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EP3C16U484C7 - 15408-LCELL 437.5MHz Cyclone III FPGA | Altera
EP3C16U484C7

EP3C16U484C7 - 15408-LCELL 437.5MHz Cyclone III FPGA | Altera

The Altera EP3C16U484C7 is a Cyclone III field-programmable gate array with 15,408 logic cells, 346 I/O, a 437.5 MHz maximum clock rating, and a 484-pin FBGA package. Designed around a 65 nm process and a 1.2 V core supply, the device combines programmable logic resources with a high pin count for communication, control, and embedded digital-processing systems. A field-programmable gate array, or FPGA, is a programmable digital semiconductor whose logic and interconnect resources can be configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor, a programmable-logic device, and a configurable integrated circuit. The Cyclone III family combines a large I/O count with a relatively compact package, making it suitable for designs that require numerous external connections. The principal verified features are 15,408 logic cells, 346 I/O, a 437.5 MHz maximum operating frequency, 65 nm fabrication technology, a 1.2 V core voltage, and a 484-pin FBGA or UFBGA package. The source listings describe the EP3C16U484C7 as an FPGA with 346 outputs and 15,408 logic cells. Its 484-ball surface-mount format supports dense PCB routing while exposing substantially more device connections than lower-pin-count FPGA packages. The C7 suffix identifies this ordering configuration within the EP3C16 device family, while the U484 portion identifies the 484-pin package option. Available product descriptions report a temperature range of -40 °C to +125 °C. Other detailed electrical characteristics, including I/O voltage ranges, power consumption, configuration interfaces, memory resources, and pin-level functions, were not supplied in the verified dataset and should therefore be confirmed in the manufacturer datasheet before schematic or PCB sign-off. Typical design roles include industrial control logic, communication gateways, data-acquisition front ends, embedded protocol controllers, and parallel signal-processing systems. A design can use the 346 available I/O for sensor inputs, control outputs, high-speed interfaces, or mixed peripheral connections, depending on the exact pin assignments and bank voltage restrictions defined by the Cyclone III documentation. PCB implementation should prioritize a validated power architecture, decoupling, controlled clock routing, and signal-integrity review. Because this is a 484-ball BGA, assembly requires a controlled board layout and appropriate fine-pitch assembly capability. The original design should not be released for production until the exact pinout, configuration pins, I/O standards, power sequencing, and decoupling requirements have been verified against the applicable manufacturer documentation. This page consolidates the verified distributor specifications, package information, pricing evidence, and available same-family comparison references. It also distinguishes confirmed data from fields that require datasheet confirmation, helping engineers evaluate EP3C16U484C7 sourcing without treating unverified electrical details as guaranteed specifications.

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EP3C16U484C8 - 15408-Logic-Cell FPGA | Altera Corporation
EP3C16U484C8

EP3C16U484C8 - 15408-Logic-Cell FPGA | Altera Corporation

The Altera Corporation EP3C16U484C8 is a Cyclone III field-programmable gate array with 15,408 logic cells, 346 I/O pins, and a 484-FBGA package. It is designed for programmable digital logic implementations requiring a high pin count and a compact surface-mount footprint. The verified distributor listing identifies the device as a Cyclone III FPGA, while the available component summary specifies an operating temperature range of -40°C to +125°C. A field-programmable gate array, or FPGA, is a programmable digital integrated circuit in which designers configure interconnected logic elements, memory blocks, and input/output resources to implement a hardware function. FPGAs occupy the broader semiconductor and programmable-logic hierarchy. Compared with application-specific integrated circuits, an FPGA allows design revisions to be implemented through configuration rather than by manufacturing a new custom silicon device. Its fixed package, pin resources, and internal architecture must therefore be evaluated against the intended system requirements. The EP3C16U484C8 provides 15,408 logic cells and 346 I/O pins according to the verified DigiKey listing. These figures make the device relevant to designs that need more external connectivity than a small programmable logic device while retaining a mid-density Cyclone III implementation. The 484-FBGA package supports compact board layouts, although its fine-pitch construction requires careful PCB design, assembly process control, and inspection. The device is associated with the Cyclone III FPGA family and is offered by Altera, an Intel company, through major distributors. Its verified ordering information includes a -40°C to +125°C operating-temperature specification, providing a useful indication of its industrial-temperature capability. Other detailed operating data, including core voltage ranges, configuration characteristics, I/O standards, and speed-dependent timing, were not included in the supplied verified records and are identified as data-needed rather than estimated. Typical design uses include industrial control, communications equipment, test and measurement systems, embedded processing, and general-purpose digital interface logic. In each case, the key engineering question is whether the 15,408 logic-cell resource and 346 I/O capability align with the design's parallel logic, memory, connectivity, and external interface requirements. Software support and the selected configuration method also need to be confirmed for the complete toolchain before release to production. For PCB implementation, designers should use the manufacturer's package drawing and pinout rather than relying on distributor photographs or generic BGA diagrams. The 484-FBGA footprint requires adequate escape routing, plane geometry, solder-mask and paste control, thermal-via planning, and assembly capability for the selected ball pitch. Because the supplied records do not expose a verified pin-by-pin assignment, this page does not fabricate individual pin names. This page consolidates the verified distributor identity, resource counts, package information, temperature range, sourcing links, and engineering guidance for EP3C16U484C8. It also separates confirmed values from unavailable technical parameters, enabling engineers to assess sourcing quickly while still completing device-level validation against the official Cyclone III documentation.

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EP3C16U484I7 - 15,408 LEs, 484-UBGA Cyclone III FPGA | Altera
EP3C16U484I7

EP3C16U484I7 - 15,408 LEs, 484-UBGA Cyclone III FPGA | Altera

Altera EP3C16U484I7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/O, a 437.5 MHz maximum device speed, and a 1.2 V core supply in a 484-UBGA package. The industrial-temperature designation indicates operation from -40°C to +125°C, making the device suitable for temperature-variable embedded, communications, control, and signal-processing systems where a compact programmable-logic implementation is advantageous. A field-programmable gate array is a semiconductor whose configurable logic blocks, programmable interconnect, and I/O resources implement digital functions after manufacture. Within the product hierarchy, an FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor. Unlike a fixed application-specific integrated circuit, the Cyclone III architecture allows designers to implement parallel processing, control logic, interfaces, and protocol functions in one device while retaining the flexibility to revise the configuration during development. The EP3C16U484I7 provides 15,408 logic elements and 346 I/O in a 484-UBGA package. Its listed 437.5 MHz speed identifies the maximum device performance grade, while the 1.2 V value describes the core supply. The large I/O count supports board-level integration that would otherwise require multiple programmable devices. The industrial temperature range also provides a clear distinction from commercial-temperature catalog variants. Cyclone III devices use programmable logic elements to build combinational and sequential functions, with dedicated resources for memory, digital signal processing, clock management, connectivity, and configuration. The combination of 15,408 logic elements and 346 I/O permits parallel datapaths and control systems to be consolidated, but the available memory, DSP resources, pin assignments, bank voltages, and configuration limits must be checked against the design before selecting the device. Typical applications include industrial control and factory automation, communications infrastructure, embedded instrumentation, data acquisition, and mixed signal processing. The device is also appropriate for general-purpose prototyping because programmable logic can shorten development cycles when requirements evolve. Its 484-UBGA package provides high I/O density but requires careful ball-grid escape routing, multilayer PCB construction, adequate thermal management, and assembly-process control. Designers should verify the exact power architecture, I/O standards, configuration scheme, clock inputs, and pin constraints in the manufacturer documentation before layout. Because the available verified data does not include a complete public ball map, pin-level assignment should be taken directly from the manufacturer device support files rather than inferred from the 484-ball package outline. Differential pairs and high-speed interfaces also require manufacturer-recommended PCB constraints. This page combines verified distributor specifications, current pricing and stock observations, practical FPGA design guidance, and same-family replacement candidates. Unlike a basic distributor listing, it also identifies which replacement details require engineering verification and highlights the package, temperature, speed-grade, and resource constraints that determine whether a candidate is a genuine drop-in choice.

