MW7IC18100NR1 vs MW7IC18100GNR1 비교

다음의 상세 나란히 비교: MW7IC18100NR1 제조: NXP Semiconductors 및 MW7IC18100GNR1 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MW7IC18100NR1 MW7IC18100NR1 - 100W RF LDMOS 1.8-2.05GHz PA TO-270 | NXP

MW7IC18100NR1 - 100W RF LDMOS 1.8-2.05GHz PA TO-270 | NXP

MW7IC18100NR1 ✓ 활성
NXP Semiconductors
MW7IC18100GNR1 MW7IC18100GNR1 - 100W 1990MHz RF LDMOS Power Amplifier | NXP

MW7IC18100GNR1 - 100W 1990MHz RF LDMOS Power Amplifier | NXP

MW7IC18100GNR1 ✓ 활성

사양 비교

파라미터 MW7IC18100NR1 MW7IC18100GNR1
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 RF Amplifiers RF Amplifiers
수명 주기 상태 활성 활성
재고 상태 In Stock In Stock
단가 (USD) $61.20 $99.50
Product Type RF LDMOS Wideband Integrated Power Amplifier —
Frequency Range 1.805 GHz to 2.05 GHz 1805 MHz to 2050 MHz
Output Power (CW, typical) 100 W (50 dBm) —
Power Gain (typical) 30 dB —
P1dB (typical) 25 W (44 dBm) CW —
Supply Voltage (VDD) 24 V to 32 V (28 V typical) —
Supply Current (typical) 1.18 A —
RF Modulation Support GSM, GSM EDGE, CDMA, W-CDMA —
VSWR Ruggedness 5:1 stable into mismatch —
Spurious (100 mW to 5 W CW) Below -60 dBc —
패키지 / 케이스 TO-270 WB-14 (Case 1618-02), plastic, flat leads —
실장 유형 Surface Mount (gull-wing flat leads) Flange-mount, bolt-down
Lead Finish e3 (matte tin) —
동작 온도 -40C to +85C (case) —
Body Material Plastic / Epoxy —
RoHS 상태 Compliant Compliant (lead-free)
Manufacturer — NXP Semiconductors (formerly Freescale)
Part Number — MW7IC18100GNR1
Part Family — MW7IC18100N series
Device Type — RF LDMOS Wideband Integrated Power Amplifier
Operating Voltage (VDD) — 24 V to 32 V (28 V typical)
Output Power (Pout) — 100 W CW (typical)
Power Gain — 27 dB to 30 dB (typical)
Power-Added Efficiency (PAE) — 48 % at 100 W CW
Supported Modulations — GSM, GSM EDGE, CDMA
Quiescent Current (IDQ1 / IDQ2) — 180 mA / 1000 mA
Technology — LDMOS (Laterally Diffused MOS)
Package / Outline — TO-270 WB-14 GULL (flanged ceramic)
Package Body Material — Plastic / Epoxy over ceramic carrier
Terminal Finish — Matte Tin (Sn)
On-Chip Matching — Yes (input matched; output partial)
Application — Cellular base-station PA, GSM/EDGE/CDMA

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