10AS032H3F34I2LG - Arria 10 SX 320K SoC FPGA | Intel | 1152-FBGA
부품 번호: 10AS032H3F34I2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2159.85 | $2,159.85 |
| 10 | $2055.32 | $20,553.20 |
| 100 | $1895.47 | $189,547.00 |
| 500 | $1745.83 | $872,915.00 |
| 1,000 | $1620.19 | $1,620,190.00 |
10AS032H3F34I2LG 개요
What is an SoC FPGA? A SoC (System-on-Chip) FPGA is an integrated device that combines a general-purpose processor subsystem (typically ARM Cortex-A series) with a programmable FPGA fabric on a single die. This architecture - LDO-of-computing in embedded design - merges software flexibility with hardware parallelism, enabling designers to partition tasks between sequential control code (running on the ARM cores) and pipelined DSP or interface logic (running on the FPGA fabric). The Arria 10 SX family occupies a mid-to-high-end position in the Intel FPGA lineup, sitting between Cyclone V/10 and high-end Stratix 10 devices.
The '10AS032' part number decodes to Arria 10 SX family, 320K logic elements, and transceiver capability. The 'H3' suffix denotes a specific speed/power grade and the 'F34' package designator indicates the 1152-ball FCBGA. The 'I2' code specifies the industrial temperature range (-40C to +100C junction) and 2 speed grade, while 'LG' indicates lead-free, RoHS-compliant, and tray packing. The integrated HPS (Hard Processor System) provides up to 1.5 GHz dual ARM Cortex-A9 cores with NEON media engine, single/double-precision FPU, L1 cache per core, and a shared L2 cache.
Typical applications include industrial machine vision, motor control and industrial drives, video broadcast infrastructure, military/aerospace signal processing, medical imaging acceleration, 5G baseband processing, and high-performance embedded computing. The combination of ARM Cortex-A9 cores and Arria 10 FPGA fabric supports workloads such as PCIe Gen3 root complexes, DDR4 memory controllers, multi-gigabit serial transceivers, and hardware-accelerated DSP pipelines within a single chip.
When designing with this device, verify Quartus Prime tool support for the specific Arria 10 SX device variant before board bring-up. Power-rail sequencing for the HPS and FPGA core, as well as multi-rail decoupling, requires careful PCB design at 28nm process node. Industrial temperature range suitability should be confirmed against the system's worst-case operating environment.
드롭인 대체품: 10AS032H3F34I2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS032H3F34I2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Package Code, Speed Grade, Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS032H3F34E2SG
✅ 드롭인✓ 재고 있음
$2120 / 개
데이터시트 보기 →10AS032H3F34E2LG
✅ 드롭인✓ 재고 있음
$1650 / 개
데이터시트 보기 →10AS032H2F34I2SG
✅ 드롭인✓ 재고 있음
$3760 / 개
데이터시트 보기 →10AS032H2F34I2LG
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →10AS032H2F34E2SG
✅ 드롭인✓ 재고 있음
$1410 / 개
데이터시트 보기 →10AS032H2F34E2LG
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →10AS032H3F34I2LG 최대 정격 & 전기적 특성
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 1.5 GHz |
| 패키지 | 1152-FBGA, FC (35x35 mm) |
| Pin/Ball Count | 1152 |
| 실장 유형 | Surface Mount |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| Operating Temperature Grade | Industrial |
| Temperature Range | -40C to +100C (junction, per industrial grade) |
| Process Node | 20 nm (Arria 10 generation) |
| Device Designator | 10AS032H3F34I2LG |
| Speed Grade | 2 |
| Lead-Free / RoHS | Yes (LG suffix) |
| Packaging Form | Tray (LG suffix) |
10AS032H3F34I2LG square 핀 구성 가이드
10AS032H3F34I2LG(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS032H3F34I2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS032H3F34I2LG 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Motor Control and Industrial Drives, Video Broadcast Infrastructure, Medical Imaging Acceleration, 5G Baseband and Radio Signal Processing, Military and Aerospace Signal Processing.
Industrial Machine Vision
The 10AS032H3F34I2LG's 320K logic elements and dual ARM Cortex-A9 HPS running at 1.5 GHz make it ideal for industrial machine vision systems that combine high-speed image pre-processing in FPGA fabric with Linux-based decision algorithms on the Cortex-A9 cores. Typical designs place MIPI CSI-2 or GigE Vision interfaces in the programmable logic for low-latency pixel pipeline processing, while the HPS runs OpenCV-based classification, object tracking, and PLC communication. The industrial temperature grade (-40C to +100C junction) supports factory floor deployment without derating, and the integrated architecture eliminates a discrete processor-FPGA interconnect that would otherwise add latency. Quartus Prime supports the Video and Image Processing Suite IP cores referenced in the Arria 10 handbook for these pipelines.
추천
Motor Control and Industrial Drives
Motor control and industrial drive applications benefit from the 10AS032H3F34I2LG's deterministic FPGA fabric for high-bandwidth PWM generation and field-oriented control (FOC) loops combined with the ARM Cortex-A9 HPS for supervisory control, HMI, and EtherCAT/PROFINET networking. The 320K logic elements are sufficient to implement multi-axis FOC with sub-microsecond current loop execution, while the HPS handles communication stacks, safety logic, and parameter management. The industrial temperature grade supports cabinet-mounted drives in factory automation. Reference designs from the Arria 10 SX SoC FPGA family demonstrate closed-loop motor control with encoder feedback and SVPWM generation entirely in the FPGA, freeing the Cortex-A9 cores for system-level coordination.
