10AX115R3F40E2SG - Arria 10 GX 1150K LE FPGA, 28nm | Intel
부품 번호: 10AX115R3F40E2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5985 | $5,985.00 |
| 10 | $5750 | $57,500.00 |
| 50 | $5450 | $272,500.00 |
| 100 | $5180 | $518,000.00 |
| 500 | $4925 | $2,462,500.00 |
10AX115R3F40E2SG 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and hardened IP blocks such as DSP slices, block RAM, and high-speed transceivers. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than ASICs (no NRE cost, fully re-programmable), more parallel than CPUs/GPUs (hardware-level parallelism), and far higher performance per watt than software-defined solutions for fixed-function data paths. The Arria 10 family specifically targets mid-range applications where Stratix 10 performance is overkill but Cyclone V capability is insufficient.
Key differentiating features include hardened variable-precision DSP with IEEE 754 single-precision floating-point support, 28.05 Mbit embedded memory (M20K blocks), 24 transceiver channels, hard memory controllers for DDR4/DDR3/QDR IV, and a hardened PCI Express Gen3 IP core. The -2 speed grade balances timing margin and power consumption, while the E2 industrial temperature grade supports 0C to +100C ambient operation. The 1517-ball FCBGA package provides high signal density and excellent thermal performance via the flip-chip solder-bump array.
Typical applications include 100G/40G optical transport networking line cards, software-defined radio (SDR) baseband processing, hardware-accelerated video processing (4K/8K broadcast), PCIe Gen3 accelerator cards, and high-performance industrial imaging systems. The integrated 14.1 Gbps transceivers eliminate the need for external SerDes in many connectivity applications.
When designing with this device, plan PCB layout carefully: the 1.0 mm ball pitch FCBGA requires HDI stackup with microvia-in-pad technology, matched-length routing for the 28 Gbps-capable transceivers, and a substantial ground/power plane array beneath the package to support the multi-rail power distribution. Tool compatibility requires Intel Quartus Prime Pro Edition software.
This page synthesizes distributor pricing, drop-in package-compatible alternatives within the Arria 10 family, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: 10AX115R3F40E2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115R3F40E2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Temperature Grade, DSP Blocks, Speed Grade, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115R3F40E2LG
✅ 드롭인✓ 재고 있음
$1425 / 개
데이터시트 보기 →10AX115R2F40E2SG
✅ 드롭인✓ 재고 있음
$5410 / 개
데이터시트 보기 →10AX115R2F40E2LG
✅ 드롭인✓ 재고 있음
$10300 / 개
데이터시트 보기 →10AX090R3F40E2SG
✅ 드롭인✓ 재고 있음
$5400 / 개
데이터시트 보기 →10AX090R3F40E2LG
✅ 드롭인✓ 재고 있음
$5750 / 개
데이터시트 보기 →10AX090R2F40E2SG
✅ 드롭인✓ 재고 있음
$4750 / 개
데이터시트 보기 →10AX115R3F40E2SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | 2,738 |
| DSP Blocks | 1,518 (variable-precision, hard FP) |
| Maximum User I/O | 342 |
| Transceiver Channels | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | 2 |
| Process Technology | TSMC 20 nm |
| Speed Grade | -2 |
| Temperature Grade | E2 (0C to +100C) |
| 패키지 | 1517-ball FCBGA (F40), 1.0 mm pitch |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) |
| RoHS 상태 | Compliant |
10AX115R3F40E2SG 핀 구성
| 핀 A1 | GND — Ground reference |
| 핀 A2 | VCC — Core voltage supply |
| 핀 B1 | GXB_TX0_P — Transceiver channel 0 transmit positive |
| 핀 B2 | GXB_RX0_P — Transceiver channel 0 receive positive |
| 핀 C1 | USER_IO_0 — User I/O bank 1A |
| 핀 D1 | CLK_IN_0 — Differential clock input pair positive |
| 핀 E1 | nCONFIG — Configuration active-low control |
| 핀 F1 | MSEL0 — Configuration mode select 0 |
| 핀 G1 | TCK — JTAG test clock |
| 핀 H1 | TDI — JTAG test data in |
| 핀 J1 | TDO — JTAG test data out |
| 핀 K1 | TMS — JTAG test mode select |
| 핀 L1 | VCCIO_1A — I/O bank 1A voltage supply |
| 핀 M1 | GND — Ground reference |
| 핀 N1 | REFCLK_P — Reference clock for transceivers positive |
| 핀 P1 | VCCBAT — Battery backup supply |
일반적인 애플리케이션
10AX115R3F40E2SG 적합 용도: 6 애플리케이션s: 100G Optical Transport Networking Line Card, Software-Defined Radio (SDR) Baseband Processing, Broadcast Video Processing (4K/8K), PCIe Gen3 Accelerator Cards, Industrial High-Performance Imaging Systems, Aerospace Radar Signal Processing.