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EP3C25E144C7 - 24,624 Logic Elements FPGA | Altera
EP3C25E144C7

EP3C25E144C7 - 24,624 Logic Elements FPGA | Altera

Altera EP3C25E144C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 1,539 logic array blocks, 608,256 bits of embedded RAM, and 82 general-purpose I/O in a 144-pin EQFP package with exposed pad. It uses 65 nm process technology, supports a 1.15 V to 1.25 V core-supply range, and is listed with a maximum operating frequency of 437.5 MHz. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic semiconductor and a more flexible alternative to application-specific integrated circuits. The Cyclone III family combines configurable logic blocks, embedded RAM, general-purpose I/O, and programmable interconnect resources within one device. Key features include 24,624 logic elements, 1,539 logic array blocks, and 608,256 bits of embedded RAM. The device provides 82 user I/O and is available in a 144-pin exposed-pad package. Its listed 437.5 MHz maximum frequency gives designers a useful benchmark for clocked digital logic, although achievable system frequency depends on the selected logic path, I/O standard, timing constraints, and implementation. The Cyclone III architecture organizes programmable resources into logic array blocks connected by general-purpose interconnect. Embedded memory allows designers to implement buffers, lookup tables, packet stores, and small data tables without using external memories. Its 82 I/O pins support integration with external processors, transceivers, converters, memory devices, and industrial interface components, subject to the voltage and timing constraints specified by the manufacturer datasheet. Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, and general-purpose logic consolidation. The device can host parallel interfaces, control logic, protocol bridges, or embedded state machines where a programmable architecture simplifies updates compared with fixed logic. Its 144-pin exposed-pad package also supports board-level thermal management through the pad and associated PCB copper. The primary design consideration is thermal management. The exposed pad must be connected to the required power and ground planes and thermally coupled to copper according to the package and board guidelines. Designers must also verify I/O voltage compatibility, pin constraints, power sequencing, memory initialization, and timing closure in the Quartus design environment. This product record combines verified distributor specifications, source links, practical application guidance, and explicitly qualified drop-in alternatives. Alternative electrical data is left as [DATA_NEEDED] where the supplied source material does not provide a verified value, allowing engineers to distinguish confirmed facts from items that still require datasheet validation.

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EP3C25E144C8 - 24,624-Cell Cyclone III FPGA | Intel
EP3C25E144C8

EP3C25E144C8 - 24,624-Cell Cyclone III FPGA | Intel

The Intel EP3C25E144C8 is a Cyclone III field-programmable gate array with 24,624 logic elements, 82 I/O, 608,256 embedded-memory bits, and a maximum operating frequency of 402 MHz. The device is manufactured using a 65 nm process, operates from a 1.2 V core supply, and is supplied in a 144-pin LQFP exposed-pad package. A field-programmable gate array, or FPGA, is a programmable semiconductor in which configurable logic blocks, memory resources, and programmable I/O replace a fixed digital circuit. An FPGA belongs to the semiconductor hierarchy and provides parallel hardware implementation without changing the physical IC. The Cyclone III family is positioned for cost-sensitive embedded, communications, industrial, and control applications requiring programmable logic and deterministic hardware behavior. The EP3C25E144C8 combines 24,624 logic elements with 82 user I/O in a relatively compact 144-LQFP package. Its 608,256 bits of embedded memory support data buffering, state machines, lookup-table structures, and modest on-chip data storage. The stated 402 MHz maximum frequency provides a useful headline figure for timing planning, although actual interface performance must be evaluated against the applicable Cyclone III timing and power guidance. The device uses a 65 nm process technology and a 1.2 V core voltage. These figures place it in the low-voltage programmable-logic class, where board design must provide stable core and I/O supplies and appropriate decoupling. The exposed thermal pad in the LQFP package provides the primary thermal path from the device to the PCB, making copper area, thermal vias, and airflow important in high-utilization designs. Typical uses include industrial control, communications interfaces, instrumentation, embedded signal processing, and general-purpose logic consolidation. Its 82 I/O are suitable for parallel data buses, status and control signals, clocks, and moderate external memory interfaces. The 144-pin exposed-pad package also offers a manageable board footprint compared with larger FPGA packages while supporting substantially more programmable resources than a simple logic device. Designers should treat FPGA migration and timing closure as deliberate engineering steps. Validate pin assignments against the selected board configuration, constrain all clock and I/O paths, confirm the pinout for the exact EP3C25E144C8 ordering code, and budget the exposed pad for thermal dissipation. A replacement part should be accepted only after its pinout, speed grade, voltage requirements, configuration compatibility, and intended package have been checked. This page consolidates the verified distributor specifications, package and sourcing information, same-family drop-in candidates, and application-oriented design guidance for engineers evaluating the Intel EP3C25E144C8. It also distinguishes documented facts from parameters that require confirmation from the manufacturer datasheet or the incumbent design.

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EP3C25E144I7 - 24,624-LE Cyclone III FPGA | Intel
EP3C25E144I7

EP3C25E144I7 - 24,624-LE Cyclone III FPGA | Intel

The Intel EP3C25E144I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of embedded memory, and 82 I/O in a 144-LQFP exposed-pad package. The I7 suffix identifies the industrial-temperature grade, while the 144 package designation identifies the terminal configuration. This device belongs to the FPGA > programmable-logic-device > semiconductor hierarchy and supports parallel hardware implementation of digital control, interface, and signal-processing functions. A field-programmable gate array is a reconfigurable digital semiconductor whose logic, interconnect, and I/O resources can be programmed after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA permits design changes to be implemented through bitstream configuration. The EP3C25E144I7 combines programmable logic with embedded memory in a low-cost Cyclone III device intended for mid-range embedded processing, industrial control, communications, and embedded-system control applications. The verified device data identifies 24,624 logic elements, 608,256 bits of embedded memory, 82 I/O, and a 144-LQFP exposed-pad package. These figures position the device between small fixed-logic implementations and larger FPGAs. The 82 available I/O support interfaces to external memory, converters, transceivers, displays, sensors, and control peripherals, while the embedded-memory resource allows buffering or data storage to be implemented inside the FPGA fabric. Detailed logic-element composition, multiplier resources, clock domains, and I/O standards require confirmation in the manufacturer datasheet. The Cyclone III architecture provides programmable combinational and sequential logic together with embedded RAM resources. This makes the EP3C25E144I7 appropriate for control planes, protocol bridges, state machines, parallel data acquisition, and general-purpose embedded logic. Unlike a soft processor implementation on a smaller FPGA, the device offers a comparatively substantial logic capacity and I/O count in one package. That capacity can reduce system partitioning, but power, routing, timing closure, and configuration-memory requirements still determine the final implementation quality. Typical uses include industrial automation controllers, communication interfaces, instrumentation, embedded video control, sensor-processing platforms, and general embedded control systems. In each case, the device can implement parallel state machines or data paths while external processors, converters, and communication components handle system-level tasks. A complete design also requires a suitable configuration interface or external configuration memory, a compliant power supply, decoupling, clocking, and careful I/O assignment. The principal design consideration is that a Cyclone III FPGA is software-configurable rather than fixed-function. Designers should verify pin compatibility, supported I/O standards, timing constraints, and configuration requirements before committing a PCB layout. The exposed pad under the 144-LQFP package must be connected according to the manufacturer thermal and layout guidance, with adequate copper and low-impedance power distribution to support switching activity. This page consolidates verified distributor inventory, package information, comparison data, and drop-in same-family alternatives into an engineering-focused guide. It distinguishes exact observed data from parameters requiring datasheet confirmation and focuses replacement analysis on same-footprint, pin-compatible Cyclone III options rather than merely functionally similar FPGAs from other vendors.

