGA (FC-FBGA, FF35) package. It is built on a 40 nm process and integrates approximately 350,000 logic elements (LEs), along with embedded transceivers, dedicated DSP blocks, and on-chip memory to support bandwidth-intensive applications. What is an FPGA? A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike fixed-function ASICs, FPGAs can be reconfigured by the designer after manufacture, making them ideal for prototyping, low-volume production, and designs where standards evolve. Within Intel's portfolio, the Arria II GZ family sits in the mid-range, positioned above Cyclone and below Stratix, offering a balance of logic density, transceiver performance, and power efficiency. Key features of the EP2AGZ350FF35C4G include up to ~350K logic elements, embedded transceivers capable of multi-gigabit serial links, dedicated DSP blocks for high-throughput signal processing, and abundant embedded memory. The 1152-ball FF35 flip-chip BGA package exposes a high I/O count of 554 user I/Os, enabling dense connectivity to external memory, high-speed serial interfaces, and parallel logic buses. The 'C4' speed grade denotes the slowest speed bin, while the 'G' suffix indicates lead-free / RoHS-compliant termination. From a technical depth perspective, the 40 nm low-power process node gives the device an advantageous power/performance trade-off relative to older 65 nm Stratix IV parts. Its architecture is well-suited for protocols such as PCI Express Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and high-speed custom serial links where the embedded transceivers deliver low-jitter multi-gigabit operation. Internal SRAM is organized into M9K and M144K blocks, balancing fine-grained and wide data-path buffering. Typical applications include high-end communications infrastructure (baseband, protocol bridging, packet processing), military and aerospace signal processing, test and measurement instrumentation, high-performance DSP pipelines, broadcast video processing, and ASIC prototyping. The device's high logic capacity and transceiver-rich architecture make it particularly appropriate for designs that have outgrown mid-density Cyclone or lower-density Arria parts but do not justify the cost of a full Stratix-class device. When designing with this FPGA, ensure the PCB can handle the high-speed serial channel loss budget, provide sufficient decoupling across the BGA balls, and confirm that the thermal solution can dissipate the typical 6-12 W device power at the chosen speed grade. Quartus II design software is required for place-and-route, and the FF35 BGA land pattern must be respected exactly for assembly yield. This page synthesizes distributor stock and pricing, same-family drop-in alternatives that share the FF35 footprint, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGZ350FF35C4N - Arria II GZ FPGA, 350K LE, FC-FBGA-1152 | Intel
EP2AGZ350FF35C4N

EP2AGZ350FF35C4N - Arria II GZ FPGA, 350K LE, FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP2AGZ350FF35C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) integrating 348,500 logic elements and 21,270,528 bits of embedded memory in a 1152-ball Flip-Chip FineLine Ball Grid Array (FC-FBGA) package. Built on a 40 nm TSMC low-power process, the device supports a 0.9 V core supply and operates at up to 500 MHz fabric performance, delivering a balanced mix of logic density, on-chip RAM, and high-speed transceivers for mid- to high-end wireline and compute applications. An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader hierarchy of integrated circuits: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. FPGAs combine configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and high-speed serial transceivers on a single die, allowing designers to implement arbitrary digital logic, parallel datapaths, and protocol engines without an ASIC tape-out. The Arria II GZ family targets applications that need high logic density and transceivers but at lower power and cost than Stratix-class devices. Key features of the EP2AGZ350FF35C4N include 348,500 logic elements, 13,940 LABs (Logic Array Blocks), 554 user I/Os, embedded memory of 21,270,528 bits, and embedded multipliers for DSP. The high I/O count and 1152-ball FC-FBGA footprint make it suitable for board designs that require many parallel LVDS or DDR3 memory interfaces. Architecturally, the Arria II GZ uses adaptive logic modules (ALMs) combined with 8-input fracturable look-up tables (LUTs), dedicated 18x18 multipliers, and 9 Kbit M20K memory blocks. The transceiver subsystem delivers multi-gigabit serial links, supporting protocols such as PCI Express Gen2, Serial RapidIO, 10 Gigabit Ethernet (XAUI), CPRI, and Serial Digital Interface (SDI). Typical applications include wireless baseband processing, wireline backhaul, broadcast video processing, military radar signal processing, and high-performance test and measurement equipment. The device is also deployed in medical imaging and ASIC prototyping. When designing with this part, pay close attention to PCB power distribution - the 0.9 V core and multiple 1.1 V/1.5 V/2.5 V/3.3 V supplies require multi-layer decoupling and a controlled-impedance stack-up. Thermal dissipation at full transceiver utilization also demands a thermal management strategy. This page synthesizes distributor pricing, lifecycle observations, package-compatible alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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EP2AGZ350FF35I3 - Arria II GZ 350K LE FPGA | Intel FPGA
EP2AGZ350FF35I3