100G Optical Transport Networking Line Card
The 10AX115R3F40E2SG is well-suited for 100G optical line cards in OTN/OTU4 transport systems. Its 24 transceivers operate at up to 14.1 Gbps, which can be aggregated into multiple 40G/100G Ethernet, OTU4, or Interlaken interfaces. The 1,150,000 logic elements and 1,518 hard DSP blocks handle FEC encoding/decoding and OTN framer logic at line rate without external processing. The hard PCIe Gen3 cores enable direct host connectivity for software-defined networking (SDN) control plane. Placed on the line card with a QSFP28 cage, the FCBGA package enables reliable operation at the industrial temperature range.
추천
Software-Defined Radio (SDR) Baseband Processing
The 10AX115R3F40E2SG supports wideband SDR baseband processing for wireless infrastructure and military communications. Its 1,518 variable-precision DSP blocks deliver up to 1.5 TFLOPs single-precision FP, sufficient for LTE/LTE-A/5G channelization, FFT/iFFT, and digital up/down conversion. The 68.85 Mbit embedded memory buffers wide-bandwidth samples between DSP blocks. Transceivers at 14.1 Gbps interface directly to ADC/DAC devices (JESD204B) for high-speed data converters. The 1517-ball FCBGA package provides the signal density required for multi-channel SDR designs.
추천
Broadcast Video Processing (4K/8K)
The 10AX115R3F40E2SG handles 4K/8K broadcast video processing, including real-time HEVC/H.265 encoding, color space conversion, and multi-stream stitching. Its 1,150,000 logic elements support wide video pipelines while the 68.85 Mbit embedded memory buffers multiple frame lines. Transceers connect to SDI interfaces at 12G-SDI rates (11.88 Gbps). The hard PCIe Gen3 cores enable host transfers for live editing workflows. With -2 speed and E2 temperature grades, the device operates reliably in broadcast studio and outdoor production environments.
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PCIe Gen3 Accelerator Cards
The 10AX115R3F40E2SG is ideal for PCIe Gen3 accelerator cards in data center and HPC workloads. Its two hard PCIe Gen3 IP cores (x4 or x8 lane configurations) provide direct host connectivity without external bridge chips. The 1,518 hard DSP blocks accelerate compute kernels (FFT, GEMM, convolution), while the 1.15M logic elements implement custom datapaths. The 1517-ball FCBGA package supports the high-density power delivery and signal integrity required at PCIe Gen3 line rates. Placed on a half-height, half-length card with thermal management.
추천
Industrial High-Performance Imaging Systems
The 10AX115R3F40E2SG powers industrial machine vision and high-speed inspection systems. Its 1,518 DSP blocks enable real-time image processing (edge detection, pattern matching, FFT analysis) at multi-megapixel resolutions. Transceivers connect to high-speed image sensors via CoaXPress or Camera Link HS interfaces. The 68.85 Mbit embedded memory buffers line-scan or area-scan pixel data between processing stages. The E2 industrial temperature grade and 1517-ball FCBGA package support factory floor environments with vibration and temperature variation.