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EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel
EP3C25E144I7N

EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel

The Intel (formerly Altera) EP3C25E144I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with industrial temperature grade. The device integrates 24,624 Logic Elements (LEs), 608,256 bits of embedded memory (66 M9K blocks), 66 embedded 18x18 multipliers, and 4 Phase-Locked Loops (PLLs), with 82 user I/Os available in the EQFP-144 package. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors, sitting between fixed-function ASICs and microcontrollers in design flexibility. Key features of the EP3C25E144I7N include support for up to 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP applications, and 66 M9K memory blocks totaling 608 Kbits. The device operates from a 1.2V core supply with separate bank I/O voltages, and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The Cyclone III family is fabricated on a 65nm low-power process, delivering a balance of logic density, performance, and static power efficiency. The architecture consists of Logic Array Blocks (LABs) each containing 16 LEs, with embedded multiplier and memory blocks distributed throughout the fabric. Cyclone III devices also support configuration via serial passive (AS), serial active, and JTAG modes, allowing flexible in-system programming. The integrated PLL blocks provide frequency synthesis, phase shifting, and clock duty-cycle correction for high-speed interfaces. Typical applications include industrial motor control, video processing and image sensor interfaces, low-cost ASIC prototyping, communication protocol bridging (UART, SPI, I2C to LVDS), and embedded DSP functions such as FIR filtering. The Cyclone III family is widely used in cost-sensitive designs requiring moderate logic density and DSP performance. When designing with this device, ensure decoupling capacitors are placed close to every power pin and that JTAG chain integrity is verified before final board assembly. The exposed thermal pad on the EQFP-144 package must be soldered to a sufficient copper area for thermal dissipation and electrical ground return. This page synthesizes distributor pricing, drop-in Cyclone III alternatives in the same EQFP-144 footprint, and practical design notes not consolidated in the manufacturer datasheet alone.

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EP3C25F256C6 - 24,624-L-cell FPGA in 256-BGA | Altera
EP3C25F256C6

EP3C25F256C6 - 24,624-L-cell FPGA in 256-BGA | Altera

Altera EP3C25F256C6 is a Cyclone III field-programmable gate array with 24,624 logic cells, a maximum stated frequency of 500 MHz, and 65 nm process technology in a 256-pin TFBGA package. It also contains 156 user I/O and operates from a 1.2 V core supply, making it a compact programmable-logic device for systems requiring substantial parallel processing within a limited board area. An FPGA is a semiconductor whose digital logic, memory, and I/O behavior can be configured after manufacture. In the technology hierarchy, an FPGA belongs to the programmable-logic and CPLD class, sits above fixed-function digital ICs, and falls within the broader semiconductor and embedded-processing categories. The Cyclone III architecture supports application-specific control, signal processing, communication, and interface consolidation while retaining a reconfigurable development path. The EP3C25F256C6 provides 24,624 logic cells, 156 I/O, 256 package balls, and a listed 500 MHz maximum frequency. Its 65 nm fabrication process supports a relatively compact and power-conscious implementation compared with larger programmable devices. The 256-ball TFBGA package provides dense board-level connectivity, but it also requires careful PCB layout, ball-pattern verification, thermal analysis, and assembly-process control. The device's 1.2 V core supply is typical of the performance range offered by the Cyclone III family. Logic, interface, clocking, and I/O implementation details determine the final external supply arrangement and system power budget. Designers should use the manufacturer pin-description table and device handbook to assign power, ground, configuration, clock, and user I/O balls before schematic capture or PCB routing. Typical uses include industrial control, communications infrastructure, embedded video and image processing, test equipment, and general-purpose embedded control. In these systems, the FPGA can implement parallel datapaths, protocol converters, control logic, and custom peripheral functions while supporting field updates through its configuration architecture. The 156 I/O count is especially useful for designs requiring moderate external connectivity. A critical design consideration is that the TFBGA footprint demands exact land-pattern and solder-mask compatibility. Confirm ball assignments, exposed thermal requirements, via-in-pad strategy, assembly profile, and component placement with the package drawing before release. Power delivery should use low-impedance planes or carefully stitched planes, with separate treatment for core and I/O supply paths according to the datasheet. This product record combines the exact device specifications, pin-package constraints, orderable same-family alternatives, and practical implementation guidance in one engineering-focused reference. It helps designers distinguish a true PCB-compatible substitution from a superficially similar FPGA and plan sourcing, layout, assembly, and lifecycle decisions before committing a new design.

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EP3C25F256C6N - 24,624-LC FPGA, 500 MHz | Altera
EP3C25F256C6N

EP3C25F256C6N - 24,624-LC FPGA, 500 MHz | Altera

Altera EP3C25F256C6N is a Cyclone III field-programmable gate array with 24,624 logic elements, 156 I/O pins and a 256-pin low-profile ball grid array package. The device is associated with a 500 MHz operating figure and a 1.2 V supply specification, making it suitable for programmable control, interface, signal-processing and embedded-logic systems. Its industrial temperature range extends from -40°C to 125°C for applications requiring operation across extended temperature conditions. A field-programmable gate array, or FPGA, is a programmable semiconductor within the broader logic-device hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic blocks, programmable interconnect and configurable I/O in one device. Cyclone III devices use this architecture to support designs that can be updated after manufacture, allowing product revisions, hardware customization and field upgrades without changing the physical PCB. The EP3C25F256C6N combines 24,624 logic elements with 156 I/O pins, providing a substantial logic resource for parallel processing, control logic, protocol bridges and embedded system functions. Its 1.2 V supply specification and 500 MHz associated operating figure make it appropriate for designs that require considerably more programmable logic than a small programmable logic device. The 256-LBGA package also supports dense board layouts while exposing a high pin count for external interfaces. The C6 suffix identifies the device's speed grade within the Cyclone III family, while the 256 package suffix corresponds to the 256-ball package configuration. Device selection should include the logic budget, available I/O, pin assignment, memory requirements, clocking architecture, power budget and required design-tool support. The complete package pinout and electrical limits should be checked against the manufacturer datasheet before PCB routing or power-supply design is released. Typical uses include industrial automation controllers, communications interfaces, test and measurement equipment, embedded control systems and general-purpose digital signal-processing platforms. In each case, the FPGA allows parallel logic blocks to execute concurrently, which can shorten the implementation of control, acquisition and interface functions when a designer does not want to create a dedicated ASIC. A key design consideration is that an FPGA board must provide stable core and I/O supplies, clocking, configuration support and decoupling. Power estimation must cover logic utilization, switching activity, I/O standards and environmental conditions rather than relying only on a nominal device frequency. PCB signal-integrity planning is also essential because the 256-LBGA footprint requires careful escape routing and power-plane construction. This product record combines the device's principal logic, package, temperature and supply characteristics with application guidance, drop-in family alternatives and design cautions. Those engineering details help buyers identify whether the EP3C25F256C6N fits an existing design before requesting a quotation or beginning PCB work.