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Video Broadcast Infrastructure
Video broadcast encoders/decoders and contribution links leverage the 10AS032H3F34I2LG's transceiver bandwidth and DSP blocks for real-time HEVC/H.264 codec acceleration while the ARM Cortex-A9 HPS manages IP networking, PTP timing, and control plane protocols. The 320K logic elements support multi-channel SDI processing, JPEG XS low-latency codec, and 4K/UHD pipelines. Industrial temperature rating suits head-end equipment deployed in uncontrolled cooling environments. The integrated SoC architecture reduces system BOM by replacing separate FPGA plus processor boards traditionally used in broadcast appliances, with the FPGA fabric handling pixel-rate processing and the HPS running Linux-based NMOS IS-04/IS-05 control.
추천
Medical Imaging Acceleration
Ultrasound beamforming, CT image reconstruction, and MRI signal processing benefit from the 10AS032H3F34I2LG's parallel DSP resources and integrated ARM Cortex-A9 subsystem. The FPGA fabric handles sample-rate ADC data acquisition and beamforming delay calculation, while the HPS manages DICOM networking, image storage, and operator interface. Industrial temperature grade supports cart-based and portable diagnostic equipment where ambient temperatures vary. The SoC integration reduces bill-of-materials and power footprint compared to discrete processor-FPGA architectures, an important consideration for battery-powered handheld ultrasound devices targeting point-of-care clinical workflows.
추천
5G Baseband and Radio Signal Processing
5G small-cell baseband units use the 10AS032H3F34I2LG's transceiver channels and 320K logic elements for PHY-layer acceleration, LDPC/Polar channel decoding, and digital up/down conversion, while the ARM Cortex-A9 HPS runs the MAC scheduler, OAM stack, and timing synchronization. The industrial temperature rating supports outdoor small-cell deployment. Reference signal chains include CPRI or eCPRI fronthaul interfaces terminated in FPGA transceivers, with the integrated HPS handling higher-layer protocol processing. Compared with ASIC-only baseband, the SoC FPGA approach enables rapid algorithm updates for evolving 3GPP releases.
추천
Military and Aerospace Signal Processing
Defense electronic warfare, radar processing, and secure communications subsystems use the 10AS032H3F34I2LG to combine high-throughput FPGA signal processing with a trusted ARM Cortex-A9 execution environment for control and crypto key management. The 320K logic elements accommodate multi-channel digital receivers, adaptive beamforming, and arbitrary waveform generation, while the HPS runs secure boot firmware, time-sensitive networking, and MIL-STD-1553 interfaces. Although the part itself is industrial grade rather than MIL-38535 qualified, the Arria 10 SX family supports ruggedized system designs where industrial temperature operation is sufficient and full military screening is handled at the board level.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS032H3F34I2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS032H3F34E2SG | 10AS032H3F34E2LG | 10AS032H2F34I2SG | 10AS032H2F34I2LG | 10AS032H2F34E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, F34 (35x35 mm) | 1152-FBGA, F34 - same | 1152-FBGA, F34 - same | 1152-FBGA, F34 - same | 1152-FBGA, F34 - same | 1152-FBGA, F34 - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz |
| Speed Grade | 3 (H3) | 3 (H3) | 3 (H3) | 2 (H2) | 2 (H2) | 2 (H2) |
| Temperature Grade | Industrial (-40C to +100C junction) | Extended | Extended | Industrial | Industrial | Extended |
| Packing Form | Tray (LG) | Tape and Reel (SG) | Tray (LG) | Tape and Reel (SG) | Tray (LG) | Tape and Reel (SG) |
주요 차별점
- Highest speed grade (3) within the 10AS032 F34 family (vs 10AS032H2F34I2LG (speed grade 2))
- Integrated dual ARM Cortex-A9 hard processor system (vs Pure FPGA Arria 10 GX variants like 10AX115N3F40)
- Industrial temperature grade with tray packing (vs 10AS032H3F34E2SG (extended temp, tape and reel))
설계 노트
Estimated: A 1152-ball FCBGA at 35x35 mm with industrial temperature rating still requires substantial thermal management when the FPGA fabric and HPS are heavily utilized. Based on the package size and typical Arria 10 power consumption of 20-40 W at full load, design engineers should plan for a heatsink or cold-plate assembly and at least 8 thermal vias in the BGA land pattern to keep junction temperature below +100C. Verify thermal behavior empirically using the Arria 10 power calculator and the Intel FPGA thermal model.
The 1152-ball FCBGA demands a high-layer-count PCB (typically 12+ layers) with microvia or via-in-pad construction for breakout routing. Decoupling capacitor placement per the Arria 10 pin connection guidelines must follow the recommended scheme: bulk capacitors near power pins, high-frequency MLCCs directly beneath the device, and a continuous power plane to minimize impedance. Reference the Arria 10 device datasheet pin connection guidelines and the Cyclone/Arria/Stratix PCB design guidelines for layer stackup recommendations.
Do not confuse the SX (SoC) variant of Arria 10 with the GX/GT (transceiver-only) variants - they share the same FPGA fabric and pin packages but the SX has the additional HPS ball assignments and different boot/configuration flow. When migrating designs between Arria 10 variants, verify the HPS boot mode pins, HPS-to-FPGA bridge signals, and the Quartus Prime device selection. Industrial temperature ('I' in suffix) and extended temperature ('E') grades differ in their junction temperature ranges and qualification testing.
규정 준수 정보
RoHS and lead-free status indicated by 'LG' suffix per Altera/Intel ordering guide. AEC-Q100 not applicable for FPGA/SoC devices - this part targets industrial, not automotive-grade qualification. Halogen-free status not explicitly stated in the verified distributor data; default unknown.