EP2AGZ350FF35I3 - Arria II GZ 350K LE FPGA | Intel FPGA

The Intel (Altera) EP2AGZ350FF35I3 is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) featuring 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 maximum user I/O pins, all integrated into a 1152-ball flip-chip BGA (FCBGA) package. The device is built on a 40nm low-power process and supports transceiver data rates up to 6.375 Gbps, making it well matched to mid-range serial-protocol bridging, video processing, and high-throughput DSP pipelines. An FPGA (field-programmable gate array) is a class of programmable logic device whose function is determined by user-defined configuration rather than fixed silicon. Within the broader programmable logic taxonomy, FPGAs rank alongside CPLDs (complex programmable logic devices) under the umbrella of programmable logic, sitting above fixed-function ASICs only in flexibility and below microcontrollers in ease of programming. Arria II GZ devices were specifically optimized for transceivers, DSP blocks, and on-chip memory bandwidth, bridging the gap between Cyclone (cost-optimized) and Stratix (performance-optimized) families. Key features of the EP2AGZ350FF35I3 include up to 16 transceivers operating at 6.375 Gbps, dedicated variable-precision DSP blocks totaling approximately 1,368 18x19 multipliers, 554 user I/O supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards, and an industrial operating range (-40C to +100C junction). On-chip PLLs support clock synthesis for multi-gigabit transceivers, memory interfaces including DDR3, and general-purpose system clocks. Hard memory controllers and PCIe Gen2 hard IP blocks reduce soft-logic footprint and improve timing closure. Typical applications for this device include high-resolution broadcast video processing, wireless baseband aggregation, medical imaging pipelines, radar signal processing, and protocol bridging between PCIe, Serial RapidIO, and 10 Gigabit Ethernet. The industrial temperature grade also supports defense and aerospace subsystems where extended thermal range is mandatory. The combination of logic density and high-speed serial I/O makes the EP2AGZ350FF35I3 a flexible mid-tier platform for ASIC prototyping and pre-silicon validation. When designing with this device, ensure your PCB BGA escape routing respects the 1.0 mm ball pitch and that the flip-chip thermal pad is properly soldered to a sufficient copper area. Use Altera Quartus II design software for synthesis, place-and-route, and timing analysis. Carefully review transceiver reference clock jitter, which directly limits the achievable Gbps rate.

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EP2AGZ350FF35I3G - Arria II GZ FPGA 350K LE | 1152-FBGA | Intel
EP2AGZ350FF35I3G