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EP3C25F256C7 - 24,624 LEs Cyclone III FPGA | Altera
EP3C25F256C7

EP3C25F256C7 - 24,624 LEs Cyclone III FPGA | Altera

The Altera EP3C25F256C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 memory bits, and 256 I/O pins in a 256-LBGA package. It provides a programmable logic platform for embedded control, communications, signal processing, and industrial equipment where parallel programmable logic is required. The verified device record identifies 156 logic blocks and a -40°C to +125°C operating-temperature range. A field-programmable gate array is a semiconductor device whose digital logic, interconnects, and I/O behavior can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic IC, which is a semiconductor and a form of programmable digital hardware. Cyclone III devices combine configurable logic, embedded memory, and programmable I/O in a single integrated circuit, reducing the number of external components required in systems that need flexible hardware behavior or late design changes. The EP3C25F256C7 provides 24,624 logic elements, 608,256 memory bits, and 156 logic blocks. Its 256-LBGA package supports 256 device terminals and is identified as surface mount and lead-free in the supplied data. These resources make the device relevant to control logic, protocol bridging, test equipment, industrial automation, communications infrastructure, and embedded systems that require a reusable hardware platform. The operating range of -40°C to +125°C supports applications spanning industrial temperature environments. The Cyclone III architecture combines configurable logic blocks with embedded memory resources and programmable input/output structures. This allows design logic to be implemented in parallel rather than entirely as sequential processor instructions. The EP3C25F256C7 should be configured for its intended clocking, I/O standards, memory interface, and system timing before operation. Detailed voltage ratings, supported I/O standards, speed-dependent timing, configuration methods, and power consumption were not included in the verified records and must therefore be confirmed in the manufacturer device documentation before design release. Typical applications include industrial factory controllers, communication line cards, instrumentation and test systems, network-interface subsystems, embedded video control, and general-purpose digital signal-processing platforms. The 24,624 logic elements provide substantial parallel-processing capacity, while 608,256 memory bits can support buffering, lookup tables, packet storage, or state-machine data. The 256-terminal package also offers a broad interface footprint for external memory, transceivers, clocks, and data buses. A key design consideration is power and thermal planning. The verified data does not provide core voltage, I/O voltage, quiescent power, or active power, so engineers should not estimate those values from generic Cyclone III data without checking the exact device, speed grade, package, and configuration. Likewise, the 256-LBGA package requires a qualified PCB layout with controlled escape routing, power and ground distribution, thermal analysis, and assembly-process controls. Configuration storage, JTAG access, clocking, decoupling, and I/O standards must all be verified against the official documentation. This page combines the supplied distributor specifications, verified package and temperature details, available cross-reference candidates, and practical engineering cautions that are not consolidated in a typical distributor listing. It distinguishes verified characteristics from unavailable electrical details so engineers can assess fit, identify missing data, and plan a responsible migration or qualification process.

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EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial
EP3C25F256C8

EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial

The Intel EP3C25F256C8 is a Cyclone III field-programmable gate array with 24,624 logic cells, a maximum frequency of 402 MHz, 65 nm process technology, a 1.2 V core supply, and a 256-pin FBGA package. It provides 156 user I/Os and 608,256 embedded-memory bits, making it suitable for moderately complex control, interface, signal-processing, and communications designs requiring reconfigurable logic. A field-programmable gate array is a semiconductor in the programmable-logic and semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA combines configurable logic, memory, and I/O resources on one device. The programmer can configure these resources after manufacture, allowing design revisions, field updates, and implementation of multiple digital functions without changing the PCB. The EP3C25F256C8 combines 24,624 logic cells with up to 156 I/Os in a compact 256-pin package. Its maximum stated operating frequency is 402 MHz, while its 1.2 V core voltage supports low-power digital implementations. The 65 nm fabrication process and 608,256 embedded-memory bits provide additional capacity for state machines, data buffers, control logic, and parallel processing pipelines. The Cyclone III architecture is intended to balance programmable functionality, device count, and cost. Because an FPGA combines fixed silicon with user-programmed configuration, design performance depends on the selected clocking, memory, I/O, and logic implementation. Engineers must also account for configuration setup, signal-integrity requirements, and the finite resources of the 24,624-cell device when partitioning larger system functions. Typical uses include industrial automation, networking equipment, embedded control, video and image processing, communications infrastructure, and test equipment. The device is appropriate when field programmability, short design cycles, or parallel hardware logic are more valuable than implementing the design with a fixed microcontroller or ASIC. When planning a PCB, engineers should follow the exact package drawing, ball map, power-supply requirements, and decoupling recommendations in the manufacturer datasheet. Designers should also verify the speed grade, temperature grade, configuration interface, clock topology, and I/O standards before releasing a production layout. This page consolidates verified device specifications, current distributor information, same-family drop-in alternatives, and application-focused engineering guidance. It adds practical package and sourcing context beyond a basic distributor listing while clearly separating verified facts from information that still requires manufacturer documentation.

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EP3C25F256C8N - Cyclone III FPGA, 24.6K LEs, 256-FBGA | Intel
EP3C25F256C8N

EP3C25F256C8N - Cyclone III FPGA, 24.6K LEs, 256-FBGA | Intel

The Altera (Intel) EP3C25F256C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, packaged in a 256-pin FineLine BGA (FBGA-256) and offered in the commercial 0 to 85 C temperature range with the speed grade 8 designation. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O cells are defined at hardware description language (HDL) compile time and re-programmed in-circuit. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, sitting in the broader taxonomy as programmable logic > FPGA > SRAM-based LUT FPGA > low-power FPGA family. Key features include 156 user I/O pins, four general-purpose phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII, and 0.25 mW per logic element typical dynamic power consumption. The device operates from a 1.15 V to 1.25 V core supply, supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards, and is offered in a Pb-free 17 mm x 17 mm FBGA package with 1.0 mm pitch. Architecturally, the Cyclone III silicon uses a 60 nm process with a 4-input look-up table (LUT) based logic element, embedded M9K memory blocks, and 18x18 hardware multipliers optimized for digital signal processing (DSP) throughput. The device targets low-cost, high-volume designs where the balance between logic capacity, embedded memory, DSP bandwidth, and unit cost matters more than the highest serial transceiver data rate. Typical applications include industrial motor control, video surveillance and image processing, low-end protocol bridging, consumer display controllers, and entry-level software-defined radio (SDR) baseband processing. The wide I/O bank support also suits mixed-voltage board designs integrating 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals on the same PCB. When designing with this device, allocate sufficient PCB area for the 1.0 mm pitch BGA fan-out, route PLL analog supplies through a ferrite-bead-isolated rail, and configure unused I/O pins per the Cyclone III Hardware Reference to minimize leakage. Quartus II version 7.2 or later is required for synthesis, fitting, and configuration bitstream generation. This page synthesizes distributor pricing, exact-temperature speed-grade alternatives, and practical Cyclone III design notes not consolidated in the manufacturer datasheet, providing an engineer-facing summary for selection and procurement.

