ATSAMA5D24B-CU vs ATSAMA5D225C-D1M-CU 비교
다음의 상세 나란히 비교: ATSAMA5D24B-CU 제조: Microchip Technology 및 ATSAMA5D225C-D1M-CU 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
ATSAMA5D24B-CU - 500MHz ARM Cortex-A5 MPU, 256-TFBGA | Microchip
ATSAMA5D24B-CU ✓ 활성Microchip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ 활성사양 비교
| 파라미터 | ATSAMA5D24B-CU | ATSAMA5D225C-D1M-CU |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $10.42 | $12.60 |
| Core Architecture | ARM Cortex-A5 (ARMv7-A) | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| Core Count | 1 | — |
| Internal SRAM | 128 KB | — |
| Internal ROM | 160 KB (secure boot) | — |
| External Memory Interface | 16-bit DDR2/LPDDR/LPDDR2/DDR3 (LV-DDR3) | — |
| Supply Voltage (Core) | 1.2 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 패키지 | 256-TFBGA (8x8 mm, 0.4 mm pitch) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| 동작 온도 | -40C to +85C (industrial) | -40C to +85C (Industrial, IND TEMP) |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 레벨 | 3 | — |
| Ethernet | 1x 10/100 Mbps GMAC | 10/100/1000 GMAC |
| USB | USB 2.0 High-Speed Host + Device (with PHY) | 1x HSIC, 1x USB 2.0 HS Host/Device |
| LCD Controller | Yes (TFT, up to XGA) | — |
| Touch Controller | Yes (Peripheral Touch Controller + 4-wire resistive) | Peripheral Touch Controller (PTC) integrated |
| Hardware Crypto | AES, SHA-256, TRNG | — |
| Backup Mode Current | 5 uA typical | — |
| RoHS 상태 | Compliant | Compliant (Green, lead-free) |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores | — | 1 Core, 32-Bit |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| Graphics Acceleration | — | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| 공급 전압 | — | 1.2 V core (per typical SiP) |