EP2AGZ350FF35I3G - Arria II GZ FPGA 350K LE | 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ350FF35I3G is a high-density Arria II GZ Field Programmable Gate Array (FPGA) delivering 350,000 logic elements, 21,270,528 bits of embedded memory, and 17.4 Mbit of RAM in a 1152-ball Flip-Chip BGA (FBGA) package. Per the DigiKey listing, the device exposes 554 user I/O pins and supports the -I3 industrial speed grade, balancing performance and power for high-throughput signal-processing applications. The 'G' suffix denotes Pb-free (lead-free) termination, while the absence of an 'N' denotes tray packaging rather than tape-and-reel. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a configurable logic-block matrix interconnected by a programmable routing fabric. The Arria II GZ family sits in Intel's mid-range transceiver-equipped tier between Cyclone (low-cost) and Stratix (high-performance), making it well suited for high-speed serial I/O, digital signal processing (DSP), and embedded memory-intensive designs. FPGAs differ from ASICs in being reprogrammable post-fabrication, which compresses development cycles and supports late-stage design changes. Key features of the EP2AGZ350FF35I3G include 350K logic elements (LEs), 17.4 Mbit embedded memory, embedded DSP blocks for high-throughput arithmetic, multi-gigabit transceivers, and 554 user I/Os. Per the GlobalSpec datasheet listing, the part is built on a 40 nm process node, supports DDR3 external memory interfaces, and includes dedicated hard IP for PCI Express Gen2 and 10 Gigabit Ethernet MACs. The 1152-FBGA flip-chip package enables high pin density and superior electrical/thermal performance compared to wire-bond variants. Architecturally, the Arria II GZ fabric combines adaptive logic modules (ALMs), M20K memory blocks, and variable-precision DSP blocks. The I3 speed grade represents a mid-bin timing/performance tradeoff versus the I4 and I5 grades, allowing designers to trade margin for cost. The device supports configuration via passive serial, fast passive parallel, JTAG, and encrypted bitstreams. Typical applications include high-performance digital signal processing (radar, beamforming, wireless baseband), high-speed serial protocol bridging (PCIe Gen2, 10GbE, Serial RapidIO), test and measurement instrumentation, and broadcast video processing. The wide transceivers and DSP density also make the device useful for medical imaging and aerospace flight-control prototyping. When designing with this device, ensure the PCB has a 1.0 mm or 0.8 mm pitch BGA fanout with microvia stack-ups, because the 1152-ball package demands high-density interconnect (HDI) board technology. Power integrity analysis with the Intel Early Power Estimator is recommended before PCB layout commit. This page synthesizes distributor stock, life-cycle context for the legacy Arria II GZ family, drop-in same-package variants, and practical design notes not consolidated in the manufacturer datasheet.

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EP2AGZ350FF35I3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Altera
EP2AGZ350FF35I3N

EP2AGZ350FF35I3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Altera

The Altera EP2AGZ350FF35I3N is a high-performance Arria II GZ Field Programmable Gate Array (FPGA) with 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/Os, housed in a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package. Built on a 40nm low-power process, it operates at a 0.9V core supply with industrial temperature grade support and integrates 24 transceivers capable of up to 6.375 Gbps data rates. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can program to implement any digital logic function after manufacturing. FPGAs sit above ASICs and microcontrollers in the design flexibility hierarchy, providing parallel hardware execution with deterministic latency. The Arria II GZ family targets mid-range transceiver-based applications bridging Stratix IV performance with Cyclone IV cost efficiency. Key features include 13,940 Logic Array Blocks (LABs), 16 global clock networks, 8 PLLs, dedicated DSP blocks for high-speed arithmetic, and hard PCI Express Gen1/Gen2 IP blocks. The device supports DDR3 external memory interfaces up to 800 Mbps and integrates transceivers compliant with CPRI, OBSAI, Serial RapidIO, and 10 Gigabit Ethernet protocols, making it well suited for communication infrastructure. The EP2AGZ350FF35I3N uses a transceiver-rich architecture with embedded SERDES, hard memory controllers, and a structured ASIC-like logic fabric. The 40nm process and 0.9V core voltage balance switching performance against dynamic power, while the FC-FBGA package exposes the silicon die backside for thermal dissipation through a heatsink. Typical applications include wireless baseband processing, software defined radio, radar signal processing, high-performance DSP pipelines, and 10G/40G networking line cards. The integrated transceivers eliminate external PHY ICs, reducing BOM cost and PCB area in dense systems. When designing with this device, plan thermal management carefully — a 1152-ball FC-FBGA typically dissipates 8–15W in transceiver applications and requires a heatsink plus adequate airflow. Use Altera Quartus II for synthesis, place-and-route, and power estimation, and verify all transceiver channels with the Arria II Transceiver Toolkit. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone — giving engineers a single-source decision aid for sourcing, replacement, and layout planning.