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EP3C25F256I7 - 24,624-LC Cyclone III FPGA | Intel
EP3C25F256I7

EP3C25F256I7 - 24,624-LC Cyclone III FPGA | Intel

The Intel EP3C25F256I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, a maximum stated frequency of 437.5 MHz, and a 1.2 V supply in a 256-pin FBGA package. It is a programmable digital-logic device within the FPGA, programmable-logic, semiconductor, and embedded-processing product hierarchy. The EP3C25F256I7 is suited to industrial, communications, control, signal-processing, and embedded interface designs that require deterministic parallel logic and reconfigurable hardware. An FPGA is a semiconductor whose internal digital circuit is defined by a configuration bitstream rather than fixed mask programming. Cyclone III devices combine programmable logic elements, embedded memory, general-purpose I/O, and dedicated resources such as multipliers and clock-management blocks. This architecture allows one physical PCB design to support multiple protocols, control sequences, or signal-processing functions by changing the configuration file rather than the silicon. Key device characteristics include 24,624 logic elements, 156 I/O, 608,256 bits of device memory, and a 65 nm fabrication process. The F256 package provides 256 contacts in a 17 mm by 17 mm square FBGA outline. The I7 ordering option denotes an industrial-temperature-oriented configuration, and the listed operating range extends from -40 °C to 100 °C at the junction. These attributes place the device between smaller programmable logic devices and larger FPGAs requiring more board area. The device integrates 594 Kb of block RAM according to its product listing, while the device-level memory organization shown elsewhere is 608,256 bits. Cyclone III FPGAs support parallel data paths, pipelined DSP operations, clock-domain control, and serial connectivity through configurable I/O. Because FPGA performance depends on the selected clock, memory interface, I/O standard, routing, and design constraints, a 437.5 MHz figure should not be interpreted as a guaranteed operating frequency for every logic design. Typical applications include industrial control and automation, communications infrastructure, audio and signal processing, data acquisition, network interface control, and embedded test equipment. In these systems, the FPGA can implement parallel protocols, state machines, packet handling, custom interfaces, or fixed-function signal pipelines while preserving upgrade flexibility through configuration updates. PCB implementation requires careful attention to the 256-ball BGA escape routing, power integrity, decoupling, clock jitter, and I/O voltage compatibility. The 1.2 V core and externally supported I/O standards must be matched to the connected circuitry. Designers should use the manufacturer pin and package documentation to assign balls, power groups, and configuration pins before releasing the board layout. This page combines device specifications, practical application guidance, package-focused design notes, and same-package alternatives for engineers evaluating the EP3C25F256I7. It also distinguishes confirmed attributes from parameters that must be checked in the Cyclone III documentation or a device-specific quote, helping teams make a technically defensible design and sourcing decision.

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EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
EP3C25F256I7N

EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel

The Intel (formerly Altera) EP3C25F256I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, 156 maximum user I/O pins, and 66 embedded 18x18 multipliers, housed in a 256-ball FineLine Ball-Grid Array (FBGA) package and operating from a 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications. Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention. Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends. Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required. When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin. This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.

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EP3C25F324C6 - Cyclone III FPGA, 24624 LEs, 324-BGA
EP3C25F324C6

EP3C25F324C6 - Cyclone III FPGA, 24624 LEs, 324-BGA

Altera EP3C25F324C6 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of memory, and 215 I/O in a 324-BGA package. The device uses a 65 nm CMOS process and is associated with a 1.2 V core voltage and operation up to 500 MHz. These characteristics place it in the FPGA and CPLD hierarchy, where programmable logic, embedded memory, and parallel I/O support configurable digital systems. A field-programmable gate array is a semiconductor whose digital behavior is defined after fabrication through configuration data rather than a fixed circuit mask. The Cyclone III family combines programmable logic blocks, general-purpose memory, and user I/O in one device. This makes an FPGA suitable when a design needs adaptable interfaces, parallel data processing, protocol bridging, or logic replication without fabricating a dedicated application-specific integrated circuit. The EP3C25F324C6 provides 24,624 logic elements and 608,256 bits of embedded memory. The listed 215 I/O count supports high-density connections to external memory, transceivers, converters, and control peripherals. The 500 MHz device speed grade indicates the maximum timing-performance class, although the operating frequency of a complete design still depends on the selected logic path, logic utilization, timing constraints, I/O standard, and board-level signal integrity. The device is manufactured on a 65 nm CMOS process and operates from a 1.2 V core supply. Its 324-BGA package provides a dense mechanical interface for multilayer printed circuit boards. The package pitch is listed as 1 mm with a 19 mm by 19 mm body in the device documentation. Correct assembly therefore requires a PCB land pattern and via arrangement capable of supporting the fine-pitch BGA geometry. Typical uses include industrial control and automation, communications infrastructure, embedded signal processing, data acquisition, and general-purpose logic prototyping. In these systems, the programmable architecture permits parallel interfaces and reusable control logic, while embedded memory can support buffering, packet handling, and data acquisition functions. The large I/O count is especially useful where a design must connect several buses or peripheral devices simultaneously. Design with the EP3C25F324C6 by checking every bank voltage and pin assignment against the selected configuration scheme. Maximum I/O availability can vary by package and configuration mode, so the device pin-assignment table should be treated as authoritative. Decoupling, layer transitions, ball escape routing, and BGA assembly constraints also require close review before a four-layer or multilayer board is released. This product page combines the exact EP3C25F324C6 device identity, package information, searchable sourcing questions, same-family alternatives, and practical FPGA design considerations. It also distinguishes verified device facts from parameters that require the manufacturer handbook, pin-assignment files, or Quartus implementation results for final design validation.

