EPF10K130EFC484-3N vs EPF10K50VFC484-3N 비교

다음의 상세 나란히 비교: EPF10K130EFC484-3N 제조: Intel 및 EPF10K50VFC484-3N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EPF10K130EFC484-3N EPF10K50VFC484-3N
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $109.25 $24.00
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 40,960
Typical Gate Count 130000 —
Number of I/O 369 —
Number of LABs/CLBs 832 —
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) —
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS 0.42 µm CMOS, SRAM-based
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
실장 유형 Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) —
RoHS 상태 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX-10K
Logic Elements — 2,880
Typical Gates — 50,000
Embedded Array Blocks (EABs) — 12
Logic Array Blocks (LABs) — 10
Maximum User I/Os — 291
Supply Voltage (VCCINT) — 3.0 V to 3.6 V (3.3 V nominal)
I/O Voltage Standards — 5.0 V, 3.3 V, 2.5 V (MultiVolt)
Internal Frequency — 125 MHz
Propagation Delay (per LE) — 0.6 ns
패키지 — 484-FBGA (23 x 23 mm, 1.27 mm pitch)
동작 온도 — 0 °C to +70 °C (commercial)
Configuration Modes — Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG
JTAG Support — IEEE 1149.1 Boundary Scan

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