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EP2AGZ350FF35I4 - Arria II GZ FPGA 350K LE, 1152-FBGA | Intel
EP2AGZ350FF35I4

EP2AGZ350FF35I4 - Arria II GZ FPGA 350K LE, 1152-FBGA | Intel

The Intel (Altera) EP2AGZ350FF35I4 is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/O in a 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) package. Designed for mid- to high-end DSP, serial connectivity, and memory-rich designs, the Arria II GZ family integrates up to 16 transceivers operating up to 6.375 Gbps, dedicated variable-precision DSP blocks, and hard memory controllers for DDR3/QDRII+/RLDRAM II interfaces. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit above CPLDs and structured ASICs in the programmable-logic hierarchy, providing the highest logic density and the richest hard-IP block mix. The Arria II GZ family is positioned in the mid-range between Cyclone (low-cost) and Stratix (high-performance) families, with transceiver and DSP capability approaching Stratix IV at lower static power. The device supports core voltage of 0.9 V with separate transceiver and I/O supply rails. Embedded memory includes 9-bit parity-protected M9K blocks plus 144-bit wide MLAB blocks, totaling up to 21.27 Mbits. Up to 16 full-duplex transceiver channels support protocols including PCIe Gen2 (x4/x8), Serial RapidIO, 10 GbE XAUI, CPRI, and CEI-6G. Variable-precision DSP blocks implement 18x18 multipliers with adders, accumulators, and 36-bit precision support, enabling >500 MHz DSP performance for wireless baseband and video processing. Typical applications include wireless baseband processing (LTE, WiMAX, 3G), high-definition video broadcast and image processing, military and aerospace signal processing, medical imaging, high-speed serial backplane bridging, and ASIC prototyping. The combination of 6.375 Gbps transceivers and ~350K LEs makes the part a common choice for designers migrating from Xilinx Virtex-6 or Stratix IV class devices to a more power-efficient mid-range fabric. Key design considerations include the Flip-Chip BGA requiring a multilayer PCB with controlled-impedance transceiver channels, matched-length differential pairs, and substantial decoupling. The 35x35 mm package demands careful thermal management, and the 0.9 V core typically requires an Altera-recommended power-supply sequencer. Configuration is via JTAG, fast passive parallel, or fast active serial flash. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with a focus on real cross-references and AEC/industrial variant comparison.

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EP2AGZ350FF35I4G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA
EP2AGZ350FF35I4G

EP2AGZ350FF35I4G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA

The Intel (formerly Altera) EP2AGZ350FF35I4G is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) housed in a 1152-ball Flip-Chip BGA (FCBGA) package. The device integrates approximately 350,000 logic elements, 21,270 Kbits of embedded memory (M9K + M144K blocks), 554 maximum user I/O pins, and up to 16 high-speed transceivers delivering up to 6.375 Gbps per channel for high-bandwidth serial links. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, memory controllers, and DSP blocks. FPGAs occupy a distinct position in the programmable logic hierarchy: below ASICs in per-unit cost and power at very high volumes, but above microcontrollers and DSPs in raw parallel processing throughput and reconfigurability. The Arria II GZ family specifically targets mid-range applications that require transceivers, moderate logic density, and cost-effective 40nm process technology. Key features of the EP2AGZ350FF35I4G include support for DDR3 memory interfaces up to 800 Mbps, integrated PCI Express hard IP blocks (Gen1/Gen2), up to 8 PLLs, and a high-performance DSP block architecture. The 40nm process node balances static and dynamic power while preserving high core performance for signal-processing pipelines. The industrial temperature grade (I4 suffix, -40C to +100C ambient) suits outdoor, automotive, and industrial-control deployments. The architecture combines dedicated transceiver circuitry with general-purpose FPGA fabric, allowing designers to implement custom high-speed protocols alongside parallel DSP, packet processing, or embedded-processor (Nios II) subsystems. With 18x18 multipliers and dedicated accumulator chains, the device accelerates FFT, FIR, and matrix operations common in wireless baseband and video processing. Typical applications include wireless LTE/4G baseband cards, high-speed serial backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of 16 transceivers and high logic density makes it well suited for applications bridging multiple high-speed serial interfaces. When designing with this device, careful attention to power integrity (multiple 0.9V/1.1V/1.5V/2.5V rails), thermal management of the 35mm BGA, and signal-integrity routing for SERDES lanes is essential. Reference Quartus II design examples demonstrate reference implementations for DDR3 controller, PCIe Gen2 endpoint, and CPRI/OBSAI interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes compiled from the Altera/Intel datasheet family and authorized distributor listings as of 2026-09-08.