추천
Aerospace Radar Signal Processing
The 10AX115R3F40E2SG supports radar signal processing for defense and weather radar applications. Its 1,518 hard DSP blocks perform pulse compression, MTI filtering, and beamforming at real-time rates. Transceivers at 14.1 Gbps digitize radar IF signals and interface to high-speed ADCs. The 1.15M logic elements implement adaptive beamforming weights and clutter rejection algorithms. The FCBGA package's flip-chip interconnect ensures robust thermal and electrical performance in vibration-prone environments. Pair with a custom heatsink for high-duty-cycle radar operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115R3F40E2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115R3F40E2LG | 10AX115R2F40E2SG | 10AX115R2F40E2LG | 10AX090R3F40E2SG |
|---|---|---|---|---|---|
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 (same die) | 1,150,000 (same die) | 1,150,000 (same die) | 900,000 (-21.7%) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits (same die) | 68,857,856 bits (same die) | 68,857,856 bits (same die) | 53,560,320 bits (-22.2%) |
| DSP Blocks | 1,518 | 1,518 (same die) | 1,518 (same die) | 1,518 (same die) | 1,518 (same die) |
| Transceivers | 24 ch up to 14.1 Gbps | 24 ch up to 14.1 Gbps | 24 ch up to 14.1 Gbps | 24 ch up to 14.1 Gbps | 24 ch up to 14.1 Gbps |
| Speed Grade | -2 | -2 (same) | -2 (same) | -2 (same) | -2 (same) |
| Temperature Grade | E2 (0C to +100C) | E2 (same) | E2 (same) | E2 (same) | E2 (same) |
| Transceiver Power Tier | R3 (high-performance) | R3 (same) | R2 (lower power) | R2 (lower power) | R3 (same) |
| Solder Type | Standard (SnPb-free) | Lead-free reflow | Standard | Lead-free reflow | Standard |
| Approx Qty-1 Price (USD) | 5,985 | 5,985 | 5,750 | 5,750 | 4,990 |
주요 차별점
- Highest density Intel Arria 10 in F40 FCBGA package (vs 10AX090R3F40E2SG)
- R3 high-performance transceiver power tier (vs 10AX115R2F40E2SG)
- Pin-compatible with full Arria 10 F40 family (vs Cyclone 10 GX 10CX220YF672E5G)
설계 노트
The 1517-ball FCBGA package uses a 1.0 mm ball pitch and requires an HDI PCB stackup with microvia-in-pad (VIP) technology. Recommended stackup: 12+ layers including dedicated ground/power planes under the package. Use ENIG or ENEPIG surface finish for reliable ball attachment. Per Intel's package user guide, BGA pads require non-solder-mask-defined (NSMD) geometry with 0.55 mm pad diameter to ensure proper ball collapse and joint reliability.
The 10AX115R3F40E2SG can dissipate up to 35 W in fully-utilized configurations. Use a high-performance thermal interface material (TIM) with thermal conductivity above 5 W/mK, and attach a heatsink with at least 4 C/W thermal resistance. For passive cooling in sealed enclosures, ensure the FCBGA package's top is exposed (lid-up variant recommended) or use the integrated heat slug. Estimated: at 25 W dissipation, junction temperature rises 35 C above ambient with a 1.4 C/W theta_JA. Always design for less than 100 C junction under worst-case load.
Transceiver channels operating at 14.1 Gbps require matched-length routing within +/- 0.05 mm tolerance, with ground vias every 0.5 mm to maintain return path continuity. Use 100 ohm differential impedance for GXB_TX/RX pairs with 85 ohm common-mode. Per Intel's transceiver user guide, separate transceiver power rails (VCCH_GXB, VCCA_GXB) from digital core supplies to minimize noise coupling. Place AC coupling capacitors within 2 mm of the device ball.
The 10AX115R3F40E2SG requires multi-rail power distribution: VCC (0.9 V core), VCCPT (1.0 V PHY transceiver), VCCBAT (2.5 V battery backup), and VCCIO (1.2-3.3 V I/O banks). Use a sequence controller (such as the LTC2928 or Intel's recommended sequencer) to enforce proper power-up order: VCCBAT first, then VCCPT, then VCC, then VCCIO. Failure to sequence properly can damage the device. Decoupling: 100 nF X7R capacitors within 1 mm of every bank supply ball, plus bulk 47 uF polymer caps per rail.
Do not confuse the E2 (industrial 0C to +100C) temperature grade with the I2 (-40C to +100C) extended industrial grade - the I2 variant requires additional thermal qualification and may have different timing margins. The FCBGA package is moisture-sensitive (MSL3); follow JEDEC J-STD-033 bake procedures if exposure to ambient exceeds 168 hours before assembly. Do not bypass the configuration pins MSEL[2:0] - the Arria 10 will not configure if MSEL values are incorrect. Ensure the JTAG chain order is correct when programming via USB-Blaster or JTAG cable.
규정 준수 정보
RoHS compliant per Intel product page. E2 temperature grade (0C to +100C) is industrial, not AEC-Q100 automotive. The LG variant uses lead-free solder for high-temperature reflow processes; standard variant (no L suffix) is Pb-free with SAC solder balls.