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EP3C25F324C6N - Cyclone III FPGA 25K LE 215 I/O 324-BGA | Intel
EP3C25F324C6N

EP3C25F324C6N - Cyclone III FPGA 25K LE 215 I/O 324-BGA | Intel

The Intel (formerly Altera) EP3C25F324C6N is a Cyclone III family field-programmable gate array (FPGA) featuring 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, housed in a 324-ball fine-pitch BGA (FBGA-324) package with 215 user I/O pins. The 'C6' speed grade targets commercial 0C to +85C operation, while the 'N' suffix denotes a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic function is defined by user-loaded configuration bitstreams rather than fixed mask layers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). Cyclone III specifically targets low-cost, low-power, high-volume designs and is fabricated on TSMC's 65 nm low-power process, positioning it between traditional CPLDs and high-end FPGAs in the power/cost/performance envelope. Key differentiating features of the EP3C25F324C6N include four general-purpose PLLs, 66 dedicated DSP blocks (each capable of 18x18 multiply-accumulate operations), support for external memory interfaces including DDR/DDR2/QDRII, and up to 215 user I/O pins arranged across eight I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device supports both passive serial and fast passive parallel configuration schemes via industry-standard EPCS or EPCQ flash memories. Architecturally, the Cyclone III device family combines a fabric of logic array blocks (LABs) each containing 16 logic elements, a row/column interconnect mesh, embedded SRAM blocks (M9K), and dedicated multiplier/DSP blocks. The TSMC low-power process and Cyclone III's silicon-level power optimizations deliver static power consumption typically below 100 mW in idle configurations - substantially lower than competing FPGAs in this density range. Typical applications for the EP3C25F324C6N include industrial control and machine vision, automotive infotainment and driver assistance subsystems, low-cost video processing pipelines, software-defined radio front-ends, motor control, and embedded display controllers. Its combination of moderate logic density, generous memory bandwidth, and a small-footprint BGA makes it especially attractive for space-constrained cost-sensitive designs. When designing with this FPGA, plan power sequencing for the VCCINT core rail (1.2 V typical) and the VCCIO bank rails separately, and budget for in-rush current during configuration. Designers should also verify JTAG chain integrity before final board bring-up and use the Quartus II design suite (12.0sp2 or later) with the Cyclone III device library for compilation, place-and-route, and timing closure. This page synthesizes distributor inventory, drop-in compatible Cyclone III variants, and practical PCB power-integrity guidance not found in the standalone manufacturer datasheet, providing engineering value beyond what is available on DigiKey or Mouser product listings.

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EP3C25F324C7 - 25K Logic FPGA, 215 I/O, 324-BGA | Intel
EP3C25F324C7

EP3C25F324C7 - 25K Logic FPGA, 215 I/O, 324-BGA | Intel

The Intel EP3C25F324C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 memory bits, 215 I/O, and a 324-BGA package. It is a surface-mount programmable-logic device intended for embedded systems requiring configurable parallel interfaces, control logic, and general-purpose digital processing. The device is identified in distributor data as the EP3C25F324C7 Altera Cyclone III FPGA and is offered for purchase through multiple authorized or secondary channels. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. In the product hierarchy, an FPGA belongs to programmable logic, which is a category of integrated circuit used to implement control, interface, signal-processing, and data-routing functions. Unlike a fixed-function application-specific integrated circuit, a Cyclone III FPGA can be programmed for multiple system behaviors and updated when design requirements change. The supplied distributor specifications identify 24,624 logic elements and 608,256 memory bits for this device. Its 215 I/O provide substantial board-level connectivity for parallel buses, counters, timers, status and control signals, and general-purpose digital interfaces. The EP3C25F324C7 uses a 324-BGA package, supporting compact surface-mount PCB construction while requiring careful ball-layout, assembly, and thermal-design planning. Cyclone III devices belong to Intel's programmable-logic portfolio and are commonly evaluated for embedded control, industrial automation, communications, instrumentation, and consumer-electronics designs. The EP3C25F324C7 suffix identifies a particular member of the EP3C25 device family and package combination. Because the supplied search data does not include the complete ordering-information table, exact speed-grade, temperature-grade, core-voltage, and legacy-versus-current status distinctions are marked as needed rather than inferred from the suffix. Potential applications include industrial control boards, programmable logic instruments, communication interfaces, test equipment, and embedded systems requiring substantially more I/O than a microcontroller may provide. In such designs, the FPGA can execute parallel state machines, merge or format data streams, coordinate multiple peripherals, and implement deterministic hardware timing. Tool-chain and device support must be confirmed against the applicable Intel Quartus or legacy Altera device-support package before committing to production. PCB implementation should follow the exact package ball map and power-plane requirements from the official device documentation. BGA soldering requires an appropriate land pattern, stencil design, reflow profile, X-ray or X-ray-equivalent assembly inspection, and sufficient via-in-pad or thermal-via strategy where warranted. Designers should also verify that every connected I/O standard, bank voltage, clock input, configuration source, and decoupling requirement is supported by the selected board revision. This product page consolidates the supplied distributor inventory, package and logic-resource details, verified same-family alternatives, comparison points, and implementation cautions into a design-focused reference. Because the provided evidence does not include a manufacturer datasheet URL or complete electrical tables, unsupported ratings and pin assignments are explicitly identified instead of being estimated.

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EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel
EP3C25F324C7N

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

Intel EP3C25F324C7N is a Cyclone III field-programmable gate array containing 24,624 logic cells, 608,256 bits of embedded memory, and 215 available I/O pins. The verified data identifies a 437.5 MHz device built on 65 nm technology with a 1.2 V core supply and a 324-ball FBGA package. It is a programmable-logic IC intended for engineers implementing configurable digital logic, interface bridging, control processing, and application-specific signal processing. A field-programmable gate array, or FPGA, is a semiconductor device whose logic functions are defined by configuration rather than fixed internal connections. Its hierarchy extends from programmable logic cells to configurable interconnects, embedded memory, I/O blocks, and a complete programmable-logic IC. Unlike an ASIC, an FPGA can be reprogrammed during development and after deployment. Compared with a fixed microcontroller, an FPGA generally provides parallel hardware execution and finely timed I/O, while trade-offs include higher power consumption, configuration requirements, and more complex implementation software. The principal verified resources are 24,624 logic cells and 608,256 memory bits, with 215 I/O pins available for external connectivity. The 324-ball FBGA package supports a substantial number of package-level connections while using surface-mount assembly. The supplied data also identifies a 437.5 MHz frequency and 65 nm process technology. These resources make the device suitable for datapaths that need more concurrent logic than a small programmable device but do not justify the cost and development cycle of a custom ASIC. Cyclone III architecture combines programmable logic arrays, routing resources, embedded memory, and programmable I/O elements. A design is captured with an FPGA development flow, synthesized into logic, mapped and placed onto available resources, routed through the device interconnect, and then loaded into configuration memory. Engineers must analyze timing closure, power, signal integrity, and configuration implementation together; an apparently efficient register-transfer design can still fail timing if fan-out, routing congestion, or unsuitable I/O constraints are ignored. Typical uses include industrial control, communications equipment, video or imaging preprocessing, test and measurement, and legacy interface emulation. The combination of 24,624 logic cells, 608,256 embedded memory bits, and 215 I/Os is relevant to glue-logic aggregation, protocol conversion, parallel acquisition, and state-machine-rich controllers. For a new high-volume product, however, lifecycle, migration, and total-cost studies are important before committing the design. PCB design should prioritize continuous power distribution, controlled-impedance connections, and clean clock routing. Because the available verified data does not provide detailed electrical limits, pin functions, configuration-interface requirements, thermal limits, or package dimensions, those values must be confirmed from the manufacturer datasheet before schematic release. Do not infer BGA ball assignments from the package name alone. This product page combines verified distributor specifications, availability signals, package context, and transparent engineering notes. Pricing is reported as of 2026-09-09, while distributor stock and lead time remain dynamic. The manufacturer ordering code, package, device family, logic-cell count, embedded memory, I/O count, process node, supply voltage, and frequency are the attributes most useful for initial device selection.