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EP2AGZ350FF35I4N - 350K LE Arria II GZ FPGA, 1152-BGA | Intel
EP2AGZ350FF35I4N

EP2AGZ350FF35I4N - 350K LE Arria II GZ FPGA, 1152-BGA | Intel

The Intel EP2AGZ350FF35I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/O pins in a 1152-ball FC-FBGA package. Built on a 40nm CMOS process, the device targets mid- to high-performance digital signal processing, high-speed serial interfacing, and memory-intensive designs that previously required ASIC-class integration. An FPGA (Field-Programmable Gate Array) is a reconfigurable logic device containing programmable logic blocks, interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism with the flexibility of post-silicon reconfiguration. The Arria II GZ family specifically targets transceiver-rich applications with up to 16 embedded transceivers per device and is fabricated at a 0.9V core voltage for power efficiency at high toggle rates. Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers for DSP, dedicated memory interface circuitry supporting DDR3, and up to 16 high-speed transceivers operating up to 6.375 Gbps. The I4 speed grade and industrial temperature rating (-40C to +100C die junction) make this part suitable for harsh-environment embedded applications. The FC-FBGA-1152 package is a 35 mm x 35 mm flip-chip BGA optimized for high signal-integrity performance on multi-layer PCBs. Architecturally, the Arria II GZ uses a logic-rich fabric paired with 8-input adaptive logic modules (ALMs), enabling efficient implementation of wide functions, register-rich pipelines, and arithmetic-intensive datapaths. Hard IP blocks for PCIe Gen2, memory controllers, and multi-gigabit transceivers offload common I/O functions from soft logic, freeing fabric resources for application logic. The 40nm process provides a favorable balance of static power, dynamic performance, and cost per logic element. Typical applications include high-performance DSP for radar and medical imaging, 40G/100G wireline data path processing, broadcast video infrastructure, ASIC prototyping, and high-throughput data acquisition. The combination of 21 Mbits of embedded memory and 720 embedded multipliers (18x18) supports large FFTs, channelizers, and baseband processing blocks. When designing with the EP2AGZ350FF35I4N, ensure the PCB uses a 1.0 mm BGA pitch and matched-impedance routing for transceiver lanes. The Quartus II design software (13.1 or later) is required for synthesis, place-and-route, and timing closure. Thermal management must consider a 35 x 35 mm BGA footprint with the exposed-die flip-chip construction. This page synthesizes distributor pricing, drop-in package-matched alternatives, and practical board-design notes not found in the manufacturer datasheet, supporting both component selection and supply-chain decisions.

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EP2AGZ350FH29C3G - 350K LE Arria II GZ FPGA | Intel | 780-HBGA
EP2AGZ350FH29C3G

EP2AGZ350FH29C3G - 350K LE Arria II GZ FPGA | Intel | 780-HBGA

The Intel (formerly Altera) EP2AGZ350FH29C3G is a high-density, high-performance Arria II GZ FPGA delivering 350K logic elements, 281 user I/O pins, and 16.4 Mbits of embedded memory in a 780-ball FineLine BGA (FBGA) package. Built on a 40 nm low-power process, the device integrates 8.5 Gbps transceivers, hard PCI Express Gen2 controllers, and dedicated DDR3 memory interfaces, making it a drop-in choice for mid-range ASIC-replacement and high-speed serial-link designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that uses configurable logic blocks (CLBs), routing switches, and I/O cells to implement arbitrary digital functions after manufacturing. Positioned in the broader programmable logic hierarchy as FPGA > programmable logic > logic IC > semiconductor, Arria II GZ sits in the mid-density segment between Cyclone (low-cost) and Stratix (high-end) families, targeting price/performance-sensitive applications that still need multi-gigabit transceivers. Key features of the EP2AGZ350FH29C3G include 350K logic elements, up to 16.4 Mbits of embedded RAM, 24 transceivers supporting data rates up to 8.5 Gbps in some speed grades, 4 PCI Express hard IP blocks compliant with PCIe Gen2 x4, and dedicated external memory interfaces supporting DDR3 up to 800 MHz. The 780-HBGA package exposes 281 user I/O pins and integrates 8 dedicated clock PLL blocks. Operating junction temperature spans 0C to +85C for the commercial C3 speed grade. Architecturally, the EP2AGZ350FH29C3G uses 8-input adaptive logic modules (ALMs), 9 Kbit MLAB blocks, and TriMatrix memory structures. The 8.5 Gbps transceivers support CPRI, OBSAI, Serial RapidIO, and 10 GbE (XAUI) protocols, while hard PCIe Gen2 controllers simplify endpoint and root-port implementations without consuming logic resources. Typical applications include wireless baseband processing, military radar signal processing, broadcast video switching, and high-performance computing accelerators. The combination of high logic density, embedded transceivers, and DDR3 support suits data plane processing in telecom and datacom equipment. Designers should note that the C3 speed grade is the slower commercial tier; C4/I4/I5 grades offer higher Fmax but at higher cost. Power estimation requires Quartus II PowerPlay early in the design cycle because the device can exceed 20 W in fully-utilized configurations.

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EP2AGZ350FH29C3N - Arria II GZ FPGA, 350K LE, 780-BGA | Intel
EP2AGZ350FH29C3N

EP2AGZ350FH29C3N - Arria II GZ FPGA, 350K LE, 780-BGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29C3N is a high-density, high-performance Arria II GZ Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. The device integrates 348,500 logic elements, 21,270,528 bits of embedded memory, and 281 user I/O pins, targeting mid- to high-end ASIC-prototype, signal-processing, and high-speed serial-link applications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, interconnect, and dedicated silicon blocks such as transceivers and DSP slices. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable-logic category and above microcontrollers for raw parallel data-path throughput. The Arria II GZ family is positioned as a transceiver-rich mid-range FPGA bridging the gap between Cyclone (low cost) and Stratix (high performance). Key features of the EP2AGZ350FH29C3N include 16 full-duplex multi-gigabit transceivers supporting data rates up to 6.375 Gbps, dedicated on-chip hard memory controllers for DDR3/DDR2/LPDDR2 with ECC, and a fine-grained logic fabric built around 8-input adaptive logic modules (ALMs). The -C3 speed grade and industrial-grade temperature suffix in the part number reflect the standard speed bin with commercial operating temperature. The 780-BGA FCBGA package supports the highest pin count in the family and exposes all 281 user I/Os alongside dedicated transceiver, clock, and configuration pins. Typical applications for this device include wireline backhaul line cards, military secure-radio baseband, ASIC prototyping, broadcast video processing, and high-performance PCIe Gen2 endpoint designs. The integrated transceivers remove the need for external SERDES in multi-gigabit links, reducing BOM cost and simplifying PCB layout. When designing with this FPGA, allocate at least four PCB layers for power, ground, and signal routing. Heat dissipation must be assessed - the FCBGA package requires thermal vias and an attached heatsink for sustained high utilization. Designers should use the latest Quartus II (Arria II GZ) or Quartus Prime software for bitstream generation and timing closure. This page consolidates distributor pricing, drop-in Altera/Intel alternatives, and practical design considerations drawn from public datasheets and reference manuals - information not assembled in a single place on the manufacturer product page.

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