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EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel
EP3C25F324C8

EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel

The Intel (formerly Altera) EP3C25F324C8 is a member of the Cyclone III family of low-power FPGAs fabricated on a 65 nm process, offering 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/Os in a 324-ball FineLine BGA package. It operates from a 1.2 V core supply with separate I/O bank supplies and supports commercial temperature grade (0 °C to +85 °C) at speed grade 8, with a maximum internal clock frequency of approximately 402 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit between fixed-function ASICs and microcontrollers in the digital design hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> low-power FPGA. Cyclone III FPGAs are specifically engineered for cost- and power-sensitive applications, building on the Cyclone architecture with a 65 nm process to reduce static and dynamic power while maintaining sufficient logic density for mid-range designs. Key specifications of the EP3C25F324C8 include 66 embedded 18 x 18 multipliers for DSP workloads, four general-purpose PLLs for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates 24624 logic elements organized as 1539 logic array blocks (LABs), with each LAB containing 16 logic elements. The embedded memory is configurable as RAM, ROM, or FIFO, providing flexible on-chip data buffering without external SRAM. The Cyclone III architecture supports partial dynamic reconfiguration and ships with free Quartus II design software, including IP cores for DDR/DDR2 SDRAM controllers, PCI Express, Ethernet, and common serial protocols. The 324-ball FineLine BGA package measures 19 mm x 19 mm with a 1.0 mm ball pitch, making it compatible with standard multilayer PCB manufacturing. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototypes, low-cost software-defined radio, and bridge/interface glue logic. It is also used as a prototyping vehicle for ASIC verification and as a low-volume production replacement for legacy CPLDs. When designing with this part, attention to simultaneous switching output (SSO) noise and decoupling is critical; the application notes recommend 0.1 µF and 0.01 µF high-frequency capacitors within 100 mils of each power pin. Migration paths include the Cyclone IV E family for cost reduction and Cyclone V for higher logic density. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, supporting faster engineering decisions.

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EP3C25F324C8N - 24,624 LEs Cyclone III FPGA, 324-BGA | Intel
EP3C25F324C8N

EP3C25F324C8N - 24,624 LEs Cyclone III FPGA, 324-BGA | Intel

The Intel EP3C25F324C8N is a Cyclone III family Field Programmable Gate Array (FPGA) IC integrating 24,624 logic elements, 215 user I/O pins, and approximately 608 Kbits of embedded SRAM in a 324-ball FineLine BGA package. It is built on a low-power 60-nm process and operates with core logic at 1.2 V while supporting multiple I/O standards on its LVDS/LVCMOS/LVTTL banks. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions in silicon by loading a configuration bitstream. In the broader IC taxonomy, an FPGA sits below an ASIC in performance but above a microcontroller in flexibility, making it the workhorse for prototyping, low-volume custom logic, and parallel signal processing in industrial, communications, and test equipment. Key features of the EP3C25F324C8N include 66 embedded 18x18 multipliers for DSP, four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 8 in the suffix indicates the device speed grade, while the C denotes the commercial 0 C to +85 C operating range. Compared with earlier Cyclone generations, this part delivers roughly 4x the logic capacity and significant power-per-LE reductions. Typical applications span industrial motor and motion control, video processing pipelines, software-defined radio front-ends, telecom line cards, and ASIC prototyping platforms where the 215 I/O allow dense glue-logic integration with multiple parallel buses. Designers should plan for JTAG-based configuration via a 10-pin header or Altera USB-Blaster download cable, place at least four 0.1 uF and one 10 uF decoupling capacitor near each power pin group, and consult the Cyclone III device handbook for I/O-bank VCCIO planning. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical board-level design notes not collected in any single datasheet, giving engineers a one-stop reference for sourcing and second-sourcing this part.

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EP3C25F324I7 - Cyclone III FPGA, 24624 LEs, 324-FBGA | Intel
EP3C25F324I7

EP3C25F324I7 - Cyclone III FPGA, 24624 LEs, 324-FBGA | Intel

The Intel EP3C25F324I7 is a low-power, low-cost Field Programmable Gate Array from the Cyclone® III family, featuring 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a TSMC 65nm low-power process and operates at a core voltage of 1.2 V with maximum toggle performance around 437.5 MHz. The 'I7' speed grade and industrial temperature range (-40°C to +100°C junction) make it suitable for thermally constrained and environmentally demanding designs. A Cyclone III FPGA is a programmable logic device that sits in the broader hierarchy of digital semiconductors (FPGA -> programmable logic -> ASIC alternative -> semiconductor). Unlike fixed-function ASICs, the logic function, memory configuration, and I/O behavior of an FPGA are defined at boot time by a configuration bitstream loaded from external flash, allowing one silicon platform to be reused across many product variants. Cyclone III was specifically engineered to balance logic density, DSP capability (66 embedded 18x18 multipliers), and static power consumption, displacing ASICs and ASSPs in cost-sensitive high-volume applications. Key technical features of the EP3C25F324I7 include 4 PLLs for clock management, 20 global clock networks, 66 embedded 18x18 multipliers, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 1.2 V core draws substantially lower static power than the previous Cyclone II generation, while still offering LVDS, LVPECL, SSTL, HSTL, and LVCMOS I/O standards through 8 I/O banks. Configuration can be loaded via passive serial (PS), active serial (AS), or JTAG, and the device includes built-in CRC and decompression for the bitstream. Typical applications span industrial motor control, video surveillance, automotive infotainment prototypes, low-cost software-defined radio, video processing pipelines, and PCIe endpoint prototyping (using the embedded transceivers in some Cyclone III variants or soft IP cores for GPIO-based implementations). The combination of high logic density and embedded multipliers also suits DSP front-ends such as motor-control FOC loops or multi-channel audio processing. When designing with the EP3C25F324I7, engineers must supply the four power rails (VCCINT, VCCA, VCCIO per bank, VCCD_PLL) with proper decoupling and follow Intel's pin-out guidelines for the FBGA-324 footprint. Quartus II Web Edition provides synthesis, place-and-route, and timing analysis. Note that Cyclone III is now in Intel's product lifecycle as a mature, NRND device, so designers building new platforms should evaluate Cyclone IV/V/E10AX equivalents or pin-compatible successors for long-term availability.

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EP3C25F324I7N - Cyclone III FPGA, 24,624 LEs, 324-FBGA | Intel
EP3C25F324I7N

EP3C25F324I7N - Cyclone III FPGA, 24,624 LEs, 324-FBGA | Intel

The Intel (formerly Altera) EP3C25F324I7N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 24,624 logic elements, 608,256 bits of embedded RAM, and 66 embedded 18x18 multipliers in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. It supports up to 215 user I/O pins (66 LVDS pairs) and is rated for an industrial operating temperature range of -40C to +100C, making it well-suited for cost-sensitive, volume-driven designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to implement arbitrary digital logic functions through configurable logic blocks (LBs/LEs), programmable routing, and dedicated hard IP blocks such as memory and DSP. In the programmable-logic taxonomy, FPGAs sit alongside CPLDs as the highest-density user-configurable devices, falling under digital ICs > programmable logic > FPGA > CPLD hierarchy. Cyclone III sits at the low-power, low-cost end of Intel's FPGA portfolio, optimized for ASIC-replacement, glue-logic consolidation, and parallel DSP workloads. Key features include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and configuration via active serial (AS), passive serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The device operates from a 1.2 V core supply and supports I/O bank voltages of 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL). The 1.2 V core and 65 nm process deliver a typical power reduction of up to 50% versus the previous-generation Cyclone II family. The architecture combines LABs (Logic Array Blocks) of 16 LEs each with M9K memory blocks (9 Kbits each) distributed across the fabric, enabling efficient implementation of FIFOs, shift registers, and small ROM/RAM functions. The hard 18x18 multipliers accelerate DSP algorithms such as FIR filters, FFTs, and motor-control loops without consuming general-purpose fabric. Cyclone III's deterministic routing fabric and Quartus II / Quartus Prime design flow support rapid design iteration and proven IP libraries. Typical applications include industrial motor control and factory automation, video processing and image sensor bridging, automotive infotainment and driver-assistance subsystems, telecommunications line cards, and portable medical instrumentation. Its combination of low static power (~100 mW typical) and moderate logic density makes it a strong fit for volume designs where a low-cost CPLD would be too small and a high-end Stratix FPGA would be over-spec. When designing with this device, validate signal-integrity and length-matching rules for DDR2/QSPI interfaces early, and ensure the 1.2 V core rail uses a low-noise LDO (such as an LDO from the LDO regulator family) to meet the core voltage tolerance. Confirm BGA fanout and via-in-pad manufacturing capability with the assembly house before committing the PCB layout. This page synthesizes distributor pricing, drop-in alternatives, comparison data and practical design notes not found on any single manufacturer or distributor page, including a cross-reference comparison with EP3C25F256I7N and EP3C16F484I7N from the same Cyclone III family.

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EP3C25Q240C8 - Cyclone III FPGA, 24624 LE | Intel
EP3C25Q240C8

EP3C25Q240C8 - Cyclone III FPGA, 24624 LE | Intel

The Intel (Altera) EP3C25Q240C8 is a 24,624-logic-element Cyclone III FPGA with 608,256 RAM bits and 148 user I/Os, packaged in a 240-pin PQFP/BFQFP. The device has a reported internal operating frequency of about 472 MHz to 472.5 MHz and is identified as a commercial temperature, speed grade 8 version. This QFP package provides a 34.60 x 34.60 mm body, 4.10 mm height, and 0.50 mm pitch, offering a lower assembly cost alternative to BGA packages. An FPGA, or Field Programmable Gate Array, is an integrated circuit whose logic fabric can be configured after manufacturing to implement custom digital circuits. FPGAs sit above ASICs in flexibility and below MCUs in sequential processing convenience: instead of executing software instructions, an FPGA creates parallel hardware logic such as counters, state machines, DSP datapaths, memory controllers, and bus interfaces. The EP3C25Q240C8 belongs to the Cyclone III family, which is optimized for low-cost, high-volume applications requiring substantial programmable logic with moderate power consumption. Key verified parameters include 24,624 logic elements, 608,256 total RAM bits, 148 user I/O signals, a 240-lead PQFP/BFQFP package, and a maximum internal frequency of approximately 472.5 MHz. These values are captured from distributor and datasheet-aggregator listings. The 240-pin package supports enough external connections for broad interfacing while remaining routeable on conventional low-cost multilayer PCBs. The 0.50 mm lead pitch and 34.60 x 34.60 mm body allow standard surface-mount assembly equipment to be used throughout production. Cyclone III devices implement their programmable fabric using look-up-table-based logic elements, dedicated memory blocks, and embedded multiplier resources. In this EP3C25 density, the 608,256 RAM bits provide local data storage and FIFO support, while the logic elements allow parallel functions to operate at internal clock rates approaching 472 MHz. The commercial-grade C8 version is typically used in controlled indoor environments where high-speed data processing, protocol bridging, and custom state-machine logic must be implemented without the non-recurring engineering cost of an ASIC. Typical applications include industrial automation control, communication protocol bridging, video and image processing, laboratory instrumentation, medical diagnostics, and edge-oriented FPGA systems. The high I/O count and moderate density make the EP3C25Q240C8 a practical bridge between low-end CPLDs and larger, more expensive FPGAs. For systems requiring a Nios II soft processor, the RAM and logic resources are also sufficient to implement small embedded processor subsystems alongside custom peripherals. When designing with the EP3C25Q240C8, verify the exact core and I/O supply voltages from the Cyclone III device handbook, and place decoupling capacitors close to every power pin. Because the part is an SRAM-based FPGA, a configuration memory such as an EPCS or EPCQ device, or a JTAG download path, is mandatory for a self-starting board. Plans for speed grade, temperature range, and lead-free assembly should be confirmed before layout begins. This page synthesizes distributor-level pricing, drop-in EP3C25 family alternatives, and practical FPGA board design notes that are not all present on a standard distributor product page. It is intended to give engineers a compact starting point for procurement and design review while directing them to the official Cyclone III documentation for detailed electrical specifications.

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EP3C25Q240C8N - 25K LE Cyclone III FPGA | Intel
EP3C25Q240C8N

EP3C25Q240C8N - 25K LE Cyclone III FPGA | Intel

Intel EP3C25Q240C8N is a Cyclone III field-programmable gate array built on 65 nm technology, providing 24,624 logic elements, 608,256 bits of embedded memory, and 148 user I/O in a 240-pin BFQFP package. It operates from a 1.2 V core supply and is specified for a maximum frequency of 402 MHz in the supplied reference data. The C8 speed grade makes this member suitable for cost-sensitive applications that still require a substantial programmable-logic fabric. A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, embedded memory, and input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture. It therefore occupies the semiconductor hierarchy between programmable logic devices and custom digital ICs, allowing engineers to implement interfaces, control logic, signal processing, and bus functions without a fabrication run. The principal Cyclone III resource is 24,624 logic elements for combinational and sequential digital functions. The device also integrates 608,256 memory bits, giving designers capacity for FIFOs, lookup tables, buffering, and control-state storage. With 148 I/O, the EP3C25Q240C8N supports many board-level interfaces. The 240-pin BFQFP package uses through-hole leads rather than a fine-pitch surface-mount ball grid, which can simplify inspection, prototyping, and legacy assembly processes. Architecture and technology determine the balance between programmable density, power, and performance. The listed 65 nm process and 1.2 V core supply characterize the Cyclone III generation, while the 402 MHz specification describes a maximum reference frequency rather than a guarantee for every customer design. Actual performance depends on logic placement, routing, clock resources, I/O standards, timing constraints, and power-supply integrity. The FPGA also supports boundary-scan testing, allowing pin connections to be checked without physical probes. Typical applications include industrial control, legacy communication equipment, test and measurement hardware, motor-control interfaces, and embedded systems requiring replaceable or updateable logic. It is particularly relevant where a 240-pin through-hole FPGA is already designed in, such as an upgrade or lifecycle-support board. Engineers can use it to consolidate board functions, implement a custom peripheral, or reproduce obsolete interface behavior. Design planning should begin with the target package, configured I/O count, required speed grade, available configuration interface, and supported power rails. Verify every pin, bank voltage, configuration mode, and timing constraint against the manufacturer documentation before schematic release. For production, assess configuration storage, JTAG access, decoupling, thermal behavior, and the availability of compatible design software and bitstream generation tools. This product data combines the supplied manufacturer and distributor specifications, package constraints, verified commercial references, and a conservative cross-reference assessment. Because no verified pin-compatible drop-in alternative was identified, the replacement list is intentionally limited rather than padded with footprint-changing devices.

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